MUR55PFG, MURD55PFG, MUR55PFG, MURF55PFG, NRVUD55PFTG SWITCHMODE Power Rectifier These state of the art devices are designed for power factor correction in discontinuous and critical conduction mode. Features 52 V Rating Meets 8% Derating Requirements of Major OEMs ow Forward Voltage Drop ow eakage Ultrafast 95 Nanosecond Recovery Time Reduces Forward Conduction oss EC Q Qualified and PPP Capable NRVUD Prefix for utomotive and Other pplications Requiring Unique Site and Control Change Requirements ll Packages are Pb Free* pplications DCM PFC Designs Switching Power Supplies Power Inverters Mechanical Characteristics: Case: Epoxy, Molded Epoxy Meets U 9 V @ 25 in Weight: MUR55PFG:. Gram (pproximately) MURD55PFG, NRVUD55PFTG:. Gram (pproximately) MUR55PFG, MURF55PFG:.9 Gram (pproximately) Finish: ll External Surfaces Corrosion Resistant and Terminal eads are Readily Solderable ead and Mounting Surface Temperature for Soldering Purposes: 26 C Max. for Seconds *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. 2 UTRFST RECTIFIER 5. MPERES, 52 VOTS MRKING DIGRMS DPK CSE 69C STYE 8 XI ED CSE 267 STYE Pin : No Connect TO 22C CSE 22B STYE TO 22FP CSE 22E STYE MUR 55PF YYWW YWW U 55G Y WWG MUR55PF K YWWG MURF55PF K = ssembly ocation YY, Y = Year WW = Work Week or G = Pb Free Package K = Diode Polarity (Note: Microdot may be in either location) Semiconductor Components Industries, C, 22 January, 22 Rev. 8 Publication Order Number: MUR55/D
MUR55PFG, MURD55PFG, MUR55PFG, MURF55PFG, NRVUD55PFTG ORDERING INFORMTION Device Package Shipping MUR55PFG xial 5 Units/Bag MUR55PFRG xial,5 Tape & Reel MURD55PFTG NRVUD55PFTG MUR55PFG DPK (Pb Free) DPK (Pb Free) TO 22C (Pb Free) 2,5 Tape & Reel 2,5 Tape & Reel 5 Units/Rail MURF55PFG TO 22FP (Pb Free) 5 Units / Rail For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8/D. MXIMUM RTINGS Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage verage Rectified Forward Current (Rated V R ) T C = 65 C (Rated V R ) T C = 6 C Rating Symbol Value Unit MUR55PFG MURD55PFG, NRVUD55PFTG, MUR55PFG, MURF55PFG Non Repetitive Peak Surge Current (Surge pplied at Rated oad Conditions Halfwave, 6 Hz) MUR55PFG NRVUD55PFTG, MURD55PFG MUR55PFG, MURF55PFG V RRM V RWM V R I F(V) 5. 5. I FSM 85 75 52 V Operating Junction Temperature Range T J 65 to +75 C Storage Temperature Range T stg 65 to +75 C ESD Ratings: Machine Model = C Human Body Model = B ESD > > 8 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERM CHRCTERISTICS Characteristic Symbol Value Unit Thermal Resistance, Junction to Case (Note ) MURD55PG, MUR55PFG, NRVUD55PFTG MURF55PFG Thermal Resistance, Junction to mbient MUR55PFG NRVUD55PFTG, MURD55PFG (Note ), MURF55PFG. Rating applies when surface mounted on the minimum pad sizes recommended. 2. See Note 2, mbient Mounting Data.. inch square pad size on FR board. EECTRIC CHRCTERISTICS Maximum Instantaneous Forward Voltage Drop (Note ) (I F = 5., T J = ) (I F = 5., T J = 5 C) Maximum Instantaneous Reverse Current (Note ) (V R = 52 V, T J = ) (V R = 52 V, T J = 5 C) R JC 2.8 5.75 R J Note 2 62 75 V C/W C/W Characteristic Symbol Value Unit V F.5.98 I R 5. Maximum Reverse Recovery Time (I F =., di/dt = 5 / s, V R = V, T J = ) t rr 95 ns. Pulse Test: Pulse Width = s, Duty Cycle 2.%. V 2
MUR55PFG, MURD55PFG, MUR55PFG, MURF55PFG, NRVUD55PFTG NOTE 2 MBIENT MOUNTING DT Data shown for thermal resistance junction to ambient (R J ) for the mountings shown is to be used as typical guideline values for preliminary engineering or in case the tie point temperature cannot be measured. TYPIC VUES FOR R J IN STI IR Mounting ead ength, (IN) Method /8 / /2 / Units 5 5 5 55 C/W 2 R J 58 59 6 6 C/W 28 C/W MOUNTING METHOD P.C. Board Where vailable Copper Surface area is small. É MOUNTING METHOD 2 Vector Push In Terminals T 28 MOUNTING METHOD P.C. Board with /2 x /2 Copper Surface = /2 Board Ground Plane
MUR55PFG, MURD55PFG, MUR55PFG, MURF55PFG, NRVUD55PFTG I R, REVERSE CURRENT (MPS) i F, INSTNTNEOUS FORWRD CURRENT (MPS)..2..6.8..2..6 v F, INSTNTNEOUS FORWRD VOTGE (VOTS).E.E.E 5.E 6.E 7.E 8.E 9 5 C Figure. Typical Forward Voltage 5 C 2 V R, REVERSE VOTGE (VOTS) 5 I R, MXIMUM REVERSE CURRENT (MPS) I F, INSTNTNEOUS FORWRD CURRENT (MPS)..E.E.E 5.E 6.E 7.E 8.E 9 5 C.2..6.8..2..6 V F, MXIMUM INSTNTNEOUS FORWRD VOTGE (VOTS) Figure 2. Maximum Forward Voltage 5 C 2 V R, REVERSE VOTGE (VOTS) 5 Figure. Typical Reverse Current Figure. Maximum Reverse Current I F, VERGE FORWRD CURRENT (MPS) 5 dc SQURE WVE P FO, VERGE POWER DISSIPTION (WTTS) 9 8 7 6 5 2 5 6 7 8 2 5 6 7 8 9 T C, CSE TEMPERTURE ( C) I O, VERGE FORWRD CURRENT (MPS) 2 SQURE WVE dc Figure 5. Current Derating Figure 6. Forward Power Dissipation
MUR55PFG, MURD55PFG, MUR55PFG, MURF55PFG, NRVUD55PFTG C, CPCITNCE (pf) 5 5 V R, REVERSE VOTGE (VOTS) Figure 7. Capacitance 2 R (t), TRNSIENT THERM RESISTNCE.5.2.5. Single Pulse.... Figure 8. Thermal Response for MUR55PFG t DUTY CYCE, D = t / R (t), TRNSIENT THERM RESISTNCE.5.2.5. Single Pulse.... Figure 9. Thermal Response for MURD55PFG, NRVUD55PFTG t DUTY CYCE, D = t / 5
MUR55PFG, MURD55PFG, MUR55PFG, MURF55PFG, NRVUD55PFTG R (t), TRNSIENT THERM RESISTNCE.5.2.5. Single Pulse.... Figure. Thermal Response for MUR55PFG t DUTY CYCE, D = t / r(t), TRNSIENT THERM RESPONSE (NORMIZED) ( C/W). D =.5.2.5.2 SINGE PUSE t DUTY CYCE, D = t / Z JC (t) = r(t) R JC R JC =.6 C/W MX D CURVES PPY FOR POWER PUSE TRIN SHOWN RED TIME T t T J(pk) - T C = Z JC (t)...... Figure. Thermal Response, (MURF55PFG) Junction to Case (R JC ) r(t), TRNSIENT THERM RESPONSE (NORMIZED) ( C/W)... D =.5.2.5.2 SINGE PUSE... t DUTY CYCE, D = t / Z JC (t) = r(t) R JC R JC =.6 C/W MX D CURVES PPY FOR POWER PUSE TRIN SHOWN RED TIME T t T J(pk) - T C = Z JC (t). Figure 2. Thermal Response, (MURF55PFG) Junction to mbient (R J ) 6
MUR55PFG, MURD55PFG, MUR55PFG, MURF55PFG, NRVUD55PFTG PCKGE DIMENSIONS XI ED CSE 267 5 ISSUE G D K 2 NOTES:. DIMENSIONS ND TOERNCING PER NSI Y.5M, 982. 2. CONTROING DIMENSION: INCH.. 267- OBSOETE, NEW STNDRD 267-5. B K INCHES MIIMETERS DIM MIN MX MIN MX.287.7 7. 9.5 B 89.29.8 5. D.7.5.2. K. --- 25. --- STYE : PIN. CTHODE (PORITY BND) 2. NODE DPK (SINGE GUGE) CSE 69C ISSUE D b2 e E b 2 b D B DETI c.5 () M C C c2 H 2 GUGE PNE DETI ROTTED 9 CW H C Z SETING PNE NOTES:. DIMENSIONING ND TOERNCING PER SME Y.5M, 99. 2. CONTROING DIMENSION: INCHES.. THERM PD CONTOUR OPTION WITHIN DI- MENSIONS b, and Z.. DIMENSIONS D ND E DO NOT INCUDE MOD FSH, PROTRUSIONS, OR BURRS. MOD FSH, PROTRUSIONS, OR GTE BURRS SH NOT EXCEED.6 INCHES PER SIDE. 5. DIMENSIONS D ND E RE DETERMINED T THE OUTERMOST EXTREMES OF THE PSTIC BODY. 6. DTUMS ND B RE DETERMINED T DTUM PNE H. INCHES MIIMETERS DIM MIN MX MIN MX.86.9 2.8 2.8..5. b.25.5.6.89 b2..5.76. b 8.25.57 5.6 c 8.2.6.6 c2 8.2.6.6 D.25.25 5.97 6.22 E.25.265 6.5 6.7 e.9 BSC 2.29 BSC H.7. 9...55.7..78 8 REF 2.7 REF 2.2 BSC.5 BSC.5.5.89.27.. Z 55.9 SODERING FOOTPRINT* 6.2.2 2.58 2. 8 5.8.228.6.6 6.7.2 SCE : mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. 7
MUR55PFG, MURD55PFG, MUR55PFG, MURF55PFG, NRVUD55PFTG PCKGE DIMENSIONS TO 22 TWO ED CSE 22B ISSUE E Q H B G D K F T U R J C S NOTES:. DIMENSIONING ND TOERNCING PER NSI Y.5M, 982. 2. CONTROING DIMENSION: INCH. INCHES MIIMETERS DIM MIN MX MIN MX.595.62 5. 5.75 B.8.5 9.65.29 C 6 9.6.82 D.25.5.6.89 F 2 6.6.9 G 9.2.8 5. H 2.79. J.25.6.6 K.5.562 2.7.27.5.6..52 Q 2 2.5. R.8 2. 2.79 S.5.55..9 T.25.255 5.97 6.8 U..5..27 STYE : PIN. CTHODE 2. N/. NODE. CTHODE TO 22 FUPK, 2 ED CSE 22E ISSUE K F Q H B 2 Y G N D 2 P.25 () M B M Y U C T S J R SETING PNE NOTES:. DIMENSIONING ND TOERNCING PER NSI Y.5M, 982. 2. CONTROING DIMENSION: INCH. INCHES MIIMETERS DIM MIN MX MIN MX.67.6 5.67 6.7 B.92.8 9.96.6 C 77 9.5.9 D.2.9.6. F 2 29.8.28 G BSC 2.5 BSC H 7 2.98.8 J 8.25.5.6 K.99.562 2.68.27.5.6..52 N.2 BSC 5.8 BSC Q 22 8..5 R 7 2.56 2.96 S.92 8 2. 2.7 U.255.27 6.8 6.88 STYE : PIN. CTHODE 2. N/. NODE ON Semiconductor and are registered trademarks of Semiconductor Components Industries, C (SCIC). SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any license under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCIC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBICTION ORDERING INFORMTION ITERTURE FUFIMENT: iterature Distribution Center for ON Semiconductor P.O. Box 56, Denver, Colorado 827 US Phone: 675 275 or 8 86 Toll Free US/Canada Fax: 675 276 or 8 867 Toll Free US/Canada Email: orderlit@onsemi.com N. merican Technical Support: 8 282 9855 Toll Free US/Canada Europe, Middle East and frica Technical Support: Phone: 2 79 29 Japan Customer Focus Center Phone: 8 587 5 8 ON Semiconductor Website: www.onsemi.com Order iterature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MUR55/D