BCR8CM-12L. Triac. Medium Power Use. Features. Outline. Applications. Maximum Ratings. REJ03G Rev.1.00 Aug
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1 BCR8CM-1L Triac Medium Power Use REJG9-1 Rev.1. ug.. Features I T (RMS) : 8 V DRM : 6 V I FGTI, I RGTI, I RGTⅢ : m ( m) Note6 Non-Insulated Type Planar Passivation Type Outline TO- 1, 1 1. T 1 Terminal. T Terminal. Gate Terminal. T Terminal pplications Contactless C switch, light dimmer, electronic flasher unit, control of household equipment such as TV sets, stereo systems, refrigerator, washing machine, infrared kotatsu, carpet, electric fan, and solenoid driver, small motor control, copying machine, electric tool, electric heater control, and other general purpose control applications Maximum Ratings Parameter Symbol Voltage class Repetitive peak off-state voltage Note1 V DRM 6 V Non-repetitive peak off-state voltage Note1 V DSM V 1 Unit Rev.1., ug.., page 1 of 1
2 BCR8CM-1L Parameter Symbol Ratings Unit Conditions RMS on-state current I T (RMS) 8 Commercial frequency, sine full wave 6 conduction, Tc = 1 C Note Surge on-state current I TSM 8 6Hz sinewave 1 full cycle, peak value, non-repetitive I t for fusing I t 6 s Value corresponding to 1 cycle of half wave 6Hz,surge on-state current Peak gate power dissipation P GM W verage gate power dissipation P G (V). W Peak gate voltage V GM 1 V Peak gate current I GM Junction temperature Tj to +1 C Storage temperature Tstg to +1 C Mass. g Typical value Notes: 1. Gate open. Electrical Characteristics Parameter Symbol Min. Typ. Max. Unit Test conditions Repetitive peak off-state current I DRM. m Tj = 1 C, V DRM applied On-state voltage V TM 1. V Tc = C, I TM = 1, Instantaneous measurement Gate trigger voltage Note Gate trigger current Note Ι V FGTΙ 1. V ΙΙ V RGTΙ 1. V ΙΙΙ V RGTΙΙΙ 1. V Ι I FGTΙ Note6 m ΙΙ I RGTΙ Note6 m ΙΙΙ I RGTΙΙΙ Note6 m Tj = C, V D = 6 V, R L = 6 Ω, R G = Ω Tj = C, V D = 6 V, R L = 6 Ω, R G = Ω Gate non-trigger voltage V GD. V Tj = 1 C, V D = 1/ V DRM Thermal resistance R th (j-c). C/W Junction to case Critical-rate of rise of off-state (dv/dt)c 1 V/µs Tj = 1 C commutating voltage Note Note Note Notes:. Measurement using the gate trigger characteristics measurement circuit.. Case temperature is measured at the T tab 1. mm away from the molded case.. The contact thermal resistance R th (c-f) in case of greasing is 1. C/W.. Test conditions of the critical-rate of rise of off-state commutating voltage is shown in the table below. 6. High sensitivity (I GT m) is also available. (I GT item: 1) Test conditions 1. Junction temperature Tj = 1 C. Rate of decay of on-state commutating current (di/dt)c =. /ms. Peak off-state voltage V D = V Commutating voltage and current waveforms (inductive load) Supply Voltage Main Current Main Voltage (dv/dt)c (di/dt)c V D Rev.1., ug.., page of 1
3 BCR8CM-1L Performance Curves Maximum On-State Characteristics Rated Surge On-State Current On-State Current () Tj = C Tj = 1 C Surge On-State Current () On-State Voltage (V) Conduction (Cycles at 6Hz) Gate Voltage (V) Gate Characteristics (I, II and III) V GM = 1V P G(V) =.W 1 1 P GM = W I GM = V GT = 1.V 1 I 1 1 FGT I I RGT I, I RGT III V GD =.V Gate Trigger Current (Tj = t C) Gate Trigger Current (Tj = C) 1 1 Gate Trigger Current vs. I RGT I, IFGT I I RGT III Gate Current (m) ( C) Gate Trigger Voltage (Tj = t C) Gate Trigger Voltage (Tj = C) Gate Trigger Voltage vs Transient Thermal Impedance ( C/W) Maximum Transient Thermal Impedance Characteristics (Junction to case) ( C) Conduction (Cycles at 6Hz) Rev.1., ug.., page of 1
4 BCR8CM-1L Maximum On-State Power Dissipation llowable Case Temperature vs. RMS On-State Current On-State Power Dissipation (W) Conduction Resistive, inductive loads Case Temperature ( C) Curves apply regardless of conduction angle 6 Conduction Resistive, inductive loads RMS On-State Current () RMS On-State Current () llowable mbient Temperature vs. RMS On-State Current llowable mbient Temperature vs. RMS On-State Current mbient Temperature ( C) ll fins are black painted aluminum and greased 1 1 t. 1 1 t. 6 6 t. 6 Curves apply regardless of conduction angle Resistive, inductive loads Natural convection mbient Temperature ( C) Natural convection No Fins Curves apply regardless of conduction angle Resistive, inductive loads RMS On-State Current () RMS On-State Current () Repetitive Peak Off-State Current (Tj = t C) Repetitive Peak Off-State Current (Tj = C) 1 1 Repetitive Peak Off-State Current vs ( C) Holding Current (Tj = t C) Holding Current (Tj = C) Holding Current vs ( C) Rev.1., ug.., page of 1
5 BCR8CM-1L Latching Current vs. Breakover Voltage vs. Latching Current (m) 1 1 Distribution T +, G 1 1 T +, G + T, G Breakover Voltage (Tj = t C) Breakover Voltage (Tj = C) ( C) ( C) Breakover Voltage (dv/dt = xv/µs) Breakover Voltage (dv/dt = 1V/µs) Breakover Voltage vs. Rate of Rise of Off-State Voltage 16 1 Tj = 1 C 1 I Quadrant III Quadrant Rate of Rise of Off-State Voltage (V/µs) Critical Rate of Rise of Off-State Commutating Voltage (V/µs) Commutation Characteristics Main Voltage (dv/dt)c V D Main Current IT (di/dt)c τ Minimum Characteristics Value III Quadrant Tj = 1 C I T = τ = µs V D = V f = Hz I Quadrant 1 Rate of Decay of On-State Commutating Current (/ms) Gate Trigger Current vs. Gate Current Pulse Width Gate Trigger Characteristics Test Circuits Gate Trigger Current (tw) Gate Trigger Current (DC) 1 1 I FGT I I RGT I I RGT III Ω 6V V Ω Test Procedure I 6Ω 6V V Ω 6Ω 6V V Ω Test Procedure II Gate Current Pulse Width (µs) Test Procedure III Rev.1., ug.., page of 1
6 BCR8CM-1L Package Dimensions TO- EIJ Package Code JEDEC Code Mass (g) (reference value) Lead Material Conforms Conforms. Cu alloy max. ±.. φ.6 ±. 1. min.8 max Note 1) The dimensional figures indicate representative values unless otherwise the tolerance is specified.. Symbol 1 b D E e x y Dimension in Millimeters Min Typ Max y 1 ZD ZE Order Code Lead form Standard packing Quantity Standard order code Standard order code example Straight type Vinyl sack 1 Type name + BCR8CM-1L Lead form Plastic Magazine (Tube) Type name + Lead forming code BCR8CM-1L-8 Note : Please confirm the specification about the shipping in detail. Rev.1., ug.., page 6 of 1
7 BCR8CM-1L (The product guaranteed maximum junction temperature of 1 C) BCR8CM-1L Triac Medium Power Use (The product guaranteed maximum junction temperature of 1 C) Features I T (RMS) : 8 V DRM : 6 V I FGTI, I RGTI, I RGTⅢ : m ( m) Note6 Non-Insulated Type Planar Passivation Type Outline TO- 1, 1 1. T 1 Terminal. T Terminal. Gate Terminal. T Terminal pplications Contactless C switch, light dimmer, electronic flasher unit, control of household equipment such as TV sets, stereo systems, refrigerator, washing machine, infrared kotatsu, carpet, electric fan, and solenoid driver, small motor control, copying machine, electric tool, electric heater control, and other general purpose control applications Warning 1. Refer to the recommended circuit values around the triac before using.. Be sure to exchange the specification before using. Otherwise, general triacs with the maximum junction temperature of 1 C will be supplied. Maximum Ratings Parameter Symbol Voltage class Repetitive peak off-state voltage Note1 V DRM 6 V Non-repetitive peak off-state voltage Note1 V DSM V 1 Unit Rev.1., ug.., page of 1
8 BCR8CM-1L (The product guaranteed maximum junction temperature of 1 C) Parameter Symbol Ratings Unit Conditions RMS on-state current I T (RMS) 8 Commercial frequency, sine full wave 6 conduction, Tc = 1 C Note Surge on-state current I TSM 8 6Hz sinewave 1 full cycle, peak value, non-repetitive I t for fusing I t 6 s Value corresponding to 1 cycle of half wave 6Hz, surge on-state current Peak gate power dissipation P GM W verage gate power dissipation P G (V). W Peak gate voltage V GM 1 V Peak gate current I GM Junction temperature Tj to +1 C Storage temperature Tstg to +1 C Mass. g Typical value Notes: 1. Gate open. Electrical Characteristics Parameter Symbol Min. Typ. Max. Unit Test conditions Repetitive peak off-state current I DRM. m Tj = 1 C, V DRM applied On-state voltage V TM 1. V Tc = C, I TM = 1, Instantaneous measurement Gate trigger voltage Note Ι V FGTΙ 1. V Tj = C, V D = 6 V, R L = 6 Ω, ΙΙ V RGTΙ 1. V R G = Ω Gate trigger current Note ΙΙΙ V RGTΙΙΙ 1. V Ι I FGTΙ Note6 m ΙΙ I RGTΙ Note6 m ΙΙΙ I RGTΙΙΙ Note6 m Tj = C, V D = 6 V, R L = 6 Ω, R G = Ω Gate non-trigger voltage V GD./.1 V Tj = 1 C/1 C, V D = 1/ V DRM Thermal resistance R th (j-c). C/W Note Note Junction to case Critical-rate of rise of off-state (dv/dt)c 1/1 V/µs Tj = 1 C/1 C commutating voltage Note Notes:. Measurement using the gate trigger characteristics measurement circuit.. Case temperature is measured at the T tab 1. mm away from the molded case.. The contact thermal resistance R th (c-f) in case of greasing is 1. C/W.. Test conditions of the critical-rate of rise of off-state commutating voltage is shown in the table below. 6. High sensitivity (I GT m) is also available. (I GT item: 1) Test conditions 1. Junction temperature Tj = 1 C/1 C. Rate of decay of on-state commutating current (di/dt)c =. /ms. Peak off-state voltage V D = V Commutating voltage and current waveforms (inductive load) Supply Voltage Main Current Main Voltage (dv/dt)c (di/dt)c V D Rev.1., ug.., page 8 of 1
9 BCR8CM-1L (The product guaranteed maximum junction temperature of 1 C) Performance Curves Maximum On-State Characteristics Rated Surge On-State Current On-State Current () Tj = 1 C 1 Tj = C Surge On-State Current () On-State Voltage (V) Conduction (Cycles at 6Hz) Gate Voltage (V) Gate Characteristics (I, II and III) V GM = 1V P G(V) =.W V GT = 1.V P GM = W I GM = 1 1 IFGT I I RGT I, IRGT III V GD =.1V Gate Trigger Current (Tj = t C) Gate Trigger Current (Tj = C) 1 1 Gate Trigger Current vs. I RGT III I FGT I, I RGT I Gate Current (m) ( C) Gate Trigger Voltage (Tj = t C) Gate Trigger Voltage (Tj = C) 1 1 Gate Trigger Voltage vs Transient Thermal Impedance ( C/W) Maximum Transient Thermal Impedance Characteristics (Junction to case) ( C) Conduction (Cycles at 6Hz) Rev.1., ug.., page 9 of 1
10 BCR8CM-1L (The product guaranteed maximum junction temperature of 1 C) Maximum On-State Power Dissipation llowable Case Temperature vs. RMS On-State Current On-State Power Dissipation (W) Conduction Resistive, inductive loads Case Temperature ( C) Curves apply regardless of conduction angle 6 Conduction Resistive, inductive loads RMS On-State Current () RMS On-State Current () llowable mbient Temperature vs. RMS On-State Current llowable mbient Temperature vs. RMS On-State Current mbient Temperature ( C) t. 1 1 t. 6 6 t. 6 Curves apply regardless of conduction angle Resistive, ll fins are black inductive loads painted aluminum Natural convection and greased mbient Temperature ( C) Natural convection No Fins Curves apply regardless of conduction angle Resistive, inductive loads RMS On-State Current () RMS On-State Current () Repetitive Peak Off-State Current (Tj = t C) Repetitive Peak Off-State Current (Tj = C) 1 6 Repetitive Peak Off-State Current vs ( C) Holding Current (Tj = t C) Holding Current (Tj = C) Holding Current vs ( C) Rev.1., ug.., page 1 of 1
11 BCR8CM-1L (The product guaranteed maximum junction temperature of 1 C) Latching Current vs. Breakover Voltage vs. Latching Current (m) 1 1 Distribution T +, G 1 1 T +, G+ T, G Breakover Voltage (Tj = t C) Breakover Voltage (Tj = C) ( C) ( C) Breakover Voltage vs. Rate of Rise of Off-State Voltage (Tj=1 C) 16 1 Tj = 1 C Breakover Voltage vs. Rate of Rise of Off-State Voltage (Tj=1 C) 16 1 Tj = 1 C Breakover Voltage (dv/dt = xv/µs) Breakover Voltage (dv/dt = 1V/µs) I Quadrant III Quadrant Rate of Rise of Off-State Voltage (V/µs) Breakover Voltage (dv/dt = xv/µs) Breakover Voltage (dv/dt = 1V/µs) I Quadrant III Quadrant Rate of Rise of Off-State Voltage (V/µs) Critical Rate of Rise of Off-State Commutating Voltage (V/µs) Commutation Characteristics (Tj=1 C) 1 1 Main Voltage (dv/dt)c V D Main Current IT (di/dt)c τ Minimum Characteristics Value III Quadrant Tj = 1 C I T = τ = µs V D = V f = Hz I Quadrant Critical Rate of Rise of Off-State Commutating Voltage (V/µs) Commutation Characteristics (Tj=1 C) Main Voltage (dv/dt)c V D Main Current IT (di/dt)c τ I Quadrant III Quadrant Tj = 1 C I T = τ = µs V D = V f = Hz Minimum Characteristics Value 1 Rate of Decay of On-State Commutating Current (/ms) Rate of Decay of On-State Commutating Current (/ms) Rev.1., ug.., page 11 of 1
12 BCR8CM-1L (The product guaranteed maximum junction temperature of 1 C) Gate Trigger Current vs. Gate Current Pulse Width Gate Trigger Current (tw) Gate Trigger Current (DC) 1 1 I FGT I I RGT I I RGT III Gate Current Pulse Width (µs) Gate Trigger Characteristics Test Circuits Recommended Circuit Values round The Triac 6Ω 6Ω Load C 1 6V V Ω Test Procedure I 6Ω 6V V Ω Test Procedure II R 1 C 1 =.1 to.µf R 1 = to 1Ω C R C =.1µF R = 1Ω 6V V Ω Test Procedure III Rev.1., ug.., page 1 of 1
13 BCR8CM-1L (The product guaranteed maximum junction temperature of 1 C) Package Dimensions TO- EIJ Package Code JEDEC Code Mass (g) (reference value) Lead Material Conforms Conforms. Cu alloy max. ±.. φ.6 ±. 1. min.8 max Note 1) The dimensional figures indicate representative values unless otherwise the tolerance is specified.. Symbol 1 b D E e x y Dimension in Millimeters Min Typ Max y 1 ZD ZE Order Code Lead form Standard packing Quantity Standard order code Standard order code example Straight type Vinyl sack 1 Type name +B BCR8CM-1LB Lead form Plastic Magazine (Tube) Type name +B Lead forming code BCR8CM-1LB-8 Note : Please confirm the specification about the shipping in detail. Rev.1., ug.., page 1 of 1
14 Sales Strategic Planning Div. Nippon Bldg., -6-, Ohte-machi, Chiyoda-ku, Tokyo 1-, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.. ll information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page ( When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein.. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. ny diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. RENESS SLES OFFICES Renesas Technology merica, Inc. Holger Way, San Jose, C , U.S. Tel: <1> (8) 8- Fax: <1> (8) 8-1 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 FH, United Kingdom Tel: <> (168) 8 1, Fax: <> (168) 8 9 Renesas Technology Europe GmbH Dornacher Str., D-86 Feldkirchen, Germany Tel: <9> (89) 8, Fax: <9> (89) Renesas Technology Hong Kong Ltd. /F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <8> , Fax: <8> -686 Renesas Technology Taiwan Co., Ltd. FL 1, #99, Fu-Hsing N. Rd., Taipei, Taiwan Tel: <886> () 1-888, Fax: <886> () Renesas Technology (Shanghai) Co., Ltd. 6/F., Ruijin Building, No. Maoming Road (S), Shanghai, China Tel: <86> (1) 6-11, Fax: <86> (1) 61-9 Renesas Technology Singapore Pte. Ltd. 1, Harbour Front venue, #6-1, Keppel Bay Tower, Singapore 986 Tel: <6> 61-, Fax: <6> Renesas Technology Corp., ll rights reserved. Printed in Japan. Colophon.1.
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