Photosensor with front-end IC

Transcription

1 Near infrared sensor that integrates an InGas photodiode and front-end IC The is a compact optical device that integrates an InGas photodiode and front-end IC. Signal from a photodiode that receives near infrared light is output digitally through an I 2 C interface. It also has a built-in LED driver and can control external LEDs. Features pplications I 2 C interface Low supply voltage: Vdd=2.25 V to 3.63 V I 2 C bus voltage: 1.65 V Low current consumption Small package ( mm) pplicable to lead-free solder reflow Built-in 16-bit /D converter Built-in LED driver Moisture level detection Laser monitors Optical power meters Laser diode life testers NIR (near infrared) photometry Options Evaluation kit C Pitch conversion board C bsolute maximum ratings (Ta=25 C) Parameter Symbol Value Unit Supply voltage Vdd -0.3 to +4 V Load current Io ±10 m Power dissipation P 100 mw Operating temperature* 1 Topr -30 to +80 C Storage temperature* 1 Tstg -40 to +85 C LED forward current IF 8 m LED pulse forward current IF 50* 2 * 3 m LED reverse voltage VR 5* 2 V Reflow soldering condition* 4 Tsol Peak temperature 260 C max., 3 times - *1: No dew condensation When there is a temperature difference between a product and the surrounding area in high humidity environment, dew condensation may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability. *2: When driven externally *3: Duty ratio 10%, pulse width 0.1 ms *4: Moisture absorption and reflow conditions: JEDEC J-STD-020D LEVEL3 Note: External LEDs can be driven up to 64 m total for the three terminals. Take heat generation of the product and LEDs into account in the design. Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. lways be sure to use the product within the absolute maximum ratings. 1

2 Recommended operating conditions Parameter Symbol Condition Min. Typ. Max. Unit Supply voltage Vdd V I 2 C bus pull-up voltage* 5 Vbus Rp=2.2 kω Vdd V High level input voltage Vih SD, SCL Vdd V Low level input voltage Vil SD, SCL Vbus V Bus capacitance Cbus SD, SCL pf Maximum incident light level - Light source lx *5: The pull-up resistance is determined by the Cbus capacitance and Vbus voltage. Satisfy the following condition: Vdd - Vbus < 1.2 V. Electrical and optical characteristics Sensor area (Ta=25 C, Vdd=Vbus=3.3 V, unless otherwise noted) Parameter Symbol Condition Min. Typ. Max. Unit Spectral response range λ to µm Peak sensitivity wavelength λp µm Operation Iddc Current mode E=0 lx (dark state), excluding consumption Standby output current Idds mode µ Dark count Sd E=0 lx (dark state), initial setting counts Sensitivity High gain Sh Light source 100 lx counts/lx I 2 C area (Ta=25 C, Vdd=Vbus=3.3 V, unless otherwise noted) Parameter Symbol Condition Min. Typ. Max. Unit I 2 C address DDR 7-bit 0 2 I 2 C clock frequency fclk khz SD, SCL output voltage High level Voh Rp=2.2 kω 0.8Vbus - - V Low level Vol Rp=2.2 kω V I/O terminal capacitance Ci pf SD/SCL output fall time* 6 tf Rp=2.2 kω, Cp=400 pf ns *6: The SCL/SD output rise time is determined by the time constant defined by Cbus Rp. Note: I 2 C interface (SD, SCL) timing complies with The I 2 C-bus specification version 2.1. LED area (Ta=25 C, LED terminal voltage=3.3 V, Vdd=3.3 V, unless otherwise noted) Parameter Symbol Condition Min. Typ. Max. Unit Pulse drive current Idr pls Pulse mode Register setting=0x1-8 - m DC drive current Idr dc DC mode (3 terminals total) m Note: We recommend driving the LED in DC mode. 2

3 Register map drs Function bit IR sensor control Reset Standby Standby Register Gain Integration function Integration time setting function reset selection mode monitor 01 Manual timing (high byte) 02 Manual timing (low byte) Manual timing (low byte) 03 Output data (high byte) 04 Output data (low byte) Channel data (16 bits) Not used 0-0B - 0C - 0D - 0E LED drive control 1 LED reset LED standby function DC mode 1/10 mode LED2 drive current selection 0F LED drive control 2 LED1 drive current selection LED3 drive current selection 10 Monitor Standby function monitor Note: We recommend that the LEDs be used in DC mode. 0 0E 0F Register map drs Initial setting Function Initial setting Function Initial setting Function bit Integration Standby Register mode Reset Standby function High gain Integration time (32 μs) reset (Manual monitor setting) : Operation 1: reset 0: Operation 1: reset 0: Operation 1: Standby Readout only 0: Reset release 1: ddress 03-0 Data reset 0: High gain 1: Low gain 0: Fixed time mode 1: Manual setting mode (00) 32 µs (01) 0.5 ms (10) 8.2 ms (11) 65.5 ms LED LED DC mode 1/10 mode LED2 drive current (0 m)* reset standby : Normal 0: Operation 0: Pulse mode 0: 0 m 0: 0 m 0: 0 m mode 1: Standby 1: DC mode 1: 64 m 1: 32 m 1: 16 m 1: 1/10 mode 0: 0 m 1: 64 m 0: 0 m 1: 8 m LED1 drive current (0 m)* 7 LED3 drive current (0 m)* : 0 m 0: 0 m 0: 0 m 0: 0 m 0: 0 m 0: 0 m 1: 32 m 1: 16 m 1: 8 m 1: 64 m 1: 32 m 1: 16 m *7: Set to the total of the currents selected with the four bit parameters. 0: 0 m 8 m 3

4 Program example Condition 1: Initial settings [manual setting mode, Tint=00 (32 μs), integration time=100 ms/ch (manual timing register set to 0x0C30)] Command ction Data body ck Remark ddress call (0x2) S W 7-bit address Register call (0x00) Specifies the control byte Register write (0x84) DC reset, standby release ddress call (0x2) Sr W Restart, address Register call (0x00) Specifies the control byte Register write (0x04) P DC reset release, bus release Stands by for longer than the integration time (standby time > 400 ms) ddress call (0x2) S W 7-bit address Register call (0x05) Specifies the sensor data byte ddress call (0x2) Sr R Changes to read mode Data read out (MSB) X X X X X X X X Data output Data read out (LSB) X X X X X X X X Ā P S=Start condition, Sr=Restart condition, =cknowledge, =cknowledge by host, P=Stop condition, R=Read mode (1), W=Write mode (0), Ā=not acknowledge Format The rest is the same as the above command list. S 0x2 (7 bits) W 0x00 0x84 Sr 0x2 (7 bits) W 0x00 0x04 P When the SCL clock is 400 khz, the write time is 135 µs. Standby S 0x2 (7 bits) W 0x05 Sr 0x2 (7 bits) R Sensor data Sensor data P The readout time is µs. from master to slave from slave to master 4

5 Condition 2: [Fixed time mode, Tint=01 (0.5 ms), integration time=1.0 ms/ch] Command ction Data body ck Remark ddress call (0x2) S W 7-bit address Register call (0x00) Specifies the control byte Register write (0x81) DC reset, standby release ddress call (0x2) Sr W Restart, bit address Register call (0x00) Specifies the control byte Register write (0x01) P DC reset release, bus release Stands by for longer than the integration time Measurement takes place during standby (standby time > 4 ms). Measurements are repeated continuously. ddress call (0x2) S W 7-bit address Register call (0x05) Specifies the sensor data byte ddress call (0x2) Sr R Changes to read mode Data read out (infrared: MSB) X X X X X X X X Data output Data read out (infrared: LSB) X X X X X X X X Ā P S=Start condition, Sr=Restart condition, =cknowledge, =cknowledge by host, P=Stop condition, R=Read mode (1), W=Write mode (0), Ā=not acknowledge Format The rest is the same as the above command list. S 0x2 (7 bits) W 0x00 0x81 Sr 0x2 (7 bits) W 0x00 0x01 P When the SCL clock is 400 khz, the write time is 135 µs. Standby S 0x2 (7 bits) W 0x05 Sr 0x2 (7 bits) R Sensor data Sensor data P The readout time is µs. from master to slave from slave to master Condition 3: [Manual setting mode, Tint=01 (0.5 ms), manual timing=357 (0x165), integration time=357 ms/ch, low gain] Command ction Data body ck Remark ddress call (0x2) S W 7-bit address Register call (0x00) Specifies the control byte Register write (0x8D) DC reset, standby release Register write (0x01) Manual timing high byte Register write (0x65) Manual timing low byte ddress call (0x2) Sr W Restart, 7-bit address Register call (0x00) Specifies the control byte Register write (0x0D) P DC reset release, bus release Stands by for longer than the integration time Measurement takes place during standby (standby time > 1428 ms). Measurements are repeated continuously. ddress call (0x2) S W 7-bit address Register call (0x05) Specifies the sensor data byte ddress call (0x2) Sr R Changes to read mode Data read out (MSB) X X X X X X X X Data output Data read out (LSB) X X X X X X X X Ā P S=Start condition, Sr=Restart condition, =cknowledge, =cknowledge by host, P=Stop condition, R=Read mode (1), W=Write mode (0), Ā=not acknowledge 5

6 Format The rest is the same as the above command list. S 0x2 (7 bits) W 0x00 0x85 0x01 0x65 Sr 0x2 (7 bits) W 0x00 0x0D P Standby When the SCL clock is 400 khz, the write time is 180 µs. S 0x2 (7 bits) W 0x05 Sr 0x2 (7 bits) R Sensor data Sensor data P The readout time is µs. from master to slave from slave to master Command When starting operation Condition 4: [LED drive DC mode), LED drive current=48 m] ction Data body ck Remark ddress call (0x2) S W 7-bit address Register call (0x0E) Specifies the control byte Register write (0x0) Standby release, DC mode Register write (0x60) Drive current ddress call (0x2) Sr W Restart, 7-bit address Register call (0x0E) Specifies the control byte Register write (0x20) P LED driver reset release, bus release When ending operation ction Data body ck Remark ddress call (0x2) S W 7-bit address Register call (0x0E) Specifies the control byte Register write (0xC0) P Standby S=Start condition, Sr=Restart condition, =cknowledge, =cknowledge by host, P=Stop condition, R=Read mode (1), W=Write mode (0), Ā=not acknowledge Format The rest is the same as the above command list. When starting operation S 0x2 (7 bits) W 0x0E 0x1 0x60 Sr 0x2 (7 bits) W 0x0E 0x20 P When ending operation S 0x2 (7 bits) W 0x0E 0xC0 P from master to slave from slave to master 6

7 Flowcharts Sensor area 1. Power-on 2. Power-on reset, initialize 3. DC reset = 1, standby release 4. Set measurement conditions Gain, integration mode, integration time setting, integration timing register setting 5. DC reset = 0 Integration mode? Fixed time mode 6. Measure Manual setting mode 6. Measure fter power-on, the built-in power-on reset circuit operates to set all registers to their initial conditions (2). With the initial settings, the product is in standby mode, waiting for commands. To set measurement conditions, enter commands via the I 2 C bus. This product starts measuring when DC reset changes from 1 to 0. Therefore, to write to registers, DC reset must be set to 1 (3). fter setting measurement conditions (4), release DC reset to start measuring (5). There are two operation modes: fixed time mode and manual setting mode. In manual setting mode, the product automatically enters standby mode after completing a single measurement. In fixed time mode, the product repeats measurement and data storage. During this repetition, if DC reset or standby is set to 1 with an I 2 C command, the product stops its operation. 7. Save data to register 7. Save data to register Standby= 1? No Yes 8. Stop (standby mode) LED driver 1. Power-on 2. Power-on reset, initialize 3. LED reset = 1, LED sleep release With the initial settings, the LED drivers are also in standby mode. Therefore, first disable the standby mode (3). Next, set the LED current, DC mode, 1/10 mode, and the like. Then, release the reset to start operating (4, 5). LED drivers continue to operate until they are set to standby mode. To end operation, enable standby mode. 4. Set measurement conditions 1/10, DC mode, LED current 5. LED reset = 0 LED driver operation No LED sleep = 1? Yes Stop (standby mode) 7

8 Spectral response 100 (Typ. Ta=25 C) 80 Relative sensitivity (%) Wavelength (µm) KPICB0204EB Linearity 1000 (Typ. Ta=25 C) Converted count Illuminance of light source (lx) KPICB0205E 8

9 Current consumption vs. ambient temperature Sensitivity vs. ambient temperature 100 (Typ.) 1.2 (Typ. Ta=25 C, λ=1.45 µm) Current consumption (µ) Operation mode Standby mode Relative sensitivity mbient temperature ( C) mbient temperature ( C) KPICB0206E KPICB0207E Block diagram Photodiode /D converter Vdd SD Current-to-frequency conversion Counter Register I 2 C interface SCL GND Timer LED driver LED1-K LED2-K LED3-K KPICC0292E 9

10 Timing chart Sensor area (manual mode) Current consumption I 2 C Command Start mode Integration time Iddc Standby time Idds Time The photodiode data is stored temporarily in a buffer register (not the I 2 C register). fter the completion of the measurement, the entire set of data is stored in the I 2 C register. If this product is set to manual mode, after the integration time elapses, it will automatically switch to standby mode. I 2 C register values are not initialized with DC reset or in standby mode. They are initialized only during a power-on reset when the power is turned on. The integration time per cycle is the sum of the three detection times indicated in the timing chart on the left. Initialization measurement instruction Standby time (>integration time) Readout time Initialization, measurement instruction Readout KPICC0330E Sensor area (fixed time mode) Current consumption Start mode Iddc Time The measurement time is the shortest under the following conditions. <Conditions> Fixed time mode, Tint=00 (32 µs) Integration time: 32 µs/ch SCL frequency: 400 khz I 2 C Command Integration time (1 cycle) Standby time Initialization measurement instruction: 135 µs Standby time (>integration time): 128 µs Readout time: µs Measurement time: µs Initialization, measurement instruction Readout KPICC0331E 10

11 LED driver (pulse drive) I 2 C Command Initialization, measurement instruction LED1-K 1.6 ms (625 Hz fixed) Drive pulse width Readout The 3-channel drivers operate in the order LED1-K, LED2-K, and LED3-K. The drive pulse width can be set in the range of 0 μs to 240 μs in 16-μs steps (16 levels total). Drive pulse can be set separately for each LED. The drive cycle is fixed at approximately 1.6 ms, and the drive current is fixed at 8 m. If set to low current mode, the current is set to 0.8 m, which is 1/10 the initial setting. LED2-K LED3-K Drive pulse width Drive pulse width LED: Standby KPICC0295E Connection example Vdd (2.25 to 3.63 V) Vbus [1.65 V to (Vdd + 0.5)] Rp (3 kω) Rp (3 kω) 10 µf node (3.3 to 5.0 V) 0.1 µf 0.1 µf Vdd GND LED1-K LED2-K LED3-K SCL SD SCL SD Microcontroller KPICC0296E 11

12 Dimensional outline (unit: mm) Photosensitive area ɸ (0.5) Photosensitive area P0.8 4= ( 10) ϕ0.3 Vdd NC NC LED3-K LED1-K NC LED2-K GND SD SCL Tolerance unless otherwise noted: ±0.2 Note: When using this product, contact us for technical information. Please check the technical information first, and then create an appropriate device design. KPIC0102E Recommended land pattern (unit: mm) P0.8 4= (10 )ϕ0.4 KPICC0332E 12

13 Standard packing specifications Reel Dimensions Hub diameter Tape width Material Electrostatic characteristics 180 mm 60 mm 12 mm PS Conductive Embossed tape (unit: mm, material: PS, conductive) ϕ ± ± ± ± ± ± 0.05 ϕ Reel feed direction 0.25 ± ± ± 0.05 KPICC0333E Packing quantity 2000 pcs/reel Packing type Reel and desiccant in moisture-proof packaging (vacuum-sealed) 13

14 Measured example of temperature profile with our hot-air reflow oven for product testing Peak temperature: 260 C Peak temperature - 5 C: 30 s max. Temperature ( C) 217 C 200 C 150 C Preheat 60 to 120 s 3 C/s max. -6 C/s max. Soldering 60 to 150 s 25 C to peak temperature: 8 min max. Time (s) KPICC0220E This product supports lead-free soldering. fter unpacking, store it in an environment at a temperature of 30 C or less and a humidity of 60% or less, and perform soldering within 168 hours. If it is not stored in the above environment after unpacking or more than three months has passed without unpacking, perform baking. For the baking method, see the related information Precautions of Surface mount type products. The effect that the product receives during reflow soldering varies depending on the circuit board and reflow oven that are used. When you set reflow soldering conditions, check that problems do not occur in the product by testing out the conditions in advance. Related information Precautions Disclaimer Surface mount type products 14

15 Evaluation kit for photosensor with front-end IC () n evaluation kit [25 mm (H) 20 mm (V)] for understanding the operating principle of Hamamatsu s photosensor with front-end IC is available. Contact us for detailed information. Information described in this material is current as of May Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always contact us for the delivery specification sheet to check the latest specifications. The product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that one year period. However, even if within the warranty period we accept absolutely no liability for any loss caused by natural disasters or improper product use. Copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission. HMMTSU PHOTONICS K.K., Solid State Division Ichino-cho, Higashi-ku, Hamamatsu City, Japan, Telephone: (81) , Fax: (81) U.S..: Hamamatsu Corporation: 360 Foothill Road, Bridgewater, N.J , U.S.., Telephone: (1) , Fax: (1) , usa@hamamatsu.com Germany: Hamamatsu Photonics Deutschland GmbH: rzbergerstr. 10, D Herrsching am mmersee, Germany, Telephone: (49) , Fax: (49) , info@hamamatsu.de France: Hamamatsu Photonics France S..R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, Massy Cedex, France, Telephone: 33-(1) , Fax: 33-(1) , infos@hamamatsu.fr United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire L7 1BW, United Kingdom, Telephone: (44) , Fax: (44) , info@hamamatsu.co.uk North Europe: Hamamatsu Photonics Norden B: Torshamnsgatan Kista, Sweden, Telephone: (46) , Fax: (46) , info@hamamatsu.se Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, rese (Milano), Italy, Telephone: (39) , Fax: (39) , info@hamamatsu.it China: Hamamatsu Photonics (China) Co., Ltd.: B1201, Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing , China, Telephone: (86) , Fax: (86) , hpc@hamamatsu.com.cn Taiwan: Hamamatsu Photonics Taiwan Co., Ltd.: 8F-3, No. 158, Section2, Gongdao 5th Road, East District, Hsinchu, 300, Taiwan R.O.C. Telephone: (886) , Fax: (886) , info@hamamatsu.com.tw 15 Cat. No. KPIC1098E04 May 2018 DN