STSPIN230. Low voltage triple half-bridge motor driver for BLDC motors. Description. Features. Applications

Transcription

1 Low voltage triple half-bridge motor driver for BLDC motors Description Datasheet - production data Features QFN 3x3 (16-pin) Operating voltage from 1.8 to 10 V Maximum output current 1.3 A rms R DS(ON) HS + LS = 0.4 typ. Full protection set Non-dissipative overcurrent protection Short-circuit protection Thermal shutdown Interlocking function Energy saving and long battery life with standby consumption less than 80 na The STSPIN230 device integrates a triple halfbridge low R DS(ON) power stage in a small QFN - 3 x 3 mm package. The device is designed to operate in batterypowered scenarios and can be forced into a zeroconsumption state, allowing a significant increase in battery life. The device offers a complete set of protection including overcurrent, overtemperature and shortcircuit protection. Applications Battery-powered 3-phase brushless (BLDC) motors in applications such as: Toys Robotics Portable medical equipment November 2016 DocID Rev 4 1/22 This is information on a product in full production.

2 Contents STSPIN230 Contents 1 Block diagram Electrical data Absolute maximum ratings Recommended operating conditions Thermal data ESD protection ratings Electrical characteristics Pin description Typical applications Functional description Standby and power-up Motor driving Overcurrent and short-circuit protection Thermal shutdown Graphs Package information VFQFPN 3x3x1.0 16L package information Ordering information Revision history /22 DocID Rev 4

3 List of tables List of tables Table 1. Absolute maximum ratings Table 2. Recommended operating conditions Table 3. Thermal data Table 4. ESD protection ratings Table 5. Electrical characteristics Table 6. Pin description Table 7. Typical application values Table 8. INxH and INxL Table 9. VFQFPN 3x3x1.0 16L package mechanical data Table 10. Device summary Table 11. Document revision history DocID Rev 4 3/22 22

4 List of figures STSPIN230 List of figures Figure 1. Block diagram Figure 2. Pin connection (top view) Figure 3. Typical application schematic Figure 4. Overcurrent and short-circuit protections management Figure 5. Disable time versus R EN and C EN values (V DD = 3.3 V) Figure 6. Disable time versus R EN and C EN values (V DD = 1.8 V) Figure 7. Thermal shutdown management Figure 8. Power stage resistance versus supply voltage Figure 9. Power stage resistance versus temperature Figure 10. Overcurrent threshold versus supply voltage Figure 11. VFQFPN 3x3x1.0 16L package outline Figure 12. VFQFPN 3x3x1.0 16L recommended footprint /22 DocID Rev 4

5 Block diagram 1 Block diagram Figure 1. Block diagram DocID Rev 4 5/22 22

6 Electrical data STSPIN230 2 Electrical data 2.1 Absolute maximum ratings Table 1. Absolute maximum ratings Symbol Parameter Test condition Value Unit V S Supply voltage -0.3 to 11 V V IN Logic input voltage -0.3 to 5.5 V V OUT - V SENSE Output to sense voltage drop up to 12 V V S - V OUT Supply to output voltage drop up to 12 V V SENSE Sense pins voltage -1 to 1 V I OUT,RMS Continuous power stage output current (each bridge) 1.3 A rms T j,op Operative junction temperature -40 to 150 C T j,stg Storage junction temperature -55 to 150 C 2.2 Recommended operating conditions Table 2. Recommended operating conditions Symbol Parameter Test condition Min. Typ. Max. Unit V S Supply voltage V V IN Logic input voltage 0 5 V t INw Logic inputs positive/negative pulse width 300 ns 2.3 Thermal data Table 3. Thermal data Symbol Parameter Conditions Value Unit R thja Junction to ambient thermal resistance R thjctop R thjcbot Junction to case thermal resistance (top side) Junction to case thermal resistance (bottom side) Natural convection, according to JESD51-2a (1) Simulation with cold plate on package top Simulation with cold plate on exposed pad 1. Simulated on a 21.2 x 21.2 mm board, 2s2p 1 Oz copper and four 300 m vias below exposed pad C/W 67.3 C/W 9.1 C/W R thjb Junction to board thermal resistance According to JESD51-8 (1) 23.3 C/W JT Junction to top characterization According to JESD51-2a (1) 3.3 C/W JB Junction to board characterization According to JESD51-2a (1) 22.6 C/W 6/22 DocID Rev 4

7 Electrical data 2.4 ESD protection ratings Table 4. ESD protection ratings Symbol Parameter Test condition Class Value Unit HBM Human body model Conforming to ANSI/ESDA/JEDEC JS kv CDM Charge device model Conforming to ANSI/ESDA/JEDEC JS C2 750 V DocID Rev 4 7/22 22

8 Electrical characteristics STSPIN230 3 Electrical characteristics Testing conditions: V S = 5 V, T j = 25 C unless otherwise specified. Table 5. Electrical characteristics Symbol Parameter Test condition Min. Typ. Max. Unit Supply V Sth(ON) V S turn-on voltage V S rising from 0 V V V Sth(OFF) V S turn-off voltage V S falling from 5 V V V Sth(HYS) V S hysteresis voltage 180 mv I S V S supply current No commutations, EN = A No commutations, EN = A I S,STBY V S standby current STBY = 0 V na V STBYL Standby low logic level input voltage 0.9 V V STBYH Power stage Standby high logic level input voltage 1.48 V V S = 10 V, I OUT = 1.3 A R DS(ON)HS+LS Total on resistance HS + LS V S = 10 V, I OUT = 1.3 A, T j = 125 C (1) V S = 3 V, I OUT = 0.4 A I DSS Leakage current OUTx = V S 1 OUTx = GND - 1 A V DF Freewheeling diode forward voltage I D = 1.3 A 0.9 V t rise Rise time V S = 10 V; unloaded outputs 10 ns Logic IOs t fall Fall time V S = 10 V; unloaded outputs 10 ns t DT Integrated dead time 50 ns V IH High logic level input voltage 1.6 V V IL Low logic level input voltage 0.6 V V RELEASE FAULT open drain release voltage 0.4 V V OL EN low logic level output voltage I EN = 4 ma 0.4 V R STBY STBY pull-down resistance 36 k I PDEN EN pull-down current 10.5 µa t End EN input propagation delay From EN falling edge to OUT high impedance 55 ns 8/22 DocID Rev 4

9 Electrical characteristics Table 5. Electrical characteristics (continued) Symbol Parameter Test condition Min. Typ. Max. Unit t IN,d(ON) Turn-on propagation delay From INxH rising edge to 10% of OUTx 125 ns t IN,d(OFF) Turn-off propagation delay From INxL rising edge to 90% of OUTx 140 ns Protections T jsd Thermal shutdown threshold 160 C T jsd,hyst Thermal shutdown hysteresis 40 C I OC Overcurrent threshold See Figure 10 on page A 1. Based on characterization data on a limited number of samples, not tested during production. DocID Rev 4 9/22 22

10 Pin description STSPIN230 4 Pin description Figure 2. Pin connection (top view) 1. The exposed pad must be connected to ground. Table 6. Pin description No. Name Type Function 1 INUL Logic input Output U driving input (low side) 2 INUH Logic input Output U driving input (high side) 3 OUTU Power output Power bridge output U 5 NC 6 VS Supply Device supply voltage 7, EPAD GND Ground Device ground 8 OUTV Power output Power bridge output V 10 OUTW Power output Power bridge output W 11 INWL Logic input Output W driving input (low side) 12 INWH Logic input Output W driving input (high side) 13 EN\FAULT Logic input\ open drain output Logic input 5 V compliant with open drain output. This is the power stage enable (when low, the power stage is turned off) and is forced low through the integrated open-drain MOSFET when a failure occurs. 10/22 DocID Rev 4

11 Pin description 4 SENSEU Power output 9 SENSEVW Power output 14 STBY\RESET Logic input Table 6. Pin description (continued) No. Name Type Function Sense output bridge U (must be connected to SENSEVW). Sense output bridge V and W (must be connected to SENSEU). Logic input 5 V compliant. When forced low, the device is forced into the low consumption mode. 15 INVL Logic input Output V driving input (low side). 16 INVH Logic input Output V driving input (high side). DocID Rev 4 11/22 22

12 Typical applications STSPIN230 5 Typical applications Table 7. Typical application values Name C S C SPOL R SNS C EN R EN C STBY R STBY Value 2.2 µf / 16 V 22 µf / 16 V 330 m / 1 W 10 nf / 6.3 V 18 k 1 nf / 6.3 V 18 k Figure 3. Typical application schematic 12/22 DocID Rev 4

13 Functional description 6 Functional description The STSPIN230 device is a protected triple half-bridge motor driver. 6.1 Standby and power-up The device provides a low consumption mode which is set forcing the STBY\RESET input below the V STBYL threshold. When the device is in standby status the power stage is disabled (outputs are in high impedance) and the supply to the integrated control circuitry is cut off. When the device leaves the standby status, all the control circuitry is reset to power-up condition. 6.2 Motor driving The outputs of the three half-bridges are directly driven through the logic inputs as listed in Table 8. Table 8. INxH and INxL EN\FAULT INxH INxL 'x' half-bridge condition 0 X X High impedance High impedance Low side MOSFET ON High side MOSFET ON High impedance (interlocking) DocID Rev 4 13/22 22

14 Functional description STSPIN Overcurrent and short-circuit protection The device embeds circuitry protecting each power output against the overload and shortcircuit conditions (short to ground, short to VS and short between outputs). When the overcurrent or the short-circuit protection is triggered the power stage is disabled and the EN\FAULT input is forced low through the integrated open-drain MOSFET discharging the external C EN capacitor (refer to Figure 4). The power stage is kept disabled and the open-drain MOSFET is kept ON until the EN\FAULT input falls below the V RELEASE threshold, then the C EN capacitor is charged through the R EN resistor. Figure 4. Overcurrent and short-circuit protections management The total disable time after an overcurrent event can be set by properly sizing the external network connected to the EN\FAULT pin (refer to Figure 4): Equation 1 t DIS = t discharge + t charge But t charge is normally much higher than t discharge, thus we can consider only the second one contribution: Equation 2 Where V DD is the pull-up voltage of the R EN resistor. 14/22 DocID Rev 4

15 Functional description Figure 5. Disable time versus R EN and C EN values (V DD = 3.3 V) Figure 6. Disable time versus R EN and C EN values (V DD = 1.8 V) DocID Rev 4 15/22 22

16 Functional description STSPIN Thermal shutdown The device embeds circuitry protecting it from the overtemperature condition. When the thermal shutdown temperature is reached the power stage is disabled and the EN\FAULT input is forced low through the integrated open-drain MOSFET (refer to Figure 7). The protection and the EN\FAULT output are released when the IC temperature returns below a safe operating value (T jsd - T jsd,hyst ). Figure 7. Thermal shutdown management 16/22 DocID Rev 4

17 Graphs 7 Graphs Figure 8. Power stage resistance versus supply voltage Figure 9. Power stage resistance versus temperature DocID Rev 4 17/22 22

18 Graphs STSPIN230 Figure 10. Overcurrent threshold versus supply voltage 18/22 DocID Rev 4

19 Package information 8 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. 8.1 VFQFPN 3x3x1.0 16L package information Figure 11. VFQFPN 3x3x1.0 16L package outline DocID Rev 4 19/22 22

20 Package information STSPIN230 Symbol Table 9. VFQFPN 3x3x1.0 16L package mechanical data Dimensions (mm) Min. Typ. Max. NOTES A (1) A A b D D E E e 0.50 L VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Packages No lead. Very thin: 0.80 < A 1.00 mm / fine pitch: e < 1.00 mm. The pin #1 identifier must be present on the top surface of the package by using an indentation mark or an other feature of the package body. Figure 12. VFQFPN 3x3x1.0 16L recommended footprint 20/22 DocID Rev 4

21 Ordering information 9 Ordering information Table 10. Device summary Order code Package Packaging STSPIN230 VFQFPN 3x3x1.0 16L Tape and reel 10 Revision history Table 11. Document revision history Date Revision Changes 06-May Initial release. 30-Jun Oct Updated document status to Datasheet - production data on page 1. Updated Table 1 on page 6 (changed Max. value of V S from 12 to 11). Updated main title on page 1 (added for BLDC motors ). Updated Section : Features on page 1 (added Interlocking function ). Updated Figure 1 on page 5, Figure 3 on page 12, and Figure 8 on page 17 (replaced by new figures). Updated Table 3 on page 6 (replaced by new table). Updated Figure 2 on page 10 (replaced SENSE by SENSEU and SENSEVW ). Updated Table 6 on page 10 (updated pin 4 and 9). Minor modifications throughout document. 04-Nov Updated Table 2 on page 6 (added t INw symbol). DocID Rev 4 21/22 22

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