STTH2002C. High efficiency ultrafast diode. Features. Description
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1 High efficiency ultrafast diode Datasheet - production data K TO-220AB K A1 A1 A2 A1 K A2 K A2 I 2 PAK D 2 PAK K K A1 A2 A1 K TO-220FPAB A1 KA2 A2 Features Suited for SMPS Low losses Low forward and reverse recovery times Low leakage current High junction temperature Insulated package: TO-220FPAB Insulating voltage = 2000 VRMS sine ECOPACK 2 compliant component for D²PAK on demand Description Dual center tap rectifier suited for switch mode power supplies and high frequency DC/DC converters. Packaged in TO-220AB, TO-220FPAB, I 2 PAK or D 2 PAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. Symbol IF(AV) VRRM Table 1: Device summary Value 2 x 10 A 200 V Tj (max) 175 C VF (typ) trr (typ) 0.78 V 22 ns December 2015 DocID10176 Rev 3 1/16 This is information on a product in full production.
2 Characteristics STTH2002C 1 Characteristics Table 2: Absolute ratings (limiting values, per diode, at 25 C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 200 V IF(RMS) Forward rms current 30 A IF(peak) IFSM Average forward current δ = 0.5, square wave Surge non repetitive forward current TO-220AB, D 2 PAK, I 2 PAK TO-220FPAB TC = 150 C Per diode 10 TC = 140 C Per device 20 TC = 130 C Per diode 15 TC = 115 C Per device 30 TC = 120 C Per diode 10 TC = 85 C Per device 20 tp = 10 ms sinusoidal 90 A Tstg Storage temperature range -65 to C Tj Maximum operating junction temperature (1) 175 C Notes: (1) (dptot/dtj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. A Table 3: Thermal parameter Symbol Parameter Value Unit Rth(j-c) Rth(c) Per diode 2.5 TO-220AB, D 2 PAK, I 2 PAK Per device 1.6 Junction to case C/W Per diode 5 TO-220FPAB Per device 3.8 TO-220AB, D 2 PAK, I 2 PAK 0.7 Coupling - C/W TO-220FPAB 2.5 When the diodes 1 and 2 are used simultaneously: ΔTj(diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c) 2/16 DocID10176 Rev 3
3 Characteristics Table 4: Static electrical characteristics (per diode) Symbol Parameter Test conditions Min. Typ. Max. Unit IR (1) VF (2) Reverse leakage current Forward voltage drop Notes: (1) Pulse test: tp = 5 ms, δ < 2% (2) Pulse test: tp = 380 µs, δ < 2% Tj = 25 C - 10 VR = VRRM Tj = 125 C Tj = 25 C IF = 10 A IF = 20 A Tj = 150 C IF = 10 A IF = 20 A µa V To evaluate the conduction losses use the following equation: P = 0.73 x IF(AV) IF 2 (RMS) Table 5: Dynamic electrical characteristics (per diode) Symbol Parameter Test conditions Min. Typ. Max. Unit trr tfr VFP IRM Reverse recovery time Forward recovery time Forward recovery voltage Reverse recovery current Tj= 25 C Tj = 25 C Tj = 25 C Tj = 125 C IF= 1 A, VR= 30 V, dif/dt= 100 A/µs IF = 10 A, dif/dt = 100 A/µs, VFR = 1.1 x VFmax, IF = 10 A, dif/dt = 100 A/µs IF = 10 A, VR = 160 V, dif/dt = 200 A/µs ns ns V A DocID10176 Rev 3 3/16
4 Characteristics 1.1 Characteristics (curves) 80 Figure 1: Peak current versus duty cycle (per diode) I (A) M STTH2002C Figure 2: Forward voltage drop versus forward current (typical values, per diode) IM T P = 10W P = 20W δ=tp/t tp 20 P = 5W 10 δ Figure 3: Forward voltage drop versus forward current (maximum values, per diode) Figure 4: Relative variation of thermal impedance junction to case versus pulse duration 1.0 Z th(j-c) /Rth(j-c) Single pulse TO-220AB, D 2 PAK, I 2 PAK 0.1 t (s) p 1.E E E E+00 Figure 5: Relative variation of thermal impedance junction to case versus pulse duration 1.0 Z th(j-c )/Rth(j-c) TO-220FPAB 100 Figure 6: Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) f=1mhz V OS C=30mV T j=25 C RMS Single pulse t (s) p 1.E-03 1.E-02 1.E-01 1.E E V (V) R /16 DocID10176 Rev 3
5 Figure 7: Reverse recovery charges versus dif/dt (typical values, per diode) Characteristics Figure 8: Reverse recovery time versus dif/dt (typical values, per diode) Figure 9: Peak reverse recovery current versus dif/dt (typical values, per diode) Figure 10: Dynamic parameters versus junction temperature Q rr ; I RM[T j]/q rr;i RM[T j=125 C] I F=10A V R=160V IRM 0.6 Qrr T ( C) j Figure 11: Thermal resistance junction to ambient versus copper surface under tab R th(j-a) ( C/W) D²PAK Epoxy printed board FR4, e CU = 35 µm S Cu(cm²) DocID10176 Rev 3 5/16
6 Package information STTH2002C 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. Cooling method: by conduction (C) Epoxy meets UL 94,V0 Recommended torque value: 0.55 N m (for TO-220AB and TO-220FPAB) Maximum torque value: 0.7 N m (for TO-220AB and TO-220FPAB) 6/16 DocID10176 Rev 3
7 2.1 D²PAK package information Figure 12: D²PAK package outline Package information This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID10176 Rev 3 7/16
8 Package information STTH2002C Table 6: D²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A A b b c c D D D E E E e 2.54 typ e H J L L L R 0.4 typ V /16 DocID10176 Rev 3
9 Figure 13: D²PAK recommended footprint (dimensions in mm) Package information DocID10176 Rev 3 9/16
10 Package information 2.2 I²PAK package information Figure 14: I²PAK package outline STTH2002C Table 7: I²PAK package mechanical data mm Dim. Min. Typ. Max. A A b b c c D e e E L L L Mounting (soldering) the I 2 PAK metal slug (heatsink) with alloy, like a surface mount device, IS NOT PERMITTED. A standard through-hole mounting is mandatory. 10/16 DocID10176 Rev 3
11 2.3 TO-220AB type A (DZ) package information Figure 15: TO-220AB package outline Package information DocID10176 Rev 3 11/16
12 Package information STTH2002C Table 8: TO-220AB package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A b b c D D typ typ. E e e F H J L L L typ typ. L typ typ. θp Q /16 DocID10176 Rev 3
13 2.4 TO-220FPAB package information Figure 16: TO-220FPAB package outline Package information H B A Dia L6 L2 L7 L3 L5 F1 D L4 F2 G1 F E G DocID10176 Rev 3 13/16
14 Package information STTH2002C Table 9: TO-220FPAB package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A B D E F F F G G H L typ typ. L L L L L Dia /16 DocID10176 Rev 3
15 Ordering information 3 Ordering information Table 10: Ordering information Order code Marking Package Weight Base qty Delivery mode STTH2002CT STTH2002CT TO-220AB 1.9g 50 Tube STTH2002CG STTH2002CG D 2 PAK 1.38g 50 Tube STTH2002CG-TR STTH2002CG D 2 PAK 1.38g 1000 Tape and reel STTH2002CR STTH2002CR I 2 PAK 1.5g 50 Tube STTH2002CFP STTH2002CFP TO-220FPAB 1.9g 50 Tube 4 Revision history Table 11: Document revision history Date Revision Changes Feb First issue. 23-Jun Dec Updated Table 1. Updated ECOPACK statement. Updated features, Table 1: "Device summary" and packages silhouette in cover page. Updated Section 1: "Characteristics" and Table 10: "Ordering information" Updated Section 2.2: "D²PAK package information". DocID10176 Rev 3 15/16
16 IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document STMicroelectronics All rights reserved 16/16 DocID10176 Rev 3
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