MC14513B. BCD To Seven Segment Latch/Decoder/Driver

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1 BCDToSeven Segment Latch/Decoder/Driver CMOS MSI (LowPower Complementary MOS) The MC453B BCDtoseven segment latch/decoder/driver is cotructed with complementary MOS (CMOS) enhancement mode devices and NPN bipolar output drivers in a single monolithic structure. The circuit provides the functio of a 4bit storage latch, an 842 BCDtoseven segment decoder, and has output drive capability. Lamp test (LT), blanking (BI), and latch enable (LE) inputs are used to test the display, to turnoff or pulse modulate the brightness of the display, and to store a BCD code, respectively. The Ripple Blanking Input (RBI) and Ripple Blanking Output (RBO) can be used to suppress either leading or trailing zeroes. It can be used with seveegment light emitting diodes (LED), incandescent, fluorescent, gas discharge, or liquid crystal readouts either directly or indirectly. Applicatio include itrument (e.g., counter, DVM, etc.) display driver, computer/calculator display driver, cockpit display driver, and various clock, watch, and timer uses. Features Low Logic Circuit Power Dissipation HighCurrent Sourcing Outputs (Up to 25 ma) Latch Storage of Binary Input Blanking Input Lamp Test Provision Readout Blanking on all Illegal Input Combinatio Lamp Inteity Modulation Capability Time Share (Multiplexing) Capability Adds Ripple Blanking In, Ripple Blanking Out to MC45B Supply Voltage Range = 3. V to 8 V Capable of Driving Two LowPower TTL Loads, One LowPower Schottky TTL Load to Two HTL Loads Over the Rated Temperature Range PbFree Package is Available* MAXIMUM RATINGS (Voltages Referenced to V SS ) Parameter Value DC Supply Voltage Range.5 to +8. V Input Voltage Range, All Inputs V in.5 to +.5 V DC Current Drain per Input Pin I ma Power Dissipation per Package (Note ) P D 5 mw Operating Temperature Range T A 55 to +25 C Storage Temperature Range T stg 65 to + C Maximum Continuous Output Drive Current (Source) per Output I OHmax 25 ma Maximum Continuous Output Power P OHmax 5 mw (Source) per Output (Note 2) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditio is not implied. Extended exposure to stresses above the Recommended Operating Conditio may affect device reliability.. Temperature Derating: Plastic P and D/DW Packages: 7. mw/ C From 65 C To 25 C 2. P OHmax = I OH ( V OH ) 8 A WL YY WW G MARKING DIAGRAM MC453BCP AWLYYWWG = Assembly Location = Wafer Lot = Year = Work Week = PbFree Package PDIP8 P SUFFIX CASE 77 ORDERING INFORMATION Device Package Shipping MC453BCP PDIP8 2 s/rail MC453BCPG PDIP8 (PbFree) 2 s/rail This device contai protection circuitry to protect the inputs agait damage due to high static voltages or electric fields. However, it is advised that normal precautio be taken to avoid application of any voltage higher than maximum rated voltages to this highimpedance circuit. A destructive high current mode may occur if V in and V out are not cotrained to the range V SS (V in or V out ). Due to the sourcing capability of this circuit, damage can occur to the device if is applied, and the outputs are shorted to V SS and are at a logical (See Maximum Ratings). Unused inputs must always be tied to an appropriate logic voltage level (e.g., either V SS or ). *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 26 Publication Order Number: MC453B/D

2 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ELECTRICAL CHARACTERISTICS (Voltages Referenced to V SS ) Output Voltage Segment Outputs Level V in = or V in = or Level Output Voltage RBO Output Level V in = or V in = or Level Input Voltage (Note 3) Level (V O = 3.8 or.5 ) (V O = 8.8 or. ) (V O = 3.8 or.5 ) (V O =.5 or 3.8 ) Level (V O =. or 8.8 ) (V O =.5 or 3.8 ) Output Drive Voltage Segments (I OH = ma) Source (I OH = ma) (I OH = ma) (I OH = ma) (I OH = 2 ma) (I OH = ma) (I OH = ma) (I OH = ma) (I OH = ma) (I OH = 2 ma) (I OH = ma) (I OH = ma) (I OH = ma) (I OH = ma) (I OH = 2 ma) V OH V OH V IL V IH 55 C 25 C 25 C Min Max Min 7. OH Noise immunity specified for worstcase input combination. Noise Margin for both and level =. = 2. = 2.5 = Typ (Note 3) Max Min Max

3 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ELECTRICAL CHARACTERISTICS (continued) (Voltages Referenced to V SS ) 55 C 25 C 25 C Min Max Min Typ (Note 4) Max Min Max Output Drive Current RBO Output (V OH = 2.5 V) Source (V OH = 9.5 V) (V OH = V) ( =.4 V) Sink ( =.5 V) ( =.5 V) I OH I OL Output Drive Current Segments ( =.4 V) Sink ( =.5 V) ( =.5 V) I OL Input Current I in ±. ±. ±. ±. Adc Input Capacitance C in 7.5 pf Quiescent Current (Per Package) V in = or, I out = A I DD Adc Total Supply Current (Note 5, 6) (Dynamic plus Quiescent, Per Package) (C L = 5 pf on all outputs, all buffers switching) I T I T = (.9 A/kHz) f + I DD I T = (3.8 A/kHz) f + I DD I T = (5.7 A/kHz) f + I DD 4. Noise immunity specified for worstcase input combination. Noise Margin for both and level =. = 2. = 2.5 = 5. The formulas given are for the typical characteristics only at 25 C. 6. To calculate total supply current at loads other than 5 pf: I T (C L ) = I T (5 pf) + x 3 (C L 5) f where: I T is in A (per package), C L in pf, in, and f in khz is input frequency. Adc Input LE and RBI low, and Inputs D, BI and LT high. f in respect to a system clock. All outputs connected to respective C L loads % A, B, AND C 5% % 2f 5% DUTY CYCLE ANY OUTPUT 5% V SS V OH Figure. Dynamic Power Dissipation Signal Waveforms 4

4 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ SWITCHING CHARACTERISTICS (Note 7) (C L = 5 pf, T A = 25 C) TLH TLH Output Fall Time Segment Outputs (Note 7) t THL = (.5 /pf) C L + 5 t THL = (.75 /pf) C L t THL = (.55 /pf) C L Output Fall Time RBO Outputs t THL = (3.25 /pf) C L t THL = (.35 /pf) C L t THL = (.95 /pf) C L Propagation Delay Time A, B, C, D Inputs (Note 7) = (.4 /pf) C L + 62 = (.25 /pf) C L = (.2 /pf) C L + 65 t PHL = (.3 /pf) C L t PHL = (.6 /pf) C L + 26 t PHL = (.35 /pf) C L Propagation Delay Time RBI and BI Inputs (Note 7) = (.5 /pf) C L = (.45 /pf) C L = (.3 /pf) C L + 35 t PHL = (.85 /pf) C L t PHL = (.45 /pf) C L t PHL = (.35 /pf) C L Propagation Delay Time LT Input (Note 7) = (.45 /pf) C L = (.25 /pf) C L = (.2 /pf) C L + 8 t PHL = (.3 /pf) C L t PHL = (.45 /pf) C L t PHL = (.35 /pf) C L t THL t THL t PHL t PHL t PHL Setup Time t su Hold Time t h Latch Enable Pulse Width t WL(LE) 7. The formulas given are for the typical characteristics only. All Types Min Typ Max

5 PACKAGE DIMENSIONS PDIP8 CASE 772 ISSUE D 8 9 B L J NOTES:. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN.25 mm (.) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 4. CONTROLLING DIMENSION: INCH. H F G A D N C SEATING PLANE K M INCHES MILLIMETERS DIM MIN MAX MIN MAX A B C D F G. BSC 2.54 BSC H J K L.3 BSC 7.62 BSC M N MC453B/D

PIN ASSIGNMENT B 1 18 C 2 17 f LT 3 16 g BI 4 a LE 5 14 b D 6 13 c A 7 12 d RBI e RBO e f d g a c b DISPLAY TRUTH TABLE Input

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