Power Distribution Networks in Multilayer LTCC for Microwave Applications
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1 EASTON Power Distribution Networks in Multilayer LTCC for Microwave Applications R. Kulke, W. Simon, J. Kassner, S. Holzwarth, G. Möllenbeck, P. Uhlig and P. Waldow IMST GmbH Carl-Friedrich-Gauß-Straße 2 D Kamp-Lintfort I M ST TECHNISCHE UNIVERSITÄT ILMENAU BOSCH SatCom Projektträger des bmb+f Förderkennzeichen: 50 YB 0007 Power Distribution Networks in LTCC / RK_ PU / IMAPS
2 Overview Antenna Elements Design and Measurement Wilkinson Divider Z L 2 λ/4 Components R = 2Z L Input Port System Integration Power Distribution Networks in LTCC / RK_ PU / IMAPS
3 On Wafer Probe ground triplate line 1 ground cavity triplate line 2 GSG- Probe Top-View ground Cross Section of the µw-port Power Distribution Networks in LTCC / RK_ PU / IMAPS
4 Transition: Probe Pad 50Ω Stripline 3D View of Simulation model Power Distribution Networks in LTCC / RK_ PU / IMAPS
5 Transition: Probe Pad 50Ω Stripline Simulation Results: 0 [db] S 11-5 S Top View: Ω Microstrip 50 Ω Stripline f in GHz Power Distribution Networks in LTCC / RK_ PU / IMAPS
6 Antenna Measurement in Anechoic Chamber Patch Antenna Positioner Absorbers Power Distribution Networks in LTCC / RK_ PU / IMAPS
7 Components Wilkinson Power Divider Transmission lines Microstrip Triplate Resistor Patch Antenna Active Devices Power Distribution Networks in LTCC / RK_ PU / IMAPS
8 Wilkinson Power Divider R = 2Z L Z L 2 λ/4 Input Port Power Distribution Networks in LTCC / RK_ PU / IMAPS
9 Power Dividers on LTCC Wilkinson Power Dividers and T-Junctions Test Structures 2x2 Patch Antenna 4x4 Patch Antenna Power Distribution Networks in LTCC / RK_ PU / IMAPS
10 100Ω Resistor on LTCC Thickfilm: 100 Ω paste from FERRO Thinfilm: Alumina SMD, Flip-Chip SMD 0201: soldered resistor size: ca. 260 x 520 µm Real {Z 11 } / Ω SMD 0201 Thickfilm: post-fired Thickfilm: co-fired test structure: 1 x 100 Ω with via Frequency / GHz Thinfilm, SMD Power Distribution Networks in LTCC / RK_ PU / IMAPS
11 Wilkinson Divider on LTCC 0 S-Parameters / db S S 11 Thinfilm, SMD Thickfilm, co-fire SMD 0201 Thickfilm, post-fire Simulation S 11 S Frequency / GHz Power Distribution Networks in LTCC / RK_ PU / IMAPS
12 Wilkinson Divider: Isolation S-Parameters / db S 32 Thinfilm, SMD Thickfilm, co-fire SMD 0201 Thickfilm, post-fire Simulation S Frequency / GHz Power Distribution Networks in LTCC / RK_ PU / IMAPS
13 1:8 Divider LTCC vs. PTFE LTCC: DuPont 951 PTFE Composite: RT/Duroid 6002 waveguide triplate: Microstrip line: thickfilm Au Cu permittivity sheet resistance 5 mω (Au) of conductor 3 mω (Ag) 1.1 mω (½ oz. Cu) 50Ω-line width 425 µm 1950 µm line loss factor 0.24 db/cm db/cm line length 46 mm 144 mm total line losses 1.1 db 0.55 db outer dimensions x 67 x 0.8* 58 x 24 x 0.7 [mm] 200x 90 x 14** weight g 215 g TCE [ppm/k] * 24** Comparison of 1:8-divider networks in LTCC and PTFE technology for 10GHz + no connectors * PTFE substrate ** Al housing Power Distribution Networks in LTCC / RK_ PU / IMAPS
14 1:30 Divider on PTFE Length 650 mm 25,6 Power Distribution Networks in LTCC / RK_ PU / IMAPS
15 Patch Antenna 2x2 and 4x4 patch antenna with different feeding networks T power divider Wilkinson power divider with thick thick film film resistors thin thin film film resistors SMD resistors measured gain: 14.5 dbi (4x4 patches) 8.2 dbi (2x2 patches) measured matching about 15 db measured efficiency about 65 % ISM-Band: GHz Power Distribution Networks in LTCC / RK_ PU / IMAPS
16 2x2 Patch Antenna 2 x 2 Patches aperture coupling microstriplines ground mesh Wilkinson-dividers Patch Slot Ground RF-Signal Power Distribution Networks in LTCC / RK_ PU / IMAPS
17 2x2 Patches, E-Plane 0-10 with GHz Ampl. rel. to Max / db front view E-plane back view measurement simulation* 20 x 20 mm Angle / deg * simulation method: MOM, Ensemble Power Distribution Networks in LTCC / RK_ PU / IMAPS
18 2x2 Patches, E- Plane Ampl. rel. to Max / GHz co-fired thin-film SMD post-fired t-junction E-plane front view Angle / deg 20 x 20 mm 2 Power Distribution Networks in LTCC / RK_ PU / IMAPS
19 4x4 Patches, E- Plane 0-10 with GHz Ampl. rel. to Max / db front view E-plane back view measurement simulation* 35 x 35 mm Angle / deg * simulation method: MOM, Ensemble Power Distribution Networks in LTCC / RK_ PU / IMAPS
20 4x4 Patches, E- Plane Ampl. rel. to Max / GHz co-fired thin-film SMD post-fired t-junction E-plane front view Angle / deg 35 x 35 mm 2 Power Distribution Networks in LTCC / RK_ PU / IMAPS
21 System Integration on LTCC Signal Distribution Combiner Antenna Beam 1...n Beam-Control Beam-Control Power Distribution Networks in LTCC / RK_ PU / IMAPS
22 Summary Thickfilm resistors and conductors can be used in microwave feeding networks High degree of integration Economic Power Distribution Networks in LTCC / RK_ PU / IMAPS
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