BAT30. Small signal Schottky diodes. Features. Description
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1 BT30 Small signal Schottky diodes SOD-323 SOD-523 SOD-923 SOT-23 SOT-323 BT30JFILM (Single) BT30KFILM (Single) BT30LFILM (Single) BT30FILM (Single) BT30FILM (Common anode) BT30SFILM (Series) BT30CFILM (Common cathode) BT30WFILM (Single) BT30CWFILM (Common cathode) BT30WFILM (Common anode) BT30SWFILM (Series) Features Datasheet - production data Very low conduction losses Negligible switching losses Low forward and reverse recovery times Extremely fast switching Surface mount device Low capacitance diode Description The BT30 series uses 30 V Schottky barrier diodes encapsulated in a wide range of packages such as SOD-323, SOD-523, SOD-923, SOT-23, SOT-323, or SOT-666. This device is specially suited for switching mode applications needing low forward voltage drop diodes. Table 1. Device summary Symbol I F V RRM C(typ) Value 300 m 30 V 14 pf T j (max) 150 C SOT-666 BT30-07P6FILM (2 parallel diodes) BT30-09P6FILM (2 opposite diodes) Configurations in top view pril 2014 DocID12564 Rev 4 1/14 This is information on a product in full production.
2 Characteristics BT30 1 Characteristics Table 2. bsolute ratings (limiting values at T j = 25 C, unless otherwise specified) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 30 V I F Continuous forward current 300 m I FSM Surge non repetitive forward current t p = 10 ms Sinusoidal 1 T stg Storage temperature range -65 to +150 C T j Maximum operating junction temperature 150 C T L Maximum soldering temperature 260 C Table 3. Thermal parameters Symbol Parameter Value Unit SOT R th(j-a) Junction to ambient (1) SOT-323, SOD-323, 550 SOD-523, SOT SOD C/W 1. On epoxy printed circuit board with recommended pad layout Table 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit V R = 5 V I R (1) Reverse leakage current T j = 25 C V R = 10 V V R = 25 V V R = 30 V µ T j = 70 C VR = 10 V T j = 85 C I F = 0.1 m I F = 1 m I F = 10 m V F (2) Forward voltage drop T j = 25 C I F = 30 m mv I F = 100 m I F = 200 m I F = 300 m Pulse test: t p = 5 ms, δ < 2 % 2. Pulse test: t p = 380 µs, δ < 2 % 2/14 DocID12564 Rev 4
3 BT30 Characteristics Table 5. Dynamic characteristics Symbol Parameter Test conditions Min. Typ Max. Unit V R = 0 V, F = 1 MHz C Diode capacitance V R = 1 V, F = 1 MHz pf V R = 10 V, F = 1 MHz Figure 1. Power dissipation versus average forward current Figure 2. verage forward current versus ambient temperature (δ = 1) P (W) 0.35 I F(V) () δ=0.05 δ=0.1 δ=0.2 δ=0.5 δ= T 0.10 T I F(V) () δ=tp/t tp δ=tp/t tp T amb ( C) Figure 3. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration Z th(j-a) /R th(j-a) Single pulse SOT-23 Z th(j-a) /R th(j-a) Single pulse SOT-323/SOD-323 Epoxy printed board FR4 Copper surface = 2.25 mm 2 Coppr thickness = 35 µm lumine substrate 10 x 8 x 0.5 mm t P(s) 1.E-03 1.E+01 1.E+02 1.E-03 t P(s) 1.E-03 1.E+01 1.E+02 1.E+03 DocID12564 Rev 4 3/14 14
4 Characteristics BT30 Figure 5. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration Z th(j-a) /R th(j-a) Single pulse SOT-666 Epoxy printed board FR4 Coppr thickness = 35 µm Z th(j-a) /R th(j-a) Single pulse SOD-923 t P(s) t P(s) 1.E-03 1.E+01 1.E-03 1.E+01 1.E+02 1.E+03 Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 8. Thermal resistance junction to ambient versus copper surface under each lead (SOD-923) Z th(j-a) /R th(j-a) Single pulse SOD-523 Epoxy printed board FR4 Coppr thickness = 35 µm R th(j-a) ( C/W) Epoxy printed board FR4 Copper thichness = 35 µm E-03 t P(s) 1.E-03 1.E S CU(cm²) Figure 9. Thermal resistance junction to ambient versus copper surface under each lead (SOD-323) Figure 10. Leakage current versus reverse applied voltage (typical values) 600 R th(j-a) ( C/W) IR (µ) 1.E+04 Epoxy printed board FR4 Copper thichness = 35 µm 1.E+03 T j =150 C 500 T j =125 C 1.E+02 T j =85 C E S CU(mm²) T j =25 C V R (V) /14 DocID12564 Rev 4
5 BT30 Characteristics Figure 11. Relative variation of reverse leakage current versus junction temperature (typical values) Figure 12. Junction capacitance versus reverse applied voltage (typical values) 1.E+04 1.E+03 I R [T j ]/I R [T j =25 C] V R =30 V 100 C(pF) F=1 MHz V OSC =30 mv RMS T j =25 C 1.E+02 1.E T j( C) V R(V) Figure 13. Forward voltage drop versus forward current (typical values) Figure 14. Forward voltage drop versus forward current (typical values) 1.E+01 I FM () 1.E+01 I FM () T j =150 C T j =125 C T j =25 C T j =85 C 1.E-03 T j =-40 C 1.E-03 1.E-04 V FM(V) E-04 V FM(V) DocID12564 Rev 4 5/14 14
6 Ordering information scheme BT30 2 Ordering information scheme Figure 15. Ordering information scheme BT30 xx xx FILM Signal Schottky diodes VRRM = 30 V Configuration Blank = Single diode = Common anode C = Common cathode S = Series diodes 07 = Parallel diodes 09 = Opposite diodes Package Blank = SOT-23 J = SOD-323 K = SOD-523 L = SOD-923 P6 = SOT-666 W = SOT-323 Packing FILM = Tape and reel 6/14 DocID12564 Rev 4
7 BT30 Package information 3 Package information Epoxy meets UL94, V0 Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPCK packages, depending on their level of environmental compliance. ECOPCK specifications, grade definitions and product status are available at: ECOPCK is an ST trademark. Table 6. SOD-323 dimensions Dimensions Ref. Millimeters Inches H b 1 Min. Max. Min. Max. E D b c Q1 c D E L H L Q Figure 16. SOD-323 footprint (dimensions in mm) DocID12564 Rev 4 7/14 14
8 Package information BT30 Table 7. SOD-523 dimensions Dimensions E 0.15 M C B Ref. Millimeters Inches E1 B Min. Typ. Max. Min. Typ. Max. 2xb D SETING PLNE C 0.20 M C B L R0.1 c 7 8 E E D b c L1 L L Figure 17. SOD-523 footprint (dimensions in mm) /14 DocID12564 Rev 4
9 BT30 Package information Table 8. SOD-923 dimensions Dimensions L Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. C b c b D D E E1 E E L Figure 18. SOD-923 footprint (dimensions in mm) DocID12564 Rev 4 9/14 14
10 Package information BT30 Table 9. SOT-23 dimensions Ref. Millimeters Dimensions Inches E Min. Max. Min. Max B e e1 D B c S D e e H L c E H L 0.6 typ typ. S Figure 19. SOT-23 footprint (dimensions in mm) /14 DocID12564 Rev 4
11 BT30 Package information Table 10. SOT-323 dimensions Dimensions Ref. Millimeters Inches E Min. Typ. Max. Min. Typ. Max b e D b c D E e c θ H L H L q Figure 20. SOT-323 footprint (dimensions in mm) DocID12564 Rev 4 11/14 14
12 Package information BT30 Table 11. SOT-666 dimensions Dimensions L1 b1 Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. L3 b D E b b E L2 3 D E E e L e L L Figure 21. SOT-666 footprint (dimensions in mm) /14 DocID12564 Rev 4
13 BT30 Ordering information 4 Ordering information Table 12. Ordering information Order code Marking Package Weight Base qty Packing mode BT30-07P6FILM P3 SOT-666 Parallel 2.9 mg 5000 Tape and reel BT30-09P6FILM Q3 SOT-666 Opposite 2.9 mg 5000 Tape and reel BT30FILM BT30WFILM BT30CFILM C30 SOT-23 Common anode SOT-323 Common anode SOT-23 Common cathode 10 mg 3000 Tape and reel 6 mg 3000 Tape and reel 10 mg 3000 Tape and reel BT30CWFILM C30 SOT-323 Common cathode 6 mg 3000 Tape and reel BT30FILM B30 SOT-23 Single 10 mg 3000 Tape and reel BT30JFILM 30 SOD-323 Single 5 mg 3000 Tape and reel BT30KFILM 30 SOD-523 Single 1.4 mg 3000 Tape and reel BT30LFILM 31 SOD-923 Single 0.56 mg Tape and reel BT30SFILM S30 SOT-23 Serial 10 mg 3000 Tape and reel BT30SWFILM S30 SOT-323 Serial 6 mg 3000 Tape and reel BT30WFILM B30 SOT-323 Single 6 mg 3000 Tape and reel 5 Revision history Table 13. Document revision history Date Revision Changes 24-Jul First issue 08-Jul dded SOD-923 package. Table 12 sorted on alphabetic sequence of order code. Updated ECOPCK statement. 13-Oct Updated Table 7 quote L1 from 0.10 to pr dded Pin 1 anode marker to SOT-666 package graphics. Updated Table 2: bsolute ratings (limiting values at T j = 25 C, unless otherwise specified). DocID12564 Rev 4 13/14 14
14 BT30 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. ll ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS ND CONDITIONS OF SLE ST DISCLIMS NY EXPRESS OR IMPLIED WRRNTY WITH RESPECT TO THE USE ND/OR SLE OF ST PRODUCTS INCLUDING WITHOUT LIMITTION IMPLIED WRRNTIES OF MERCHNTBILITY, FITNESS FOR PRTICULR PURPOSE (ND THEIR EQUIVLENTS UNDER THE LWS OF NY JURISDICTION), OR INFRINGEMENT OF NY PTENT, COPYRIGHT OR OTHER INTELLECTUL PROPERTY RIGHT. ST PRODUCTS RE NOT DESIGNED OR UTHORIZED FOR USE IN: () SFETY CRITICL PPLICTIONS SUCH S LIFE SUPPORTING, CTIVE IMPLNTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONL SFETY REQUIREMENTS; (B) ERONUTIC PPLICTIONS; (C) UTOMOTIVE PPLICTIONS OR ENVIRONMENTS, ND/OR (D) EROSPCE PPLICTIONS OR ENVIRONMENTS. WHERE ST PRODUCTS RE NOT DESIGNED FOR SUCH USE, THE PURCHSER SHLL USE PRODUCTS T PURCHSER S SOLE RISK, EVEN IF ST HS BEEN INFORMED IN WRITING OF SUCH USGE, UNLESS PRODUCT IS EXPRESSLY DESIGNTED BY ST S BEING INTENDED FOR UTOMOTIVE, UTOMOTIVE SFETY OR MEDICL INDUSTRY DOMINS CCORDING TO ST PRODUCT DESIGN SPECIFICTIONS. PRODUCTS FORMLLY ESCC, QML OR JN QULIFIED RE DEEMED SUITBLE FOR USE IN EROSPCE BY THE CORRESPONDING GOVERNMENTL GENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. ll other names are the property of their respective owners STMicroelectronics - ll rights reserved STMicroelectronics group of companies ustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of merica 14/14 DocID12564 Rev 4
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