Surface Mount > 200W > SMF5.0AT1G Series. Description. Features
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1 SMF.TG Series Pb OBSOLETE/EOL Description DTE June/3/8 PCN/ECN# LFPCN446 REPLCED BY SMF Series The SMF.TG Series is designed to protect voltage sensitive components from high voltage, high energy transients. Excellent clamping capability, high surge capability, low zener impedance and fast response time. Because of its small size, it is ideal for use in cellular phones, portable devices, business machines, power supplies and many other industrial/consumer applications. Features Stand off Voltage: 8 Volts Peak Power ms (SMF. SMF8) Low Leakage imum Ratings and Thermal Characteristics Rating Response Time is Typically < ns Symbol Value Unit imum Ppk Dissipation (PW / µs) (Note ) SMF. SMF8 PPK W imum Ppk T = C, (PW 8/ µs) (Note ) PPK W PD 38 mw 4. mw/c R8J 3 C/W TJ, Tstg to + DC Power T = C (Note 3) Derate bove C Thermal Resistance from Junction to mbient (Note 3) ESD Rating of Class 3 (> 6 kv) per Human Body Model ESD Rating of Level 4 (8 kv Contact Discharge) per EC6 4 EFT (Electrical Fast Transients) Rating of 4 per EC6 4 4 Low Profile imum Height of. mm Small Footprint Footprint rea of 8.4 mm Supplied in 8 mm Tape and Reel 3, Units per Reel Cathode ndicated by Polarity Band Operating and Storage Temperature Range C Lead Orientation in Tape: Cathode Lead to Sprocket Holes Bi-directional These s are Pb Free and are RoHS Compliant Stresses exceeding imum Ratings may damage the device. imum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Functional Diagram. Non repetitive current pulse at T = C, per waveform of Figure.. Non repetitive current pulse at T = C, per waveform of Figure Mounted with recommended minimum pad size, DC board FR 4. Cathode node dditional nformation Uni-directional Datasheet Resources Samples
2 -V Curve Characteristics (T = C unless otherwise noted, VF = 3. F (Note 4) = ) Symbol Parameter PP imum Reverse Peak Pulse Current VC Clamping PP VRWM V Working Peak Reverse Voltage R imum Reverse Leakage VRWM VBR Breakdown T T Test Current F Forward Current VF Forward F 4. / sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. Ratings and Characteristic Curves Figure. Pulse Rating Curve Figure. X µs Pulse Waveform, tr. t ʺ s tp., t tr PEK VLUE 8 s PULSE WDTH (tp) S DEFNED S THT PONT WHERE THE PEK CURRENT DECY = 8 s 6 HLF VLUE s Figure 4. Pulse Derating Curve Figure 3. 8 X µs Pulse Waveform 6 6 tp
3 Figure. Typical Derating Factor for Duty Cycle Figure 6. Steady State Power Derating.. s.. s Figure 7. Forward Voltage Figure 8. Capacitance vs. Working Peak Reverse Voltage...6.
4 Electrical Characteristics (TL = 3C unless otherwise noted, VF =. T VRWM VC() PP() () m (µ) (V) (Note 7) KP SMF8.G KR SMF9.G KV SMFG KX SMFG KZ SMFG LE SMF3G LG SMF4G LK SMFG LM SMF8G LT SMFG LV SMFG LX SMF4G LZ SMF6G ME SMF8G MG SMF3G MK SMF33G MM SMF36G MP SMF48G MX SMFG MZ SMF8G NG Marking VRWM VRWM V μ SMF.G KE SMF6.G KG 6 4 SMF6.G KK 6. SMF7.G KM SMF7.G T (V) (Note 6). transient suppressor is normally selected according to the Working Peak Reverse Voltage (VRWM) which should be equal to or greater than the DC or continuous peak operating voltage level. 6. VBR measured at pulse test current T at ambient temperature of C. 7. Surge current waveform per Figure and derate per Figure 3.
5 Dimensions Soldering Footrpint E D POLRTY NDCTOR OPTONL S NEEDED END VEW TOP VEW HE ORDERNG NFORMTON c SDE VEW X X L Package b SOD 3FL (Pb Free) SMFxxxTG BOTTOM VEW Dim nches Millimeters Shipping 3, / Tape & Reel Flow/Wave Soldering (Solder Dipping) b c D E L HE NOTES: 6ºC Meets MSL Requirements Peak Temperature : Physical Specifications Case Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V Lead Finish % Matte Sn (Tin) Mounting Position ny. DMENSONNG ND TOLERNCNG PER NS Y4.M, 98.. CONTROLLNG DMENSON: MLLMETER. 3. DMENSONS ND B DO NOT NCLUDE MOLD FLSH. 4. DMENSONS D ND J RE TO BE MESURED ON FLT SECTON OF THE LED: BETWEEN. ND. MM FROM THE LED TP. Part Marking System Disclaimer Notice - nformation furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at:
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