LXA20T600 Qspeed Family

Transcription

1 Qspeed Family 6 V, 2 A X-Series PFC Diode Product Summary I F(AVG) 2 A V RRM 6 V Q RR (Typ at 1 C) 14 nc I RRM (Typ at 1 C). A Softness t b /t a (Typ at 1 C).4 Pin Assignment General Description This device has the lowest Q RR of any 6 V Silicon diode. Its recovery characteristics increase efficiency, reduce EMI and eliminate snubbers. Applications Power Factor Correction (PFC) boost diode Motor drive circuits DC-AC inverters Features A C TO-22AC RoHS Compliant Package uses Lead-free plating and Green mold compound. Halogen free per IEC Absolute Maximum Ratings Low Q RR, low I RRM, low t RR High di F /dt capable (1 A/µs) Soft recovery Benefits Increases efficiency Eliminates need for snubber circuits Reduces EMI filter component size & count Enables extremely fast switching Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Symbol Parameter Conditions Rating Units V RRM Peak repetitive reverse voltage 6 V I F(AVG) Average forward current T J = 1 C, T C = 1 C 2 A I FSM Non-repetitive peak surge current 6 Hz, ½ cycle 1 A I FSM Non-repetitive peak surge current ½ cycle of t = 28 µs Sinusoid, T C = C 3 A T J(MAX) Maximum junction temperature 1 C T STG Storage temperature to 1 C Lead soldering temperature Leads at 1.6 mm from case, 1 sec 3 C P D Power dissipation T C = C 1 W V RRM Peak repetitive reverse voltage 6 V Thermal Resistance Symbol Resistance from: Conditions Rating Units R θja Junction to ambient TO C/W R θjc Junction to case TO C/W June 21

2 Electrical Specifications at T J = C (unless otherwise specified) Symbol Parameter Conditions Min Typ Max Units DC Characteristics I R V F Reverse current Forward voltage V R = 6 V, T J = C - - µa V R = 6 V, T J = 1 C ma I F = 2 A, T J = C V I F = 2 A, T J = 1 C V C J Junction capacitance V R = 1 V, 1 MHz pf Dynamic Characteristics t RR Q RR I RRM Reverse recovery time Reverse recovery charge Maximum reverse recovery current S Softness factor = tb ta di/dt = 2 A/µs V R = 4 V, I F = 2 A di/dt = 2 A/µs V R = 4 V, I F = 2 A di/dt = 2 A/µs V R = 4 V, I F = 2 A di/dt = 2 A/µs V R = 4 V, I F = 2 A T J = C ns T J = 1 C ns T J = C nc T J = 1 C nc T J = C A T J = 1 C -. - A T J = C T J = 1 C Note to component engineers: X-Series diodes employ Schottky technologies in their design and construction. Therefore, Component Engineers should plan their test setups to be similar to those for traditional Schottky test setups. (For additional details, see Application Note AN-3.) I F t RR dif/d t a t b.2xi RRM I RRM Figure 1. Reverse Recovery Definitions Figure 2. Reverse Recovery Test Circuit 2 Rev 1.2 6/1

3 Electrical Specifications at T J = C (unless otherwise specified) IF (A) Tj=1C Tj=C Cj (pf) V F (V) VR (V) Figure 3. Typical I F vs V F Figure 4. Typical C j vs V R 2 di F /dt=a/us 4 di F /dt=2a/us 2 4 QR R (nc) tr R (ns) di F /dt=2a/us di F /dt=a/us I F (A) I F (A) Figure. Typical Q RR vs I F at T J = 1 C Figure 6. Typical t RR vs I F at T J = 1 C IF(AV) (A) P (W) Case Temperature, TC ( o C) Case Temperature, T C ( o C) Figure 7. DC Current Derating Curve Figure 8. Power Derating Curve 3 Rev 1.2 6/1

4 IF(PEAK) (A) T C ( C) Figure 9. I F (PEAK) vs T C, f=7 khz duty cycle=1% duty cycle=3% duty cycle=% DC 1 LXA2T6 D=. D =.3.1 D=.1 Zth(j-c)/Rth(j-c) D=. D=.2 D=.1.1 D=. D=.2 Single Pulse.1 1.E-6 1.E- 1.E-4 1.E-3 1.E-2 1.E-1 1.E+ t1(sec) Figure 1. Normalized Maximum Transient Thermal Impedance 4 Rev 1.2 6/1

5 Dimensional Outline Drawings Millimeters Dim MIN MAX A A A C D E E F F H H H H H L L1-6.3 Mechanical Mounting Method Maximum Torque / Pressure specification Screw through hole in package tab 1 Newton Meter (nm) or 8.8 inch-pounds (lb-in) Clamp against package body 12.3 kilogram-force per square centimeter (kgf/cm 2 ) or 17 lbf/in 2 Soldering time and temperature: This product has been designed for use with high-temperature, leadfree solder. The component leads can be subjected to a maximum temperature of 3 C, for up to 1 seconds. See Application Note AN-33, for more details. Ordering Information Part Number Package Packing LXA2T6 TO-22AC units/tube The information contained in this document is subject to change without notice. Rev 1.2 6/1

6 Revision Notes Date 1. Released by Qspeed 9/9 1.1 Converted to Power Integrations Document 1/ Stop Point of t RR error corrected due to typo in Figure 1 11/ Updated with new Brand Style. 6/1 6 Rev 1.2 6/1

7 For the latest updates, visit our website: Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. Patent Information The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations patents may be found at Power Integrations grants its customers a license under certain patent rights as set forth at Life Support Policy POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein: 1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or death to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. The PI Logo, TOPSwitch, TinySwitch, LinkSwitch, LYTSwitch, InnoSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero, HiperPFS, HiperTFS, HiperLCS, Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, FluxLink, StackFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. Copyright 21 Power Integrations, Inc. Power Integrations Worldwide Sales Support Locations WORLD HEADQUARTERS 24 Hellyer Avenue San Jose, CA 9138, USA. Main: Customer Service: Phone: Fax: usasales@power.com GERMANY Lindwurmstrasse , Munich Germany Phone: Fax: eurosales@power.com JAPAN Kosei Dai-3 Building , Shin-Yokohama, Kohoku-ku, Yokohama-shi, Kanagawa Japan Phone: Fax: japansales@power.com TAIWAN F, No. 318, Nei Hu Rd., Sec. 1 Nei Hu District Taipei 11493, Taiwan R.O.C. Phone: Fax: taiwansales@power.com CHINA (SHANGHAI) Rm 241, Charity Plaza, No. 88, North Caoxi Road, Shanghai, PRC 23 Phone: Fax: chinasales@power.com INDIA #1, 14 th Main Road Vasanthanagar Bangalore-62 India Phone: Fax: indiasales@power.com KOREA RM 62, 6FL Korea City Air Terminal B/D, 19-6 Samsung-Dong, Kangnam-Gu, Seoul, Korea Phone: Fax: koreasales@power.com UK First Floor, Unit 1, Meadway Court, Rutherford Close, Stevenage, Herts. SG1 2EF United Kingdom Phone: +44 () Fax: +44 () eurosales@power.com CHINA (SHENZHEN) 17/F, Hivac Building, No. 2, Keji Nan 8th Road, Nanshan District, Shenzhen, China, 187 Phone: Fax: chinasales@power.com ITALY Via Milanese 2, 3 rd. Fl. 299 Sesto San Giovanni (MI) Italy Phone: Fax: eurosales@power.com SINGAPORE 1 Newton Road, #19-1/ Goldhill Plaza Singapore, 389 Phone: Fax: singaporesales@power.com 7 Rev 1.2 6/1