From Technologies to Market. LED Lighting Module. Technology, Industry. and Market Trends. Sample. Market & Technology Report

Transcription

1 From Technologies to Market LED Lighting Module Technology, Industry and Market Trends Sample Market & Technology Report

2 TABLE OF CONTENT OF THE REPORT (1/4) o Authors of the Report P6 o Objectives of the Report P7 o Acronym P8 o Executive Summary P9 o Definitions and Uses of LED Modules P33 Definitions LED Module in the Global LED Value Chain Luminaire Design Approach with a LED Module Benefits of LED Module for Integrator Overview Focus on Time and Cost Savings o International Standards for LED Modules P41 Introduction Overview of Main Standards International vs. Local Standards - Deviations & Trends o LED Module Integration into Lighting Systems (1/2) P45 System Integration Engineering Thermal Integration Electrical Insulation Rules Overview Details on Driver Classes Zhaga Guideline for Interchangeability of Light Sources Consortium Members The Dilemma o LED Module Integration into Lighting Systems (2/2) P45 The Different Types of LED Modules Taxonomy Middle Power vs. High Power vs. COB vs. AC vs. Custom Positioning Geometry and Size Electrical Interfaces LED Module vs. LEDi Module The Case of Flexible LED Strips o Analysis of Main Functions in LED Modules (1/2) P62 Introduction System Structure Parameter Interdependence Thermal Management Why Thermal Management is Required for LED Systems? Substrates/PCB Heatsink and Thermal Interface Materials Analysis of Different Thermal Interface Materials Heatsink technologies Heatsink Design vs. LED Module Technology Major Trends in Thermal Management Importance of Thermal Management for LED Module Reliability Optical Design A Large Panel of Optical Solutions Optical Generic Architecture in Lighting Collimators, Lenses and Refractors - Materials & Process Focus on Reflectors Focus on Diffusers Mixing Chamber Optical Architecture vs. LED Module Technology Overview Analysis per Application 2

3 TABLE OF CONTENT OF THE REPORT (2/4) o Analysis of Main Functions in LED Modules (2/2) P62 Power Supply and Drivers Overview of Drivers The Different Driver Topologies Driver Topology vs. LED Module Technology AC Drivers Low Voltage DC Minigrids Driver Reliability Trends o Analysis of Middle Power LED Modules P94 Drivers for Integration Why Middle Power LEDs for LED Modules? Overview of Standard Design Type of LEDs Performance Aspects Substrate/PCB Thermal Management and Reliability Power and Voltage Drivers Optics Focus on AC Middle Power LED Module Introduction Impact on Design Efficacy Cost Aspects Performance Standards for Luminaire o Analysis of High Power LED Modules (1/2) P112 Introduction High Power LEDs vs. Middle Power LEDs High Power LED Modules vs. Middle Power LED Modules o Analysis of High Power LED Modules (2/2) P112 The Different Type of High Power LED Modules High Brightness and Large (HBL) Module Overview Substrate/PCB Drivers and Electrical Connections Thermal Management Optics High Quality of Light (HQL) Module Overview Beating CDM Lamp Evolution Multichannel Technology Phosphor Technology High Brightness and Compact (HBC) Module o Analysis of COB LED Modules (1/2) P126 Introduction COB Technology - A Compromise Solution Main COB Design Choices Substrate/PCB Chip Layout Trends High Lumen Density in COB Positioning of High Density COB Market Segmentation and Uses New COB Devices COB Evolution and Roadmap Ecosystem Interconnection Options for COB Comparison of Technology 3

4 TABLE OF CONTENT OF THE REPORT (3/4) o Analysis of COB LED Modules (2/2) P126 Holder Reliability Diversity and Compatibility Standardization Zhaga Influence Optics Overview Integration Management of System Performance Drivers Thermal Behavior Performance Standards for Luminaires o Analysis of Flexible LED Strips P152 Flexible LED Strips at a Glance Flexible LED Strips vs. Rigid LED Strips Status of the Industry Differentiation Factors Overview Focus on Large Variety of Flexible LED Strip Types Focus on Quality Criteria Focus on Specific Products and Innovative Solutions Focus on Price Voltage Connectors Dust/Water Protection Adhesive o LED Lighting Module Industry and Market Trends (1/2) P167 Introduction - Packaged LED Industry and Market Trends Introduction to LEDs History of LED Industry Overview Recent Trends Market Trends LED Adoption Rate (Comparison 2014 vs. 2020) Focus on Display Applications Focus on General Lighting Applications LED Industry in Main Challenges LED Lighting Module Market Trends Application vs. Module Technology Market Volume and Revenue Introduction Total Market (Excluding Flexible LED Strips) Split by Module Technology (Excluding Flexible LED Strips) The Case of Flexible LED Strips Market Volume and Revenue Trends in ASP Conclusion LED Lighting Module Industry Trends History of the LED Lighting Module Industry The SSL Chasm Main LED Module Suppliers (Excluding COB and Flexible LED Strips) Main COB LED Suppliers Main Flexible LED Strip Suppliers Non-COB LED Module Supplier vs. COB LED Module Supplier Origin of Players Overview Positioning of some LED Module Suppliers Example of Vossloh Schwabe 4

5 TABLE OF CONTENT OF THE REPORT (4/4) o LED Lighting Module Industry and Market Trends (2/2) P167 LED Lighting Module Industry Trends Focus on Packaged LED Manufacturers Focus on Driver Manufacturers Focus on Optic, Luminaire and Connector Manufacturers o Conclusion P203 o Appendix - International Standards for LED Modules P209 o Appendix - Presentation of Yole Développement P216 o Appendix - Presentation of PISEO P231 5

6 OBJECTIVES OF THE REPORT TO PROVIDE A COMPREHENSIVE OVERVIEW OF ALL ASPECTS OF LED LIGHTING MODULES! - Technologies. - Markets and applications. - Main functions. - Integration into lighting systems ( ). TO ANALYZE POSITIONING OF EACH LED LIGHTING MODULE TYPE! - Middle power LED module. - High power LED module. - COB LED module. - Flexible LED strips. TO ANALYZE MAIN TECHNOLOGY IN USE FOR EACH LED LIGHTING MODULE TYPE! - Thermal management (PCB/substrate,TIM, heatsink). - Optical design. - Power supply and driver. TO ANALYZE LED LIGHTING MODULE INDUSTRY STRUCTURE AND FUTURE TRENDS! TO PROVIDE VOLUME AND MARKET SIZE FOR LED LIGHTING MODULE! 6

7 DEFINITIONS AND USES OF LED MODULES LED Module in the Global LED Value Chain LED MODULES LED Die/Chip Packaged LED Light/LED Module Light Source (Module + Driver) Luminaire Light System/ Solution Lumileds From LED chip to LED lighting system, several steps of value drive the lighting industry. LED modules represent a bridge between the packaged LED offer and the luminaire shaped product. A significantly integrated LED package reduces the level of know-how necessary for lighting manufacturers, thereby enabling conventional lighting system manufacturers to have easier access to the technology. Basically, we can consider an LED module as a unit containing one or more LEDs with mechanical and optical components. It may contain additional components (e.g., connectors, resistors, ESD protection devices, lenses ). Generally, LED module is considered a replaceable item for use in a luminaire. An LED module represents a component/sub-system optimized for a given application scope. Philips Lighting 7

8 LED MODULE INTEGRATION INTO LIGHTING SYSTEMS System Integration System integration is based on standardized interfaces and building blocks: LED module, driver, optic, electronic ( ). The design effort of the integrator is mainly focused on: The interfaces between these building blocks. The system performance qualification. Modular approach enable an easier integration of LED modules. Please note that lower efforts can be done on the LED module qualification which is under the responsibility of the LED module manufacturer / supplier. Modular architecture can be developed to easier upgrade of the building blocks ( allowing for short and efficient product development / evolution). With this strategy, companies benefit from: Improvement of LED performance (lm/w). LED cost decrease ($/lm). PCB / Connector Thermal System Packaged LED Driver Optic Mechanical Assembly Work also for other components, such as driver ( ). Technology leverage Same LED module for different applications. Thermal redesign. Optics redesign (and improvements). 8

9 LED MODULE INTEGRATION INTO LIGHTING SYSTEMS Zhaga - Guideline for Interchangeability of Light Sources (1/2) The Zhaga Consortium is an organization enabling the interchangeability of LED light sources made by different manufacturers. Zhaga establishes interface specifications for different form factors. For each form factor, Zhaga s specifications enable interchange of components from different suppliers. Zhaga define following interfaces: Mechanical interface. Photometric interface. Thermal interface. Electrical interface. * Books in development as of October 2015 Overview of Zhaga books Source: Zhaga Example of compatible spot modules from Zhaga book 3 Source: Zhaga 9

10 MAIN FUNCTIONS IN LED MODULES System Structure (1/2) LED Lighting Module Function Associated Components / Materials Thermal Management To dissipate heat produced by LEDs Substrate / PCB Thermal Interface Management / Material Heatsink Optical Design To shape the light emitted from LED Collimator Reflector Lens Plates Diffusers Power Supply & Driver To realize AC to DC conversion External Driver Integrated Driver 10

11 THERMAL MANAGEMENT IN LED MODULES Heatsink Design vs. LED Module Technology Although the heatsink contributes to the design of the luminaire, it remains a part dedicated to cooling the whole system. Shape, size, weight are directly the consequence of the total embedded thermal power and the thermal power density. Middle Power modules have low cooling needs due to their large surfaces and low embedded power. Some lighting products like T5 tubes don t need a heatsink. COB modules concentrate the light output on a small area, requiring good design of the thermal cooling system for performance and reliability management. High Power modules in general require large and efficient heatsinks. Active cooling is an option to reduce the size while getting the required thermal performance. Maximum heatsink required performance No heatsink needed or low heatsink performance Moderate heatsink performance Passive cooling High heatsink performance Active cooling 11

12 OPTICAL DESIGN FOR LED MODULES Optical Architecture vs. LED Module Technology - Analysis per Application In practice, creativity of solutions covers almost all configurations. Middle Power LED Module High Power LED Module COB Module High Bay Can be used but not mainstream Lens plate or collimators Technology XX Low Bay Technology XX Technology XX Can be used but not mainstream Technology XX Spot Lighting Lens plates and collimators Technology XX Technology XX Troffer Downlight Linear Technology XX Diffusers Technology XX Technology XX Lens plates or collimators Technology XX Technology XX Can be used but not mainstream Can be used but not mainstream Can be used but not mainstream Technology XX Can be used but not mainstream Outdoor Can be used but not mainstream Technology XX Reflectors Can be used but not mainstream Task Technology XX Diffusers Can be used but not mainstream Wall Pack Technology XX Reflectors Technology XX Technology XX Can be used but not mainstream 12

13 LED MODULE INTEGRATION INTO LIGHTING SYSTEMS The Different Types of LED Modules - Positioning Middle Power LED Module: The middle power LED is a solution offering low power consumption and high flux. High flux High Power LED Module: The high power LED is a solution offering small lighting emitting surface and high flux. COB LED Module: The COB module architecture is a solution offering good compromise between size of the light emitting surface, flux power and power consumption. COB MODULE The choice of the right LED module solution depends on requirements at application level, cost level ( ). Low consumption LOW POWER LED / MODULE Small light emitting surface 13

14 MIDDLE POWER LED MODULE Performance Aspects Photometric performances are similar between modules. Differences can be observed on the diversity (flux, CRI ), the choice of the LEDs, the pattern, the connections ( ). The table below highlight key characteristics of middle power LED modules and associated general trends: Characteristics Efficacy (lm/w) Flux Range (lm) General trend In relation with LED performances. Efficacy stays in a range of XXlm/W to XXlm/W. Driven by the application. Flux range is in average between XX lm to XX lm. CCT (K) 3000K, 3500K, 4000K or 5000K. CRI Color Consistency (SDCM) Mostly CRI 80. CRI 90 in specific cases. X SDCM at initial time. Can increase up to X X SDCM after aging. Analysis flux vs. efficacy of different middle power LED modules Source: Piseo Lifetime (hours) Not systematically specified. 14

15 MIDDLE POWER LED MODULE Substrate/PCB MCPCB is the solution of choice for middle power LEDs MCPCB offers valuable thermal and mechanical properties compared to glass epoxy PCBs. Various thicknesses of substrates are available. Most common thicknesses are 1.1mm and 1.6mm. Dielectric thickness varies between 70µm to 200µm. This parameter has an influence on the thermal performances and the breakdown voltage. Usual copper thickness is 35µm (1oz). The amount of power to dissipate requires a good enough thermal dissipation/management through the PCB. Technology Standard Glass Epoxy Thermal Conductivity 1 (W/m.K) (R th : XX K/W) Voltage Breakdown (kv) XX XX Cost ($/m²) Low (< $XX) Pros Low cost. Multiple suppliers.. Cons MCPCB architecture Source: The Bergquist Company (now part of Henkel) FR4 + Thermal Vias In between Depend on number of vias Non Available Medium. Multiple suppliers.. MCPCB 1-XX typically R th : XX K/W XX XX High ($XX $XX) Better performance than standard glass epoxy PCB. Cheaper than ceramic PCB... 15

16 HIGH POWER LED MODULES Introduction - High Power LED Modules vs. Middle Power LED Modules Strategy of middle power LED module manufacturers is driven by cost aspect and based on mass production of middle power LEDs (i.e., economy of scale), resulting in a standard offer with limited diversity and flux range. High power modules address applications having different needs (or combinations of needs): Need XX. Need XX. Need XX. The market is characterized by less volumes, but higher value and selling price. Type of Application Application XX Spot Lighting Troffer & Linear Lighting Key Requirements LED Module Used High Power Module Type High flux Application XX Application XX Task Lighting Artistic touch High efficacy For 300lux Optical control High brightness Middle Power NA Middle Power COB NA High Power NA Wall Lighting Architectural light control NA 16

17 HIGH POWER LED MODULES HBL Module - Optics High power LED modules integrate both primary and secondary optics (and can also integrate tertiary optics). High power LEDs already integrate a Silicone dome shape (encapsulant/primary optic) which is used to extract the light of the (individual) LEDs and increase the light efficacy. In general, a secondary optic is added on the module. This optic consists of a plate supporting a lens array with each lens being located in front of an LED and providing an individual light beam. Key features for a lens plate: Feature XX. Feature XX. Feature XX. Lens design, shape and material choices are managed by optical manufacturers, but the lens plate geometry is generally made under the supervision of the LED module manufacturer. LED module manufacturers offer also integrates modules combining the LED board with the optical plate. Zhaga participates in the standardization of interfaces between LED modules and optics. Lens plate for LED array Integrate module white optic 17

18 COB LED MODULE Main COB Design Choices - Chip Layout Chips are spread into series and parallel chains. The rules are similar to mid-power modules (minimum of 3 pcs for a string). CLU-56 (Citizen) CXA1304 (CREE) There is a wide variety of LED quantity and arrangement. The smallest COB has 12 chips, the biggest can have 650 chips or more. There is no real limitation in terms of number of chips. However, the chip to chip placement lowers the reabsorption of light, leading to a flux penalty. Chip number Targeted flux 20,000 lm 400 lm LES diameter 32.8 mm 6 mm Power 170 W 0.4 W COB size 38 x 38 x 1.4mm x x 1.7mm Analysis of COB products available on the market (data from CREE, LG Innotek and Lumileds) Source: Piseo 18

19 FLEXIBLE LED STRIPS Differentiation Factors - Focus on Specific Products and Innovative Solutions (1/3) Offering specific products might be a strong differentiation factor however products have to respond to a customer demand and might represent only niche markets. Parameter Typical Value (s) Differentiating Value(s) Light Output lm/m (depends on color) lm/m for white light lm/w for white light Example of Product / Manufacturer XX XX NA LED Density / XX / 60 / XX / 120 / XX (unit per meter) NA Most manufacturers Voltage 12 VDC or 24 VDC V DC Most Chinese manufacturers White Color Type 2 3 types of white (cold white, warm white, natural white) NA Most manufacturers XX Blue, Red, Green, Yellow ( ) NA White Color Choice NA XX CRI No specification or superior to 80 > XX DIFFERENTIATION STRENGTH: High Medium Low 19

20 LED LIGHTING MODULE INDUSTRY TRENDS Origin of Players - Overview (2/2) Most of the LED module manufacturers are coming from the XX field. As detailed previously, LED module manufacturers are coming from different horizons in terms of activities. However the majority of them is coming from the XX industry and the XX industry (see analysis on the right). Detailed explanations about drivers for such players to manufacture LED modules are given in the next slides. It is also important to understand that the LED module industry is strongly disparate, with: Small companies and large companies. Companies having a unique offer and companies developing large product portfolio. ( ). Analysis of origin of LED module manufacturers per activity As a very young industry, the LED module industry is not really structured at the moment! The analysis is based on the identification of main players involved in LED module manufacturing and sale (sample of more than 40 LED lighting module manufacturers 20

21 LED LIGHTING MODULE INDUSTRY TRENDS Main LED Module Suppliers (Excluding COB and Flexible LED Strips) England: XX, XX, Carclo Finland: XX, XX Russia: XX US: Cree, Bridgelux, XX, XX, XX, XX, XX, XX, XX, Lumileds The Netherlands: Philips Italy: TCI Germany: Osram, BJB, XX, XX, XX, XX Slovakia: XX South Korea: Seoul Semi., XX, XX China: XX Taiwan: XX, Lextar Austria: Vossloh-Schwabe 21

22 LED LIGHTING MODULE MARKET TRENDS In 2014, total LED lighting module market represented a size of ~$XXB. It should grow to a size of ~$XX by

23 Yole Développement From Technologies to Market 2015

24 FIELDS OF EXPERTISE Yole Développement s 30 analysts operate in the following areas Imaging Photonics MEMS & Sensors MedTech Compound Semi. LED/OLED Manufacturing Power Electronics PV Advanced Packaging 24

25 4 BUSINESS MODELS o Consulting and Analysis Market data & research, marketing analysis Technology analysis Strategy consulting Reverse engineering & costing Patent analysis o Financial services M&A (buying and selling) Due diligence Fundraising Maturation of companies IP portfolio management & optimization Blu Morpho o Reports o Media Market & Technology reports i-micronews.com website Patent Investigation and patent infringement e-newsletter analysis Technology magazines Teardowns & Reverse Costing Analysis Communication & webcast services Cost Simulation Tool Events

26 A GROUP OF COMPANIES M&A operations Due diligences Market, technology and strategy consulting Blu Morpho Fundraising Maturation of companies IP portfolio management & optimization TBA Manufacturing costs analysis Teardown and reverse engineering Cost simulation tools IP analysis Patent assessment 26

27 OUR GLOBAL ACTIVITY Blu Morpho Yole Korea Yole Japan Yole Inc. 40% of our business is in EU countries 30% of our business is in Asia 30% of our business is in North America 27

28 SERVING THE ENTIRE SUPPLY CHAIN Integrators and end-users Our analysts provide market analysis, technology evaluation, and business plan along the entire supply chain Device makers Suppliers: material, equipment, OSAT, foundries Financial investors, R&D centers 28

29 REPORTS COLLECTION Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in: MEMS & Sensors Imaging Medical technologies (MedTech) Advanced packaging Power electronics Compound semiconductors OLED, LED & Laser diode Semiconductor Manufacturing Photovoltaics Batteries Our reports are unmatched in quality and technology depth and typically include: Technology trends and evolution: costs, barriers, roadmaps, etc. Supply & value chain analysis: business models, relationships, value flows, etc. In-depth analysis of applications and market drivers: challenges, inflection points, etc. Market data ($, units, wafer starts, etc.) Every year, Yole Développement, System Plus Consulting and KnowMade publish +60 reports. Take the full benefit from our Bundle and Annual Subscription offers. 29

30 OUR 2015 PUBLISHED REPORTS LIST o o o o o MEMS & SENSORS Sensors and Data Management for Autonomous Vehicles Sensors for Wearable Electronics And Mobile Healthcare Status of the MEMS Industry Uncooled Infrared Imaging Technology & Market Trends IR Detector and Small Size Imagers High End Gyro, Accelerometers and IMU Non Volatile Memory Markets and Technology Trends IMAGING & OPTOELECTRONICS Camera Module Packaging (Vol 1: Market & Technology Trends / Vol 2 Teardowns & Reverse Engineering) Uncooled Infrared Imaging Technology & Market Trends Status of the CMOS Image Sensors MEDTECH Microfluidic for Sample Preparation Microfluidic Applications Sensors for Wearable Electronics And Mobile Healthcare COMPOUND SEMICONDUCTORS Sapphire Applications & Market 2015: from LED to Consumer Electronics Status of Wide Band Gap Material: GaN, SiC (and also AlN, Ga2O3, Diamond as a trend) GaN and SiC Devices for Power Electronics Applications LED LED Module Technologies UV LED - Technology, Manufacturing and Application Trends Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays Sapphire Applications & Market 2015: from LED to Consumer Electronics o o o POWER ELECTRONICS Power Packaging Technology Trends and Market Expectations Thermal Managment for LED and Power Power Electronics for Renewable Energy Energy Management for Smart Grid, Cities and Buildings: Opportunities for battery electricity storage solutions Status of Chinese Power Electronics Industry New Technologies and Architectures for Efficient Data Center IGBT Market and Technology Trends Status of Power Electronics Industry Status of Wide Band Gap Material: GaN, SiC (and also AlN, Ga2O3, Diamond as a trend) GaN and SiC Devices for Power Electronics Applications ADVANCED PACKAGING Advanced Packaging in Emerging Markets in China* Status of the Advanced Packaging Industry Supply Chain Readiness for Panel Manufacturing in Packaging Fan-in Wafer Level Packaging: Market and Technology Trends Flip Chip Business Update 2.5D & 3DIC Business Update* Fan-Out and Embedded Die: Technologies & Market Trends MANUFACTURING Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED Applications Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS Image Sensors Non Volatile Memory Markets and Technology Trends Reports to be decided within

31 CONTACT INFORMATION o Consulting and Specific Analysis North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc. laferriere@yole.fr Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K. katano@yole.fr RoW: Jean-Christophe Eloy, President & CEO, Yole Développement eloy@yole.fr o Report business North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc. laferriere@yole.fr Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service khamassi@yole.fr Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. onozawa@yole.fr Korea: Hailey Yang, Business Development Manager, Korean Office yang@yole.fr o Financial services o General Jean-Christophe Eloy, CEO & President eloy@yole.fr info@yole.fr Follow us on 31

32 Appendix - Presentation of PISEO 2015

33 HISTORIC & MISSION National Lighting Innovation Platform and Testing Lab Initiated in spring 2010 by CEA-LETI & Cluster Lumière members Selected as National Technological Platform and granted for public funding by the French Ministry of Industry on September 23rd, 2011 Created as an independant private company on November, 30th 2011, capital, owned by 30 shareholders 4 millions investment over ,6 millions support from French State and local Authorities Located in Lyon, France MISSION We help our clients to Create and Deploy Innovative and Performing Lighting Systems 33

34 OUR CLIENTS Manufacturers Materials LED packages LED Modules Luminaires (LED & conv.) Lamps (LED & conv.) Displays Other LED Systems (automotive, medical, ) Specifiers & Users Property developpers : buildings, shops, roads, Specifiers : architects, lighting designers, engineering offices, Retailers Installers, contractors Tenants 34

35 OUR SERVICE OFFER TESTING Photometrical Electriqal Thermal Reliability Safety TRAINING LED Technology System design Reliability Regulations Standards Applications CONSULTING R&D Reliabibility Safety Regulations Standards Applications 35

36 TESTING Photometric & electrical characterizations Luminous flux Spectral analysis & colorimetry (colour point, CCT, CRI) Light distribution Consummed power Luminous efficacy Power factor Harmonic distorsion 2D Luminance Mapping Thermal measurments Hot point with thermal camera LED junction temperature in operating conditions Thermal interface analysis Tests on demand (half, full lab day) 36

37 TESTING Performance & Reliability Critical analysis of the design and manufacturing of electronics parts Endurance and sturdiness tests X-rays Microscopy Regulation and standards compliancy CE Compliancy of lamps, modules and LED luminaires (244/2009/CE, 874/2012/CE, 1194/2012/CE) Photobiological risk (EN 62471, IEC/TR 62778, EN 60598, EN 60031) Emergency lighting (EN ) Product Certification ENEC+ testing 37

38 CONSULTING R&D Prospective & Research Concept Creation Function / Product Development Market introduction Marketing of technology Strategic Roadmapping State of the art analysis Application research Market research Technology scouting IP scouting LED, modules & electronics analysis - Opportunity study - Idea generation - Demonstrators - Proof of concept - Technology maturity grids - Functional requirements - Modelization & dimensionning - Optical design - Product and system designprototyping - Sourcing strategy - Risk management - Testing and qualification - Offer valorization - Certification - Labellization Financing Research & Innovation 38

39 CONSULTING Specific Programs Benchmarking of LED packages, lamps and luminaires Failure analysis Reliability improvement FMEA Supplier assesment Quality control Support for regional homologation (CE, UL, ) Lighting design & DIALUX simulations Ts ( C) = Set Anode I (ma) = Set Tp Vf (V) RESULTATS DES MESURES 100 ma Flux Lumineux (lm) Flux Radiométrique (W) IRC CCT (K) x y 1, ,2 24,19 210,1 0,78 97,5 2985,4 0,4392 0, ,7 23,81 204,0 0,76 97,7 2958,7 0,4397 0, ,6 23,59 199,5 0,74 97,8 2942,5 0,4399 0, ,1 23,32 193,1 0,72 97,8 2925,5 0,4399 0, ,4 23,25 189,8 0,71 97,7 2918,7 0,4398 0, ,4 23,10 186,2 0,70 97,6 2912,4 0,4398 0, ,5 22,99 182,0 0,69 97,4 2906,7 0,4396 0,

40 TRAINING Regulation & standards Implementation of LED technology for SSL lighting Reliability of LED lighting systems Basics of photometry Basics of optics Understanding LED package datasheets IP for LED Systems Lighting simulation with DIALUX «A la carte» programs 40

41 EQUIPMENT Unique concentration of photometrical, electrical & thermal imaging equipment Gonio-photometer MAJANTYS for retrofit lamps 2 m Integrating sphere INSTRUMENT SYSTEMS equipped with CAS 120 spectrometer Photobiological test bench OST-300 EVERFINE (200nm-3000nm) Photo-Goniometer LMT GO DS 2000 type C equipped with CAS 140 spectrometer Thermal camera INFRATEC 50 cm integrating sphere MAJANTYS (or 5cm for LED sources) equipped B&WTEK spectrometer Video-luminancemeter LUMETRIX Non exhaustive pictures 41

42 QUALITY Quality as our foundation High precision equipments calibrated in accredited labs Quality management system according to ISO accreditation pending Photometrical and electrical tests according to international standards (EN , EN , LM-79) Regular Participation in inter-laboratory comparaison programs (eg: participation in IEA SSL inter-comparison program) 42

43 KEY ELEMENTS Highly specialized team with large experience in the lighting industry (technology, system design and integration, metrology, applications) Independant Testing Lab with cutting edge equipment Comprehensive offer (from Research to full System Qualification) Strong Partnerships : LCIE Bureau VERITAS, electrical test lab and certification body SERMA Technologie, reliability of electronic systems test and consulting YOLE Développement, strategic analysis of semi-conductor markets and consulting Institut d optique Graduate School, optical engineering graduate school Strong involvment in the development of the lighting sector Participation in light sources and luminaires standardization committees of AFNOR, CENELEC and IEC 3 professional lighting associations as shareholders (Cluster Lumière, GIL, Syndicat de l éclairage) 43