May 16, th annual spring meeting presentation abstracts and speaker biographies

Transcription

1 microphotonics industry consortium 2005 communications technology roadmap May 16, th annual spring meeting presentation abstracts and speaker biographies

2 presentation abstracts CTR Vision, Key Findings, and Expectations Lionel C. Kimerling The optical components industry stands at the threshold of a major expansion that will restructure its business processes and sustain its profitability for the next three decades. This growth will establish a costeffective platform for the partitioning of electronic and photonic functionality to extend the processing power of integrated circuits. The traditional dimensional shrink approach to the scaling of technology generations is encountering barriers in materials and power dissipation that dictate more distributed architectures. These short link interconnection requirements will cross the 10 Mb/s km threshold for optical technology during the next five years. The technology challenges involve design, fabrication, packaging, and testing. This business direction will require a major change in leadership of the industry from information transmission (telecom) to information processing (computing, imaging), and it will open significant new markets with high volume applications. It is the Roadmap consensus, however, that you can t get there from here without extraordinary cross-industry teaming. Future Economics of Photonics Jerry Hausman Ever since the bubble burst, the photonics industry has been struggling to move forward. While the decline of telecom has significantly contributed to the hardships the industry is dealing with, the broad number of applications the industry serves and consequent industry fragmentation has not helped either. In order for the photonics industry to survive, it will have to look beyond the classic approach of economies-of-scale and learning-by-doing to solve its problems. Implementing standards and reducing manufacturing costs may help, but ultimately, the industry will have to consolidate as well as increase demand by identifying new markets for photonics.

3 Current State of the Photonics Industry Michael J. Schabel Based on industry-level economic trends, the financial outlook for the photonics industry in all the major application spaces, including the communications sector, is presently stable and growing. Photonics supplier-level economic indicators, however, tell a different story where net income losses continue to be posted. In this talk, I will review possible root causes underpinning the major disconnect between industry-level and supplier-level economic indicators, and will review some key recommendations for resolving this disconnect. Roadmap: Server Optical Interconnect Needs Alan F. Benner Servers, particularly large clusters & parallel systems, have high and quickly-growing requirements for optical interconnects of various types. This presentation describes current and projected future requirements and opportunities for 2 Gb/s to 120 Gb/s optical links within data centers and computing centers, and roadmap technology and market requirements for networks supporting the range of multiple Pb/s (Petabits/sec) of optical transmission capacity. Vision for Optoelectronics in the Automobile Thomas M. Forest This presentation provides a brief overview of the use of optoelectronic technologies in the automobile, focusing on communication, object detection, illumination, and sensing technologies. Some future predictions are made, as well as indications of areas where new capabilities would be beneficial to the automotive industry. Modeling Photonics Manufacture: Economic Insights into Design, Process, and Production Strategy Erica R. Fuchs Photonics component manufacturers require cost reduction to stay competitive and to open new markets. Three options are available: new technology, standardization for volume, and moving to a low-wage location. This presentation discusses the use of process-based models developed within the MIT CTR program to provide insight into the

4 economic advantages of these options. Case studies will be discussed which examine the advantage of EML integration and OSA production in developed and developing country environments. Ultimately, these models provide the type of quantitative perspective unique to the roadmapping effort. Fujifilm G-I POF Optical Link System Roadmap Yukiya Miyachi The future market requires high speed transmission, and optical home link systems will be required within five years. In this presentation, I will talk about FUJIFILM G-I Plastic Optical Fiber "LUMISTAR" and the Optical DVI Link System. Fiber-to-the-Home Deployment and the Optoelectronics Industry Andjelka Kelic Regulatory push for the rapid deployment of broadband and fiber-to-thehome may be in direct conflict with the health of the optoelectronic industry. The interests of consumers, regulators, and even service providers are in conflict with the industry that provides a critical component necessary for fiber-to-the-home service. The industry needs to recognize the potential for this conflict and explore strategies to keep itself viable in light of these conflicts. Next Generation Transceivers: The Roadmap Component Driver Dominic C. O Brien, Michael J. Schabel There are exciting emerging markets for optical communications transceivers, and many excellent technical solutions to achieve the required performance. In order to fully exploit these opportunities, transceiver manufacturers need to move to a silicon-like model of production, and this will require the adoption of a smaller number of processing and manufacturing options. In this presentation, some key challenges in achieving this are presented, as well as potential actions that might begin the necessary convergence.

5 Silicon Photonics: The Volume Driver Jerry R. Bautista, Jeffrey Swift, Michael Morse Silicon-based microphotonics has been under great scrutiny in recent years as a potential solution for bandwidth limitations impacting shorter reach applications. This presentation seeks to identify various volume applications and highlight specific technical challenges and potential solutions. The key market driver for silicon microphotonics adoption will be significantly reduced cost which will drive the transition from electronic to photonic interconnects. The key to reduced cost will be monolithic integration, just as it has been for VLSI electronics. III-V Optoelectronics: Taking the Lead or Filling a Niche? Richard Clayton, Thomas J. Dudley Monolithic integration of optical, photonic, and electronic devices in III-V materials has been a long term goal for the industry for many years. Many advances in technology and the market have occurred in the last five years which have enabled more highly integrated commercial product offerings, especially in telecom applications, with more to come. This presentation will examine the benefits, barriers, approaches, and opportunities for monolithic integration in III-V materials in the commercial environment. Organic Materials: A Case for Hybrid Integration Louay Eldada A healthy photonics industry will be built on standardized component platforms that can be manufactured in high volume at low cost. These platforms will deliver performance:cost ratios that scale exponentially with each technology generation. Organic materials provide a versatile set of properties and processes that meet this need for both hybrid and monolithic photonic circuits. Organic devices have been fabricated and tested for both passive and active functions. Photonic circuits constructed of organic components are being manufactured and deployed in the field. During the next decade, organic materials will continue to be a critical ingredient in commercial, hybrid photonic circuits.

6 2030: A Vision of the Future Through the Lens of History Christopher S. Weaver This talk will examine the history of certain seminal technologies and their lessons for present day technology development. It is instructive that much of what we are questioning and striving to achieve today parallels many of the events that occurred over one hundred years ago. It also argues for the importance of broad cooperation to achieve common goals. (1) Infrastructure Moderator: Jeffrey Swift Low cost photonic IC's may enable emerging high volume markets such as backplane, server, computer, and display interface. If so, will photonic packaging and interconnect infrastructure evolve fast enough to meet the demand? Or will photonic packaging and low cost interconnect become the real bottleneck for these emerging markets? This session will take a look at this photonic infrastructure question. The session will be discussion format, with participants providing their thoughts as to whether such bottlenecks exist, and what methods of resolution should be followed. (2) Integration Moderator: Thomas J. Dudley Introduction of large scale integration in photonics, and subsequent demonstration of economies of scale, will open new markets and fuel growth for the photonics industry. This workshop will explore the impact of integration on productivity improvements in the photonics industry. (3) Standardization and Consolidation Moderator: Michael J. Schabel It has been proposed that the number of suppliers supporting the communications photonics industry, as well as the large number of technical variants, serve as major barriers for the photonics industry to be healthy and prosperous. In this breakout session, we will develop and evaluate possible steps that the industry can or must take, and investigate the consequences of action or inaction with respect to supporting the needs of next generation communication networks.

7 speaker biographies Jerry Bautista Intel Jerry Bautista is Director of Technology Management for the Microprocessor Technology Lab of Intel. In addition to guiding optical strategies, he leads a cross-intel task force aimed at identifying and proposing solutions for bandwidth limitations impacting compute performance across the breadth of Intel s products. Prior to joining Intel, he was CTO of an optical startup (Wavesplitter) and performed basic research at Bell Labs, Murray Hill for 13 years. He has a BS from Stanford, and PhD from Princeton, both in Chemical Engineering. Alan Benner IBM Alan Benner is a Senior Technical Staff Member in the IBM Systems and Technology Group, Architecture and Performance Department. Dr. Benner has been working since the early 1990's on architecture, design, and development of optical and electronic network technologies & systems for various high-performance IBM servers and parallel processing machines. Rick Clayton Clayton & Associates Rick Clayton has over 20 years experience in the optoelectronic component industry, with Bell Northern Research, Nortel, and Bookham. He has deep engineering experience in III-V device design, processing, reliability, test and measurement, and packaging, as well as sub-system and instrumentation design and implementation. In addition, he has extensive management experience in pxroduct definition, M&A technology evaluation, and business-wide technology strategy. Rick has a BASc in Engineering Physics from the University of British Columbia.

8 Thomas Dudley Pelorus Strategies Tom Dudley has over 20 years experience in photonics with leadership roles at Lucent, CoreTek, and Nortel. Recently Tom has been involved on the Boards at technology-based private companies and has consulted for TriQuint on the spin-out and sale of their Optoelectronics division. Louay Eldada DuPont Photonics Technologies Louay Eldada is the CTO and VP of Engineering of DuPont Photonics Technologies. He holds a PhD in photonics from Columbia University. He started his career at Honeywell, where he founded the Telecom Photonics business unit and managed its product development arm. He held the same position when this business was acquired by Corning. He later founded Telephotonics and served as its CTO until an acquisition by DuPont. He has authored 150 papers and books, has presented 90 keynote and invited talks, has organized 70 industry conferences, holds 35 patents, and is the recipient of 24 technical awards. Eugene A. Fitzgerald MIT Eugene A. Fitzgerald is the Merton C. Flemings-SMA Professor of Materials Science & Engineering at MIT. He earned his BS from MIT in 1985 and his PhD from Cornell in 1989, both in Materials Science & Engineering. Prof. Fitzgerald's group's research activities attack the current limitations of electronic materials, especially limitations created by imperfections in materials such as point, line, and planar defects. Much of the group's efforts are focused on lattice-mismatched semiconductor systems, in which layers in electronic materials and devices have different lattice parameters. Thomas Forest General Motors Research & Development Tom Forest is a Staff Research Engineer with the Electrical Controls and Integration Laboratory of General Motors Research and Development in Warren, Michigan. Mr. Forest joined General Motors in 1988, and his

9 current responsibilities include advanced communication systems, vehicle electronic architectures, and safety-critical systems. Erica R. Fuchs MIT Erica Fuchs earned her BS in Materials Science & Engineering in 1999 and her MS from the Technology Policy Program in 2002, both from MIT. Ms. Fuchs is currently completing her PhD in Engineering Systems at MIT (anticipated graduation, May 2006). She has been a Research Assistant at the Materials Systems Laboratory at MIT since September She has worked previously with Nanogram Corporation, the United Nations Industrial Development Organization in Beijing, China, Bayer AG in Cologne, Germany, and on a joint project between OVAKO Steel and the Royal Institute of Stockholm in Sweden. Erica s research focuses on materials selection, the cost-competitiveness of emerging technologies, and the implications of manufacturing offshore for firms global technology portfolios. Jerry A. Hausman MIT Jerry Hausman is the John and Jennie S. MacDonald Professor at MIT, where he has been on the faculty since He has been Director of the MIT Telecommunications Economics Research Program since Prof. Hausman has received the John Bates Clark Medal from the American Economic Association and the Frisch Medal from the Econometric Society. He has researched econometrics, public finance, applied microeconomics, and regulation. He has consulted for most telecommunications companies in the US and numerous international telecommunications providers and equipment companies. He has advised governments and companies on telecommunications in the US, Canada, Mexico, Brazil, China, Columbia, UK, France, Sweden, Norway, Germany, the EU, Australia, Hong Kong, and New Zealand. Professor Hausman is current an advisor to the Ministry of Telecommunications in China.

10 Andjelka Kelic MIT Angie Kelic is a doctoral candidate in the Technology, Management, and Policy Program of the Engineering Systems Division at the Massachusetts Institute of Technology. Her research work focuses on system dynamics modeling and telecommunications policy and wireline broadband technologies. Lionel C. Kimerling MIT Lionel Kimerling earned his degrees here at Tech an S.B. in Metallurgical Engineering (1965) and a Ph.D. in Materials Science (1969). He joined the technical staff of AT&T Bell Laboratories in 1972, then headed their Materials Physics Research Dept. from 1981 to 1990, at which time he returned to MIT to join the faculty as the Thomas Lord Professor of Materials Science & Engineering. He has directed the Materials Processing Center since 1993 and also directs the MIT Microphotonics Center, which he cofounded with thirty faculty in Among his industry responsibilities were long-term reliability of semiconductor lasers, development of the first 1Mb DRAM chip and defect control in silicon IC manufacturing. At MIT, his group s research has focused on silicon microphotonics, environmentally benign IC manufacturing, and solar electricity. Randolph E. Kirchain MIT Randolph Kirchain earned his BS at the Georgia Institute of Technology in 1994 and his PhD at MIT in 1999, both in Materials Science & Engineering. He is currently an Assistant Professor at MIT with a dual appointment in the Department of Materials Science & Engineering and the Engineering Systems Division. Prior to this, he was the associate director of the MIT Materials Systems Laboratory. His research and teaching focuses on improving engineering and policy decisions surrounding the selection, processing, and recovery of materials with focus on decision-making around both structural and electronic materials.

11 Yukiya Miyachi Fuji Photo Film Co. / MIT Yukiya Miyachi earned his BS (Materials/Physics, 1998) and MS (Materials/Applied Physics, 2000), both from Waseda University. He has worked for Fuji Photo Film since 2000, initially in the Picture Printer Development Division, and presently in the R&D Management Headquarters Business Development Division, where he has developed a GI-POF link system transceiver. Dominic O Brien University of Oxford / MIT Dominic O Brien is a Lecturer in Engineering Science at the University of Oxford, where he leads the Optical Communications group. His research interests are in optical interconnect, optical communications and wireless networks. Michael J. Schabel Bell Labs, Lucent Technologies Michael Schabel is a Technical Manager with Bell Labs, currently on assignment in Ireland to help establish a new research center focusing on next-generation product realization for the telecommunications industry. Dr. Schabel leads a large multi-disciplinary and collaborative effort to investigate value chain optimization in the context of a globally distributed multi-agent supply chain. Dr. Schabel is particularly interested in driving change to enable health and prosperity in the photonics supply chain that supports telecommunication networks. Jeffrey Swift formerly Analog Devices Jeff Swift, recently retired, was Director of Engineering at Analog Devices for 15 years. Notable accomplishments include developing ADI s ultrahigh-speed automatic test equipment (ATE) ICs, development of ADI s highly successful MEMS technology and business, and most recently initiating their silicon photonic IC research and development program. Jeff earned both his BS and his MS (Electrical Engineering & Computer Science, 1977) at MIT.

12 Christopher Weaver Media Technology / MIT Christopher Weaver founded Bethesda Softworks in He is currently president of Media Technology, Ltd. and a consultant in UI, telecommunications, and software. He previously served as Chief Engineer to the Congressional Subcommittee on Communications, Vice President of Science & Technology for the National Cable and Telecommunications Association, and directed the Office of Technology Forecasting for the American Broadcasting Company. He holds degrees from Wesleyan University and MIT, where he is a member of the CTR and teaches in the Comparative Media Studies program. Fred Welsh formerly OIDA Fred Welsh retired in 2004 from the Optoelectronic Industry Development Association in Washington, DC (where he had been Executive Director for seven years) and now works part time as a consultant to the industry. Prior to OIDA, he was with Lucent Technologies where he held various assignments including as a Bell Labs Department Head for lightwave devices as well as in marketing and business development. Welsh holds a PhD in Applied Physics from Cornell and a BS degree in Electrical Engineering from Princeton.