Printing Practices for Components. Greg Smith
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1 Printing Practices for Components Greg Smith
2 Outline/Agenda Introduction Components-Size, Shape and usage Stencil Design Transfer Efficiencies Q & A
3 Introduction components are a challenge due to their size
4 Introduction components are a challenge due to their size
5 Introduction **Murata Manufacturing Company
6 Why Use Components? Small size allows for use in high density circuit boards. Cell phones, Bluetooth applications, wireless LAN and wearable technology
7 Why Use Components?
8 Why Use Components?
9 Printing Challenges Proper paste printing requires: Optimized Stencil design Best Stencil Material Best Coating Technology Proper Solderpaste Type
10 Stencil Design IPC-7525B 2011-October. Stencil Design Guidelines
11 Stencil Design IPC Recommended Land Size
12 Stencil Design IPC Recommended Aperture Size Land Pad Component Stencil Aperture
13 Stencil Design The IPC aperture design produces an Area Ratio of: 5 mil=.41 4 mil=.51 3 mil=.68
14 Stencil Design Land Designs in Manufacturing Environments: Approx. 30% smaller than IPC
15 Stencil Design Land Designs in Manufacturing Environments: Must Balance Volume and Placement Pressure
16 Stencil Design Land Designs in Manufacturing Environments: Reduced Volume/Less Pressure-Optimized Reflow
17 Stencil Design Land Designs in Manufacturing Environments Minimize overprint, float and skew by reducing Land Size Print 7.5 mil aperture, radius corners 2 mils to improve release
18 Stencil Design Land Designs in Manufacturing Environments
19 Material Types: Fine grain steel gives smoother side walls Improves Paste Transfer Efficiency Mill grade steel (500X) µm Fine grain steel (500X) 8-9 µm
20 Material Types: Fine grain steel gives smoother side walls Improves Paste Transfer Efficiency
21 Material Types: Fine Grain or Finer Grain? Fine grain steel gives smoother side walls Datum FG/Tension Foil is Now down to the 2-3 micron Grain Size and is the best Performing material available.
22 Fine Grain Stencils Fine grain steel reduces the min. area ratio Minimum area ratios Mill grade steel = 0.66 (industry standard) Fine grain steel = 0.55 (with no coating)
23 Nano Coatings Polymer Nano Coatings can reduce min area ratios and maintain acceptable TE% Minimum area ratios Fine grain steel = 0.55 Fine grain steel + Nano Coating = 0.45
24 Transfer Efficiency Experiment Equipment and Materials Essemtec printer 20 mm/sec, 0.18 Kg/cm, 1.5 mm/sec ASC International SPI AP212 with VM150 sensor Solder paste No clean, lead free, SAC305 Stencils Datum PhD Copper Clad Board
25 SAR Test Design
26 SAR Test Design Size (mils) Shape Pitch (mm) Volume (mil3) Area Ratio 5 mil stencil 6 RSQ RSQ RSQ RSQ mil stencil 6 RSQ RSQ RSQ RSQ mil stencil 6 RSQ RSQ RSQ RSQ
27 1 st Experiment Compare TE of 3 mil, 4 mil and 5 mil Foil, Uncoated Compare TE of Type 3 vs Type 4 paste Draw Conclusions
28 Solder Paste & TE thick stencil, Uncoated
29 Solder Paste & TE thick stencil, Uncoated
30 Solder Paste & TE thick stencil, Uncoated
31 Stencil Thickness Summary Type 4 solder paste gives higher TE than Type 3 5 mil thick stencil does not work for 01005s 4 mil thick stencil and Type 4 paste acceptable 3 mil thick stencil is the best option 3 mil thick stencils works with Type 3 & 4 pastes
32 2nd Experiment Compare TE of 3 mil, 4 mil and 5 mil Foil, With Nanocoated Polymer Compare TE of Type 3 vs Type 4 paste Draw Conclusions
33 Solder Paste & TE thick stencil, Nano Coat Polymer
34 Solder Paste & TE thick stencil, Nano Coat Polymer
35 Solder Paste & TE thick stencil, Nano Coat Polymer
36 Nano Coating Polymer Summary 5 mil Nano coated stencil still low TE 4 mil Nano coated stencil and Type 4 paste works well 3 mil Nano coated stencil gave exceptional TE
37 Summary: Uncoated Stencils 3 mil uncoated stencil & Type 4 paste near 70% TE
38 Summary: Nano Coated Polymer Stencils 3 and 4 mil Nano coated stencils gave > 70% TE
39 5 mil Stencil Summary 5 mil Stencils, Coated and Uncoated
40 4 mil Stencil Summary 4 mil Stencils, Coated and Uncoated
41 3 mil Stencil Summary 3 mil Stencils, Coated and Uncoated
42 Transfer Efficiency Summary Adequate TE% can be achieved 4 mil Nano coated stencil with Type 4 paste 3 mil uncoated stencil with Type 4 paste 3 mil Nano coated stencil with Type 3 paste 5 mil stencil too thick area ratios too low
43 Conclusion Recommended Stencil Design 4 mil Stencil, Standard Phd material 7.5 mil Square Aperture, 2 mil Radius Corners Nano coated polymer coating
44 Notes For Further Study Fine Grain/Tension Foil needs to be examined to determine the effect of TE with and without Polymer Nanocoatings on different foil thicknesses. Type 5 Solderpaste needs to be examined to determine the effect on TE with different foil types and thicknesses.
45 Any Questions? Greg Smith
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