A low-power, high-speed, 9-channel germaniumsilicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer
|
|
- Eunice Martin
- 6 years ago
- Views:
Transcription
1 A low-power, high-speed, 9-channel germaniumsilicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer A. V. Krishnamoorthy, 1* X. Zheng, 1 D. Feng, 3 J. Lexau, 2 J. F. Buckwalter, 1 H. D. Thacker, 1 F. Liu, 2 Y. Luo, 1 E. Chang, 2 P. Amberg, 1 I. Shubin, 1 S. S. Djordjevic, 1 J. H. Lee, 1 S. Lin, 1 H. Liang, 3 A. Abed, 3 R. Shafiiha, 3 K. Raj, 1 R. Ho, 2 M. Asghari, 3 and J. E. Cunningham 1 1 Oracle Netra Systems & Networking, San Diego CA 92121, USA 2 Oracle Labs, Redwood Shores, CA USA 3 Mellanox Technologies, 2630 Corporate Place, Monterey Park, CA USA * ashok.krishnamoorthy@oracle.com Abstract: We demonstrate the first germanium-silicon C-band electroabsorption based waveguide modulator array and echelle-grating-based silicon wavelength multiplexer integrated with a digital CMOS driver circuit. A 9-channel, 10Gbps SiGe electro-absorption wavelengthmultiplexed modulator array consumed a power of 5.8mW per channel while being modulated at 10.25Gbps by 40nm CMOS drivers delivering peak-to-peak voltage swings of 2V, achieving a modulation energyefficiency of ~570fJ/bit including drivers. Performance up to 25Gbps on a single-channel SiGe modulator and CMOS driver is also reported Optical Society of America OCIS codes: ( ) Optical interconnects; ( ) Waveguide modulators; ( ) Photonic integrated circuits. References and links 1. A. V. Krishnamoorthy, K. W. Goossen, W. Jan, X. Zheng, R. Ho, G. Li, R. Rozier, F. Liu, D. Patil, J. Lexau, H. Schwetman, D. Feng, M. Asghari, T. Pinguet, and J. E. Cunningham, Progress in low-power switched optical interconnects, IEEE J. Sel. Top. Quantum Electron. 17(2), (2011). 2. M. Asghari and A. V. Krishnamoorthy, Energy-efficient communication, Nat. Photonics 5(5), (2011). 3. J. F. Liu, M. Beals, A. Pomerene, S. Bernardis, R. Sun, J. Cheng, L. C. Kimerling, and J. Michel, Waveguideintegrated, ultralow-energy GeSi electro-absorption modulators, Nat. Photonics 2(7), (2008). 4. A. E.-J. Lim, T.-Y. Liow, F. Qing, N. Duan, L. Ding, M. Yu, G.-Q. Lo, and D.-L. Kwong, Novel evanescentcoupled germanium electro-absorption modulator featuring monolithic integration with germanium p-i-n photodetector, Opt. Express 19(6), (2011). 5. P. Chaisakul, D. Marris-Morini, M. S. Rouifed, G. Isella, D. Chrastina, J. Frigerio, X. Le Roux, S. Edmond, J. R. Coudevylle, and L. Vivien, 23 GHz Ge/SiGe multiple quantum well electro-absorption modulator, Opt. Express 20(3), (2012). 6. N. N. Feng, D. Feng, S. Liao, X. Wang, P. Dong, H. Liang, C.-C. Kung, W. Qian, J. Fong, R. Shafiiha, Y. Luo, J. Cunningham, A. V. Krishnamoorthy, and M. Asghari, 30GHz Ge electro-absorption modulator integrated with 3 μm silicon-on-insulator waveguide, Opt. Express 19(8), (2011). 7. D. Feng, S. Liao, H. Liang, J. Fong, B. Bijlani, R. Shafiiha, B. J. Luff, Y. Luo, J. E. Cunningham, A. V. Krishnamoorthy, and M. Asghari, High speed GeSi electro-absorption modulator at 1550 nm wavelength on SOI waveguide, Opt. Express 20(20), (2012). 8. D. Feng, W. Qian, H. Liang, C.-C. Kung, Z. Zhou, Z. Li, J. Levy, R. Shafiiha, J. Fong, B. J. Luff, and M. Asghari, High-speed GeSi electro-absorption modulator on the SOI waveguide platform, IEEE J. Sel. Top. Quantum Electron. 19(6), (2013). 9. G. Li, A. V. Krishnamoorthy, I. Shubin, J. Yao, Y. Luo, H. Thacker, X. Zheng, K. Raj, and J. E. Cunningham, Ring resonator modulators in silicon for interchip photonic links, IEEE J. Sel. Top. Quantum Electron. 19(6), (2013). (C) 2014 OSA 19 May 2014 Vol. 22, No. 10 DOI: /OE OPTICS EXPRESS 12289
2 10. F. Liu, D. Patil, J. Lexau, P. Amberg, M. Dayringer, J. Gainsley, H. Moghadam, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy, E. Alon, and R. Ho, 10Gbps, 5.3mW optical transceiver circuits in 40nm CMOS, in Proceedings of IEEE Symp. VLSI Circuits (Institute of Electrical and Electronics Engineers, Honolulu, HI, 2011), pp A. V. Krishnamoorthy, A. L. Lentine, K. W. Goossen, J. A. Walker, T. K. Woodward, J. E. Ford, G. F. Aplin, L. A. D Asaro, S. P. Hui, R. Leibenguth, D. Kossives, D. Dahringer, L. M. F. Chirovsky, and D. A. B. Miller, 3-D integration of MQW modulators over submicron CMOS circuits: 375Mb/s transimpedancereceiver-transmitter circuit, IEEE Photon. Technol. Lett. 7(11), (1995). 12. J. F. Buckwalter, X. Zheng, G. Li, K. Raj, and A. V. Krishnamoorthy, A Monolithic 25-Gb/s Transceiver With Photonic Ring Modulators and Ge Detectors in a 130-nm CMOS SOI Process, IEEE J. Solid-State Circuits 47(6), (2012). 1. Introduction The gradual adoption of optical interconnects into computing and switching systems over the last decade has paved the way for new photonic technologies to be incorporated into the computing system hierarchy. We will soon witness ubiquitous incorporation of optical interconnect technologies at the board, backplane, and rack level server systems at 25Gbps and beyond [1]. Parallel silicon-based photonic links will naturally replace other optical solutions for applications that require a combination of high-speed, high-density, and tight integration to VLSI application specific integrated circuits including switches, processors, gate arrays, and memory modules. Both WDM and multi-core fiber techniques are being investigated for further density improvements, and it is possible that one or both of these technologies will ultimately see wide-spread use in commercial systems. Regardless of the multiplexing method, it is critical to achieve low-power, high-density silicon transmitters and associated receivers to support the ever-growing bandwidth demand to bandwidth-hungry chips including switches, processors, and field-programmable gate arrays. A germanium-silicon (GeSi) Franz-Keldysh Effect (FKE) electro-absorption (EA) waveguide modulator is expected to become an integral part of a high-speed energy-efficient multi-wavelength interconnect platform [2]. In earlier work, GeSi EA modulators were originally designed and operated with sub-micron-thick silicon-on-insulator (SOI) waveguides [3 5], and subsequently fabricated with an optimized 3-micron-thick, large-core SOI waveguides in the L-band [6] and C-band [7] wavelength ranges. A 4-channel modulator array based on this platform was recently reported in [8]. In this letter, we present a compact, broad-band 9-channel 10Gbps/channel GeSi waveguide modulator array with a monolithically integrated echelle-based wavelength multiplexer hybrid integrated to a lowpower CMOS driver circuit designed in a 40nm CMOS process. We also present a singlechannel GeSi FKE modulator with CMOS driver at 25Gbps. Fig. 1. (a) Insertion loss and extinction ratio vs wavelength and reverse-bias voltages (b) total equivalent modulator link power penalty showing that a bandwidth of 30nm obtained at approx. 9.5dB total penalty. (C) 2014 OSA 19 May 2014 Vol. 22, No. 10 DOI: /OE OPTICS EXPRESS 12290
3 2. Multi-wavelength modulators and multiplexers The GeSi EA modulator array based on the FKE is fully integrated with 3µm thick rib waveguides on a high-resistivity SOI substrate with an operational wavelength in the C-band. The insertion loss and extinction ratio of an FKE modulator versus reverse-bias voltage is shown in Fig. 1(a). The equivalent modulator link power penalty [9] is plotted in Fig. 1(b). With an applied peak-to-peak swing of 2V, each modulator in the array has an operating wavelength range in excess of 30nm for a modulator optical power penalty of ~10dB. Assuming the total modulator power penalty should be controlled to within a fixed range (e.g. <10dB for 30nm), the working wavelength range can, to an extent, be traded for a working temperature range. The rate of the band edge shift is ~0.8nm/ C [7]. Consequently, the insertion loss and extinction ratio curves in Fig. 1(a) shift to longer wavelengths, but no modulation performance degradation is observed. Hence, we can use this modulator at elevated temperatures without closed-loop temperature control (see Section 3). Practical limits to temperature excursions potentially arise due to fiber-to-chip packaging and the WDM mux/demux - which moves only at ~0.1nm/ C. For instance, as temperature ranges across 40 C, the band edge will shift ~32nm while the operating wavelength (to align with the mux) will likewise shift ~4nm to keep total modulator penalty below 10dB. Figures 2(a) and 2(b) show the device before and after integration with the VLSI circuit. Each device has a size of approximately 20µm 40µm, including contacts. Each modulator is electrically isolated and has two 15µm 15µm flip-chip pads to connect to the driver circuit. Edge-coupled waveguides (one per modulator) provide external laser input (Fig. 2(c)). The EA modulator array is monolithically integrated with an echelle-grating-based multiplexer to achieve a 9-channel WDM transmitter chip with one output waveguide. The area of the echelle grating (bounding box) is approx. 1.7mm 2.6mm. Two additional waveguides are used for optical alignment and one additional input port not attached to a driver is used to test the echelle multiplexer. The WDM transmitter assembly (Figs. 2(d) and 2(e)) has a footprint of ~5mm 14mm and an aggregate bandwidth of over 100 Gbps when operated at its maximum speed of 12Gbps per channel. The clocked driver array circuit was fabricated in a 40nm TSMC CMOS process and is based on a pulsed cascode-design [10]. An external clock at half the data rate is provided to the CMOS driver chip. Each driver cell incorporates a level-shifter to create a 1-2V swing that is complemented to a 0-1V swing to create an effective 2V peak-to-peak modulation signal followed by the final cascaded driver. Each modulator driver cell has a size of approximately 15µm x 15µm and additionally incorporates two 15µm x 15µm pads with a center-to-center spacing of ~48µm to connect to the corresponding modulator. The combined minimum footprint of a modulator plus associated driver circuit was approximately 30µm 100µm. Although not done in this case, the circuits can be placed underneath the flip-chip pads for 3-D photonics-on-cmos integration [11] to achieve even higher density. Small-signal measurements were performed on a representative device on an unpackaged chip to measure the electro-optic response of the FKE modulators (Fig. 3(a)) at bias voltages of 0V, 1V, and 2V. At zero bias, the modulator bandwidth was 20GHz. At a reverse-bias voltage between 1V and 2V, a 3dB bandwidth in excess of 40GHz was measured. To model the device, s 11 parameter measurements were taken, and a circuit model made (Fig. 3(b)). With the circuit diagram and extracted parasitics, excellent fitting was obtained at all voltages. The extracted values (Table in Fig. 3(c)) indicate a modulator device capacitance (junction plus parasitic) of ~50fF at 1V. The substrate capacitance does not significantly affect device performance because of the high-resistivity SOI substrate. (C) 2014 OSA 19 May 2014 Vol. 22, No. 10 DOI: /OE OPTICS EXPRESS 12291
4 Fig. 2. (a) GeSi modulator micrograph; (b) infrared micrograph of the modulator array after bonding to CMOS chip showing flip-chip pads and I/O waveguides; (c) Micrograph of the 3µm GeSi EA WDM modulator array (face-up) integrated with the 40nm TSMC driver chip (face-down); (d) Schematic of the driver chip integrated to the 3-micron silicon-on-insulator chip containing the Si/Ge FKE electro-absorption modulators array and the echelle multiplexer; (e) After fiber attach on packaged system test board. Fig. 3. (a) Small-signal bandwidth of the GeSi FKE modulator (b) equivalent circuit based on S11 measurements and parameter fitting (c) Table of extracted values of junction, parasitic, and substrate capacitance and series resistance. 3. WDM transmitter array testing The CMOS-FKE EA WDM transmitter assembly is packaged into a fixture that provides heat spreading, mechanical stability, and support for edge-coupled fiber attach (Fig. 2(e)). Figure 4 shows the transmission of the unpackaged 10-channel modulator with echelle mux normalized to the fiber-coupling loss. This is a representation of the loss and non-uniformity (C) 2014 OSA 19 May 2014 Vol. 22, No. 10 DOI: /OE OPTICS EXPRESS 12292
5 of the array before fiber-coupling and packaging. The non-uniformity is primarily due to the modulator array insertion loss variation across the wavelength range (~1.8dB) and variation due to echelle mux and wafer non-uniformity ( 1dB). Ten channels separated by ~200GHz spacing (~1.6nm) were provisioned, of which nine channels around 1535nm were connected to modulator devices. The fiber-attached array is mounted on a custom printed circuit board and wire-bonded for power and control. The chip-assembly was thermally-imaged (Fig. 5(a)) and a temperature scan (Fig. 5(b)) shows that the temperature of the VLSI chip and attached photonic chip rises 7-8 C, relatively uniformly across the entire photonic array. Further, the actual modulator temperature rises about 2 C above the VLSI chip temperature. Given that this effect is predictable, the Si-Ge FK band edge and mux can be engineered and optimized for operation at this elevated temperature. Fig. 4. Transmission of an unpackaged 10-channel modulator + multiplexer array chip normalized to fiber coupling loss; Worst-case isolation is >20dB on adjacent channels spaced at 100GHz. The transmitter assembly was tested at speed. On-chip PRBS generators created digital electrical signals which were applied to each modulator by its respective driver circuit. Figure 5(c) shows the optical eye when one channel is driven at the maximum data-rate of 12Gbps supported by the VLSI chip with 4dBm of input optical power. The measured output extinction ratio is ~4.3dB. Optical and electrical crosstalk between channels is negligible. As shown in Fig. 6, nine channels of the parallel WDM transmitter were simultaneously modulated at 10.25Gbps with open eyes with extinction ratios ranging from 4dB to 5.5dB. The power dissipation per channel is measured by enabling a modulator channel and measuring the on-chip power. A power dissipation of 5.82mW per channel is measured at the bit-rate of 10.25Gbps which takes into account the dynamic power consumed by the driver + modulator (~1.5mW) the absorbed photo-current power of the EA device (~1.5mW) as well as leakage current power, which was significant in this case (~2.5mW). The corresponding modulator energy per bit is ~570fJ/bit including driver circuit at an average photo-current of 0.7mA. We expect this can be reduced to ~300fJ/bit or below with device improvements. The small channel footprint, wide bandwidth, and low capacitance of the GeSi EA modulator and driver array enable a compelling, low-power, high-density silicon-photonic WDM transmitter solution. By scaling the modulator transmitter chip with more channels and operating the silicon driver chip at higher bitrates with 25Gbps and faster driver circuits, we anticipate a potential transceiver array with a total bandwidth on the order of up to 10Tbps (C) 2014 OSA 19 May 2014 Vol. 22, No. 10 DOI: /OE OPTICS EXPRESS 12293
6 and a power dissipation in the range of 10-20W for ubiquitous photonic communication applications. Fig. 5. (a) Thermal profile of flip-chip assembly when powered ON. Powered modulator array can be seen as a vertical column on the left. (b) Scan of temperature across the assembly showing a temperature difference of ~10 C with peak temperature at EA modulator. (b) Eye diagram of a channel running at 12Gbps with on-chip PRBS data generator. Fig. 6. Test of the integrated multi-wavelength transmitter showing simultaneous modulation on all nine channels at 10.25Gbps. Center wavelength was 1532nm and separation between channels was 1.6nm We also tested a single-channel CMOS-FKE EA modulator with driver circuits at 25Gbps to evaluate transmitter performance with higher-speed drivers for packaging into a 100Gbps transceiver. The high-speed drivers were based on push-pull (inverter) amplifiers integrated in 130nm CMOS SOI and are similar to the circuits reported previously [12]. The output driver stage is illustrated in Fig. 7 and consists of a pair of push-pull drivers that are driven with complementary data signals. Additionally, the two data signals are level-shifted with respect to ground to allow complementary voltage swing across the p-n junction which does not forward bias the junction but also avoids exceeding the voltage swing limitations of the CMOS devices. The size of the push-pull driver transistors is related to the capacitance of the FK modulator and, therefore, can be directly related to the power consumption of the driver circuits. Figure 8 shows the transmitter eye at 25Gbps when integrated with the 130nm CMOS high-speed driver. In this experiment, the driver die was located adjacent the FKE EA modulator and wire-bonded with low-inductance ribbon bonds. The capacitance of the (C) 2014 OSA 19 May 2014 Vol. 22, No. 10 DOI: /OE OPTICS EXPRESS 12294
7 bondpads on the driver and the modulator can be incorporated into a broadband pi-network with a bandwidth of more than 20GHz. Excluding the off-chip laser power, the transmitter consumed below 70mW per channel (2.8pJ/bit) at 25Gbps including the 25Gbps electrical I/O circuit. This power can be reduced with flip-chip integration of the modulator chip onto the driver die. Fig. 7. Schematic of the 130nm CMOS SOI driver stage. Two push-pull driver stages control the swing across the p-n junction. Fig. 8. Test of a single-channel version of the FK transmitter driven by a 130nm CMOS driver at 25Gbps/lane package: optical output eye at 25Gbps. Acknowledgments The authors gratefully acknowledge Dr. Guoliang Li for RF measurements, Chaoqi Zhang for thermal simulation, Dr. J. Mitchell and C. Stephen of Oracle Labs and J. Malinge formerly of Kotura Inc. for their support of this project. This work was supported in part by DARPA under Agreement HR under the supervision of Dr. J. Shah. The view expressed are those of the authors and do not reflect the official policy of the Dept. of Defense or the U. S. government. Approved for public release; distribution unlimited. (C) 2014 OSA 19 May 2014 Vol. 22, No. 10 DOI: /OE OPTICS EXPRESS 12295
A high-speed, tunable silicon photonic ring modulator integrated with ultra-efficient active wavelength control
A high-speed, tunable silicon photonic ring modulator integrated with ultra-efficient active wavelength control Xuezhe Zheng, 1 Eric Chang, 2 Philip Amberg, 1 Ivan Shubin, 1 Jon Lexau, 2 Frankie Liu, 2
More informationECEN689: Special Topics in Optical Interconnects Circuits and Systems Spring 2016
ECEN689: Special Topics in Optical Interconnects Circuits and Systems Spring 2016 Lecture 10: Electroabsorption Modulator Transmitters Sam Palermo Analog & Mixed-Signal Center Texas A&M University Announcements
More informationCompact two-mode (de)multiplexer based on symmetric Y-junction and Multimode interference waveguides
Compact two-mode (de)multiplexer based on symmetric Y-junction and Multimode interference waveguides Yaming Li, Chong Li, Chuanbo Li, Buwen Cheng, * and Chunlai Xue State Key Laboratory on Integrated Optoelectronics,
More informationHigh speed silicon-based optoelectronic devices Delphine Marris-Morini Institut d Electronique Fondamentale, Université Paris Sud
High speed silicon-based optoelectronic devices Delphine Marris-Morini Institut d Electronique Fondamentale, Université Paris Sud Data centers Optical telecommunications Environment Interconnects Silicon
More informationDual-Function Detector Modulator Smart-Pixel Module
Dual-Function Detector Modulator Smart-Pixel Module A. V. Krishnamoorthy, T. K. Woodward, K. W. Goossen, J. A. Walker, S. P. Hui, B. Tseng, J. E. Cunningham, W. Y. Jan, F. E. Kiamilev, and D. A. B. Miller
More informationSilicon Photonics Technology Platform To Advance The Development Of Optical Interconnects
Silicon Photonics Technology Platform To Advance The Development Of Optical Interconnects By Mieke Van Bavel, science editor, imec, Belgium; Joris Van Campenhout, imec, Belgium; Wim Bogaerts, imec s associated
More informationNew advances in silicon photonics Delphine Marris-Morini
New advances in silicon photonics Delphine Marris-Morini P. Brindel Alcatel-Lucent Bell Lab, Nozay, France New Advances in silicon photonics D. Marris-Morini, L. Virot*, D. Perez-Galacho, X. Le Roux, D.
More informationOptical Proximity Communication for a Silicon Photonic Macrochip
Optical Proximity Communication for a Silicon Photonic Macrochip John E. Cunningham, Ivan Shubin, Xuezhe Zheng, Jon Lexau, Ron Ho, Ying Luo, Guoliang Li, Hiren Thacker, J. Yao, K. Raj and Ashok V. Krishnamoorthy
More informationNEXT GENERATION SILICON PHOTONICS FOR COMPUTING AND COMMUNICATION PHILIPPE ABSIL
NEXT GENERATION SILICON PHOTONICS FOR COMPUTING AND COMMUNICATION PHILIPPE ABSIL OUTLINE Introduction Platform Overview Device Library Overview What s Next? Conclusion OUTLINE Introduction Platform Overview
More informationGHz-bandwidth optical filters based on highorder silicon ring resonators
GHz-bandwidth optical filters based on highorder silicon ring resonators Po Dong, 1* Ning-Ning Feng, 1 Dazeng Feng, 1 Wei Qian, 1 Hong Liang, 1 Daniel C. Lee, 1 B. J. Luff, 1 T. Banwell, 2 A. Agarwal,
More informationA 3.9 ns 8.9 mw 4 4 Silicon Photonic Switch Hybrid-Integrated with CMOS Driver
A 3.9 ns 8.9 mw 4 4 Silicon Photonic Switch Hybrid-Integrated with CMOS Driver A. Rylyakov, C. Schow, B. Lee, W. Green, J. Van Campenhout, M. Yang, F. Doany, S. Assefa, C. Jahnes, J. Kash, Y. Vlasov IBM
More information50-Gb/s silicon optical modulator with travelingwave
5-Gb/s silicon optical modulator with travelingwave electrodes Xiaoguang Tu, 1, * Tsung-Yang Liow, 1 Junfeng Song, 1,2 Xianshu Luo, 1 Qing Fang, 1 Mingbin Yu, 1 and Guo-Qiang Lo 1 1 Institute of Microelectronics,
More informationVertical p-i-n germanium photodetector with high external responsivity integrated with large core Si waveguides
Vertical p-i-n germanium photodetector with high external responsivity integrated with large core Si waveguides Ning-Ning Feng* 1, Po Dong 1, Dawei Zheng 1, Shirong Liao 1, Hong Liang 1, Roshanak Shafiiha
More informationSilicon Mod-MUX-Ring transmitter with 4 channels at 40 Gb/s
Silicon Mod-MUX-Ring transmitter with 4 channels at 40 Gb/s Yang Liu, 1,6,* Ran Ding, 1,6 Yangjin Ma, 1 Yisu Yang, 1 Zhe Xuan, 1 Qi Li, 2 Andy Eu-Jin Lim, 3 Guo-Qiang Lo, 3 Keren Bergman, 2 Tom Baehr-Jones
More informationA silicon avalanche photodetector fabricated with standard CMOS technology with over 1 THz gain-bandwidth product
A silicon avalanche photodetector fabricated with standard CMOS technology with over 1 THz gain-bandwidth product Myung-Jae Lee and Woo-Young Choi* Department of Electrical and Electronic Engineering,
More informationDemonstration of low power penalty of silicon Mach Zehnder modulator in long-haul transmission
Demonstration of low power penalty of silicon Mach Zehnder modulator in long-haul transmission Huaxiang Yi, 1 Qifeng Long, 1 Wei Tan, 1 Li Li, Xingjun Wang, 1,2 and Zhiping Zhou * 1 State Key Laboratory
More informationSilicon Optical Modulator
Silicon Optical Modulator Silicon Optical Photonics Nature Photonics Published online: 30 July 2010 Byung-Min Yu 24 April 2014 High-Speed Circuits & Systems Lab. Dept. of Electrical and Electronic Engineering
More informationLecture: Integration of silicon photonics with electronics. Prepared by Jean-Marc FEDELI CEA-LETI
Lecture: Integration of silicon photonics with electronics Prepared by Jean-Marc FEDELI CEA-LETI Context The goal is to give optical functionalities to electronics integrated circuit (EIC) The objectives
More informationAn Example Design using the Analog Photonics Component Library. 3/21/2017 Benjamin Moss
An Example Design using the Analog Photonics Component Library 3/21/2017 Benjamin Moss Component Library Elements Passive Library Elements: Component Current specs 1 Edge Couplers (Si)
More informationDesign of an Energy-Efficient Silicon Microring Resonator-Based Photonic Transmitter
Design of an Energy-Efficient Silicon Microring Resonator-Based Photonic Transmitter Cheng Li, Chin-Hui Chen, Binhao Wang, Samuel Palermo, Marco Fiorentino, Raymond Beausoleil HP Laboratories HPL-2014-21
More informationOverview of short-reach optical interconnects: from VCSELs to silicon nanophotonics
Acknowledgements: J. Cunningham, R. Ho, X. Zheng, J. Lexau, H. Thacker, J. Yao, Y. Luo, G. Li, I. Shubin, F. Liu, D. Patil, K. Raj, and J. Mitchell M. Asghari T. Pinguet Overview
More informationLow-Power, 10-Gbps 1.5-Vpp Differential CMOS Driver for a Silicon Electro-Optic Ring Modulator
Low-Power, 10-Gbps 1.5-Vpp Differential CMOS Driver for a Silicon Electro-Optic Ring Modulator Michal Rakowski 1,2, Julien Ryckaert 1, Marianna Pantouvaki 1, Hui Yu 3, Wim Bogaerts 3, Kristin de Meyer
More informationWafer-scale 3D integration of silicon-on-insulator RF amplifiers
Wafer-scale integration of silicon-on-insulator RF amplifiers The MIT Faculty has made this article openly available. Please share how this access benefits you. Your story matters. Citation As Published
More informationJOURNAL OF LIGHTWAVE TECHNOLOGY, VOL. 31, NO. 16, AUGUST 15,
JOURNAL OF LIGHTWAVE TECHNOLOGY, VOL. 31, NO. 16, AUGUST 15, 2013 2785 Fabrication-Tolerant Four-Channel Wavelength- Division-Multiplexing Filter Based on Collectively Tuned Si Microrings Peter De Heyn,
More informationNew silicon photonics technology delivers faster data traffic in data centers
Edition May 2017 Silicon Photonics, Photonics New silicon photonics technology delivers faster data traffic in data centers New transceiver with 10x higher bandwidth than current transceivers. Today, the
More informationSi CMOS Technical Working Group
Si CMOS Technical Working Group CTR, Spring 2008 meeting Markets Interconnects TWG Breakouts Reception TWG reports Si CMOS: photonic integration E-P synergy - Integration - Standardization - Cross-market
More informationElectro-Optic Crosstalk in Parallel Silicon Photonic Mach-Zehnder Modulators
> REPLACE THIS LINE WITH YOUR PAPER IDENTIFICATION NUMBER (DOUBLE-CLICK HERE TO EDIT) < 1 Electro-Optic Crosstalk in Parallel Silicon Photonic Mach-Zehnder Modulators Lingjun Jiang, Xi Chen, Kwangwoong
More informationSilicon Photonics Photo-Detector Announcement. Mario Paniccia Intel Fellow Director, Photonics Technology Lab
Silicon Photonics Photo-Detector Announcement Mario Paniccia Intel Fellow Director, Photonics Technology Lab Agenda Intel s Silicon Photonics Research 40G Modulator Recap 40G Photodetector Announcement
More informationHigh-speed Ge photodetector monolithically integrated with large cross silicon-on-insulator waveguide
[ APPLIED PHYSICS LETTERS ] High-speed Ge photodetector monolithically integrated with large cross silicon-on-insulator waveguide Dazeng Feng, Shirong Liao, Roshanak Shafiiha. etc Contents 1. Introduction
More informationSilicon photonics on 3 and 12 μm thick SOI for optical interconnects Timo Aalto VTT Technical Research Centre of Finland
Silicon photonics on 3 and 12 μm thick SOI for optical interconnects Timo Aalto VTT Technical Research Centre of Finland 5th International Symposium for Optical Interconnect in Data Centres in ECOC, Gothenburg,
More informationECEN689: Special Topics in Optical Interconnects Circuits and Systems Spring 2016
ECEN689: Special Topics in Optical Interconnects Circuits and Systems Spring 2016 Lecture 1: Introduction Sam Palermo Analog & Mixed-Signal Center Texas A&M University Class Topics System and design issues
More informationWavelength tracking with thermally controlled silicon resonators
Wavelength tracking with thermally controlled silicon resonators Ciyuan Qiu, Jie Shu, Zheng Li Xuezhi Zhang, and Qianfan Xu* Department of Electrical and Computer Engineering, Rice University, Houston,
More informationInnovative ultra-broadband ubiquitous Wireless communications through terahertz transceivers ibrow
Project Overview Innovative ultra-broadband ubiquitous Wireless communications through terahertz transceivers ibrow Mar-2017 Presentation outline Project key facts Motivation Project objectives Project
More informationOpportunities and challenges of silicon photonics based System-In-Package
Opportunities and challenges of silicon photonics based System-In-Package ECTC 2014 Panel session : Emerging Technologies and Market Trends of Silicon Photonics Speaker : Stéphane Bernabé (Leti Photonics
More informationCHAPTER 2 POLARIZATION SPLITTER- ROTATOR BASED ON A DOUBLE- ETCHED DIRECTIONAL COUPLER
CHAPTER 2 POLARIZATION SPLITTER- ROTATOR BASED ON A DOUBLE- ETCHED DIRECTIONAL COUPLER As we discussed in chapter 1, silicon photonics has received much attention in the last decade. The main reason is
More informationISSCC 2006 / SESSION 13 / OPTICAL COMMUNICATION / 13.7
13.7 A 10Gb/s Photonic Modulator and WDM MUX/DEMUX Integrated with Electronics in 0.13µm SOI CMOS Andrew Huang, Cary Gunn, Guo-Liang Li, Yi Liang, Sina Mirsaidi, Adithyaram Narasimha, Thierry Pinguet Luxtera,
More informationOPTICAL I/O RESEARCH PROGRAM AT IMEC
OPTICAL I/O RESEARCH PROGRAM AT IMEC IMEC CORE CMOS PHILIPPE ABSIL, PROGRAM DIRECTOR JORIS VAN CAMPENHOUT, PROGRAM MANAGER SCALING TRENDS IN CHIP-LEVEL I/O RECENT EXAMPLES OF HIGH-BANDWIDTH I/O Graphics
More informationSilicon Photonics Transceivers for Hyper Scale Datacenters: Deployment and Roadmap
Silicon Photonics Transceivers for Hyper Scale Datacenters: Deployment and Roadmap Peter De Dobbelaere Luxtera Inc. 09/19/2016 Luxtera Proprietary www.luxtera.com Luxtera Company Introduction $100B+ Shift
More informationSilicon photonics with low loss and small polarization dependency. Timo Aalto VTT Technical Research Centre of Finland
Silicon photonics with low loss and small polarization dependency Timo Aalto VTT Technical Research Centre of Finland EPIC workshop in Tokyo, 9 th November 2017 VTT Technical Research Center of Finland
More informationA tunable Si CMOS photonic multiplexer/de-multiplexer
A tunable Si CMOS photonic multiplexer/de-multiplexer OPTICS EXPRESS Published : 25 Feb 2010 MinJae Jung M.I.C.S Content 1. Introduction 2. CMOS photonic 1x4 Si ring multiplexer Principle of add/drop filter
More informationSNR characteristics of 850-nm OEIC receiver with a silicon avalanche photodetector
SNR characteristics of 850-nm OEIC receiver with a silicon avalanche photodetector Jin-Sung Youn, 1 Myung-Jae Lee, 1 Kang-Yeob Park, 1 Holger Rücker, 2 and Woo-Young Choi 1,* 1 Department of Electrical
More informationIEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 2010 Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 2010 Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging Christophe Kopp, St ephane Bernab e, Badhise Ben Bakir,
More informationA Fully Integrated 20 Gb/s Optoelectronic Transceiver Implemented in a Standard
A Fully Integrated 20 Gb/s Optoelectronic Transceiver Implemented in a Standard 0.13 µm CMOS SOI Technology School of Electrical and Electronic Engineering Yonsei University 이슬아 1. Introduction 2. Architecture
More informationThe Past, Present, and Future of Silicon Photonics
The Past, Present, and Future of Silicon Photonics Myung-Jae Lee High-Speed Circuits & Systems Lab. Dept. of Electrical and Electronic Engineering Yonsei University Outline Introduction A glance at history
More informationSP 22.3: A 12mW Wide Dynamic Range CMOS Front-End for a Portable GPS Receiver
SP 22.3: A 12mW Wide Dynamic Range CMOS Front-End for a Portable GPS Receiver Arvin R. Shahani, Derek K. Shaeffer, Thomas H. Lee Stanford University, Stanford, CA At submicron channel lengths, CMOS is
More informationISSCC 2004 / SESSION 26 / OPTICAL AND FAST I/O / 26.6
ISSCC 2004 / SESSION 26 / OPTICAL AND FAST I/O / 26.6 26.6 40Gb/s Amplifier and ESD Protection Circuit in 0.18µm CMOS Technology Sherif Galal, Behzad Razavi University of California, Los Angeles, CA Optical
More informationUltra-compact, flat-top demultiplexer using anti-reflection contra-directional couplers for CWDM networks on silicon
Ultra-compact, flat-top demultiplexer using anti-reflection contra-directional couplers for CWDM networks on silicon Wei Shi, Han Yun, Charlie Lin, Mark Greenberg, Xu Wang, Yun Wang, Sahba Talebi Fard,
More informationA COMPACT WIDEBAND MATCHING 0.18-µM CMOS UWB LOW-NOISE AMPLIFIER USING ACTIVE FEED- BACK TECHNIQUE
Progress In Electromagnetics Research C, Vol. 16, 161 169, 2010 A COMPACT WIDEBAND MATCHING 0.18-µM CMOS UWB LOW-NOISE AMPLIFIER USING ACTIVE FEED- BACK TECHNIQUE J.-Y. Li, W.-J. Lin, and M.-P. Houng Department
More informationEE 232 Lightwave Devices Optical Interconnects
EE 232 Lightwave Devices Optical Interconnects Sajjad Moazeni Department of Electrical Engineering & Computer Sciences University of California, Berkeley 1 Emergence of Optical Links US IT Map Hyper-Scale
More informationActive Microring Based Tunable Optical Power Splitters
Active Microring Based Tunable Optical Power Splitters Eldhose Peter, Arun Thomas*, Anuj Dhawan*, Smruti R Sarangi Computer Science and Engineering, IIT Delhi, *Electronics and Communication Engineering,
More informationISSCC 2006 / SESSION 10 / mm-wave AND BEYOND / 10.1
10.1 A 77GHz 4-Element Phased Array Receiver with On-Chip Dipole Antennas in Silicon A. Babakhani, X. Guan, A. Komijani, A. Natarajan, A. Hajimiri California Institute of Technology, Pasadena, CA Achieving
More informationSilicon Photonics in Optical Communications. Lars Zimmermann, IHP, Frankfurt (Oder), Germany
Silicon Photonics in Optical Communications Lars Zimmermann, IHP, Frankfurt (Oder), Germany Outline IHP who we are Silicon photonics Photonic-electronic integration IHP photonic technology Conclusions
More informationResonant normal-incidence separate-absorptioncharge-multiplication. photodiodes
Resonant normal-incidence separate-absorptioncharge-multiplication Ge/Si avalanche photodiodes Daoxin Dai 1*, Hui-Wen Chen 1, John E. Bowers 1 Yimin Kang 2, Mike Morse 2, Mario J. Paniccia 2 1 University
More informationInP-based Waveguide Photodetector with Integrated Photon Multiplication
InP-based Waveguide Photodetector with Integrated Photon Multiplication D.Pasquariello,J.Piprek,D.Lasaosa,andJ.E.Bowers Electrical and Computer Engineering Department University of California, Santa Barbara,
More informationSemiconductor Optical Communication Components and Devices Lecture 39: Optical Modulators
Semiconductor Optical Communication Components and Devices Lecture 39: Optical Modulators Prof. Utpal Das Professor, Department of Electrical Engineering, Laser Technology Program, Indian Institute of
More informationHitless tunable WDM transmitter using Si photonic crystal optical modulators
Hitless tunable WDM transmitter using Si photonic crystal optical modulators Hiroyuki Ito, Yosuke Terada, Norihiro Ishikura, and Toshihiko Baba * Department of Electrical and Computer Engineering, Yokohama
More informationPolarization insensitive Ge-rich silicon germanium waveguides for optical interconnects on silicon
Polarization insensitive Ge-rich silicon germanium waveguides for optical interconnects on silicon V Vakarin, Papichaya Chaisakul, Jacopo Frigerio, Andrea Ballabio, Joan Manel Ramírez, Xavier Le Roux,
More informationSilicon microring modulator for 40 Gb/s NRZ- OOK metro networks in O-band
Silicon microring modulator for 4 Gb/s NRZ- OOK metro networks in O-band Zhe Xuan, 1,* Yangjin Ma, 1,2 Yang Liu, 2 Ran Ding, 2 Yunchu Li, 1 Noam Ophir, 2 Andy Eu- Jin Lim, 3 Guo-Qiang Lo, 3 Peter Magill,
More informationSilicon Carrier-Depletion-Based Mach-Zehnder and Ring Modulators with Different Doping Patterns for Telecommunication and Optical Interconnect
Silicon Carrier-Depletion-Based Mach-Zehnder and Ring Modulators with Different Doping Patterns for Telecommunication and Optical Interconnect Hui Yu, Marianna Pantouvaki*, Joris Van Campenhout*, Katarzyna
More information- no emitters/amplifiers available. - complex process - no CMOS-compatible
Advantages of photonic integrated circuits (PICs) in Microwave Photonics (MWP): compactness low-power consumption, stability flexibility possibility of aggregating optics and electronics functionalities
More informationDevice Requirements for Optical Interconnects to Silicon Chips
To be published in Proc. IEEE Special Issue on Silicon Photonics, 2009 Device Requirements for Optical Interconnects to Silicon Chips David A. B. Miller, Fellow, IEEE Abstract We examine the current performance
More informationHigh-speed silicon-based microring modulators and electro-optical switches integrated with grating couplers
Journal of Physics: Conference Series High-speed silicon-based microring modulators and electro-optical switches integrated with grating couplers To cite this article: Xi Xiao et al 2011 J. Phys.: Conf.
More informationSi Photonics Technology Platform for High Speed Optical Interconnect. Peter De Dobbelaere 9/17/2012
Si Photonics Technology Platform for High Speed Optical Interconnect Peter De Dobbelaere 9/17/2012 ECOC 2012 - Luxtera Proprietary www.luxtera.com Overview Luxtera: Introduction Silicon Photonics: Introduction
More informationSilicon photonics: Optical modulation in silicon platform
Silicon Photonics Silicon-based micro and nanophotonic devices Silicon photonics: Optical modulation in silicon platform, Institut d Electronique Fondamentale, CNRS UMR 8622, Université Paris Sud, 91405
More informationElectronic-Photonic ICs for Low Cost and Scalable Datacenter Solutions
Electronic-Photonic ICs for Low Cost and Scalable Datacenter Solutions Christoph Theiss, Director Packaging Christoph.Theiss@sicoya.com 1 SEMICON Europe 2016, October 27 2016 Sicoya Overview Spin-off from
More informationS-band gain-clamped grating-based erbiumdoped fiber amplifier by forward optical feedback technique
S-band gain-clamped grating-based erbiumdoped fiber amplifier by forward optical feedback technique Chien-Hung Yeh 1, *, Ming-Ching Lin 3, Ting-Tsan Huang 2, Kuei-Chu Hsu 2 Cheng-Hao Ko 2, and Sien Chi
More informationon-chip Design for LAr Front-end Readout
Silicon-on on-sapphire (SOS) Technology and the Link-on on-chip Design for LAr Front-end Readout Ping Gui, Jingbo Ye, Ryszard Stroynowski Department of Electrical Engineering Physics Department Southern
More informationProceedings Integrated SiGe Detectors for Si Photonic Sensor Platforms
Proceedings Integrated SiGe Detectors for Si Photonic Sensor Platforms Grégory Pandraud 1, *, Silvana Milosavljevic 1, Amir Sammak 2, Matteo Cherchi 3, Aleksandar Jovic 4 and Pasqualina Sarro 4 1 Else
More informationIndex. Cambridge University Press Silicon Photonics Design Lukas Chrostowski and Michael Hochberg. Index.
absorption, 69 active tuning, 234 alignment, 394 396 apodization, 164 applications, 7 automated optical probe station, 389 397 avalanche detector, 268 back reflection, 164 band structures, 30 bandwidth
More informationECEN620: Network Theory Broadband Circuit Design Fall 2014
ECEN620: Network Theory Broadband Circuit Design Fall 2014 Lecture 19: High-Speed Transmitters Sam Palermo Analog & Mixed-Signal Center Texas A&M University Announcements Exam 3 is on Friday Dec 5 Focus
More informationLow Thermal Resistance Flip-Chip Bonding of 850nm 2-D VCSEL Arrays Capable of 10 Gbit/s/ch Operation
Low Thermal Resistance Flip-Chip Bonding of 85nm -D VCSEL Arrays Capable of 1 Gbit/s/ch Operation Hendrik Roscher In 3, our well established technology of flip-chip mounted -D 85 nm backside-emitting VCSEL
More informationfor optical communication system
High speed Ge waveguide detector for optical communication system Xingjun Wang, Zhijuan Tu and Zhiping Zhou State Key Laboratory of Advanced Optical Communication Systems and Networks, School of Electronics
More informationDesign of a Low Noise Amplifier using 0.18µm CMOS technology
The International Journal Of Engineering And Science (IJES) Volume 4 Issue 6 Pages PP.11-16 June - 2015 ISSN (e): 2319 1813 ISSN (p): 2319 1805 Design of a Low Noise Amplifier using 0.18µm CMOS technology
More informationPresentation Overview
Low-cost WDM Transceiver Technology for 10-Gigabit Ethernet and Beyond Brian E. Lemoff, Lisa A. Buckman, Andrew J. Schmit, and David W. Dolfi Agilent Laboratories Hot Interconnects 2000 Stanford, CA August
More informationSilicon Photonics: A Platform for Integration, Wafer Level Assembly and Packaging
Silicon Photonics: A Platform for Integration, Wafer Level Assembly and Packaging M. Asghari Kotura Inc April 27 Contents: Who is Kotura Choice of waveguide technology Challenges and merits of Si photonics
More informationMODELING AND EVALUATION OF CHIP-TO-CHIP SCALE SILICON PHOTONIC NETWORKS
1 MODELING AND EVALUATION OF CHIP-TO-CHIP SCALE SILICON PHOTONIC NETWORKS Robert Hendry, Dessislava Nikolova, Sébastien Rumley, Keren Bergman Columbia University HOTI 2014 2 Chip-to-chip optical networks
More informationLow-power 2.5 Gbps VCSEL driver in 0.5 µm CMOS technology
Low-power 2.5 Gbps VCSEL driver in 0.5 µm CMOS technology Bindu Madhavan and A. F. J. Levi Department of Electrical Engineering University of Southern California Los Angeles, California 90089-1111 Indexing
More informationIBM T. J. Watson Research Center IBM Corporation
Broadband Silicon Photonic Switch Integrated with CMOS Drive Electronics B. G. Lee, J. Van Campenhout, A. V. Rylyakov, C. L. Schow, W. M. J. Green, S. Assefa, M. Yang, F. E. Doany, C. V. Jahnes, R. A.
More informationISSCC 2004 / SESSION 26 / OPTICAL AND FAST I/O / 26.4
ISSCC 2004 / SESSION 26 / OPTICAL AND FAST I/O / 26.4 26.4 40Gb/s CMOS Distributed Amplifier for Fiber-Optic Communication Systems H. Shigematsu 1, M. Sato 1, T. Hirose 1, F. Brewer 2, M. Rodwell 2 1 Fujitsu,
More informationTU3B-1. An 81 GHz, 470 mw, 1.1 mm 2 InP HBT Power Amplifier with 4:1 Series Power Combining using Sub-quarter-wavelength Baluns
TU3B-1 Student Paper Finalist An 81 GHz, 470 mw, 1.1 mm 2 InP HBT Power Amplifier with 4:1 Series Power Combining using Sub-quarter-wavelength Baluns H. Park 1, S. Daneshgar 1, J. C. Rode 1, Z. Griffith
More informationMICRO RING MODULATOR. Dae-hyun Kwon. High-speed circuits and Systems Laboratory
MICRO RING MODULATOR Dae-hyun Kwon High-speed circuits and Systems Laboratory Paper preview Title of the paper Low Vpp, ultralow-energy, compact, high-speed silicon electro-optic modulator Publication
More informationHigh-speed free-space based reconfigurable card-to-card optical interconnects with broadcast capability
High-speed free-space based reconfigurable card-to-card optical interconnects with broadcast capability Ke Wang, 1,2,* Ampalavanapillai Nirmalathas, 1,2 Christina Lim, 2 Efstratios Skafidas, 1,2 and Kamal
More informationHeinrich-Hertz-Institut Berlin
NOVEMBER 24-26, ECOLE POLYTECHNIQUE, PALAISEAU OPTICAL COUPLING OF SOI WAVEGUIDES AND III-V PHOTODETECTORS Ludwig Moerl Heinrich-Hertz-Institut Berlin Photonic Components Dept. Institute for Telecommunications,,
More informationA Variable-Frequency Parallel I/O Interface with Adaptive Power Supply Regulation
WA 17.6: A Variable-Frequency Parallel I/O Interface with Adaptive Power Supply Regulation Gu-Yeon Wei, Jaeha Kim, Dean Liu, Stefanos Sidiropoulos 1, Mark Horowitz 1 Computer Systems Laboratory, Stanford
More informationEnvisioning the Future of Optoelectronic Interconnects:
Envisioning the Future of Optoelectronic Interconnects: The Production Economics of InP and Si Platforms for 100G Ethernet LAN Transceivers Shan Liu Dr. Erica Fuchs Prof. Randolph Kirchain MIT Microphotonics
More informationPhoto-Electronic Crossbar Switching Network for Multiprocessor Systems
Photo-Electronic Crossbar Switching Network for Multiprocessor Systems Atsushi Iwata, 1 Takeshi Doi, 1 Makoto Nagata, 1 Shin Yokoyama 2 and Masataka Hirose 1,2 1 Department of Physical Electronics Engineering
More informationHigh-power flip-chip mounted photodiode array
High-power flip-chip mounted photodiode array Allen S. Cross, * Qiugui Zhou, Andreas Beling, Yang Fu, and Joe C. Campbell Department of Electrical and Computer Engineering, University of Virginia, 351
More informationHeterogeneously Integrated Microwave Signal Generators with Narrow- Linewidth Lasers
Heterogeneously Integrated Microwave Signal Generators with Narrow- Linewidth Lasers John E. Bowers, Jared Hulme, Tin Komljenovic, Mike Davenport and Chong Zhang Department of Electrical and Computer Engineering
More informationChallenges for On-chip Optical Interconnect
Initial Results of Prototyping a 3-D Integrated Intra-Chip Free-Space Optical Interconnect Berkehan Ciftcioglu, Rebecca Berman, Jian Zhang, Zach Darling, Alok Garg, Jianyun Hu, Manish Jain, Peng Liu, Ioannis
More informationWavelength and bandwidth-tunable silicon comb filter based on Sagnac loop mirrors with Mach- Zehnder interferometer couplers
Wavelength and bandwidth-tunable silicon comb filter based on Sagnac loop mirrors with Mach- Zehnder interferometer couplers Xinhong Jiang, 1 Jiayang Wu, 1 Yuxing Yang, 1 Ting Pan, 1 Junming Mao, 1 Boyu
More informationAdaptive multi/demultiplexers for optical signals with arbitrary wavelength spacing.
Edith Cowan University Research Online ECU Publications Pre. 2011 2010 Adaptive multi/demultiplexers for optical signals with arbitrary wavelength spacing. Feng Xiao Edith Cowan University Kamal Alameh
More informationMA4AGSW2. AlGaAs SP2T PIN Diode Switch. MA4AGSW2 Layout. Features. Description. Absolute Maximum Ratings TA = +25 C (Unless otherwise specified)
AlGaAs SP2T PIN Diode Switch Features Ultra Broad Bandwidth: 5 MHz to 5 GHz Functional bandwidth : 5 MHz to 7 GHz.7 db Insertion Loss, 33 db Isolation at 5 GHz Low Current consumption: -1 ma for Low Loss
More informationBinary phase-shift keying by coupling modulation of microrings
Binary phase-shift keying by coupling modulation of microrings Wesley D. Sacher, 1, William M. J. Green,,4 Douglas M. Gill, Solomon Assefa, Tymon Barwicz, Marwan Khater, Edward Kiewra, Carol Reinholm,
More information40 Gb/s silicon photonics modulator for TE and TM polarisations
40 Gb/s silicon photonics modulator for TE and TM polarisations F. Y. Gardes,* D. J. Thomson, N. G. Emerson and G. T. Reed Advanced Technology Institute, University of Surrey Guildford, Surrey, GU2 7XH,
More informationOpto-VLSI-based reconfigurable photonic RF filter
Research Online ECU Publications 29 Opto-VLSI-based reconfigurable photonic RF filter Feng Xiao Mingya Shen Budi Juswardy Kamal Alameh This article was originally published as: Xiao, F., Shen, M., Juswardy,
More informationHybrid vertical-cavity laser integration on silicon
Invited Paper Hybrid vertical-cavity laser integration on Emanuel P. Haglund* a, Sulakshna Kumari b,c, Johan S. Gustavsson a, Erik Haglund a, Gunther Roelkens b,c, Roel G. Baets b,c, and Anders Larsson
More informationSpecification for 100GBASE-DR4. Piers Dawe
Specification for 100GBASE-DR4 Piers Dawe IEEE P802.3bm, July 2013, Geneva IEEE P802.3bm, July 2013, Geneva Specification for 100GBASE-DR4 1 Supporters Arlon Martin Kotura IEEE P802.3bm, July 2013, Geneva
More informationHybrid Integration Technology of Silicon Optical Waveguide and Electronic Circuit
Hybrid Integration Technology of Silicon Optical Waveguide and Electronic Circuit Daisuke Shimura Kyoko Kotani Hiroyuki Takahashi Hideaki Okayama Hiroki Yaegashi Due to the proliferation of broadband services
More informationVariable splitting ratio 2 2 MMI couplers using multimode waveguide holograms
Variable splitting ratio 2 2 MMI couplers using multimode waveguide holograms Shuo-Yen Tseng, Canek Fuentes-Hernandez, Daniel Owens, and Bernard Kippelen Center for Organic Photonics and Electronics, School
More informationNear/Mid-Infrared Heterogeneous Si Photonics
PHOTONICS RESEARCH GROUP Near/Mid-Infrared Heterogeneous Si Photonics Zhechao Wang, PhD Photonics Research Group Ghent University / imec, Belgium ICSI-9, Montreal PHOTONICS RESEARCH GROUP 1 Outline Ge-on-Si
More information