DC-6GHz Reflective SPDT. GaAs Monolithic Microwave IC in SMD leadless package

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1 Description GaAs Monolithic Microwave IC in SMD leadless package The CHS5104-FAA is a monolithic FET based reflective switch housed in leadless surface mount hermetic metal ceramic 6x6mm² package. It is designed for a wide range of applications, from space and military to commercial communication systems. The circuit is manufactured with a phemt process, 0.25µm gate length. It is supplied in RoHS compliant SMD package. Main Features Broadband performance: DC-6GHz Low insertion loss: Isolation: Input P1dB: 30dBm Main Electrical Characteristics Tamb.= +25 C Vh=0V/VL=-5V Symbol Parameter Min Typ Max Unit Freq Frequency range DC 6 GHz IL On state insertion loss 1.3 db ISOL Off state isolation 30 db RL On state return loss 10 db IP1dB Input gain compression 30 dbm Ref. : DSCHS5104-FAA Feb 18 1/16 Specifications subject to change without notice United Monolithic Semiconductors S.A.S.

2 Electrical Characteristics (1) Tamb.= +25 C, specifications are given for 50Ω source and load impedances. Symbol Parameter Condition Min Typ Max Unit Freq Frequency range DC 6 GHz IL On state insertion loss (1) DC - 2GHz DC - 4GHz DC - 6GHz ISOL Off state isolation DC - 2GHz DC - 4GHz DC - 6GHz RL On state input and output return losses DC - 2GHz DC - 4GHz DC - 6GHz VH Control voltage high level VL Control voltage low level -8-5 V IP1dB Input gain Freq. 0.5GHz dbm compression. VL=-5V/VH=0V VL=-8V/VH=0V Ton / Toff Switching time 50% control to 10 ns 90% RF, and 50% control to 10% RF Ic Current consumption on the control supply voltage µa Freq. 0.5GHz Pin 33dBm VH= 0V VL=-5V VL=-8V (1) These values are representative of onboard measurements as defined on the drawing in paragraph "Evaluation mother board". Reference planes of on-board measurements are defined in the paragraph S-parameters reference planes (2) Variation rate of insertion loss with temperature in the range -40 C to +125 C: dB/ C db db db SPDT truth table PAD A PAD B Electrical path RFC to RF1 VH VL ON OFF VL VH OFF ON Electrical path RFC to RF2 Ref. : DSCHS5104-FAA Feb 18 2/16 Specifications subject to change without notice

3 CHS5104-FAA Absolute Maximum Ratings (1) Tamb.= +25 C Symbol Parameter Values Unit VH High level control voltage 0.8 V VL Low level control voltage -10 ma Pin Maximum peak input power overdrive 37 dbm Tj Maximum Junction temperature 175 C (1) Operation of this device above anyone of these parameters may cause permanent damage. Temperature Range Ta Operating temperature range -55 to +125 C Tstg Storage temperature range -55 to +150 C Ref. : DSCHS5104-FAA Feb 18 3/16 Specifications subject to change without notice

4 Device thermal performances All the figures given in this section are obtained assuming that the FAA device is only cooled down by conduction through the package thermal pad (no convection mode considered). The temperature is monitored at the package back-side interface (Tcase). The system maximum temperature must be adjusted in order to guarantee that Tjunction remains below the maximum value specified in the Absolute Maximum Ratings table. So, the system PCB must be designed to comply with this requirement. Parameter RTH (1) Thermal Resistance ( Junction to Case) Biasing conditions VH= 0V/VL=-5V Pdiss= 2.1W Tjunction ( C) RTH ( C/W) T50 ( hours) E+05 (1) Assuming 85 C Tcase Note: when SPDT operates in linear mode Pdiss can be neglected and Tj=Tcase Ref. : DSCHS5104-FAA Feb 18 4/16 Specifications subject to change without notice

5 CHS5104-FAA Typical Package Sij parameters Tamb.= +25 C, A=0V, B=-5V, on-state RFC-RF1 path Freq (GHz) S11 (db) PhS11 ( ) S21 (db) PhS21 ( ) S12 (db) PhS12 ( ) S22 (db) PhS22 ( ) Ref. : DSCHS5104-FAA Feb 18 5/16 Specifications subject to change without notice

6 Typical Package Sij parameters Tamb.= +25 C, A=-5V, B=0V, off-state RFC-RF1 path Freq (GHz) S11 (db) PhS11 ( ) S21 (db) PhS21 ( ) S12 (db) PhS12 ( ) S22 (db) PhS22 ( ) Ref. : DSCHS5104-FAA Feb 18 6/16 Specifications subject to change without notice

7 CHS5104-FAA Typical Board Measurements Tamb.= +25 C, VH=0V / VL=-5V ON state RFC-RF1 path : S21 versus Frequency (A=0V, B=-5V) ON state RFC-RF1 path : S11 and S22 versus Frequency (A=0V, B=-5V) Ref. : DSCHS5104-FAA Feb 18 7/16 Specifications subject to change without notice

8 Typical Board Measurements Tamb.= +25 C, VH=0V / VL=-5V OFF state RFC-RF1 path : S21 versus Frequency (A=-5V, B=0V) Ref. : DSCHS5104-FAA Feb 18 8/16 Specifications subject to change without notice

9 CHS5104-FAA Typical Board Measurements Tamb.= +25 C, VH=0V / VL=-5V Note: board losses are corrected Insertion Loss RFC-RF1 path versus input power (A=0V/B=-5V) Input power at 1dB Insertion Loss compression (RFC-RF1 path) versus frequency (A=0V/B=-5V) Ref. : DSCHS5104-FAA Feb 18 9/16 Specifications subject to change without notice

10 Typical Board Measurements Tamb.= +25 C, VH=0V / VL=-8V Note: board losses are corrected Insertion Loss RFC-RF1 path versus input power (A=0V/B=-8V) Ref. : DSCHS5104-FAA Feb 18 10/16 Specifications subject to change without notice

11 CHS5104-FAA Package outline Units : mm 1- GND (2) 8- RF1 15- GND (2) 21- GND 2- NC 9- GND (2) 16- NC 3- RFC 10- A 17- GND (2) 4- NC 11- GND (2) 18- NC 5- GND (2) 12- NC 19- RFC 6- NC 13- GND 20- NC 7- GND (2) 14- RF1 (1) The package outline drawing included to this data-sheet is given for indication. Refer to the application note AN0024 ( for exact package dimensions. (2) It is strongly recommended to ground all pins marked GND through the PCB board. Ensure that the PCB board is designed to provide the best possible ground to the package. Ref. : DSCHS5104-FAA Feb 18 11/16 Specifications subject to change without notice

12 Definition of the Sij reference planes The reference planes used for Sij measurements given above are symmetrical from the symmetrical axis of the package (see drawing beside). The input and outputs reference planes are located at 3.39mm offset (input wise or output wise respectively) from these axis. Then, the given Sij parameters incorporate the land pattern of the evaluation motherboard recommended in paragraph "Evaluation mother board". Package Information Parameter Package body material Lead finish Hermetic sealing (fine leak compliant Mil-Std-883 Method Condition A4, tracer gas He at 1atm) Value RoHS-compliant Gold 1x10-8 cche/s/atm Ref. : DSCHS5104-FAA Feb 18 12/16 Specifications subject to change without notice

13 CHS5104-FAA Evaluation board description Compatible with the proposed footprint. Based on typically Ro4003 / 8mils or equivalent. Using a micro-strip to coplanar transition to access the package. Recommended for the implementation of this product on a module board. Recommendation on decoupling Label Type Decoupling Comment A, B Control Not required SPDT switch pad control voltage RFC, RF1, RF2 RF access External DC block must be used to ensure DC decoupling The MMIC is DC coupled Ref. : DSCHS5104-FAA Feb 18 13/16 Specifications subject to change without notice

14 DC Schematic Ref. : DSCHS5104-FAA Feb 18 14/16 Specifications subject to change without notice

15 CHS5104-FAA Notes Ref. : DSCHS5104-FAA Feb 18 15/16 Specifications subject to change without notice

16 Recommended package footprint for FAA Package Refer to the application note AN0024 available at for package foot print recommendations and exact package dimensions. SMD mounting procedure for FAA Package For the mounting process standard techniques involving solder paste and a suitable reflow process can be used. For further details, see application note AN0024 available at Recommended environmental management UMS products are compliant with the regulation in particular with the directives RoHS N 2011/65 and REACh N 1907/2006. More environmental data are available in the application note AN0019 also available at Recommended ESD management Refer to the application note AN0020 available at for ESD sensitivity and handling recommendations for the UMS package products. Ordering Information FAA package: CHS5104-FAA/XY Waffle pack: XY = 24 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHS5104-FAA Feb 18 16/16 Specifications subject to change without notice