UWB advantages: - High data rate, up to 2Mbps High density of devices Low susceptibility to multipath fading High immunity against wireless networks i

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1 Full Specification of IR-UWB Module UM100 This small IR-UWB module (13.4mm*13.4mm*2.60mm) can be used for RTLS (Real Time Location System), location tracking devices or wireless network system (WPAN wireless personal area networks, Wireless connectivity ). This module offer best in class indoor location system, with precision down to 10cm, and a range up to 880m LOS Line of Sight. It is highly flexible, and can work in standalone mode or can be controlled by an external microcontroller. A lot of control interfaces are available (UART, I2C, SPI, USB), as well as numerous GPIOs (General Purpose In Out), and external interfaces (UART, SPIs, I2C) to control external devices such as LEDs, Sensors, Application: This module is specially designed for warehousing and logistics companies, healthcare maintenance, security and building controls, Robotics, virtual reality and gaming, personal navigation devices, wearable sensors Features: 2 power supplies: - bat from 2.7 to 5.25 dd_io_mcu from 1.8 to 3.6 (IOs voltage settings to be compliant with customer baseband voltages) Low power modes, down to 6µA with RTC (Real-Time Clock) counter enabled for module version available in Q Up to 10 GPIOs available if USB control is used or 7 GPIOs if SPI bus is used to control the module and one I2C bus is used to control an external device. application programming interfaces for firmware upgrade (Mode selection, Hardware interface selection, external device control ) Compact design: 13.4 x 13.4 x 2.60mm Surface-mount device (SMD) module Full specification 2.13 AUGUST 2016 Page 1

2 UWB advantages: - High data rate, up to 2Mbps High density of devices Low susceptibility to multipath fading High immunity against wireless networks interferences Secure communication Mitigation techniques supported: LDC (Low duty cycle), DAA (Detect and Avoid), TPC (Transmit Power Control) Module control interface: This module can be controlled either by: USB (USB_DM, USB_DP) SPI (SPI_MISO, SPI_MOSI, SPI_NSS, SPI_CLK) I2C (I2C_SCL, I2C_SDA) UART (or 5 pins USART: UART_Tx, UART_Rx, UART_CTS, UART_RTS, UART_CLK) The interface selection is mainly done by software settings. External control interface: This module is quite flexible, and can control external devices with: 10 GPIOs SPI (1 SPI bus, with 3 chips select) I2C UART (or USART, can be configured as SPI bus) Caution! ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage. Disclaimer: Specifications and data are subject to change without prior notice. Full specification 2.13 AUGUST 2016 Page 2

3 Table of contents Full Specification of IR-UWB Module UM Document history...7 Introduction...8 Block diagram... 8 Pin description...9 Pin layout... 9 Pin definitions... 9 Application proposal...12 Standalone solution...12 External Master MCU associated:...13 ST Debug interface: USB configuration Electrical characteristics...16 Absolute maximum rating General operating conditions...16 General input/output characteristics UWB features Frequency range: Receiver sensitivity:...19 Transmitter performances:...20 General physical characteristics:...21 Current consumption profile:...22 PSDU Frame format Internal blocks...24 MCU Clocks Reset Wake up...25 Interruption (IT) Timers Full specification 2.13 AUGUST 2016 Page 3

4 SPI...25 I2C USART USB ADC...26 DAC...27 BOOT Mode...27 Serial Wire debug (SWD)...27 Lower Power Modes...28 oltage regulators Software modules API System control commands Radio control commands Sequencer control commands...32 Protocol control commands SPI command diagram...34 Product Outline...35 Land Pattern recommendation Soldering proposal Packaging information...38 Product Marking Product Package Storage and Use control...39 Applicable standards Contacts Full specification 2.13 AUGUST 2016 Page 4

5 List of Figures Figure 1 Block diagram of UM Figure 2 Pin layout... 9 Figure 3 Pin connections for standalone solution Figure 4 Pin connections to an external host MCU...13 Figure 5 Pin connections for ST debug interface...14 Figure 6 Pin connections for USB configuration...15 Figure 7 PSDU frame format...23 Figure 8 SPI command diagram...34 Figure 9 Product outline Figure 10 Land pattern recommendation Figure 11 Soldering profile proposal...37 Figure 12 Product Marking Figure 13 Product Package Full specification 2.13 AUGUST 2016 Page 5

6 List of Tables Table 1 Document history. (1) Firmware version 2.0, 2.1.0, do not exist due to ersion alignment...7 Table 2 Pin definition Table 3 Absolute maximum rating...16 Table 4 General operating conditions Table 5 General input characteristics Table 6 General output characteristics Table 7 Frequency range...18 Table 8 Receiver sensitivity Table 9 Transmitter performances Table 10 General physical characteristics Table 11 Current consumption profile Table 12 32KHz clock parameters...24 Table 13 26MHz clock parameters Table 14 ADC parameters Table 15 DAC parameters Table 16 UWB radio power modes Table 17 Categories of module commands...29 Table 18 System control commands...30 Table 19 Radio control commands Table 20 Sequencer control commands...32 Table 21 Protocol control commands Full specification 2.13 AUGUST 2016 Page 6

7 Document history Revision 2.1 Date 05/10/ /01/ /01/ /02/ /02/ /03/ /04/ /06/ /08/ /11/ /01/ /06/ /08/2016 Software Compatibility First customers release Firmware version 0.2 Firmware version 1.0 Updated Datasheet with erratum Firmware version 1.1 Updated Datasheet with erratum Firmware version 1.2 Updated Datasheet with erratum Firmware version 1.3 and 1.4 Firmware version 1.3 and 1.4 Firmware version 1.5 Firmware version 1.6 Firmware version 1.7 Firmware version 1.8 Firmware version 1.9 Firmware version 2.2.1(1) Firmware version 2.3.0(2) Firmware version 2.4.x Table 1 Document history. (1) Firmware version 2.0, 2.1.0, do not exist due to ersion alignment. (2) Firmware version is an Internal version Full specification 2.13 AUGUST 2016 Page 7

8 Introduction UPosition is a professional solution provider for indoor & outdoor location systems. We provide our customers hardware devices, back-end customized solutions and also consultant service regarding location-based applications (for more information, please visit Collaborating closely with BeSpoon, a fabless semiconductor company (for more information, please visit ), we unveil the first ultra-small IR-UWB module UM100 for high-precision indoor location purposes based on BeSpoon chip. UM100 module offers best in class indoor location solution in term of precision (down to 10cm), ranging (up to 880m Line of Sight) and receiver sensitivity (down to -118dBm). Customers can quickly integrate this module in their hardware without any knowledge of radio communication. Several source codes are provided to allow customers to write their own application, and start measuring distances between two or more devices. Block diagram Module Enable dd_io_mcu voltage Settings Module Control interface bat regulator Always ON Level shifter MCU STM32F072 regulator Ext. Ref. oltage (2v5) IR-UWB chip Antenna 32KHz XTAL 26MHz CTCXO 2v5 GPIOs & External devices control interface Figure 1 Block diagram of UM100 PLEASE NOTE: The voltage DD_IO_MCU must be supplied to enable SPI interface and all signals supplied by this voltage (please check pin definition section). Full specification 2.13 AUGUST 2016 Page 8

9 Pin description Pin layout Figure 2 Pin layout Pin definitions Pin Pin Name # (function after reset) Alternate functions (soft setting) In / Out IO_ ref. Supply / GND(1) Description of Main function Internal level shifter Yes 1 GND GND GND 2 MCU_WAKEUP In DD_IO_MCU Ext. Pin to wake up the module MCU 3 USART2_TX ADC or SPI slave MISO, GPIO_G1IO3 Out DD_2v5(3) For trace. 4 USART2_RX ADC or SPI slave MOSI, GPIO_G1IO4 In DD_2v5(3) For trace. Full specification 2.13 AUGUST 2016 Page 9

10 5 DAC1 ADC, SPI slave CLK, GPIO_G2IO1 6 MCU_MODULE_IT GPIO_G4IO2 Out DD_2v5(3) Out DD_IO_MCU(2 ) 7 8 MCU_USB_DM MCU_USB_DP USART1_CTS, GPIO_G4IO3 In/Out USART1_RTS, GPIO_G4IO4 In/Out DD_IO_MCU(2 ) DD_IO_MCU(2 ) 9 GND GND GND 10 MCU_SWDIO In/Out DD_IO_MCU(2 ) 11 MCU_SWCLK In DD_IO_MCU(2 ) 12 MCU_SPI1_NSS In DD_IO_MCU(2 ) 13 GPIO_G3IO4 SPI2_ NSS Out DD_2v5(3) 14 MCU_SPI1_CLK GPIO_G5IO1 In DD_IO_MCU(2 ) 15 MCU_SPI1_MISO GPIO_G5IO2 Out DD_IO_MCU(2 ) 16 MCU_SPI1_MOSI Wake up 6 In DD_IO_MCU(2 ) 17 GND 18 MCU_USART1_TX MCU_USART1_RX I2C2_SCL GND GND I2C1_SCL, GPIO_G5IO3 Out DD_IO_MCU(2 I2C1_SDA, GPIO_G5IO4 In USART3_TX, SPI2_ MOSI Out Debug, Programming interface IO Debug, Programming interface clock SPI slave bus to control the module Yes SPI slave bus to control the module Yes SPI slave bus to control the module Yes SPI slave bus to control the module Yes Yes ) DD_IO_MCU(2 ) Full specification 2.13 AUGUST 2016 Page 10 Pin to wake up ext. MCU that controls the module DD_2v5(2) Yes

11 21 I2C2_SDA In DD_2v5(2) 22 GPIO_G6IO2 Out DD_2v5(2) 23 MCU_NRST In DD_IO_MCU 24 DD_IO_MCU In 1.8 to BAT_MODULE 25 GND GND GND 26 BAT_MODULE 3 to ENABLE 1.8 to BAT_MODULE 28 DD_2v5 Out 29 GND RF GND 30 ANTENNA 31 GND RF GND GND 32 BOOTMODE In DD_2v5(3) (1) (2) (3) USART3_RX, SPI2_ MISO, GPIO_G6IO1 UART3_CLK, SPI2_ CLK Internal reference voltage GND RF Path For the main function after reset 5 tolerant. For more details specification, please refer to STM32F072 datasheet 3.3 tolerant Table 2 Pin definition Full specification 2.13 AUGUST 2016 Page 11 Yes Antenna pads

12 Application proposal Standalone solution In this configuration, the module can act as a standalone tag, replying to master request. A short circuit is required between pin # 32 (BOOTMODE) and pin # 1(GND), connect the battery on pin # 26 (BAT_MODULE) and on pin #27 (ENABLE), pin # 30 (ANTENNA) should be connected to the external antenna.. Figure 3 Pin connections for standalone solution Full specification 2.13 AUGUST 2016 Page 12

13 External Master MCU associated: In this configuration, an external Master MCU can control the module with a dedicated power domain (DD_IO_MCU). Make sure that the right voltage of the host interface is provided at pin #24 (DD_IO_MCU). The Master MCU can control the UM100 module with several interfaces : UART, I2C or SPI with a power domain reference at 2.5. Pin # 32 (BOOTMODE) is connected to GND to start module boot sequence from embedded code in Flash, otherwise if the MCU needs to re-program flash memory this pin must be set to high voltage at start up. PLEASE NOTE: the module by default is in sleep mode (Low power mode). To be able to communicate/program the module you must first either wake up it via the SPI bus (review paragraph: SPI command diagram), or make sure pin # 2 (MCU_WAKEUP) is LOW: MCU is active and it prevent from sleeping when doing protocol. Figure 4 Pin connections to an external host MCU Full specification 2.13 AUGUST 2016 Page 13

14 ST Debug interface: In this configuration, with ST debugger/programmer ST Linkv2 interface, you can flash the module, run the code, do step by step instruction, add break point, review register values To control the module via ST Link, nrst must be held at low level at start up (Mode connect under reset) Figure 5 Pin connections for ST debug interface Full specification 2.13 AUGUST 2016 Page 14

15 USB configuration In this configuration, the module is used in USB mode. An external regulator is required as the STM32 require a 3 minimum voltage to be USB compliant. Figure 6 Pin connections for USB configuration Full specification 2.13 AUGUST 2016 Page 15

16 Electrical characteristics Absolute maximum rating oltages and temperatures out of those values may cause permanent damage to the module. Symbol Parameter Batt. Supply voltage DD_IO_MCU Supply voltage All IOs Input / ouput all digital IOs Comments Min. Max. Unit Must not be supplied if batt.is not present On 5 tolerant pins(1) All others pins Ts Storage temperature C To Operating temperature C Max. Unit (1) 5 tolerant. For more details specification, please refer to STM32F072 datasheet Table 3 Absolute maximum rating General operating conditions Symbol Parameter Batt. Supply voltage input Comments Min. Typ. 2.7 DD_IO_MCU Supply voltage input Must not be supplied if batt.is not present 1.65 All IOs On 5 tolerant pins(1) All others pins -0.3 IO_ ref Input / output all digital IOs dd_2v5 (1) Supply voltage output tolerant. For more details specification, please refer to STM32F072 datasheet Table 4 General operating conditions Full specification 2.13 AUGUST 2016 Page 16

17 General input/output characteristics Symbol Parameter Comments IL 5 tolerant inputs (no Low level input voltage IL Min. Max. Unit level shifter) 0.475* IO_ ref dd_io_mcu pins (with 0.35* IO_ ref. level shifter) IL Boot0 0.3* IO_ ref. 0.3 IL Pin # 3, 4&5 0.3* IO_ ref IH High level input voltage 5 tolerant inputs (no 0.5* IO_ ref * IO_ ref. level shifter) IH 5 tolerant inputs (with level shifter) IH Boot0 0.2* IO_ ref IH Pin # 3, 4& * IO_ ref See STM32F072 datasheet +/-0.1 Ilkg Input leakage current 10 A Max. Unit 0.4 Table 5 General input characteristics Symbol Parameter Comments OL Output Low level voltage All pins OH Output High level voltage All pins Iodc Output drive current for pin with IO_ ref. = DD_2v5 Iodc Output drive current for pin with IO_ ref. = DD_IO_MCU Min. IO_ ref Level shifter pins limitation 25 Table 6 General output characteristics Full specification 2.13 AUGUST 2016 Page 17 8 ma A

18 UWB features Frequency range: The module supports the frequency band from 3 to 5GHz. All frequencies are provided by an internal PLL using as a standard reference clock 26MHz. Symbol Parameter CH1 Channel 1 BW1 Freq. bandwidth of channel 1 CH2 Channel 2 BW2 Freq. bandwidth of channel 2 CH3 Comments Min. Typ. Max. Unit MHz 500 MHz dB 500 MHz Channel 3 Filtering required on antenna side at 4.8GHz MHz BW3 Freq. bandwidth of channel -10dB 500 MHz CH4 Channel MHz BW4 Freq. bandwidth of channel dB Table 7 Frequency range Full specification 2.13 AUGUST 2016 Page 18

19 Receiver sensitivity: Measured at the antenna input pin with preamble of 512 symbols and data rate of 110kbps. Symbol Parameter Comments Min. S2_optimum CH2 (3993.6MHz), BW = 500MHz PER 20%, 4Bytes -113 dbm S1 CH1 (3494.4MHz), BW = 500MHz PER 1%, 20Bytes -110 dbm S2 CH2 (3993.6MHz), BW = 500MHz PER 1%, 20Bytes -110 dbm S3 CH3 (4492.8MHz), BW = 500MHz PER 1%, 20Bytes -110 dbm S4 CH4 (3494.4MHz), BW = 1000MHz PER 1%, 20Bytes -108 dbm S2 CH2 (3993.6MHz), BW = 500MHz PER 20%, 4bytes, 15 to 2Kbps -118 Table 8 Receiver sensitivity Full specification 2.13 AUGUST 2016 Page 19 Typ. Max Unit dbm

20 Transmitter performances: Measured at the antenna output pin with preamble of 512 symbols and data rate of 110kbps. Symbol Parameter Comments Txpeak BW = 500MHz Txrms Typ. Max. Unit Max. output Power in 50MHz BW dbm BW = 500MHz Max. Mean Power dbm/mhz Txpeak BW = 1000MHz Max. output Power in 50MHz BW dbm Txrms BW = 1000MHz Max. Mean Power dbm/mhz 0 4 db Tx Step Power range from 41.3dBm/MHz reference Min. -12 Tpulse Pulse duration 0,7 3 ns BW Pulse Freq. Bandwidth MHz Table 9 Transmitter performances Full specification 2.13 AUGUST 2016 Page 20

21 General physical characteristics: UWB radio physical controller is optimized for ranging, and not data throughput. Symbol Parameter PRF Pulse Repetition Frequency Symb. Symbol Code length Preamble Preamble Length 53 Symb. SFD Start Frame Delimiter Length 16 Symb. PHR(1) PHY Header 0 PSDU(1) PHY Service Data Unit 0 Mod. Modulation Type (1) (2) Comments Min. Typ PRP = 1/PRF 7(2) DBPSK PHR & PSDU are flexible. Internal CRC and/or FEC optimized for short packet data size can be enabled. Allow data rate up to 2Mbps Table 10 General physical characteristics Full specification 2.13 AUGUST 2016 Page 21 Max. Unit MHz 127 PRP 16 Symb. 127 Bytes

22 Current consumption profile: All data provided are computed data, final data and current profile will be provided later on. Power Mode PM_3 PM_2 PM_2 PM_0 STDBY TX_IDLE TX_ON RX_IDLE RX_ON UWB chip mode OFF Sleep RTC ON Sleep RTC ON Init Standby Tx Idle Tx Rx Idle Rx MCU mode OFF Standby Stop Run & sleep mode Run & sleep mode Run & sleep mode Run & sleep mode Run & sleep mode Run & sleep mode Description The module is in OFF state (no supply or enable pin # 27 = 0) UWB chip: 32KHz running & counting next event. MCU : No RAM retention, only 20Bytes are kept alive. UWB chip: 32KHz running & counting next event. MCU:. RAM retention and regulator low power mode UWB chip: running with 26MHz Clock, all internal regulator ON. MCU: in run or sleep mode, depends on the required activity. UWB chip: running with 26MHz and counting with his most accurate reference clock. UWB chip: ready to transmit. UWB chip: transmitting UWB chip: ready to receive. UWB chip: receiving UWB Current consumption(2) <100nA 4uA 4uA 3,9mA 10mA 12,7mA 13,6mA 95mA 120mA(1 UWB Current 172µA ) 172µA 172µA 3,9mA 12,8mA 14,7mA 16,6mA 102mA 130mA(1) 2µA 5µA When MCU active current 18,5mA for ranging activity is around 7,8ms max. 40ms from OFF state 40ms from OFF state 3.5ms from MCU ON or OFF Reset or MCU watchdog timer IRq from UWB chip or SPI, UART, MCU_wake up pin or MCU counter consumption(3) MCU Current consumption Duration to reach power mode state(4) MCU wake up condition (1) (2) (3) (4) Supply provided and enable pin activated 500µs from INIT 200µs from Standby Average duration between preamble synchronization and PSDU demodulation (50% of time for each state). Total current consumption for Module of next release, current consumption due to MCU activity is not included. Total current consumption of 1st Module release, current consumption due to MCU activity is not included. Indicative values, performances can be improved with final design. Table 11 Current consumption profile Full specification 2.13 AUGUST 2016 Page 22 Automatic or <200µs from TxIdle 500µs from standby Automatic or <200µs from RxIdle

23 PSDU Frame format The packet size PSDU can be defined in different ways: using a PHR or not with the help of register programming. Figure 7 PSDU frame format 1) Fixed packet length: In this case no PHR is use (PHR = 0), the size of the packet is defined by one module command: set_data_size Min PSDU size: 0 bits max size 1024 bits 2) ariable packet length (current) : The first byte after the synch word gives the length of the Payload in bytes. PHR = 8: Min PSDU Size: 0 byte, max size: 127 Bytes (no CRC), 125 Bytes with CRC. PHR = 16: Min PSDU size: 0 byte, Max size 126 Bytes (no CRC), 124 Bytes with CRC 3) CRC A CRC can be added separately on PHR and/or PSDU. The size can be either 12 or 16bits. 4) FEC (Forward Error Correction) A FEC can be enabled on PHR + PSDU. The FEC uses a Golay channel encoder adding 12bits for 12bits of data preventing frame loss due to fading / transmission errors. Full specification 2.13 AUGUST 2016 Page 23

24 Internal blocks MCU The MCU is a STM32F072 from ST, with ARM Core 32-bit Cortex -M0 CPU. The MCU can be clocked at a frequency up to 48 MHz, with 128KB of embedded flash memory and 16KB of SRAM. Clocks It is important to understand that the module includes several internal clocks. Some from the MCU itself with frequency clocks from 40 KHz up to 48MHz. Two clocks are required by the UWB chip: one at 32KHz Xtal and one at 26MHz CTCXO. The 32KHz is a low power clock, which is always enabled. It allows the UWB chip to count for the next event to occurs, and will wake up automatically the MCU and the 26MHz. The 26MHz is used during Tx and Rx, and to accurately measure the elapsed time between two events when it is needed (In case of a 2 way or 3 way ranging for example). 32KHz and 26MHz clocks can be adjusted internally: For the 32KHz: Symbol Parameter Min Freq. Default frequency Range Minimum frequency offset range -40 Step Programming step 1 Typ. Max Unit Hz +100 ppm 10 ppm/lsb Table 12 32KHz clock parameters Frequency adjustment of 32KHz clock is explained in paragraph: SYS_SET_CAPATUNE_AL For the 26MHz: Symbol Parameter Freq. Default frequency Range Minimum Frequency offset range Step Programming step Min Typ. Max MHz +6 0,004 Unit ppm ppm/lsb Table 13 26MHz clock parameters Frequency adjustment of 26MHz clock is explained in paragraph: SYS_SET_DAC_AL Full specification 2.13 AUGUST 2016 Page 24

25 Reset The NRST pin includes a permanent pull-up resistor, RPU of 4,7Kohms typical To reset the module hold the voltage low for at least 500ns. Wake up When the microcontroller is in stop mode (Low power mode), it can be woken up with an internal interrupt from UWB chip to MCU, or with the external pin #2 (MCU_WAKEUP): MCU_WAKEUP pin LOW: MCU is active and it prevent from sleeping when doing protocol MCU_WAKEUP pin High : MCU is put in stop mode or will be able to go in stop in protocol mode when doing ranging Interruption (IT) The Module has a dedicated hardware pin to wake up or request events from external MCU controlling the module. The internal MCU also handle UWB chip ITs which are generated on following events: Rx completed Rx preamble time out Rx SFD time out Tx completed TS-Delay Timers The STM32 includes 8 timers of 16bits, and one timer of 32bits. For further information, please have a look at STM32F072 datasheet. The UWB chip also includes a way to program events at dedicated time. This programming is done by counting events with numbers of 32KHz period and/or with numbers of 26MHz period and sub-26mhz period down to 125ps. SPI Two SPI Buses are available, one to control the module and one to program external devices, several GPIOs and SPI2_emul_NSS can be used to select specific devices. SPI bus can run up to 18Mbps. Full specification 2.13 AUGUST 2016 Page 25

26 I2C The I2C bus can run in three modes: Standard with a frequency up to 100KHz Fast mode with a frequency up to 400KHz Fast mode+ with a frequency up to 1MHz USART 3 UART buses can be available, depending on the configuration used. USB To be compliant with USB 2.0, the USB ports require a dd_io_mcu voltage between 3 to 3.6.² ADC One 12-bit analog to digital converter is used to measure the internal: Temperature sensor Reference voltage of the MCU Module supply voltage Pin # 3 to 5 can be used for this purpose. Symbol Parameter DD Analog supply voltage Min IDD(ADC) Typ. Max. Unit ma F(ADC) Sampling rate MHz ADC Conversion voltage range RIN External input impedance 50 KOhms Table 14 ADC parameters Full specification 2.13 AUGUST 2016 Page 26

27 DAC One 12-bit buffered DAC channel is used to convert digital signals into analog voltage signal outputs on pin # 5. Symbol Parameter dd Analog supply voltage RLOAD CLOAD Buffer ON Min Typ. Max. 2.5 Unit 5 Kohms Buffer OFF 15 Kohms Capacitive load 50 pf 2.3 DAC Range 0.2 Table 15 DAC parameters BOOT Mode There are 2 boot modes which are selected by the boot mode pin level during start up time: - Boot from MCU internal memory: pin #32 (BOOTMODE) must be kept in low voltage mode (The bootloader is embedded in the system memory.) - reprogram the module: pin #32 (BOOTMODE) must be kept at high level during start up time. You can reprogram the module on following interfaces: USART2: Pin # 3 & 4 I2C1: Pin # 18 & 19 USB: Pin # 7 & 8 with DFU (Device Firmware Upgrade) interface. Serial Wire debug (SWD) An ARM SW-DP interface is provided to allow a serial wire debugging tool to be connected to the MCU. Use Pin # 10 & 11. Full specification 2.13 AUGUST 2016 Page 27

28 Lower Power Modes Several low power modes are available for the UWB radio: Mode OFF description No Power Supply provided to the module. PM_3 UWB chip initialized, memory retention PM_2 UWB chip uses low power 32KHz Xtal clock, and potentially counting next event to do PM_0 UWB regulator ON, 26MHz ON PM_STDBY UWB running with precise 26MHz clock PM_RX_IDLE UWB ready to perform Rx PM_TX_IDLE UWB ready to perform Tx PM_TXRX_IDLE UWB ready to perform either Tx or Rx Table 16 UWB radio power modes oltage regulators The module includes two internal regulators at 2.5. These regulators are used to provide power supplies to the embedded MCU and the IR-UWB chip. The module also provides an output voltage from the main regulator. oltage is at 2.5 when module enable is set to High level. Full specification 2.13 AUGUST 2016 Page 28

29 Software modules API Module can embed software that will provide different kind of operations: 1) GENERIC software, provided by BeSpoon. Such software allows direct access to UWB chip solution: - UWB chip initialization - Configuration of symbol length, channel, setting the scheduler - Data to send - Action to do: Tx, Rx, No Action - Received Data & TOA (Time of Arrival) timing - Error management info Generic software user can then manage their software sequence. As a matter of fact, they must then create and develop their own UWB layer. 2) Software with BeSpoon Protocol. This software embeds a full abstraction of UWB chip. It allows access to BeSpoon Protocol: - BeSpoon protocol initialization - Configuration of slots, device mode - Getting distances, Data & TOA (Time of Arrival) Using such software with the module allows fast time to market as it can be integrated easily in a complete RTLS system. Such software is Available under specific license with BeSpoon Both GENERIC and PROTOCOL firmware can be accessed and controlled by external Master MCU through a set of SPI commands: Commands are grouped in four categories: Type of command Description Module firmware required System control Global module configuration and status GENERIC / PROTOCOL Radio control UWB Radio control GENERIC / PROTOCOL Sequencer control UWB Sequencer control Protocol control BeSpoon protocol control Table 17 Categories of module commands Refer to UM100 Reference Manual for more details on APIs. Full specification 2.13 AUGUST 2016 Page 29 GENERIC PROTOCOL

30 System control commands Command name Description SYS_GET_INFO Get info on module SYS_SET_MCU_STATE Put MCU under a pm state SYS_GET_DAC_AL Get DAC value SYS_SET_DAC_AL Set new DAC value SYS_GET_CAPATUNE_AL Get current Capa-tune val for 32Khz oscillator SYS_SET_CAPATUNE_AL Set new Capa-tune to tune 32Khz oscillator SYS_GET_RXFRAME_CFG Get the RX frame format sent to host MCU SYS_SET_RXFRAME_CFG Set the RX frame format sent to host MCU SYS_GET_STATUS_MSK Get event mask value SYS_SET_STATUS_MSK Set new event mask SYS_GET_STATUS Get current module status Table 18 System control commands Full specification 2.13 AUGUST 2016 Page 30

31 Radio control commands Command name Description RADIO_INIT Reset and initialize UWB radio RADIO_SPI_READ Read single or burst of radio register RADIO_SPI_WRITE Read single or burst of radio register RADIO_GET_PM_STATE Get current radio state RADIO_SET_PM_STATE Set new radio state RADIO_GET_PHY_CFG Get current radio settings RADIO_SET_PHY_CFG Set new radio settings RADIO_GET_RX_CFG Get current module RX configuration. This API are not available with software embedding BeSpoon Protocol, as it is not necessary. RADIO_SET_RX_CFG Set new module RX configuration. This API are not available with software embedding BeSpoon Protocol, as it is not necessary. RADIO_CLR_RNG_TIMER Reset module ranging timer This API are not available with software embedding BeSpoon Protocol, as it is not necessary. RADIO_WRITE_TX_DATA Write data to TX FIFO. This API are not available with software embedding BeSpoon Protocol, as it is not necessary. RADIO_READ_RX_DATA Get RX_DATA. This API are not available with software embedding BeSpoon Protocol, as it is not necessary. RADIO_PHY_CTRL Start/Stop a TX and/or -a RX. This API are not available with software embedding BeSpoon Protocol, as it is not necessary. Table 19 Radio control commands Full specification 2.13 AUGUST 2016 Page 31

32 Sequencer control commands In this module some events such as Tx, Rx, NO ACTION can be launched automatically thanks to a timer sequencer embedded in UWB chip. This timer used the 32KHz Xtal and/or 26MHz + 32KHz from 26MHz (~26MHZ/794) clocks, which allow the user to perform actions at with very precise timing down to 125ps. These APIs are not available with software embedding BeSpoon Protocol. Command name Description SEQ_INIT Initialize sequencer SEQ_GET_CFG Get global sequencer configuration SEQ_SET_CFG Set global sequencer configuration SEQ_QUEUE_SINGLE_ACT Enqueue single action to be performed by sequencer SEQ_CTRL Start/Stop sequencer Table 20 Sequencer control commands Full specification 2.13 AUGUST 2016 Page 32

33 Protocol control commands With Protocol firmware, more abstracted commands are available, to ease system development. This are available only under specific license with BeSpoon. Command name Description PROT_INIT Initialize BeSpoon Protocol PROT_SET_CAPS Set current BeSpoon protocol capabilities and device type. PROT_GET_CAPS Get current BeSpoon protocol capabilities and device type. PROT_SET_SFRAME_SCH Set BeSpoon protocol Superframe info. It s the timing configuration shema PROT_GET_SFRAME_SCH Get current BeSpoon protocol Superframe info. PROT_GET_STATS Get BeSpoon protocol statistics. PROT_RESET_STATS Reset BeSpoon protocol statistics. PROT_GET_ARTLS_PKT Get ARTLS command from BeSpoon protocol while its running (Live control and information). PROT_SET_ARTLS_PKT Send new ARTLS command to BeSpoon protocol while its running (Live control). PROT_GET_RANGING_PKT Get Ranging data (configurable) PROT_CTRL Start / Stop BeSpoon Protocol. Allow to get status of BeSpoon Protocol Table 21 Protocol control commands Full specification 2.13 AUGUST 2016 Page 33

34 SPI command diagram Default module control interface is SPI1. This interface is configured as standard 4-pins SPI, MODE 0: CPOL=0, CPHA=0 (sampling on rising edge of SPI clock). SPI word size is a byte, MSB sent first. SPI clock maximum frequency is 16MHz. Figure 8 SPI command diagram In case the module is programmed to enter in deep sleep mode, host must be sure that time between NSS and first clock is at least 80µseconds to let the module wake-up before sampling SPI data. To avoid this delay, it is possible to force the MCU to stay in awaken state (see SYS_SET_MCU_STATE), or to use pin #2 (MCU_WAKEUP) (Set MCU_WAKEUP pin to low). Full specification 2.13 AUGUST 2016 Page 34

35 Product Outline The pinout is always seen from the Top, the Land Pattern recommendation show the real requirement for you own PCB. Figure 9 Product outline Full specification 2.13 AUGUST 2016 Page 35

36 Land Pattern recommendation All dimensions in mm Figure 10 Land pattern recommendation Full specification 2.13 AUGUST 2016 Page 36

37 Soldering proposal This section need to be reviewed carefuly. For the time being it is a recommended / wished profile Figure 11 Soldering profile proposal Caution: 1) When opening the stencil of the mainboard where the module sits on, the hole of bonding pad of module should be expanded outward 0.7 mm. The thickness of the solder paste should be no more than 0.12 mm. 2) Operators should wear gloves and anti-static ring during accessing the modules. Full specification 2.13 AUGUST 2016 Page 37

38 Packaging information Product Marking Figure 12 Product Marking A label is stuck on the shielding of each UM100 module. The 2-dimensional code on the label includes all necessary information of the module, such as hardware version, MAC address, production serial number and production data. Product Package 1. The unit of the tray size in above picture is millimeter. 2. The tolerance of the length and width of the tray is ±1 mm. 3. Material: 0.6mm thickness black Polystyrene with antistatic finish (anti-static index: 103~108Ω) Figure 13 Product Package Full specification 2.13 AUGUST 2016 Page 38

39 Storage and Use control 1. The storage life of modules in tray with the vacuum packing: Shelf life: 12 months; Storage conditions: Temperature should be -40 C ~85 C. Relative humidity: < 90% R.H. 2. The module`s vacuum packing once opened, time limit of the assembly: 1) Check the humidity card, the display value should be less than 30% (blue), such as: 30% ~ 40% (pink), or greater than 40% (red), which means module has moisture absorption. 2) Factory environmental temperature should be controlled 30% C and humidity should be controlled 60% R.H. 3) Once the vacuum packing opened, save life will be 168 hours. 3. Once the vacuum packing opened and not used up within 168 hours: 1) The module must be bake again in order to remove moisture absorption. 2) The baking temperature should be 125 C, 8 hours. 3) Put the desiccant and seal packages after baking. Full specification 2.13 AUGUST 2016 Page 39

40 Applicable standards US FCC Part 15 EU ECC/ETSI Full specification 2.13 AUGUST 2016 Page 40

41 Contacts Please contact us at for any support you wish from us. Full specification 2.13 AUGUST 2016 Page 41