Brief Specification of IR-UWB Module UM100

Transcription

1 Brief Specification of IRUWB Module UM100 Introduction UPosition is a professional solution provider for indoor & outdoor location systems. We provide our customers hardware devices, backend customized solutions and also consultant service regarding locationbased applications (for more information, please visit Collaborating closely with BeSpoon, a fabless semiconductor company (for more information, please visit ), we unveil the first ultrasmall IRUWB module UM100 for highprecision indoor location purposes based on BeSpoon chip. UM100 module offers best in class indoor location solution in term of precision (down to 10cm), ranging (up to 880m Line of Sight) and receiver sensitivity (down to 118dBm). Also, it offers the best in class UWB solution in term of receiver sensitivity and transmission power. UM100 is ultra small with a footprint of 13.4mm*13.4mm*2.60mm. It can be used for RTLS (Real Time Location System), location tracking devices and WPAN (Wireless Personal Area Network) systems. UM100 is highly flexible, and can either work in standalone mode or be controlled by an external microcontroller. A lot of control interfaces (UART, I2C, SPI, USB) are available, as well as numerous GPIOs (General Purpose In Out), and external interfaces (UART, SPIs, I2C) to control external devices such as LEDs and sensors. Customers can quickly integrate UM100 module in their hardware without any knowledge of radio communication. Several source codes are provided to allow customers to write their own application, and start measuring distances between two or more devices. Application: UM100 is specially designed for warehousing and logistics companies, healthcare maintenance, security and building controls, Robotics, virtual reality and gaming, personal navigation devices, wearable sensors Features: 2 power supplies: Vbat from 2.7V to 5.25V Vdd_IO_MCU from 1.8V to 3.6V (IOs voltage settings to be compliant with customer baseband voltages) Low power modes, down to 6µA with RTC (RealTime Clock) counter enabled for module version available in Q Up to 10 GPIOs available if USB control is used or 7 GPIOs if SPI bus is used to control the module and one I2C bus is used to control an external device. application programming interfaces for firmware upgrade (Mode selection, Hardware interface selection, external device control ) Brief Specification 2.2 Jan Page 1

2 Memory available for user: about 80Kbytes ROM and about 10KBytes RAM with generic version Compact design: 13.4 x 13.4 x 2.60mm Surfacemount device (SMD) module UWB advantages: High data rate, up to 2Mbps High density of devices Low susceptibility to multipath fading High immunity against wireless networks interferences Secure communication Mitigation techniques supported: LDC (Low duty cycle), DAA (Detect and Avoid), TPC (Transmit Power Control) Module control interface: This module can be controlled either by: USB (USB_DM, USB_DP) SPI (SPI_MISO, SPI_MOSI, SPI_NSS, SPI_CLK) I2C (I2C_SCL, I2C_SDA) UART (or 5 pins USART: UART_Tx, UART_Rx, UART_CTS, UART_RTS, UART_CLK) The interface selection is mainly done by software settings. External control interface: UM100 is quite flexible, and can control external devices with: 10 GPIOs SPI (1 SPI bus, with 3 chips select) I2C UART (or USART, can be configured as SPI bus) Brief Specification 2.2 Jan Page 2

3 Block diagram Module Enable Vbat Vdd_IO_MCU voltage Settings regulator Always ON regulator Ext. Ref. Voltage (2v5) Module Control interface Level shifter MCU STM32F072 IRUWB chip Antenna 32KHz XTAL 26MHz VCTCXO 2v5 GPIOs & External devices control interface Figure 1 Block diagram of UM100 Brief Specification 2.2 Jan Page 3

4 Pin description Pin Layout Figure 2 Pin layout Pin Definitions Pin # Pin Name (function after reset) Alternate functions (soft setting) In / Out Supply / GND (1) VIO_ ref. Description of Main function Internal level shifter 1 GND GND GND 2 MCU_WAKEUP In VDD_IO_MCU Ext. Pin to wake up the module MCU Yes 3 USART2_TX ADC or SPI slave MISO, GPIO_G1IO3 4 USART2_RX ADC or SPI slave MOSI, GPIO_G1IO4 Out VDD_2v5 (3) For trace. In VDD_2v5 (3) For trace. Brief Specification 2.2 Jan Page 4

5 5 DAC1 ADC, SPI slave CLK, GPIO_G2IO1 Out VDD_2v5 (3) 6 MCU_MODULE_IT GPIO_G4IO2 Out VDD_IO_MCU (2) Pin to wake up ext. MCU that controls the module 7 MCU_USB_DM USART1_CTS, GPIO_G4IO3 8 MCU_USB_DP USART1_RTS, GPIO_G4IO4 In/Out VDD_IO_MCU (2) In/Out VDD_IO_MCU (2) 9 GND GND GND 10 MCU_SWDIO In/Out VDD_IO_MCU (2) Debug, Programming interface IO 11 MCU_SWCLK In VDD_IO_MCU (2) Debug, Programming interface clock 12 MCU_SPI1_NSS In VDD_IO_MCU (2) SPI slave bus to control the module Yes 13 GPIO_G3IO4 SPI2_ NSS Out VDD_2v5 (3) 14 MCU_SPI1_CLK GPIO_G5IO1 In VDD_IO_MCU (2) SPI slave bus to control the module 15 MCU_SPI1_MISO GPIO_G5IO2 Out VDD_IO_MCU (2) SPI slave bus to control the module 16 MCU_SPI1_MOSI Wake up 6 In VDD_IO_MCU (2) SPI slave bus to control the module Yes Yes Yes 17 GND GND GND 18 MCU_USART1_TX I2C1_SCL, GPIO_G5IO3 19 MCU_USART1_RX I2C1_SDA, GPIO_G5IO4 20 I2C2_SCL USART3_TX, SPI2_ MOSI Out VDD_IO_MCU (2) Yes In VDD_IO_MCU (2) Yes Out VDD_2v5 (2) Brief Specification 2.2 Jan Page 5

6 21 I2C2_SDA USART3_RX, SPI2_ MISO, GPIO_G6IO1 In VDD_2v5 (2) 22 GPIO_G6IO2 UART3_CLK, SPI2_ CLK Out VDD_2v5 (2) 23 MCU_NRST In VDD_IO_MCU Yes 24 VDD_IO_MCU In 1.8 to VBAT_MODULE 25 GND GND GND 26 VBAT_MODULE 3 to 4.2V 27 ENABLE 1.8 to VBAT_MODULE 28 VDD_2v5 Out Internal reference voltage 29 GND RF GND GND 30 ANTENNA RF Path Antenna pads 31 GND RF GND GND 32 BOOTMODE In VDD_2v5 (3) 1. For the main function after reset 2. 5 V tolerant. For more details specification, please refer to STM32F072 datasheet V tolerant Table 1 Pin definition Brief Specification 2.2 Jan Page 6

7 Application proposal: Standalone solution In this configuration, the module can act as a standalone tag, replying to master request. A short circuit is required between pin # 32 (BOOTMODE) and pin # 1(GND), connect the battery on pin # 26 (VBAT_MODULE) and on pin #27 (ENABLE), pin # 30 (ANTENNA) should be connected to the external antenna.. Figure 3 Pin connections for standalone solution Brief Specification 2.2 Jan Page 7

8 External MCU associated with this module: In this configuration, an external Master MCU can control the module with a dedicated power domain (VDD_IO_MCU). Make sure that the right voltage of the host interface is provided at pin #24 (VDD_IO_MCU). The Master MCU can control the UM100 module with several interfaces : UART, I2C or SPI with a power domain reference at 2.5V. Pin # 32 (BOOTMODE) is connected to GND to start module boot sequence from embedded code in Flash, otherwise if the MCU needs to reprogram flash memory this pin must be set to high voltage at start up. PLEASE NOTE: the module by default is in sleep mode (Low power mode). To be able to communicate/program the module you must first either wake up it via the SPI bus (review paragraph: SPI command diagram), or make sure pin # 2 (MCU_WAKEUP) is LOW: MCU is active and it prevent from sleeping when doing protocol. Figure 4 Pin connections to an external host MCU Brief Specification 2.2 Jan Page 8

9 ST Debug interface: In this configuration, with ST debugger/programmer ST Linkv2 interface, you can flash the module, run the code, do step by step instruction, add break point, review register values To control the module via ST Link, nrst must be held at low level at start up (Mode connect under reset) Figure 5 Pin connections for ST debug interface Brief Specification 2.2 Jan Page 9

10 USB configuration In this configuration, the module is used in USB mode. An external regulator is required as the STM32 require a 3V minimum voltage to be USB compliant. Figure 6 Pin connections for USB configuration Brief Specification 2.2 Jan Page 10

11 Electrical characteristics Absolute maximum rating Voltages and temperatures out of those values may cause permanent damage to the module. Symbol Parameter Comments Min. Max. Unit VBatt. Supply voltage V V DD_IO_MCU Supply voltage Must not be supplied if Vbatt.is not present V All IOs Ts To Input / ouput all digital IOs Storage temperature Operating temperature On 5V tolerant pins (1) V All others pins V C C (1) 5 V tolerant. For more details specification, please refer to STM32F072 datasheet General operating conditions Table 2 Absolute maximum rating Symbol Parameter Comments Min. Typ. Max. Unit VBatt. Supply voltage input V VDD_IO_MCU Supply voltage input Must not be supplied if Vbatt.is not present V All IOs Input / output all digital IOs On 5V tolerant pins (1) V All others pins 0.3 V IO_ ref V Vdd_2v5 Supply voltage output V (1) 5 V tolerant. For more details specification, please refer to STM32F072 datasheet Table 3 General operating conditions Brief Specification 2.2 Jan Page 11

12 General input/output characteristics Symbol Parameter Comments Min. Max. Unit V IL Low level input voltage 5V tolerant inputs (no level shifter) 0.475* V IO_ ref. 0.2 V V IL Vdd_IO_MCU pins (with level shifter) 0.35* V IO_ ref. V V IL Boot0 0.3* V IO_ ref. 0.3 V IL Pin # 3, 4&5 0.3* V IO_ ref V V V IH High level input voltage 5V tolerant inputs (no level shifter) 0.5* V IO_ ref V V IH 5V tolerant inputs (with level shifter) 0.65* V IO_ ref. V V IH Boot0 0.2* V IO_ ref V V IH Pin # 3, 4& * V IO_ ref V I lkg Input leakage current See STM32F072 datasheet +/ A Table 4 General input characteristics Symbol Parameter Comments Min. Max. Unit V OL Output Low level voltage All pins 0.4 V V OH Output High level voltage All pins V IO_ ref. 0.4 V I odc I odc Output drive current for pin with VIO_ ref. = VDD_2v5 Output drive current for pin with VIO_ ref. = VDD_IO_MCU 2 8 ma Level shifter pins limitation 25 A Table 5 General output characteristics Brief Specification 2.2 Jan Page 12

13 UWB features Frequency range: The module supports the frequency band from 3 to 5GHz. All frequencies are provided by an internal PLL using as a standard reference clock 26MHz. Symbol Parameter Comments Min. Typ. Max. Unit CH1 Channel MHz BW1 Freq. bandwidth of channel 10dB 500 MHz CH2 Channel MHz BW2 Freq. bandwidth of channel 10dB 500 MHz CH3 Channel 3 Filtering required on antenna side at 4.8GHz MHz BW3 Freq. bandwidth of channel 10dB 500 MHz CH4 Channel MHz BW4 Freq. bandwidth of channel 10dB 1000 MHz Table 6 Frequency range Brief Specification 2.2 Jan Page 13

14 General physical characteristics: UWB radio physical controller is optimized for ranging, and not data throughput. Symbol Parameter Comments Min. Typ. Max. Unit PRF Pulse Repetition Frequency 15.6 MHz Symb. Symbol Code length PRP = 1/PRF 7 (2) PRP Preamble Preamble Length 53 Symb. SFD Start Frame Delimiter Length 16 Symb. PHR (1) PHY Header Symb. PSDU (1) PHY Service Data Unit Bytes Mod. Modulation Type DBPSK (1) PHR & PSDU are flexible. Internal CRC and/or FEC optimized for short packet data size can be enabled. (2) Allow data rate up to 2Mbps Table 7 General physical characteristics Brief Specification 2.2 Jan Page 14

15 PSDU Frame format The packet size PSDU can be defined in different ways: using a PHR or not with the help of register programming. 1) Fixed packet length: Figure 7 PSDU frame format In this case no PHR is use (PHR = 0), the size of the packet is defined by one module command: set_data_size Min PSDU size: 0 bits max size 1024 bits 2) Variable packet length (current) : The first byte after the synch word gives the length of the Payload in bytes. PHR = 8: Min PSDU Size: 0 byte, max size: 127 Bytes (no CRC), 125 Bytes with CRC. PHR = 16: Min PSDU size: 0 byte, Max size 126 Bytes (no CRC), 124 Bytes with CRC 3) CRC A CRC can be added separately on PHR and/or PSDU. The size can be either 12 or 16bits. 4) FEC (Forward Error Correction) A FEC can be enabled on PHR + PSDU. The FEC uses a Golay channel encoder adding 12bits for 12bits of data preventing frame loss due to fading / transmission errors. Brief Specification 2.2 Jan Page 15

16 Software modules API The embedded software provides different operation mode: A direct access to UWB chip solution, which allows the following actions: UWB chip initialization Configuration of symbol length, channel, setting the scheduler Data to send Action to do: Tx, Rx, No Action Received Data & TOA (Time of Arrival) timing Error management info Brief Specification 2.2 Jan Page 16

17 Commands For UWB module V1.0 commands are grouped in four categories: Type of command Description Module firmware required System control Global module configuration and status GENERIC Radio control UWB Radio control GENERIC Sequencer control UWB Sequencer control GENERIC Protocol control BeSpoon protocol control PROTOCOL* *Available under specific license with BeSpoon Table 8 Categories of module commands Brief Specification 2.2 Jan Page 17

18 System control commands Command name Cmd code Param1 Param2 Description Module Answer SYS_GET_INFO 0x01 [INFO TYPE] Get info on module [INFO0] [INFON] Reserved 0x02 SYS_SET_MCU_STATE 0x03 [new_state] Put MCU under a pm state SYS_GET_DAC_VAL 0x04 Get DAC value [VAL_MSB][VAL_LSB] SYS_SET_DAC_VAL 0x05 [VAL_MSB] [VAL_LSB] Set new DAC value SYS_GET_CAPATUNE_VAL 0x06 Get current Capatune val for 32Khz oscillator SYS_SET_CAPATUNE_VAL 0x07 [CAPATUNE] Set new Capatune to tune 32Khz oscillator SYS_GET_RXFRAME_CFG 0x08 Get the RX frame format sent to host MCU SYS_SET_RXFRAME_CFG 0x09 [RXFRAME_CFG] Set the RX frame format sent to host MCU SYS_GET_STATUS_MSK 0x0A Get event mask value [CAPATUNE] [RX_FRAME_CFG] [MSK_MSB][MSK_LSB] SYS_SET_STATUS_MSK 0X0B [MSK_MSB] [MSK_LSB] Set new Brief Specification 2.2 Jan Page 18

19 event mask SYS_GET_STATUS 0x0C Get current module status [STAT_MSB][STAT_LSB] Reserved Reserved 0X0F Table 9 System control commands Brief Specification 2.2 Jan Page 19

20 Radio control commands Command name Cmd code Param1 Param2 Desc Module Answer RADIO_INIT 0x10 Reset and initialize UWB radio RADIO_SPI_READ 0x11 [BURST_LEN_MSB] [BURST_LEN_LSB] Read single or burst of radio register RADIO_SPI_WRITE 0x12 [BURST_LEN_MSB] [BURST_LEN_LSB] Read single or burst of radio register RADIO_GET_PM_STATE 0x13 Get current radio state RADIO_SET_PM_STATE 0x14 [RADIO_STATE] Set new radio state RADIO_GET_PHY_CFG 0x15 [CFG_SIZE_MSB] [CFG_SIZE_LSB] Get current radio settings RADIO_SET_PHY_CFG 0x16 [CFG_SIZE_MSB] [CFG_SIZE_LSB] Set new radio settings RADIO_GET_RX_CFG 0x17 [RX_CFG_SIZE_MSB] [RX_CFG_SIZE_LSB] Get current module RX configuration RADIO_SET_RX_CFG 0x18 [RX_CFG_SIZE_MSB] [RX_CFG_SIZE_LSB] Set new module RX configuration RADIO_CLR_RNG_TIMER 0x19 Reset module ranging timer RADIO_WRITE_TX_DATA 0x1A [TX_DATA_SIZE] Write data to TX FIFO RADIO_READ_RX_DATA 0x1B SIZE (0x04) Get RX_DATA size [REG1] [RADIO_STATE] [RADIO_PHY_CFG] [RX_DATA_CFG] [rx_data_size] Brief Specification 2.2 Jan Page 20

21 0x1B DATA(0x05) Read output RX data 0x1B CHECKSUM(0x06) Get checksum on rx_data RADIO_PHY_CTRL 0x1C START (0x01) [TX/RX] Start a TX and/or a RX 0x1C STOP (0x02) Abort in progress RX [RX_Data0] [checksum] Reserved Table 10 Radio control commands Brief Specification 2.2 Jan Page 21

22 Sequencer control commands In this module some events such as Tx, Rx, NO ACTION can be launched automatically thanks to a timer sequencer embedded in UWB chip. This timer used the 32KHz Xtal and/or 26MHz + 32KHz from 26MHz (~26MHZ/794) clocks, which allow the user to perform actions at with very precise timing down to 125ps. Command name Cmd code Param1 Param2 Desc Module Answer SEQ_INIT 0x20 Initialize sequencer SEQ_GET_CFG 0x21 Get global sequencer configuration SEQ_SET_CFG 0x22 Set global sequencer configuration SEQ_QUEUE_SINGLE_ACT 0x23 Enqueue single action to be performed by sequencer Reserved SEQ_CTRL 0x2C START (0x01) Start sequencer 0x2C STOP (0x02) Stop sequencer Reserved Table 11 Sequencer control commands Brief Specification 2.2 Jan Page 22

23 Packaging information Product Outline The pinout is always seen from the Top, the Land Pattern recommendation show the real requirement for you own PCB. Figure 8 Product outline Brief Specification 2.2 Jan Page 23

24 Product Marking Figure 9 Product Marking A label is stuck on the shielding of each UM100 module. The 2dimensional code on the label includes all necessary information of the module, such as hardware version, MAC address, production serial number and production data. Product Package 1. The unit of the tray size in above picture is millimeter. 2. The tolerance of the length and width of the tray is ±1 mm. 3. Material: 0.6mm thickness black Polystyrene with antistatic finish (antistatic index: 10 3 ~10 8 Ω) Figure 10 Product Package Brief Specification 2.2 Jan Page 24

25 Storage and Use control 1. The storage life of modules in tray with the vacuum packing: Shelf life: 12 months; Storage conditions: Temperature should be 40 C ~85 C. Relative humidity: < 90% R.H. 2. The module`s vacuum packing once opened, time limit of the assembly: 1) Check the humidity card, the display value should be less than 30% (blue), such as: 30% ~ 40% (pink), or greater than 40% (red), which means module has moisture absorption. 2) Factory environmental temperature should be controlled 30 C and humidity should be controlled 60% R.H. 3) Once the vacuum packing opened, save life will be 168 hours. 3. Once the vacuum packing opened and not used up within 168 hours: 1) The module must be bake again in order to remove moisture absorption. 2) The baking temperature should be 125 C, 8 hours. 3) Put the desiccant and seal packages after baking. Brief Specification 2.2 Jan Page 25

26 Contacts Please contact us at for any support you wish from us. Brief Specification 2.2 Jan Page 26