TDK-Lambda EFE300 RELIABILITY DATA. Issue : 1 2 Mod : Release Date : Initials : KM AC

Transcription

1 TDK-Lambda RELIABILITY DATA Issue : 1 2 Mod : Release Date : Initials : KM AC Drawn : KM-MIS

2 TDK-Lambda M INDEX PAGE 1. Calculated Values of MTBF R-1 2. Component Derating R-2~3 3. Main Components Temperature Rise T List R-4 4. Electrolytic Capacitor Lifetime R-5 5. Abnormal Test R-6 6. Vibration Test R-7 7. Noise Simulate Test R-8 8. Thermal Shock Test R-9 * Test results are typical data. Nevertheless the following results are considered to be actual capability data because all units have nearly the same characteristics.

3 TDK-Lambda R-1 1. Calculated Values of MTBF M MODEL : -12 (1) Calculating Method Calculated based on stress reliability projection of Telcordia SR-332 Issue1 Method ⅠCase3 MTBF is calculated by temperature data and stress data of each part. <Formula> MTBF 1 = λ equip = n i = 1 1 ( λ ) G i 10 6 Hours λequip :Total Equipment Failure Rate (Failure/106Hours) λ G :Failure Rate for the i th Part (Failure/106Hours) n :Number of Part (2) MTBF Values G B : Ground Benign, Controlled Telcordia SR-332 Issue1 Method I Case 3 MTBF 1,001,882 Hours

4 TDK-Lambda R-2 2. Components Derating MODEL : -12 (1) Calculating Method (a) Measuring method Mounting method : Standard mounting : A Ambient temperature : 50 Input voltage : 90VAC Output voltage & current : 12V, 25A (b) Semiconductors Compared with maximum junction temperature and actual one which is calculated based on case temperature, power dissipation and thermal impedance. (c) IC, Resistors, Capacitors, etc. Ambient temperature, operating condition, power dissipation and so on are within derating criteria. (d) Calculating method of thermal impedance Tj(max) Tc Tj(max) Tl θj c = θj l = Pc(max) Pc(max) Tj(max) Ta' θj a = Pc(max) Tc Tl Ta' Pc(max) (Pch(max)) Tj(max) (Tch(max)) θj-c (θch-c) θj-l (θch-l) θj-a (θch-a) : Case Temperature at Start Point of Derating;25 in General : Lead Temperature at Start Point of Derating;25 in General : Ambient Temperature at Start Point of Derating;25 in General : Maximum Collector (channel) Dissipation : Maximum Junction (channel) Temperature : Thermal Impedance between Junction (channel) and Case : Thermal Impedance between Junction (channel) and Lead : Thermal Impedance between Junction (channel) and Ambient

5 部品ディレーティング表 Component Derating List (2) 部品ディレーティング表 部品番号 Vin = 90VAC Load=100% Ta = 50 Location No. XQ201 Tch (max) = 150 θch-c = 0.60 /W Pch (max) = 208W SPB20N60C3 Pch= 11.8 W Tc= 54.9 Tc= INFINEON Tch= Tc+ ((θch-c) Pch )= D.F. = 74.6 % XQ203 Tch (max) = 150 θch-c = 0.78 /W Pch (max) = 160W STB12NM50T4 Pch= 8.8 W Tc= 44.2 Tc= 94.2 ST MICRO Tch= Tc+ ((θch-c) Pch )= D.F. = 67.4 % XQ205 Tch (max) = 150 θch-c = 0.78 /W Pch (max) = 160W STB12NM50T4 Pch= 8.7 W Tc= 44.2 Tc= 94.2 ST MICRO Tch= Tc+ ((θch-c) Pch )= D.F. = 67.3 % Q1 Tch (max) = 175 θch-c = 0.45 /W Pch (max) = 230W IRF1405ZPBF Pch= 7.9 W Tc= 48.5 Tc= 98.5 I.R Tch= Tc+ ((θch-c) Pch )= D.F. = 58.3 % D1 Tj (max) = 150 θj-c = 3.1 /W GBU6M Pd= 4.2 W Tc= 51.0 Tc= FAIRCHILD Tj= Tc+ ((θj-c) Pd )= D.F. = 75.9 % XD201 Tj (max) = 175 θj-c = 4.1 /W IDD04S60C Pd= 1.9 W Tc= 49.8 Tl= 99.8 INFINEON Tj= Tc+ ((θj-c) Pd )= D.F. = 61.5 % XD34 Tj (max) = 150 θj-l = 13 /W MURS160T3G Pd= 59.0 mw Tl= 40.8 Tl= 90.8 ON SEMI. Tj= Tl+ ((θj-l) Pd )= 91.6 D.F. = 61.0 % XD35 Tj (max) = 150 θj-l = 13 /W MURS160T3G Pd= 90.0 mw Tl= 38.2 Tl= 88.2 ON SEMI. Tj= Tl+ ((θj-l) Pd )= 89.4 D.F. = 59.6 % XU8 Tj (max) = 125 θj-l = 24 /W LM317EMPX/NOPB Pd= mw Tl= 38.7 Tl= 88.7 NATIONAL SEMI. Tj= Tl+ ((θj-l) Pd )= D.F. = 84.5 % TDK-Lambda R-3

6 3. Main Components Temperature Rise T List MODEL : -12 (with chassis/fan) (1) Measuring Conditions Mounting A Mounting B Mounting C Mounting E Mounting Method (INPUT) IMS (Standard Mounting : Method : A) IMS Input Voltage (VAC) 90 Output Voltage (VDC) 12 Output Current (A) 25 (2) Measuring Results T Temperature Rise ( ) 100 Output Derating (%) Ta=50 Ta=50 Ta=50 Ta=50 Location No. Part name Mounting A Mounting B Mounting C Mounting E XQ201 MOS FET XQ203 MOS FET Q1 MOS FET XU3 CHIP IC XU8 CHIP IC L1 BALUN COIL L2 BALUN COIL L3 CHOKE COIL L4 CHOKE COIL TX2 Winding TRANS PULSE TX2 Core TRANS PULSE TX2 Braid winding TRANS PULSE C1 E.CAP C7 FILME.CAP C8 FILME.CAP C9 E.CAP C10 E.CAP C11 E.CAP U2 Opto coupler Input connector TDK-Lambda R-4

7 TDK-Lambda R-5 4. Electrolytic Capacitor Lifetime MODEL : -12 (with chassis/fan) Cooling condition : Forced Air Cooling Mounting A, B, C, E Mounting A Mounting B Mounting C Mounting E IMS (INPUT) IMS Conditions Ta 40 : 50 : 60 : 70 : Vin=100VAC Lifetime (yeaetime (years) Load (%) Ta= Ta= Ta= Ta= Lifetime (years) Output current (%)

8 TDK-Lambda R-6 5. Abnormal Test MODEL : -12 (1) Test Conditions Input : 240VAC Output : Rating Ta : R.T. (2) Test Results ( Da : Damaged ) Test position Test mode Test result a b c d e f g h I j k l No. Location No. Test int po Short Open Fire Smoke Burst Smell hot Red Damaged blown Fuse O.V.P. O.C.P. output No change No Others Note 1 XQ201 D-S, Da :XR56 2 D-G 3 XQ203 D-S 4 D-G Da :XQ201,XR56 Da :XR56,XR61,XR62,XR63 Da :XR56,XR61,XR62,XR63 5 XD201 A-K, Da :XR56 6 XD202 A-K Efficiency Down 7 D1 AC-AC 8 DC-DC 9 AC-DC 10 C9 Da : XR56,XD TX2 1-2 Da : XR56,XR61,XR62,XR Into Hiccup Mode Da : XR56,XR61,XR62,XR63 14 L Da : XR Da : L3 16 XC25 Da : XD14 17 XR35 18 XD18 A-K 19 XU8 1-4 Fan Output increased 20 XD28 A-K Da : XR61,XR62,XR63,Q2 21 R3 Q2 Temperature increased 22 Q1 D-S Da : XR61,XR62,XR63 23 D-G Into Hiccup Mode 24 L4 Ripple increased 25 XC72 Da : XR J3 1-2 XU8 Temperature increased 27 J2 2-7 Into Hiccup Mode 28 Fan Locked Roter OTP operate.

9 TDK-Lambda R-7 6. Vibration Test MODEL : -24 (1) Vibration Test Class Frequency variable endurance test (2) Equipment Used LING DYNAMIC SYSTEMS Vibrator : V450/1 LING DYNAMIC SYSTEMS Amplifier : PA500L DACTRON Controller : COMET (3) Test Conditions Sweep frequency : 10~500Hz Direction : X, Y, Z Sweep time : 6.0min Sweep count : 2 hour each Acceleration : Constant 19.6m/s2 (2G) (4) Test Method Z D.U.T. Input Connector Y Fitting Stage Direction X Vibrator (5) Acceptable Conditions 1.Not to be broken 2.Characteristic to be within regulation specification after the test. (6) Test Results OK

10 TDK-Lambda R-8 7. Noise Simulate Test MODEL :-12 (1) Test Circuit and Equipment シミュレータ Simulator FG L N 供試体 D.U.T. 負荷 Load Simulator :INS-4320(A) (Noise Laboratory Co.,LTD) (2) Test Conditions Input voltage : 100, 230VAC Noise level : 0V~2kV Output Voltage : Rated Phase : 0~360 deg Output current : 0, 100% Polarity : +, - Ambient temperature : 25 Mode : Common, Normal Pulse width : 50~1000ns Trigger select : Line (3) Acceptable Conditions 1.Not to be broken 2.Not to be shut down output 3.No other out of orders (4) Test Results OK

11 8. Thermal Shock Test MODEL : -12 (1) Equipment Used ATSS : THERMOTRON (2) Test Conditions Ambient Temperature : Test Time : Refer to Dwg cycle 30min Test Cycle : 100 Cycles Not Operating min (3) Test Method Before testing, check if there is no abnormal output, then put the D.U.T. in testing chamber, and test it according to the above cycle. 100 cycles later, leave it for 1 hour at the room temperature, then check if there is no abnormal output. (4) Acceptable Conditions 1.Not to be broken 2.Characteristic to be within regulation specification after the test. (5) Test Results OK TDK-Lambda R-9