STTH2003. High frequency secondary rectifier. Features. Description
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1 High frequency secondary rectifier Datasheet - production data TO-220AB K A1 A1 A2 A1 K A2 A2 I 2 PAK D 2 PAK K K A1 A2 A1 K TO-220FPAB A1 KA2 A2 Features Combines highest recovery and reverse voltage performance Ultra-fast, soft and noise-free recovery Insulated package: TO-220FPAB Insulating voltage = 2000 VRMS sine ECOPACK 2 compliant component for D²PAK on demand Description Dual center tap fast recovery epitaxial diodes suited for switch mode power supply and high frequency DC/DC converters. Packaged in TO-220AB, TO-220FPAB, I 2 PAK or D 2 PAK, this device is especially intended for secondary rectification. Symbol IF(AV) VRRM Table 1: Device summary Value 2 x 10 A 300 V Tj (max) 175 C VF (typ) trr (max) 0.85 V 25 ns June 2015 DocID5377 Rev 11 1/17 This is information on a product in full production.
2 Characteristics 1 Characteristics Table 2: Absolute ratings (limiting values, per diode, at 25 C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 300 V IF(RMS) Forward rms current 30 A IF(AV) IFSM Average forward current δ = 0.5, square wave Surge non repetitive forward current TO-220AB, D 2 PAK, I 2 PAK TC = 140 C TO-220FPAB TC = 115 C Per diode All types Per device 20 tp = 10 ms sinusoidal 110 A Tstg Storage temperature range -65 to C Tj Maximum operating junction temperature (1) C Notes: (1) (dptot/dtj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. 10 A Table 3: Thermal parameter Symbol Parameter Value Unit Rth(j-c) Rth(c) Junction to case TO-220AB, D 2 PAK, I 2 PAK 2.5 Per diode TO-220FPAB 4.6 TO-220AB, D 2 PAK, I 2 PAK 1.3 Total TO-220FPAB 4 C/W Coupling TO-220AB, D 2 PAK, I 2 PAK TO-220FPAB 3.5 C/W When the diodes 1 and 2 are used simultaneously: ΔTj (diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c) Table 4: Static electrical characteristics (per diode) Symbol Parameter Test conditions Min. Typ. Max. Unit IR (1) VF (2) Reverse leakage current Tj = 25 C - 20 VR = 300 V Tj = 125 C µa Forward voltage drop Tj = 25 C IF = 10 A Tj = 125 C V Notes: (1) Pulse test: tp = 5 ms, δ < 2% (2) Pulse test: tp = 380 µs, δ < 2% 2/17 DocID5377 Rev 11
3 To evaluate the conduction losses use the following equation: Characteristics P = 0.75 x IF(AV) IF 2 (RMS) Table 5: Recovery characteristics (per diode) Symbol Parameter Test conditions Min. Typ. Max. Unit trr tfr VFP Reverse recovery time Forward recovery time Peak forward voltage Tj= 25 C Tj= 25 C Tj= 25 C IF= 0.5 A, Irr= 0.25 A, IR= 1 A - 25 IF= 1 A, VR= 30 V,dIF/dt= -50 A/µs IF= 10 A, VFR= 1.1 x VFmax, dif/dt= 100 A/µs - 35 ns ns IF= 10 A, dif/dt= 100 A/µs V Reverse recovery IRM current Tj= 125 IF= 10 A, VCC= 200 V, - 8 A C dif/dt= 200 A/µs S factor Softness factor Characteristics (curves) Figure 1: Conduction losses versus average forward current (per diode) Figure 2: Forward voltage drop versus forward current (maximum values, per diode) P1(W) δ = 0.05 δ = 0.1 δ = 0.2 δ = δ = T 2 I F(AV) (A) 0 δ=tp/t tp Figure 3: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AB, D²PAK, I²PAK) 1.0 Z th(j-c )/Rth(j-c) Figure 4: Relative variation of thermal impedance junction to case versus pulse duration (TO- 220FPAB) 1.0 Z th(j-c )/Rth(j-c) Single pulse t p(s) 0.0 1E-3 1E-2 1E-1 1E Single pulse t (s) p 1E-2 1E-1 1E+0 1E+1 DocID5377 Rev 11 3/17
4 Characteristics Figure 5: Peak reverse recovery current versus dif/dt (typical values, per diode) Figure 6: Reverse recovery time versus dif/dt (typical values, per diode) 16 I RM(A) 100 t (ns) rr V R=200V T j=125 C I F=I F(AV) I F=2 x I F(AV) 80 I F=I F(AV) V R=200V T j=125 C 10 8 I F=0.5 x I F(AV) 60 I F=2 x I F(AV) I F=0.5 x I F(AV) di F/dt(A/µs) di F/dt(A/µs) Figure 7: Softness factor versus dif/dt (typical values, per diode) S factor Figure 8: Relative variation of dynamic parameters versus junction temperature (reference: Tj = 125 C) 0.50 V R=200V T j=125 C di F/dt(A/µs) Figure 9: Transient peak forward voltage versus dif/dt (typical values, per diode) (TO-220AB) Figure 10: Forward recovery time versus dif/dt (typical values, per diode) V FP(V) 10 I F=I F(AV) T j=125 C t (ns) fr I F=I F(AV) V FR=1.1 x VF max. T j=125 C di /dt(a/µs) F di F/dt(A/µs) /17 DocID5377 Rev 11
5 Rth(j-a)( C/W) Figure 11: Thermal resistance, junction to ambient, versus copper surface under tab (epoxy printed board FR4, ecu =35µm) (D²PAK) SCu(cm²) Characteristics Figure 12: Average forward current versus ambient temperature (δ = 0.5, per diode) I F(AV) (A) R th(j-a) = Rth(j-c) 2 2 TO-220AB / I PAK / D PAK TO-220FPAB 1 T amb( C) DocID5377 Rev 11 5/17
6 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. Cooling method: by conduction (C) Epoxy meets UL 94,V0 Recommended torque value: 0.55 N m (for TO-220AB and TO-220FPAB) Maximum torque value: 0.7 N m (for TO-220AB and TO-220FPAB) 6/17 DocID5377 Rev 11
7 2.1 D²PAK package information Figure 13: D²PAK package outline Package information This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID5377 Rev 11 7/17
8 Package information Table 6: D²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A A b b c c D D D E E E e 2.54 typ e H J L L L R 0.4 typ V /17 DocID5377 Rev 11
9 Figure 14: D²PAK recommended footprint (dimensions in mm) Package information DocID5377 Rev 11 9/17
10 Package information 2.2 I²PAK package information Figure 15: I²PAK package outline 10/17 DocID5377 Rev 11
11 Package information Table 7: I²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A A b b F F F G G H L typ typ. L L L L L Dia Mounting (soldering) the I 2 PAK metal slug (heatsink) with alloy, like a surface mount device, IS NOT PERMITTED. A standard through-hole mounting is mandatory. DocID5377 Rev 11 11/17
12 Package information 2.3 TO-220AB package information Figure 16: TO-220AB package outline H2 A Dia C L5 L7 L6 L2 F2 F1 L9 D L4 F G1 M E G 12/17 DocID5377 Rev 11
13 Package information Table 8: TO-220AB package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A C D E F F F G G H L typ typ. L L L L L M 2.6 typ typ. Diam DocID5377 Rev 11 13/17
14 Package information 2.4 TO-220FPAB package information Figure 17: TO-220FPAB package outline H B A Dia L6 L2 L7 L3 L5 F1 D L4 F2 G1 F E G 14/17 DocID5377 Rev 11
15 Package information Table 9: TO-220FPAB package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A B D E F F F G G H L typ typ. L L L L L Dia DocID5377 Rev 11 15/17
16 Ordering information 3 Ordering information Table 10: Ordering information Order code Marking Package Weight Base qty Delivery mode CT CT TO-220AB 1.95g 50 Tube CG CG D 2 PAK 1.38g 50 Tube CG-TR CG D 2 PAK 1.38g 1000 Tape and reel CFP CFP TO-220FPAB 1.9g 50 Tube CR CR I 2 PAK 1.5g 50 Tube 4 Revision history Table 11: Document revision history Date Revision Changes Aug G Previuous release 26-Mar Removed ISOWATT package 11-Feb Updatd base quantity for tape and reel delivery. Corrected temperature in Table 1. Added warning paragraph above Table Sep Updated Table 2. Added Figure May Updated features, Table 1: "Device summary" and packages silhouette in cover page. Updated Section 1: "Characteristics". Updated Section 2.2: "D²PAK package information". 16/17 DocID5377 Rev 11
17 IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document STMicroelectronics All rights reserved DocID5377 Rev 11 17/17
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