LC026D. High Voltage LED Series Chip on Board. High efficacy COB LED package well-suited for use in spotlight applications. Features & Benefits

Transcription

1 Product Family Data Sheet Rev # High Voltage LED Series Chip on Board LC26D High efficacy COB LED package well-suited for use in spotlight applications Features & Benefits Chip on Board (COB) solution makes it easy to design in Simple assembly reduces manufacturing cost Low thermal resistance InGaN/GaN MQW LED with long time reliability Applications Spotlight / Downlight LED Retrofit Bulbs Outdoor Illumination

2 2 Table of Contents 1. Characteristics Product Code Information Typical Characteristics Graphs Outline Drawing & Dimension Reliability Test Items & Conditions Label Structure Packing Structure Precautions in Handling & Use

3 3 1. Characteristics a) Absolute Maximum Rating Item Symbol Rating Unit Condition Ambient / Operating Temperature Ta -4 ~ +15 ºC - Storage Temperature Tstg -4 ~ +12 ºC - LED Junction Temperature TJ 14 ºC - Case Temperature Tc 15 ºC Forward Current IF 184 ma - Power Dissipation PD 69 W - ESD (HBM) - ±2 kv - ESD (MM) - ±.5 kv - b) Electro-optical Characteristics (IF = 72 ma, TJ = 85 ºC) Item Unit Rank Min. Typ. Max. Forward Voltage (VF) V YZ Color Rendering Index (Ra) Thermal Resistance (junction to chip point) ºC/W Beam Angle º Nominal Power W 24.9 Notes: 1) The COB is tested in pulsed condition at rated test current (1 ms pulse width) and rated temperature (T J = T C = T a = 85 C) 2) Samsung maintains measurement tolerance of: forward voltage = ±5 %, CRI = ±1 3) Refer to the derating curve, 3. Typical Characteristics Graph designed within the range.

4 4 c) Luminous Flux Characteristics (IF = 72 ma) CRI (Ra) Min. Nominal CCT (K) Flux Rank Tc = 85 C (lm) Min. Typ. Max. 27 K D K D K D K D K D K D K D CRI (Ra) Min. Nominal CCT (K) Flux Rank Tc = 85 C (lm) Min. Typ. Max. 27 J D J D J D J D J D Notes: 1) The COB is tested in pulsed operating condition at rated test current (1 ms pulse width) and rated temperature (T J = T C = 85 C). 2) Samsung maintains measurement tolerance of: Luminous flux = ±7 %, CRI = ±1

5 5 2. Product Code Information S P H W H A H D N G 2 5 Y Z W 3 K Digit PKG Information Code Specification Samsung Package High Power SPH 4 5 Color WH White 6 Product Version A 7 8 Form Factor HD COB 9 Lens Type N No lens 1 Wattage or Model G LC26D 11 Internal Code 2 12 CRI & Sorting Temperature 5 Min. 8 (85 ) 7 Min. 9 (85 ) Forward Voltage (V) YZ 31.8~ CCT (K) W V U T R Q P 27K 3K 35K 4K 5K 57K 65K 16 MacAdam Step 2 MacAdam 2-step 3 MacAdam 3-step J6 Min. 26 J7 Min. 27 J8 Min Luminous Flux K Min. 3 K2 Min.32 K3 Min. 33 K4 D1 Min. 34 Add rank

6 6 a) Binning Structure (IF = 72 ma, TJ = 85 ºC) CRI (Ra) Min. Nominal CCT (K) Product Code VF Rank Color Rank Flux Rank Flux Range (Φv, lm) 27 SPHWHAHDNG25YZW2K SPHWHAHDNG25YZW3K SPHWHAHDNG25YZW2D1 SPHWHAHDNG25YZW3D1 YZ W2 W3 W2 W3 K 364 ~ D ~ 3 SPHWHAHDNG25YZV2K2 SPHWHAHDNG25YZV3K2 SPHWHAHDNG25YZV2D1 SPHWHAHDNG25YZV3D1 YZ V2 V3 V2 V3 K2 322 ~ D1 3389~ 8 35 SPHWHAHDNG25YZU2K3 SPHWHAHDNG25YZU3K3 SPHWHAHDNG25YZU2D1 SPHWHAHDNG25YZU3D1 YZ U2 U3 U2 U3 K ~ D ~ 4 SPHWHAHDNG25YZT2K3 SPHWHAHDNG25YZT3K3 SPHWHAHDNG25YZT2D1 SPHWHAHDNG25YZT3D1 YZ T2 T3 T2 T3 K3 338 ~ D ~ 5 SPHWHAHDNG25YZR3K4 K4 349 ~ YZ R3 SPHWHAHDNG25YZR3D1 D ~ 57 SPHWHAHDNG25YZQ3K4 K4 349 ~ YZ Q3 SPHWHAHDNG25YZQ3D1 D ~ 65 SPHWHAHDNG25YZP3K3 K3 338 ~ YZ P3 SPHWHAHDNG25YZP3D1 D ~

7 7 CRI (Ra) Min. Nominal CCT (K) Product Code VF Rank Color Rank Flux Rank Flux Range (Φv, lm) SPHWHAHDNG27YZW2J6 W2 J ~ SPHWHAHDNG27YZW3J6 W3 27 YZ SPHWHAHDNG27YZW2D1 W2 D1 276 ~ SPHWHAHDNG27YZW3D1 W3 SPHWHAHDNG27YZV2J7 V2 J ~ 3 ` SPHWHAHDNG27YZV3J7 SPHWHAHDNG27YZV2D1 YZ V3 V2 D1 293 ~ SPHWHAHDNG27YZV3D1 V3 9 SPHWHAHDNG27YZU2J8 U2 J8 284 ~ SPHWHAHDNG27YZU3J8 U3 35 YZ SPHWHAHDNG27YZU2D1 U2 D1 299 ~ SPHWHAHDNG27YZU3D1 U3 SPHWHAHDNG27YZT2J8 T2 J ~ SPHWHAHDNG27YZT3J8 T3 4 YZ SPHWHAHDNG27YZT2D1 T2 D1 351 ~ SPHWHAHDNG27YZT3D1 T3 5 SPHWHAHDNG27YZR3J8 R3 J ~ YZ SPHWHAHDNG27YZR3D1 R3 D1 377 ~

8 8 b) Chromaticity Region & Coordinates (IF = 72 ma, TJ = 85 ºC) CIE x,y MacAdam Ellipse (W2, W3) MacAdam Ellipse (V2, V3) Step CIE x CIE y a b Step CIE x CIE y a b 2-step step step step MacAdam Ellipse (U2, U3) MacAdam Ellipse (T2, T3) Step CIE x CIE y a b Step CIE x CIE y a b 2-step step step step MacAdam Ellipse (R3) MacAdam Ellipse (Q3) Step CIE x CIE y a b Step CIE x CIE y a b 3-step step MacAdam Ellipse (P3) Step CIE x CIE y a b 3-step Note: Samsung maintains measurement tolerance of: Cx, Cy = ±.5

9 Relative Emission Intensity(%) Relative Emission Intensity(%) Relative Emission Intensity(%) Relative Emission Intensity(%) Relative Emission Intensity(%) Relative Emission Intensity(%) 9 3. Typical Characteristics Graphs a) Spectrum Distribution (IF = 72 ma, TJ = 85 ºC) CCT: 27 K (8 CRI) CCT: 3 K (8 CRI) Relative Intensity vs. Wavelength Relative Intensity vs. Wavelength Wavelength Wavelength(nm) CCT: 35 K (8 CRI) CCT: 4 K (8 CRI) Relative Intensity vs. Wavelength Wavelength Relative Intensity vs. Wavelength Wavelength CCT: 5 K (8 CRI) CCT: 57 K (8 CRI) Relative Intensity vs. Wavelength Wavelength Relative Intensity vs. Wavelength Wavelength

10 Relative Luminous Flux(%) Forward Voltage(V) Relative Luminous Flux(%) Forward Voltage(%) Relative Emission Intensity(%) 1 CCT: 65 K (8 CRI) Relative Intensity vs. Wavelength Wavelength b) Forward Current Characteristics (TJ = 85 ºC) Relative luminous Flux vs. Forward Current Forward Voltage vs. Forward Current Forward Current(A) Forward Current(A) C) Temperature Characteristics (IF = 72mA) Relative Luminous Flux vs. Temperature Forward Voltage vs. Temperature Tc( ) Tc( )

11 If [ ma ] Relative Luminous Intensity CIE x, CIE y CIE x, CIE y 11 d) Color Shift Characteristics (TJ = 85 ºC, IF = 72mA, CRI8+) CIE x, CIE y vs. Forward Current CIEx, CIEy vs. Temperature CIE x -.4 CIE y Forward Current(A) ΔCIE x -.4 ΔCIE y Tc( ) e) Beam Angle Characteristics (IF = 72 ma, TJ = 85 ºC) Angle( ) f) Derating Characteristics 2 Derating Curve Tc [ ]

12 12 4. Outline Drawing & Dimension Model Description LC26D183 Internal Code XXX...XXXX LOT No. T C SAMSUNG 1. Unit: mm 2. Tolerance: ±.3 mm Item Dimension Tolerance Unit Length 19. ±.15 mm Width 19. ±.15 mm Height 1.5 ±.3 mm Light Emitting Surface (LES) Diameter 14.5 ±.3 mm Note: Denoted product information above is only an example ( LC26D183 : LC26D, CRI8+, 3K )

13 13 5. Reliability Test Items & Conditions a) Test Items Test Item Test Condition Test Hour / Cycle High Temperature Humidity Life Test High Temperature Life Test Low Temperature Life Test 6 ºC, 9 % RH,, DC Derating, IF 1 h 85 ºC, DC Derating, IF 1 h -4 ºC, DC, IF = 129 ma 1 h Pulsed Operating Life Test 55, Pulse width 1 μs, duty cycle 3 % 1 h High Temperature Storage Low Temperature Storage Temperature Humidity Storage 12 ºC 1 h -4 ºC 1 h 6 ºC, 9% RH 1h Thermal Cycle Temperature Cycle On/Off Test ESD (HBM) -45 ºC / 15 min 125 ºC / 15 min temperature change in 5 min -4 ºC / 85 ºC each 2 min, 3 min transfer power on/off each 5 min, DC Derating, IF = max R1: 1 MΩ R2: 1.5 kω C: 1 pf V: ±2 kv 5 cycles 1 cycles 5 times ESD (MM) R1: 1 MΩ R2: kω C: 2 pf V: ±.2 kv 5 times Vibration Test 2 ~ 8 Hz (displacement:.6 inch, max. 2 g) 8 ~ 2 khz (max. 2 g) min. frequency max. frequency 4 min transfer 4 times Mechanical Shock Test 15 g,.5 ms each of the 6 surfaces (3 axis x 2 sides) 5 times Sulfur Resistance 25 C, 75%, H2S 15 ppm 54h b) Criteria for Judging the Damage Item Symbol Test Condition (Tc = 25 ºC) Min. Limit Max. Forward Voltage VF IF = 72 ma L.S.L. *.9 U.S.L. * 1.1 Luminous Flux Φv IF = 72 ma L.S.L *.7 U.S.L * 1.3

14 14 6. Label Structure a) Label Structure LC26D RA8 27K YZW3K abcdef SPHWHAHDNG25YZW3K YZW3K 1 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII G4AZC41 / 11 / xxxx pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Lot Number Bin Code Product Code Note: Denoted bin code and product code above is only an example (see description on page 5) Bin Code: ab: Forward Voltage bin (refer to page 11) cd: Chromaticity bin (refer to page 9-1) ef: Luminous Flux bin (refer to page 6) b) Lot Number The lot number is composed of the following characters: LC26D RA8 27K YZW3K SPHWHAHDNG25YZW3K YZW3K 1 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII /1abc/ xxxx pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / 1abc / xxxx pcs : Production site (S: Giheung, Korea, G: Tianjin, China) : 4 (LED) : Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample) : Year (Z: 215, A: 216, B: 217 ) 5 : Month (1~9, A, B, C) 6789 : Day (1~9, A, B~V) abc : Product serial number (1 ~ 999)

15 15 7. Packing Structure Max. quantity Dimension(mm) Packing material in pcs of COB Length Width Height Tolerance Tray Aluminum Bag 4(2 trays) Inner Box Outer Box a) Packing Structure Label Label

16 16 b) Tray 1 Cover 2 Body c) Aluminum Vinyl Packing Bag

17 17 8. Precautions in Handling & Use 1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the device. 2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at temperature ~4 ºC, ~9 % RH). 3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be: a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 3 ºC / 6 % RH, or b. Stored at <1 % RH 4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 5) Devices require baking before mounting, if humidity card reading is >6 % at 23 ± 5 ºC. 6) Devices must be baked for 1 hour at 6 ± 5 ºC, if baking is required. 7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or antielectrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 8) The thermal management is one of the most critical factors for the LED lighting system. Especially the LED junction temperature should not exceed the absolute maximum rating while operation of LED lighting system. For more information, please refer to Application Note Mechanical & Thermal Guide for COB. 9) In case of driving LEDs around the minimum current level (If_min), chips might exhibit different brightness due to the variation in I-V characteristics of each one. This is normal and does not adversely affect the performance of product. 1) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical properties of materials used in luminaires and they must be carefully selected. 11) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead, please pick at the handling area as indicated below.

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