P-Series 0.1W Super-Red SPMSRT2422T0

Transcription

1 Product Family Data Sheet Rev Middle Power LED PLCC Series P-Series 0.1W Super-Red SPMSRT2422T0 Features Package : Ag Plated 2 pad design package with silicone resin Dimension : 2.2 mm x 1.4 mm Technology : AlGaInP Chip Configuration : 1 chip ESD Voltage : Up to 2 kv acc. to ISO contact Viewing Angle: 120 Qualifications: The product qualification test based on the guidelines of AEC-Q101

2 2 Table of Contents 1. Characteristics Product Code Information Typical Characteristics Graphs Soldering Temperature Location Mechanical Dimension Soldering Conditions Tape & Reel Label Structure Packing Structure Precautions in Handling & Use Company Information

3 3 1. Characteristics a) Typical Characteristics [Ts= 25 ] [1] Item Symbol Value Unit Luminous Flux (I F= 20 ma) [1] Φ Typ cd Forward Voltage (I F= 20 ma) [1] V F Typ V Viewing Angle φ Typ. 120 Deg Reverse Current I R 10 μa Real Thermal Resistance (Junction to Solder point) R th_j-s (Real) Typ. 62 Max. 73 K/W Electrical Thermal Resistance (Junction to Solder point) R th_j-s (Elec.) Typ. 55 Max. 65 K/W Radian Surface A 1.64 mm 2 [1] The measurement condition means that temperature dependence is excluded by applying pulse current for typically 25ms. b) Absolute Maximum Rating Item Symbol Rating Unit Ambient / Operating Temperature T a -40 ~ +100 ºC Storage Temperature T stg -40 ~ +100 ºC LED Junction Temperature T j 125 ºC Maximum Forward current [2] (T s: 25 ) [3] Minimum Forward current [2] (T s: 25 ) [3] Maximum Reverse current I F 30 ma I F 3 ma Do not apply for reverse current ESD Sensitivity [4] - ±2 HBM kv [2] Driving the product at forward current (IF) below Min. IF or above Max. IF may result in unpredictable behavior of the product. [3] The measurement condition means that temperature dependence is excluded by applying pulse current for typically 25ms. [4] It is recommended to use the LED with additional protection device (for example Zener diode) to protect it against ESD.

4 4 2. Product Code Information S P M S R T T 0 A B C D E F Digit PKG Information 1 2 company name and Samsung LED PKG (SP for Samsung PKG) 3 power variant (M for automotive middle power) 4 5 color variant (SR for automotive super-red color) 6 LED PKG version (T for initial version) product configuration and type (242 for automotive Pin PKG Ag plate type) 10 operating condition (2 for 20mA) 11 specific property (T for Automotive interior) 12 CRI variant (0 for default) forward voltage property dominant wavelength property luminous flux property

5 5 a) Luminous Intensity Bins [5] ( I F= 20 ma, Ts= 25 ºC) Symbol Bin Code Intensity Range (cd) Flux Range (lm) Min Max Min Max U Φ V V AA b) Voltage Bins [5] (I F= 20 ma, Ts= 25 ºC) Symbol Bin Code Min Voltage Range (V) Max E E V F E E [5] Luminous intensity measuring equipment: CAS140CT ΦV and VF tolerances are ±7% and ±0.1 V, respectively. Given tolerances are valid for typical conditions. c) Dominant Wavelength Bins [6] (I F= 20 ma) Symbol Bin Code Min Wavelength Range ( nm ) Max λ D B [6] Wavelength measuring equipment: CAS140CT Tolerance ±2nm

6 Shift in Wavelength Relative Intensity 6 3. Typical Characteristics Graphs a) Spectrum Distribution (I F= 20 ma, Ts= 25 ºC) W d W d(max) Wavelength λ[ nm ] b) Wavelength Shift vs Radiation Angle (I F= 20 ma, Ts= 25 ºC) [7] Δλ D [ nm ] Radiation Angle φ[º] [7] The measurement condition means that temperature dependence is excluded by applying pulse current for typically 25ms.

7 Shift in Wavelength Relative Luminous Flux Relative Forward Voltage 7 c) Forward Current Characteristics (Ts= 25 ºC) [8] I v 1.6 V F 1.1 I v(20ma) V F(20mA) Forward Current IF [ma] Forward Current IF [ma] Δλ D [ nm ] Forward Current IF [ma] [8] The measurement condition means that temperature dependence is excluded by applying pulse current for typically 25ms.

8 Shift in Wavelength Relative Luminous Flux Relative Forward Voltage 8 d) Temperature Characteristics (I F= 20 ma) I v 1.4 V F 1.15 I v(25 ) V F(25 ) Temperature Temperature Tj [ ] Tj [ ] Δλ D [ nm ] Temperature Tj [ ]

9 Relative Luminous Flux Forward Current 9 e) Derating Curve [9] IF [ma] Temperature Ts [ ] [9] The measurement condition means that temperature dependence is excluded by applying pulse current for typically 25ms. f) Beam Angle Characteristics (I F= 20 ma, Ts= 25 ºC) I v 1.2 I v(0º) Radiation Angle φ[º]

10 10 4. Soldering Temperature Location T j: Temperature of Junction T s: Temperature of Solder Pad Rth j-s: Thermal Resistance from Junction to Solder Pad

11 11 5. Mechanical Dimension Unit: mm, Tolerance: ±0.1mm Approximate Weight : 7mg a) Pick and Place Do not place pressure on the resin lens (hatch area) The maximum compressing force is 15N in the polymer b) Electric Schematic Diagram Anode [ Circuit ] c) Material Information Description Lead Frame LED Die Wire Resin Mold Material PLCC AlGaInP Au Silicone

12 12 6. Soldering Conditions a) Pad Configuration & Solder Pad Layout Unit: mm, Tolerance: ±0.1mm b) Reflow Conditions (Pb free) Reflow frequency: 2 times max. All temperature refer to the pad of package. c) Manual Soldering Conditions Not more than 5 max 300 ºC, under soldering iron. (One time only)

13 13 7. Tape & Reel a) Taping Dimension Unit: mm, LED taping quantity: 2,000EA / Reel b) Reel Dimension Unit: mm, Tolerance: ±0.2mm

14 14 8. Label Structure a) Product Labeling Information E F C D A B A B C D E F E1B0V1 SPMSRT2422T0 ABCDEF E1B0V1 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII SLAA94001 / I001 / 2,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Bin Code Part Number Lot Number N.B) Denoted rank is the only example. b) Bin Code Structure AB: Forward Voltage (V F) Bin (refer to page. 5) CD: Dominant Wavelength bin (Wd) (refer to page. 5) EF: Luminous Flux (I V) Bin (refer to page. 5) c) Lot Number Structure The lot number is composed of the following characters: No. Information 1,2 Production Site : SL:SAMSUNG LED, GL:GOSIN CHINA, EL/EM : KOREA 3 Product State A :Normality, B :Bulk, C :First Production, R :Reproduction, S :Sample 4 Year : C:2018, D:2019, E: Month : 1 ~ 9, A, B 6 Day : 1 ~ 9, A, B ~ V 789 Product number : 1 ~ 999 abc Reel Number : 1 ~ 999

15 15 9. Packing Structure a) Packing Process Dimension of Transportation Box in mm Width Length Height Will be changed oval mark to letter mark Oval Letter Mark

16 Precautions in Handling & Use 1) For over-current-proof function, customers are recommended to apply resistors to prevent sudden change of the current caused by slight shift of the voltage. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA is recommended to use. 3) When the LEDs illuminate, operating current should be decided after considering the ambient maximum temperature. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3 months or more after being shipped from Samsung Electronics, they should be packed by a sealed container with nitrogen gas injected.(shelf life of sealed bags: 12 months, temp. ~40, ~90% RH) 5) After storage bag is open, device subjected to soldering, solder reflow, or other high temperature processes must be: a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 / 60% RH, b. Stored at <10% RH. 6) Repack unused Products with anti-moisture packing, fold to close any opening and then store in a dry place. 7) Devices require baking before mounting, if humidity card reading is >60% at 23±5. 8) Devices must be baked for 1 day at 60±5, if baking is required. 9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leak current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 10) VOCs (volatile organic compounds) may be occurred by adhesives, flux, hardener or organic additives which are used in luminaires (fixture) and LED silicone bags are permeable to it. It may lead a discoloration when LED expose to heat or light. This phenomenon can give a significant loss of light emitted (output) from the luminaires (fixtures). In order to prevent these problems, we recommend you to know the physical properties for the materials used in luminaires, it requires selecting carefully. 11) Risk of Sulfurization (or Tarnishing) The lead frame from Samsung Electronics is a plated package and it may change to black(or dark colored) when it is exposed to Ag (a), Sulfur (S), Chlorine (Cl) or other halogen compound. It requires attention. Sulfide (Sulfurization) of the lead frame may cause a change of degradation intensity, chromaticity coordinates and it may cause open circuit in extreme cases. It requires attention. Sulfide (Sulfurization) of the lead frame may cause of storage and using with oxidizing substances together. Therefore, LED is not recommend to use and store with the below list. : Rubber, Plain paper, lead solder cream etc.

17 11. Company Information 17

18 18 Legal and additional information About Samsung Electronics Co., Ltd. Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at news.samsung.com. Copyright 2018 Samsung Electronics Co., Ltd. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd. Specifications and designs are subject to change without notice. Non-metric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged. Samsung Electronics Co., Ltd. 95, Samsung 2-ro Giheung-gu Yongin-si, Gyeonggi-do, KOREA