TS274. High performance CMOS quad operational amplifier. Features. Description
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1 High performance CMOS quad operational amplifier Features Output voltage can swing to ground Excellent phase margin on capacitive loads Gain bandwidth product: 3.5 MHz Unity gain stable Two input offset voltage selections Description The TS274 devices are low cost, quad operational amplifiers designed to operate with single or dual supplies. These operational amplifiers use the ST silicon gate CMOS process giving an excellent consumption-speed ratio. These series are ideally suited for low consumption applications. Three power consumptions are available thus offering the best consumption-speed ratio for your application: I = µa/amp: TS27L4 (very low power) I = 50 µa/amp: TS27M4 (low power) I = ma/amp: TS274 (standard) These CMOS amplifiers offer very high input impedance and extremely low input currents. The major advantage versus JFET devices is the very low input currents drift with temperature (see Figure 5 on page 6). For enhanced features of TS274, in particular railto-rail capability and low offset voltage, two new Non-inverting Input 2 DIP4 (Plastic package) SO-4 (Plastic micropackage) TSSOP4 (Thin shrink small outline package) Non-inverting Input 3 Inverting Input 2 Pin connections (top view) Output Inverting Input 2 V + 4 V - Output families, TSV9x and TSV99x will better suit low voltage applications Output 4 Inverting Input 4 Non-inverting Input 4 Non-inverting Input 3 Inverting Input 3 Output 3 Table. Enhanced related families Part number V range (V) Rail-torail I/O V io max (mv) I ib max (pa) A vd min (db) I max (ma) GBP typ (MHz) SR typ (V/µs) Packages TSV I/O.5/ TSV I/O.5/ (G 3) SO-4, TSSOP4 SO-4, TSSOP4 February 2008 Rev 3 /4 4
2 Absolute maximum ratings and operating conditions TS274 Absolute maximum ratings and operating conditions Table 2. Absolute maximum ratings (AMR) Symbol Parameter TS274C/AC TS274I/AI Unit + V Supply voltage () V id Differential input voltage (2) V in Input voltage (3) 8 V ±8 V -0.3 to 8 V I o Output current for V + 5V ±30 ma I in Input current ±5 ma T oper Operating free-air temperature range 0 to to +25 C T stg Storage temperature range -65 to +50 C R thja R thjc ESD Thermal resistance junction to ambient (4) SO-4 TSSOP4 DIP4 Thermal resistance junction to case SO-4 TSSOP4 DIP4 HBM: human body model (5) All values, except differential voltage are with respect to network ground terminal. 2. Differential voltages are the non-inverting input terminal with respect to the inverting input terminal. 3. The magnitude of the input and the output voltages must never exceed the magnitude of the positive supply voltage. 4. Short-circuits can cause excessive heating and destructive dissipation. Values are typical. 5. Human body model: A 0pF capacitor is charged to the specified voltage, then discharged through a.5kω resistor between two pins of the device. This is done for all couples of connected pin combinations while the other pins are floating. 6. Machine model: A 200pF capacitor is charged to the specified voltage, then discharged directly between two pins of the device with no external series resistor (internal resistor < 5Ω). This is done for all couples of connected pin combinations while the other pins are floating. 7. Charged device model: all pins and the package are charged together to the specified voltage and then discharged directly to the ground through only one pin. This is done for all pins. Table 3. MM: machine model (6) CDM: charged device model (7) Operating conditions C/W C/W 500 V 0 V 800 V Symbol Parameter Value Unit V + Supply voltage 3 to 6 V V icm Common mode input voltage range 0 to V V T oper Operating free-air temperature range TS274C TS274I 0 to to 25 C 2/4
3 Block diagram and circuit schematics 2 Block diagram and circuit schematics Figure. Block diagram V Current source x I Input differential Second stage Output stage Output V E E 3/4
4 Block diagram and circuit schematics TS274 Figure 2. Schematic diagram (for /4 TS274) T 24 T 25 R 2 T7 8 T T9 T 20 T 2 T26 T 23 T 22 V T27 T28 T29 Input V T5 T T2 T 3 T4 Input C R T6 T7 T T8 T T2 T9 T3 T4 T5 Output T6 4/4
5 Electrical characteristics 3 Electrical characteristics Table 4. V + = +V, V - = 0V, T amb = +25 C (unless otherwise specified) TS274C/AC TS274I/AI Symbol Parameter Conditions Min Typ Max Min Typ Max Unit V io Input offset voltage V o =.4V, V ic = 0V TS274C/I TS274AC/AI T min T amb T max TS274C/I TS274AC/AI DV io Input offset voltage drift 2 2 µv/ C I io Input offset current () V ic = 5V, V o = 5V pa T min T amb T max I ib Input bias current () V ic = 5V, V o = 5V T min T amb T max V OH High level output voltage V id = 0mV, R L = kω 8.2 T min T amb T max V OL Low level output voltage V id = -0mV mv A vd GBP CMR SVR I Large signal voltage gain Gain bandwidth product Common mode rejection ratio Supply voltage rejection ratio Supply current (per amplifier) V ic = 5V, R L = kω, V o = V to 6V T min T amb T max A v = 40dB, R L = kω, C L = 0pF, f in = 0kHz mv mv pa V V/mV MHz V ic = V to 7.4V, V o =.4V db V + = 5V to V, V o =.4V db A v =, no load, V o = 5V T min T amb T max I o Output short circuit current V o = 0V, V id = 0mV ma I sink Output sink current V o = V, V id = -0mV ma SR Slew rate at unity gain R L = kω, C L = 0pF, V in = 3 to 7V µa V/µs φm Phase margin at unity gain A v = 40dB, R L = kω, C L = 0pF Degrees K OV Overshoot factor % e n Equivalent input noise voltage f = khz, R s = 0Ω nv/ Hz V o /V o2 Channel separation db. Maximum values including unavoidable inaccuracies of the industrial test. 5/4
6 Electrical characteristics TS274 Figure 3. Supply current (each amplifier) vs. supply voltage Figure 4. High level output voltage vs. high level output current OUTPUT VOLTAGE, V OH (V) T V amb id = 25 C = 0mV V V = V = 6V OUTPUT CURRENT, I OH (ma) Figure 5. INPUT BIAS CURRENT, I IB (pa) 0 Input bias current vs. free-air temperature V = V V = 5V ic TEMPERATURE, T amb ( C) Figure 6. Low level output voltage vs. low level output current Figure 7. High level output voltage vs. high level output current Figure 8. Low level output voltage vs. low level output current OUTPUT VOLTAGE, V OH (V) T V amb id = 25 C = 0mV V = 5V V = 3V OUTPUT CURRENT, I OH (ma) 6/4
7 Electrical characteristics Figure 9. Open loop frequency response and phase shift Figure. Phase margin vs. capacitive load GAIN (db) T amb = 25 C V + = V R = L kω C = 0pF L A = 0 VCL 2 3 PHASE 4 GAIN Gain Bandwidth Product 5 6 FREQUENCY, f (Hz) Phase Margin PHASE (Degrees) PHASE MARGIN, m (Degrees) φ CAPACITANCE, C L T amb= 25 C R L = kω A V = V = V (pf) Figure. Gain bandwidth product vs. supply voltage Figure 2. Slew rate vs. supply voltage GAIN BANDW. PROD., GBP (MHz) T amb= 25 C R L = kω C L = 0pF A = SUPPLY VOLTAGE, V V (V) SLEW RATES, SR (V/μs) T amb= 25 C R L = kω C = 0pF L SUPPLY VOLTAGE, V SR SR (V) Figure 3. Phase margin vs. supply voltage Figure 4. Input voltage noise vs. frequency PHASE MARGIN, φ m (Degrees) T amb= 25 C R L = kω C L = 0pF A = V SUPPLY VOLTAGE, V (V) EQUIVALENT INPUT NOISE VOLTAGE (nv/vhz) V = V T amb = 25 C R S =0Ω FREQUENCY (Hz) 7/4
8 Macromodel TS274 4 Macromodel 4. Important note concerning this macromodel Please consider the following remarks before using this macromodel. All models are a trade-off between accuracy and complexity (i.e. simulation time). Macromodels are not a substitute to breadboarding; rather, they confirm the validity of a design approach and help to select surrounding component values. A macromodel emulates the nominal performance of a typical device within specified operating conditions (temperature, supply voltage, for example). Thus the macromodel is often not as exhaustive as the datasheet, its purpose is to illustrate the main parameters of the product. Data derived from macromodels used outside of the specified conditions (V, temperature, for example) or even worse, outside of the device operating conditions (V, V icm, for example), is not reliable in any way. 4.2 Macromodel code ********************************.SUBCKT TS27X *** INP- =, INP+ =2, OUT = 3 VDD=4 VSS = 5 *** TYPE = TS27/TS272/TS274.MODEL MDTH D IS=E-8 KF=2.664E-6 CJO=F ***INPUT STAGE CIP 2 5 E-2 CIN 5 E-2 EIP EIN RIP 8 RIN RIS CPS 5 E-9 DIP 20 MDTH 400E-2 DIN 5 40 MDTH 400E-2 RDEG RDEG VOFP 2 3 DC 0 VOFN 3 4 DC 0 IPOL E-6 ***I DI 4 3 MDTH 400E-2 DI MDTH 400E-2 DI MDTH 400E-2 DI MDTH 400E-2 RI E3 I E-6 ***COMMON MODE INPUT LIMITATION DINN 7 3 MDTH 400E-2 VIN 7 5 DC -0. 8/4
9 Macromodel DINR 5 8 MDTH 400E-2 VIP 4 8 DC 2.2 ***GM STAGE FGMP 9 5 VOFP FGMN 9 5 VOFN RAP 9 4 E6 RAN 9 5 E6 ***GM2 STAGE G2P E-4 G2N E-4 R2P E3 R2N E3 ***COMPENSATION 9 9 7p ***BUFFER EBUF ***SHORT-CIRCUIT LIMITATIONS( ISINK, ISOURCE) DOPM 9 22 MDTH 400E-2 DONM 2 9 MDTH 400E-2 HOPM VOUT 9 VIPM 28 4 DC 50 HONM 2 27 VOUT 222 VINM 5 27 DC 50 VOUT 3 23 DC 0 ***VOH, VOL DEFINITIONS DOP 9 25 MDTH 400E-2 VOP DON 24 9 MDTH 400E-2 VON ***OUTPUT RESISTOR ROUT ENDS 9/4
10 Package information TS274 5 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: 5. DIP4 package information Figure 5. DIP4 package mechanical drawing Table 5. Ref. DIP4 package mechanical data Millimeters Inches Min. Typ. Max. Min. Typ. Max. a B b b D E e e F I L Z /4
11 Package information 5.2 SO-4 package information Figure 6. SO-4 package mechanical drawing Table 6. Ref. SO-4 package mechanical data Millimeters Dimensions Inches Min. Typ. Max. Min. Typ. Max. A a a b b C c 45 (typ.) D E e e F G L M S 8 (max.) /4
12 Package information TS TSSOP4 package information Figure 7. TSSOP4 package mechanical drawing A A2 A b e c K L E D E PIN IDENTIFICATION Figure 8. Ref. TSSOP4 package mechanical data Millimeters Dimensions Inches Min. Typ. Max. Min. Typ. Max. A A A b c D E E e 0.65 BSC BSC K L /4
13 Ordering information 6 Ordering information Table 7. Order code Order codes Temperature range Package Packing Marking TS274CD TS274CDT TS274ACD TS274ACDT TS274CN TS274ACN 0 C, +70 C SO-4 DIP4 Tube or Tape & reel Tube 274C 274AC TS274CN TS274ACN TS274CPT TS274ACPT TSSOP4 Tape & reel 274C 274AC TS274ID TS274IDT TS274AID TS274AIDT TS274IN TS274AIN -40 C, +25 C SO-4 DIP4 Tube or Tape & reel Tube 274I 274AI TS274IN TS274AIN TS274IPT TS274AIPT TSSOP4 Tape & reel 274I 274AI 7 Revision history Table 8. Document revision history Date Revision Changes 9-Nov-200 Initial release. 07-Apr Feb ESD protection inserted in Table 2. on page 2. Thermal resistance junction to case information added see Table 2. on page 2. Macromodel insertion in Section 4 on page 8. Added information on enhanced related families of devices on cover page. Removed TS274B version in AMR table and in order codes table. 3/4
14 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 4/4
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