ISOVCC B Y Z YR C1HI C2LO C2HI ISOCOM ±60V. C4 10nF. Maxim Integrated Products 1

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1 ; Rev ; 2/3 High CMRR RS-485 Transceiver General Description The is a high CMRR RS-485/RS-422 data-communications interface providing ±6 isolation in a hybrid microcircuit. single +5V supply on the logic side powers both sides of the interface, with external 1 capacitors transferring power from the logic side to the isolated side. Each contains one transmitter and one receiver and is guaranteed to operate at data rates up to 25kbps. Drivers are short-circuit current limited and protected against excessive power dissipation by thermal shutdown circuitry that places the driver outputs into a high-impedance state. The receiver input has a fail-safe feature that guarantees a logic-high receiver output if the inputs are open, shorted, or connected to a terminated transmission line with all drivers disabled. The typically draws 25m of supply current when unloaded or when fully loaded with the driver disabled. Supply current drops to 25µ when the device is placed in shutdown mode. The device is pin selectable between half- and full-duplex mode and also features an independently programmable receiver and transmitter output phase through separate pins. The is a low-cost replacement for opto-isolated transceivers. For fully isolated RS-485/RS-422 transceivers, refer to the MX148 family data sheet. pplications Industrial Controls Level Translators Telecommunications Local rea Networks Features ±6 Isolated Data Interface +5V Single Supply Low-Cost Replacement for Opto-Isolated Transceivers True Fail-Safe Receiver While Maintaining EI/TI-485 Compliance Pin-Selectable Full/Half-Duplex Operation Phase Controls to Correct for Twisted-Pair Reversal 25µ Low-Power Shutdown Mode Thermal Shutdown for Driver Overload Protection 28-Pin SSOP Package Slew-Rate-Limited Reduced EMI Ordering Information PRT TEMP RNGE PIN-PCKGE CI C to +7 C 28 SSOP CPI C to +7 C 28 PDIP EI -4 C to +85 C 28 SSOP EPI -4 C to +85 C 28 PDIP Pin Configurations appear at end of data sheet. Typical Operating Circuit.1µF H/F TXP ISOVCC C3 1µF MICRO RXP DI Y Z YR RT = 1Ω RS-485 NO REMOTE MICRO RE ZR RO R GND R RG C1LO C1HI C2LO C2HI ISOCOM ±6 C1.47µF C2.47µF C4 1nF GND OFFSET REMOTE GND Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at , or visit Maxim s website at

2 SOLUTE MXIMUM RTINGS (ll voltages referenced to GND, unless otherwise noted.) Supply Voltage ( )...+7V Cable Ground (ISOCOM)...±75V Isolated Supply ISOVCC Relative to Cable Ground (ISOCOM)...+7V Digital Input, Output Voltage (DI,, RE, TXP, RXP, RO)...-.3V to ( +.3V) Digital Inputs (H/F) Relative to Cable Ground (ISOCOM)...-.3V to (ISOVCC +.3V) Driver Output Voltage (Y, Z) Relative to Cable Ground (ISOCOM)...-8V to +12.5V Receiver Input Voltage (, ) Relative to Cable Ground (ISOCOM)...-8V to +12.5V Termination Connections (YR, ZR, R, R) Relative to Cable Ground (ISOCOM)...-8V to +12.5V Charge-Pump Capacitance Low (C1LO, C2LO)...-.3V to ( +.3V) Charge-Pump Capacitance High (C1HI, C2HI) Relative to Cable Ground (ISOCOM)...-.3V to (ISOVCC +.3V) Continuous Power Dissipation (T = +7 C) 28-Pin SSOP (derate 1.8mW/ C above +7 C)...86mW 28-Pin PDIP (derate 14.3mW/ C above +7 C) mW Operating Temperature Ranges C_I... C to +7 C E_I...-4 C to +85 C Junction Temperature C Storage Temperature Range C to +16 C Lead Temperature (soldering, 1s)...+3 C Stresses beyond those listed under bsolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICL CHRCTERISTICS ( = +5V ±5%, YR = ZR = R = R = ISOCOM, C1 = C2 =.47µF, C3 = C4 = 1µF, T = T MIN to T MX, unless otherwise noted. Typical values are at = +5V and T = +25 C.) (Note 1) DRIVER PRMETER SYMOL CONDITIONS MIN TYP MX UNITS Differential Driver Output, No Load Differential Driver Output, Loaded V OD1 Figure 1, R = 1MΩ 6 V Figure 1, R = 5Ω (RS-422) 2. V OD2 Figure 1, R = 27Ω (RS-485) 1.5 V Change in Magnitude of Differential Output Voltage (Note 2) V OD Figure 1, R = 5Ω or R = 27Ω.2 V Driver Common-Mode Voltage V OC Figure 1, R = 5Ω or R = 27Ω, V OC relative to ISOCOM 3.5 V Change in Magnitude of Common-Mode Voltage (Note 2) V OC Figure 1, R = 5Ω or R = 27Ω.2 V Input High Voltage V IH, DI, RE, TXP, RXP, relative to GND, H/F relative to ISOCOM 2. V Input Low Voltage V IL, DI, RE, TXP, RXP, relative to GND, H/F relative to ISOCOM.8 V DI Input Hysteresis V HYS 1 mv 2

3 ELECTRICL CHRCTERISTICS (continued) ( = +5V ±5%, YR = ZR = R = R = ISOCOM, C1 = C2 =.47µF, C3 = C4 = 1µF, T = T MIN to T MX, unless otherwise noted. Typical values are at = +5V and T = +25 C.) (Note 1) Input Current PRMETER SYMOL CONDITIONS MIN TYP MX UNITS I IN1, DI, RE ±2 I IN2 H/F, TXP, RXP internal pulldown 1 4 = GND, = GND or 5.25V, -7V (V IN - V ISOCOM ) +12V, R = R = ISOCOM Input Current ( and ) I IN3 = GND, = GND or 5.25V, -7V (V IN - V ISOCOM ) +12V, R open, R open Output Leakage (Y and Z) Full Duplex = GND, = GND or 5.25V, -7V (V IN - V ISOCOM ) +12V, YR = ZR = ISOCOM I O = GND, = GND or 5.25V, -7V (V IN - V ISOCOM ) +12V, YR open, ZR open Driver Short-Circuit Output I OSD1 V ISOCOM - 7V V OUT V ISOVCC -25 Current (Note 3) I OSD2 V ISOCOM - 7V V OUT V ISOCOM + 12V 25 RECEIVER Receiver Differential Threshold Voltage V TH -7V V CM - V ISOCOM +12V m V Receiver Input Hysteresis V TH 25 mv Receiver Output High Voltage V OH I O = -4m, V ID = -5mV V Receiver Output Low Voltage V OL I O = 4m, V ID = -2mV.4 V Three-State Output Current at Receiver I OZR.4V V O 2.4V ±1 µ -7V V CM - V ISOCOM +12V, R = R = ISOCOM Receiver Input Resistance R IN -7V V CM - V ISOCOM +12V, R open, R open Receiver Output Short-Circuit Current SUPPLY CURRENT I OSR V RO ±7 ±1 m Supply Current I CC No load, RE = = DI = GND or m Supply Current in Shutdown Mode = GND, RE =, V ISOCOM = GND 25 6 I SHDN = GND, RE =, V ISOCOM = ±6 ±65 Maximum Ground Differential V GND = GND, RE =, ISOCOM leakage 65µ µ m m m kω µ ±6 V 3

4 SWITCHING CHRCTERISTICS ( = +5V ±5%, YR = ZR = R = R = ISOCOM, C1 = C2 =.47µF, C3 = C4 = 1µF. Typical values are at = +5V and T = +25 C.) PRMETER SYMOL CONDITIONS MIN TYP MX UNITS Driver Input to Output Driver Output Skew t DPLH - t DPHL t DPLH Figures 3 and 5, R DIFF = 54Ω, C L1 = C L2 = 1pF t DPHL Figures 3 and 5, R DIFF = 54Ω, C L1 = C L2 = 1pF t DSKEW Figures 3 and 5, R DIFF = 54Ω, C L1 = C L2 = 1pF ns 25 ns Driver Rise or Fall Time t DR, t DF Figures 3 and 5, R DIFF = 54Ω, C L1 = C L2 =1pF ns Maximum Data Rate f MX 25 kbps Driver Enable to Output High t DZH Figures 4 and 6, C L = 1pF, S2 closed 35 ns Driver Enable to Output Low t DZL Figures 4 and 6, C L = 1pF, S1 closed 35 ns Driver Disable Time from Low t DLZ Figures 4 and 6, C L = 15pF, S1 closed 3 ns Driver Disable Time from High t DHZ Figures 4 and 6, C L = 15pF, S2 closed 3 ns Receiver Input to Output t RPLH, t RPHL Figures 7 and 9; V ID ns Differential Receiver Skew t RPLH - t RPHL t RSKEW Figures 7 and 9; V ID 2. 2 ns Receiver Enable to Output Low t RZL Figures 2 and 8, C L = 1pF, S1 closed 2 5 ns Receiver Enable to Output High t RZH Figures 2 and 8, C L = 1pF, S2 closed 2 5 ns Receiver Disable Time from Low t RLZ Figures 2 and 8, C L = 1pF, S1 closed 2 5 ns Receiver Disable Time from High t RHZ Figures 2 and 8, C L = 1pF, S2 closed 2 5 ns Time to Shutdown t SHDN (Note 4) ns Driver Enable from Shutdown to Output High t DZH (SHDN) Figures 4 and 6, C L = 15pF, S2 closed.2 1 ms Driver Enable from Shutdown to Output Low Receiver Enable from Shutdown to Output High Receiver Enable from Shutdown to Output Low t DZL (SHDN) t RZH (SHDN) t RZL (SHDN) Figures 4 and 6, C L = 15pF, S1 closed.2 1 ms Figures 2 and 8, C L = 1pF, S2 closed.2 1 m s Figures 2 and 8, C L = 1pF, S1 closed.2 1 ms Charge-Pump Oscillating Frequency f OSC 1.3 MHz Note 1: ll currents into the device are positive; all currents out of the device are negative. ll voltages are referred to device ground unless otherwise noted. Note 2: V OD and V OC are the changes in V OD and V OC, respectively, when the DI input changes state. Note 3: Current level applies to peak current just prior to foldback-current limiting. Note 4: The device is put into shutdown by bringing RE high and low. If the enable inputs are in this state for less than 5ns, the device is guaranteed not to enter shutdown. If the enable inputs are in this state for at least 7ns, the device is guaranteed to have entered shutdown. 4

5 Typical Operating Characteristics ( = +5V, YR = ZR = R = R = ISOCOM, C1 = C2 =.47µF, C3 = 1µF, C4 = 1nF, T = +25 C, unless otherwise noted.) SUPPY CURRENT (m) SUPPLY CURRENT vs. TEMPERTURE R L = 54Ω NO LOD toc1 SUPPY CURRENT (µ) SHUTDOWN SUPPLY CURRENT vs. TEMPERTURE V ISOCOM = -5 V ISOCOM = V ISOCOM = toc2 OUTPUT CURRENT (m) RECEIVER OUTPUT CURRENT vs. RECEIVER OUTPUT LOW VOLTGE OUTPUT LOW VOLTGE (V) toc3 OUTPUT CURRENT (m) RECEIVER OUTPUT CURRENT vs. RECEIVER OUTPUT HIGH VOLTGE toc4 OUTPUT LOW VOLTGE (V) RECEIVER OUTPUT LOW VOLTGE vs. TEMPERTURE I RO = 8m toc5 OUTPUT VOLTGE (V) RECEIVER OUTPUT HIGH VOLTGE vs. TEMPERTURE I RO = -8m toc OUTPUT HIGH VOLTGE (V) OUTPUT CURRENT (m) DRIVER OUTPUT CURRENT vs. DRIVER OUTPUT LOW VOLTGE OUTPUT VOLTGE (V) toc7 OUTPUT CURRENT (m) DRIVER OUTPUT CURRENT vs. DRIVER OUTPUT HIGH VOLTGE OUTPUT HIGH VOLTGE (V) toc8 OUTPUT CURRENT (m) DRIVER OUTPUT CURRENT vs. DIFFERENTIL OUTPUT VOLTGE DIFFERENTIL OUTPUT VOLTGE (V) toc9 5

6 Typical Operating Characteristics (continued) ( = +5V, YR = ZR = R = R = ISOCOM, C1 = C2 =.47µF, C3 = 1µF, C4 = 1nF, T = +25 C, unless otherwise noted.) OUTPUT VOLTGE (V) DRIVER DIFFERENTIL OUTPUT VOLTGE vs. TEMPERTURE R L = 54Ω toc1 PROPGTION LY (ns) RECEIVER PROPGTION LY vs. TEMPERTURE toc11 PROPGTION LY (µs) DRIVER PROPGTION LY vs. TEMPERTURE R L = 54Ω toc12 DRIVER ENLE TIME (µs) DRIVER ENLE TIME vs. TEMPERTURE toc13 DRIVER DISLE TIME (ns) DRIVER DISLE TIME vs. TEMPERTURE toc14 RECEIVER PROPGTION LY toc15 V - V 5V/div R O µs/div DRIVER PROPGTION LY toc16 POWER-UP LY (V ISOCOM = ) toc17 POWER-UP LY (V ISOCOM = -5) toc18 DI 1/div 5V/div 2V/div VY - VZ VY 5V/div -5 VY 1/div 2µs/div R DIFF = 54Ω CL1 = CL2 = 1pF 4µs/div 1µs/div 6

7 Typical Operating Characteristics (continued) ( = +5V, YR = ZR = R = R = ISOCOM, C1 = C2 =.47µF, C3 = 1µF, C4 = 1nF, T = +25 C, unless otherwise noted.) +5 POWER-UP LY (V ISOCOM = +5) toc19 5V/div VY 1/div COMMON-MO VOLTGE TO GROUND (V) MXIMUM COMMON-MO VOLTGE TO GROUND vs. COMMON-MO FREQUENCY MXIMUM COMMON-MO VOLTGE TO ISOCOM COMMON-MO VOLTGE TO ISOCOM = 7V PEK toc2 1µs/div COMMON-MO FREQUENCY (khz) Test Circuits and Timing Diagrams Y V OD R DI 3V Y V ID C L1 R DIFF R V OC Z C L2 Z Figure 1. Driver DC Test Load Figure 3. Driver Timing Test Circuit TEST POINT RECEIVER OUTPUT C L 1pF 1kΩ S1 1kΩ OUTPUT UNR TEST 5Ω S1 C L S2 S2 Figure 2. Receiver Enable/Disable Timing Test Load Figure 4. Driver Enable/Disable Timing Test Load 7

8 DI 3V Z Y V O 1.5V t DPLH t DPHL 1.5V Test Circuits and Timing Diagrams (continued) 1/2 V O 3V RE RO 1.5V 1.5V t RZL(SHDN), t RZL t RLZ 1.5V OUTPUT NORMLLY LOW V OL +.5V V DIFF V O -V O 1/2 V O t DR 1% V DIFF = V (Y) - V (Z) 9% 9% t DF t DSKEW = t DPLH - t DPHL 1% RO OUTPUT NORMLLY HIGH 1.5V t RZH(SHDN), t RZH t RHZ V OH -.5V Figure 5. Driver Propagation Delays Figure 8. Receiver Enable and Disable Times 3V 1.5V 1.5V Y, Z V OL Y, Z t DZL(SHDN), t DZL t DLZ 2.3V OUTPUT NORMLLY LOW OUTPUT NORMLLY HIGH 2.3V V OL +.5V V OH -.5V TE V ID R RECEIVER OUTPUT t DZH(SHDN), t DZH t DHZ Figure 6. Driver Enable and Disable Times Figure 9. Receiver Propagation Delay Test Circuit V OH RO V OL 1.5V 1.5V OUTPUT 1V -1V t RPHL INPUT t RPLH t RSKEW = t RPLH - t RPHL Figure 7. Receiver Propagation Delays 8

9 PIN SSOP PDIP NME FUNCTION Pin Description 1 2 RO Receiver Output. When RE is low and - > -5mV, RO will be high; if - -2mV, RO will be low. 2 3 RE Receiver Output Enable. Drive RE low to enable RO. 3 4 Driver Output Enable. Drive high to enable driver outputs. 4 5 DI Driver Input. With high, a low on DI forces the noninverting output low and the inverting output high; with DI high, outputs reverse. 5 6 C1LO Connect to the negative terminal of C1 (.47µF, 1). 6, 7, 12, 22, 23 1, 12, 14, 15, 28 No Connection. Not internally connected. 8 7 C1HI Connect to the positive terminal of C1 (.47µF, 1). 9 8 ISOVCC 1 9 H/F 11 1 ZR Internally generated power-supply voltage, referenced to the cable ground (ISOCOM). Connect a 1µF capacitor to ISOCOM. Half/Full-Duplex Selector Pin. Leave open, or connect to ISOCOM to select Full Duplex, or connect to ISOVCC to select Half Duplex. Connect to ISOCOM for a 1.5kΩ input impedance on Z. Leave open for a 12kΩ input impedance on Z YR Connect to ISOCOM for a 1.5kΩ input impedance on Y. Leave open for a 12kΩ input impedance on Y ISOCOM Cable Ground Z Inverting Driver Output (and Inverting Receiver Input in Half-Duplex Mode) Y Noninverting Driver Output (and Noninverting Receiver Input in Half-Duplex Mode) Inverting Receiver Input in Full-Duplex Mode Noninverting Receiver Input in Full-Duplex Mode 19 2 R Connect to ISOCOM for a 1.5kΩ input impedance on. Leave open for a 12kΩ input impedance on R Connect to ISOCOM for a 1.5kΩ input impedance on. Leave open for a 12kΩ input impedance on C2HI Connect to the positive terminal of C2 (.47µF, 1) C2LO Connect to the negative terminal of C2 (.47µF, 1) GND Ground TXP Transmitter Phase. Leave open, or connect to GND for normal transmitter polarity, or connect to to invert the transmitter polarity RXP Receiver Phase. Leave open, or connect to GND for normal receiver polarity, or connect to to invert the receiver polarity V to +5.25V Positive Supply. Connect a.1µf capacitor to GND. 9

10 Detailed Description The is a high CMRR RS-485/RS-422 datacommunications interface providing ±6 isolation in a hybrid microcircuit. single +5V supply on the logic side powers both sides of the interface, with external 1 capacitors transferring power from the logic side to the isolated side (see lock Diagram). The typically draws 25m of supply current when unloaded or when fully loaded with the driver disabled. Supply current drops to 25µ when the device is placed in shutdown mode (see Low-Power Shutdown Mode section). The transceiver for RS-485/RS-422 communication contains one driver and one receiver. This device features fail-safe circuitry, which guarantees a logic-high receiver output when the receiver inputs are open or shorted, or when they are connected to a terminated transmission line with all drivers disabled (see Fail-Safe section). The is selectable between half- and full-duplex communication by connecting a selector pin to ISOVCC or ISOCOM, respectively. Drivers are output short-circuit current limited. Thermal shutdown circuitry protects drivers against excessive power dissipation. When activated, the thermal shutdown circuitry places the driver outputs into a high-impedance state. The device also features independently programmable receiver and transmitter output phase through separate pins. The is a low-cost replacement for opto-isolated transceivers. Fail-Safe The guarantees a logic-high receiver output when the receiver inputs are shorted or open, or when they are connected to a terminated transmission line with all drivers disabled. The receiver threshold is fixed between -5mV and -2mV. If the differential receiver input voltage ( - ) is greater than or equal to -5mV, RO is logic high. If - is less than or equal to -2mV, RO is logic low. In the case of a terminated bus with all transmitters disabled, the receiver s differential input voltage is pulled to by the termination. With the receiver thresholds of the, this results in a logic high with a 5mV minimum noise margin. Unlike competitor s fail-safe devices, the -5mV to -2mV threshold complies with the ±2mV EI/TI-485 standard. Programming The has several programmable operating modes. Occasionally, twisted-pair lines are reversed. The has two pins that invert the phase of the driver and the receiver to correct for this problem. For normal operation, drive TXP and RXP low, connect them to ground, or leave them unconnected (internal pulldown). To invert the driver phase, drive TXP high or connect it to. To invert the receiver phase, drive RXP high or connect it to. Note that the receiver threshold is positive when RXP is high. The can operate in full- or half-duplex mode. Connect H/F to ISOCOM for full-duplex mode, and connect it to ISOVCC for half-duplex operation. In halfduplex mode, the receiver inputs are switched to the driver outputs, connecting outputs Y and Z to inputs and, respectively. In half-duplex mode, the internal full-duplex receiver input resistors are still connected to pins and. Low-Power Shutdown Mode The low-power shutdown mode is initiated by bringing both RE high and low. In shutdown, this device typically draws only 25µ of supply current, and no power is transferred across the isolation capacitors in this mode. RE and may be driven simultaneously; the parts are guaranteed not to enter shutdown if RE is high and is low for less than 5ns. If the inputs are in this state for at least 7ns, the parts are guaranteed to enter shutdown. Enable times t_ ZH and t_ ZL in the Switching Characteristics table assume the part was not in a low-power shutdown state. Enable times t_ ZH(SHDN) and t_ ZL(SHDN) assume the parts were shut down. It takes drivers and receivers longer to become enabled from low-power shutdown mode t_ ZH(SHDN), t_ ZL(SHDN) than from driver/receiver-disable mode (t_ ZH, t_ ZL ). Driver Output Protection Two mechanisms prevent excessive output current and power dissipation caused by faults or by bus contention. The first, a foldback current limit on the output stage, provides immediate protection against short circuits over the whole common-mode voltage range (see Typical Operating Characteristics). The second, a thermal shutdown circuit, forces the driver outputs into a high-impedance state if the die temperature becomes excessive typically around +15 C. pplications Information Capacitor and Grounding Resistor Selection The value for the charge-pump capacitors C1 and C2 should be between 47nF and 1nF. Smaller values will result in insufficient supply voltage on the isolated side. Larger values are allowed but will not result in better charge-pump capacity. The values for C1 and C2, as well as that of C4, determine the maximum frequency and amplitude of the voltage difference (under operating conditions) between the local and isolated ground. esides the capacitor values, this maximum frequency 1

11 DI TXP lock Diagram Y Z YR ZR RO RE RXP R R H/F ISOVCC OSC POWER GND C1L C2L C1H C2H ISOCOM and amplitude are also determined by the resistance between the remote ground and the ISOCOM pin. The receiver input resistors will cause the isolated common voltage to go to the mean voltage of the receiver inputs, which will be a direct function of the remote ground potential. The receiver input resistance and the capacitors C1, C2, and C4 set up a time constant that limits how fast the ISOCOM pin can follow variations in the remote ground voltage. Connecting YR and ZR in halfduplex operation, or R and R in full-duplex operation, to ISOCOM results in a relatively low input impedance of the receiver inputs (2kΩ). This allows for a 6Hz sine wave with a 6 maximum amplitude (see Typical Operating Characteristics). If YR, ZR, R, and R are left open, the receiver input impedance is 12kΩ allowing up to 32 transceivers on the bus. To guarantee the same low time constant under those conditions, use a shielded cable with a 1kΩ resistor connected between the shield and ISOCOM. Using a lower value for this resistor is not recommended because this could trigger a holding current in the internal ESD protection device if the ±75V isolation limit is exceeded. single point hard-ground connection for the shield is recommended. Communication etween Two s If two devices are used to communicate with each other, one of the devices must have ISOCOM connected to local ground. Failure to do so will result in floating ISOCOM pins, with both devices trying to adapt to the isolated ground of the other. Chip Information TRNSISTOR COUNT:

12 High CMRR RS-485 Transceiver RXP TXP GND C2LO Z C2HI R R Y ISOCOM YR ZR H/F ISOVCC C1HI C1LO DI RE RO 28 SSOP TOP VIEW RXP TXP GND C2LO Z C2HI R R Y ISOCOM YR ZR H/F ISOVCC C1HI C1LO DI RE RO 28 PDIP MX3157 Pin Configurations

13 Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to E H DIM 1 C D E e H L INCHES MILLIMETERS MIN MX MIN MX SEE VRITIONS SC.65 SC D D D D D INCHES MIN MX MILLIMETERS MIN MX N 14L 16L 2L 24L 28L SSOP.EPS N e D 1 L C NOTES: 1. D&E DO NOT INCLU MOLD FLSH. 2. MOLD FLSH OR PROTRUSIONS NOT TO EXCEED.15 MM (.6"). 3. CONTROLLING DIMENSION: MILLIMETERS. 4. MEETS JEC MO LEDS TO E COPLNR WITHIN.1 MM. PROPRIETRY INFORMTION TITLE: PCKGE OUTLINE, SSOP, 5.3 MM PPROVL DOCUMENT CONTROL NO. REV C

14 Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to PDIPN.EPS Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 14 Maxim Integrated Products, 12 San Gabriel Drive, Sunnyvale, C Maxim Integrated Products Printed US is a registered trademark of Maxim Integrated Products.

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