Wires, Ground loops Thermal considerations Energy PCB Layout Spring 2018 Lecture 12 1
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1 Wires, Ground loops Thermal considerations Energy PCB Layout Spring 2018 Lecture 12 1
2 4 Quiz Grades 3 2 Quiz Grades 1 0 < Average: 58, SD: Spring 2018 Lecture 12 2
3 Ignoring BFC5, what value do we need for BFC4 to produce a 3dB point at 10Hz, for the power amp only? The gain below 10 Hz will roll off at 20dB per decade, but at some lower frequency it will stop dropping. Why? What is the approximate lower frequency and what is the gain that we end up with? Spring 2018 Lecture 12 3
4 Available diodes (V F = 0.6V), resistors, bypass caps, 7805 (see datasheet), general purpose 2N2222 NPN transistor (see datasheet) and a 1,000uF 50V capacitor. Accept 12VAC or 12V DC and charge the battery with a 50ma current source. When not charging, there must be no leakage current from the battery Spring 2018 Lecture 12 4
5 Wires Theory vs Reality 30-50mv voltage drop in chip power supply noise Spring 2018 Lecture 12 5
6 Signal Grounds Spring 2018 Lecture 12 6
7 Signal Grounds Spring 2018 Lecture 12 7
8 Power Line Connection *Bill Whitlock, Understanding, Finding, & Eliminating Ground Loops In Audio & Video Systems Spring 2018 Lecture 12 8
9 AD Supply Voltages Consideration Noise caused by current spikes in fast switching digital circuits: i c c dv dt AV DD Positive Analog Supply Voltage AV SS Analog Ground DV DD Positive Digital Supply Voltage DV SS Digital Ground Spring 2018 Lecture 12 9
10 Digital/Analog Grounds AVdd DVdd analog circuit LM 4550 digital logic + Vin - analog circuit digital logic n signals analog ground AVss digital ground DVss Connect the grounds at a single place Spring 2018 Lecture 12 10
11 Noise Unavoidable Noise generated: switching power supplies, high current output stage Noise picked up: 60 hz, broadcast signal; conducted: ground pickup, system clocks Spring 2018 Lecture 12 11
12 Simple Scenario Silicon T j -T a =R JA P D R JA is the thermal resistance between silicon and Ambient Junction (Silicon) Temperature P D Realistic Scenario Silicon Case Sink R JC T J T J T C T S T A T J T C P D R JA R CS T S T A R SA T j =T a R JA P D T A Make this as low as possible R CA = R CS +R SA is minimized by facilitating heat transfer (bolt case to extended metal surface heat sink) Spring 2018 Lecture 12 12
13 Heatsinks Mounting screw insulated from metal tab! Insulators * * Spring 2018 Lecture 12 13
14 Thermal Grease Improves thermal conductivity less is better (why?) Spring 2018 Lecture 12 14
15 6.101 Spring 2018 Lecture 12 15
16 Problem: Energy Consumption The Energy Problem 7.5 cm 3 AA battery Alkaline: ~10,000J What can One Joule of energy do? Battery (40+ lbs) Mow your lawn for 1 ms Operate a processor for ~ 7s Moore s law for batteries snails pace! Today: Understand where power goes and ways to manage it Send a 1 Megabyte file over b Credit: Anantha Chandraksan Lecture 12 16
17 Trends: Energy Scavenging MEMS Generator Power Harvesting Shoes Jose Mur Miranda/ Jeff Lang Vibration-to-Electric Conversion ~ 10 W Joe Paradiso (Media Lab) After 3-6 steps, it provides 3 ma for 0.5 sec ~10mW Lecture 12 17
18 Low-Profile Wearable Body-Powered Thermoelectric Generator Low profile, lightweight, conformal. Utilization of small temperature difference Utilization of natural convection for cooling Credit: Krishna Settaluri MIT 2010 Lecture 12 18
19 Experimental Results 15mV Optimal Electrical Load Resistance 33Ω (20Ω theoretical) Optimized Power 11µW 16 TEG Islands (2 TEG modules) Credit: Krishna Settaluri MIT 2010 Lecture 12 19
20 Body Powered, Flex EKG System Credit: Krishna Settaluri MIT 2010 Lecture 12 20
21 Board Layout EKG Leg Inputs 6.4cm EKG Chip Interface to external world Voltage regulation Thin flex substrate in ~ 0.02cm Credit: Krishna Settaluri MIT 2010 Lecture 12 21
22 Resistor High Frequency Performance Metal film resistors have coils of metallic film Surface mount resistors have a higher parallel capacitance L C Spring 2018 Lecture 12 22
23 Capacitors Frequency Limitations Type Aluminum Electrolytic Tantalum Electrolytic Mica Ceramic Max Frequency 100kHz 1MHz 500MHz 1GHz C L Use HP Impedance Bridge to measure Spring 2018 Lecture 12 23
24 Inductors* High Frequency Performance DC resistance of windings Capacitance between turns of wires and layers of wires L C Use HP Impedance Bridge to measure * choke Spring 2018 Lecture 12 24
25 Reliability Product of stress factor (2x safety factor recommended) capacitor operating voltage resistor power rating temperature factor the environment factor shock, vibration packaging the quality factor the adjustment factor Spring 2018 Lecture 12 25
26 PCB Printed Circuit Board Invented by Paul Eisler circa 1930 s Used in WW 2 radios Released after WW 2 for commerical use by US Army General commercial use in 1950 s Zenith Radio/TV last to implement PCB s in manufacturing process 1960 s Spring 2018 Lecture 12 26
27 Zenith Marketing Spin Spring 2018 Lecture 12 27
28 PCB Printed Circuit Board FR 4 glass epoxy, high strength a elevated temperature, self extinguishing FR Flame retardant Type two layer or four (or more) PCB 1oz PCB: (1oz cu per sq ft) Silkscreen: labels components on PCB Solder mask: lacquer like polymer applied to prevent solder bridges and oxidation Spring 2018 Lecture 12 28
29 PCB Files Netlist: a text file describing connectivity of the design Gerber file: de facto standard used by PCB industry software to describe the printed circuit board images: copper layers, solder mask, legend, drill holes Spring 2018 Lecture 12 29
30 PCB General Rules Where ever possible, make the botton layer a ground plane Be careful of autorouters all grounds not the same! Coupling between traces: incidental capacitive coupling; 0.75mm x 7.5mm run with thickness creates a 1pF cap Cross talk Trace resistance : 10mil trace 0.048ohm/inch for 1oz Cu (35um thickness, 1cm cu cube = 1.7uohm) Avoid 90 deg turns, use 45 deg turns Spring 2018 Lecture 12 30
31 PCB Trace PCB trace are transmissions lines 90 deg corners results in reflections Use 45 deg turns Spring 2018 Lecture 12 31
32 KiCad Open source (Windows, OSX, Linux) Schematic capture Up 32 layers with routing for differential piars 3D viewer Expresspcb Free download Windows only Limitations: 4 layer max No netlist import PCB Design Software Altium CircuitMaker Windows only Design must be open sourced Internet link required Eagle (cadsoft) Free download available (Eagle light Windows, OSX, Linux) Limitations: The useable board area is limited to 100 x 80 mm (4 x 3.2 inches). Only two signal layers can be used (top and bottom). The schematic editor can only create one sheet Spring 2018 Lecture 12 32
33 PCB Sources prototyping.com (China) 10 boards, 10cm x 10cm 2 layer $ $20 shipping Typically 7 day delivery via AIR Accepts Gerber files (US) 4 boards, 3.8 X layer $75 2 day production, 2 day AIR Uses proprietary PCB tool Spring 2018 Lecture 12 33
34 Surface Mount Technology Higher component density Simpler and faster automated assembly = lower manfacturing costs Lower component costs Terminology: capacitors and resistors: length x width 0805 (0.079in x 0.049in = 2.0mm x1.25mm Transistors: SOT Small Outline Transistor IC s: SOIC Small Outline Integrated Circuit BGA: Ball Grid Array Spring 2018 Lecture 12 34
35 SMT Board Example Surface mount a 1.4 watt class D stereo amplifier 1206 components USB powered 84% efficiency at 400mw Short circuit and thermal protection Spring 2018 Lecture 12 35
36 PCB Layout Example Express PCB LF353 (use LT1413), 2 resistor, capacitor, DB 9 connector Trace width Digikey link Top/bottom trace selections Simple ordering Spring 2018 Lecture 12 36
37 PCB Layout Process Draw schematic Label components: resistors, caps, IC Save schematic Link PCB layout with schematic Connect components Spring 2018 Lecture 12 37
38 PCB Schematic Spring 2018 Lecture 12 38
39 PCB Layout Spring 2018 Lecture 12 39
40 Lab 6 PPG suggestions Break down problems Currents are extremely small Characterize probe Simulation Design/debug tone generator separately Spring 2018 Lecture 12 40
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