General Session & 18 th Annual Meeting of Members. February 23, 2017
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1 General Session & 18 th Annual Meeting of Members February 23, 2017
2 Activities of the Association Report to the Membership on the Affairs of the Company
3 Membership: February 23, entities stable and growing General Session 2017 Industry Conference & 18th Annual Meeting 3
4 ODVA at Work HQ Staff & local PR supporting North & Latin America HQ Staff & local PR supporting European in-country resources RIC Germany RIC Italy TAG Korea ODVA ATS with TAG China TAG Japan HQ Staff supporting Asian in-country resources General Session 2017 Industry Conference & 18th Annual Meeting 4
5 A Community Driving the Stages of Diffusion for the 4 th Industrial Revolution ODVA GUIDING PRINCIPLES FOR SUCCESS 1. Design for Integration of Heterogeneous Systems 2. Deploy ICT Standards to Achieve Interoperability 3. Optimize Performance-Cost Ratio with COTS 4. Blend the Best Technical Solutions of the Future with Proven Solutions of the Present 5. Architect and Automate for Diagnostics 6. Design for the Scalability of THINGS Technology implementations and diffusion from suppliers to users will be particularly impacted by common approaches information models and cybersecurity. General Session 2017 Industry Conference & 18th Annual Meeting 5
6 The Ascent of EtherNet/IP EtherNet/IP has become a Device Profiles comprehensive CIP I/O CIP Energy CIP Sync CIP Security CIP Motion CIP Safety and proven platform for the smart and secure industrial control systems of tomorrow. CIP Services Profile(s), Objects and Services Objects and Services Objects and Services Standard Connections (includes TCP and UDP) Profile(s), Objects and Services Secured Connections 1 Profile(s) and Axis Objects Motion I/O Connections CIP Application Layer (IPV4 migrating to IPv6, optional CoCo and TCL) EtherNet/IP Layer 2 (options for high availability, QOS with or without TSN) Ethernet Layer 1 (with 1 GbE) NETWORK ARCHITECTURE FRAMEWORK Profile(s), Objects and Services Safety Connections General Session 2017 Industry Conference & 18th Annual Meeting 6
7 Ascent of EtherNet/IP What are industry analysts saying? Transition to industrial Ethernet is accelerating and EtherNet/IP accounted for approximately 25% of all new Ethernet nodes shipped in The growth trend for EtherNet/IP is expected to continue building on its strong installed base, the transition from fieldbus to Ethernet networks, and the fact that industrial Ethernet will provide a fundamental component of connectivity necessary to enable smart manufacturing and IIOT solutions. Alex West, analyst for IHS Markit New Connected Industrial Ethernet Nodes 2015 Industrial Communications Report 2015 IHS Markit. General Session 2017 Industry Conference & 18th Annual Meeting 7
8 Leadership Michael Höing Weidmüller Interface Fabrice Jadot Schneider Electric Dr. Jürgen Weinhofer Rockwell Automation Masaru Takeuchi Omron Dr. Thomas Bürger Bosch Rexroth Dr. Rolf Birkhofer Endress+Hauser General Session 2017 Industry Conference & 18th Annual Meeting 8
9 Officers President and Executive Director Katherine Voss Chief Technology Officer Joakim Wiberg Secretary Christopher Lynch Treasurer Jürgen Weinhofer General Session 2017 Industry Conference & 18th Annual Meeting 9 9
10 Welcome Back General Session 2017 Industry Conference & 18th Annual Meeting 10
11 Industry Awareness Exhibits at Hannover Fair and SPS IPC Drives show in Germany and Concurrent Media Briefings General Session 2017 Industry Conference & 18th Annual Meeting 11
12 Industry Awareness Exhibits at Systems Controls Fair and Industrial Open Net Fair in Japan General Session 2017 Industry Conference & 18th Annual Meeting 12
13 Industry Awareness Launched refreshed EtherNet/IP seminar, starting in: Barcelona, Spain Detroit, Michigan, USA Frankfurt, Germany Parma, Italy General Session 2017 Industry Conference & 18th Annual Meeting 13
14 Industry Awareness Organization Ambassador to IOT Solutions World Congress General Session 2017 Industry Conference & 18th Annual Meeting 14
15 Industry Awareness Chinese Automation Association Forum September 2016 General Session 2017 Industry Conference & 18th Annual Meeting 15
16 Industry Awareness Western China GongKong Forum December 2016 General Session 2017 Industry Conference & 18th Annual Meeting 16
17 Report on ODVA Technical Activities
18 Agenda ODVA Technology Development Overview Technical Review Board Roster Special Interest Groups and Working Groups Key Technical Accomplishments since last Annual Meeting Key Planned Activities for Next Term Technical Track 2017 Industry Conference & 18th Annual Meeting 18
19 ODVA Technology Development Process EtherNet/IP Roundtable Special Interest Group Set SIG Work Plans Submit SE or TDE Technical Review Board Approved SE or TDE Strategic Initiatives Board of Directors ODVA Update Update (TRB review) Specification Set Update (via Conformance Authority) Conformance Test Policies and Procedures Technical Track 2017 Industry Conference & 18th Annual Meeting 19
20 Technical Review Board Joakim Wiberg, chairperson Dave VanGompel Dr. Ludwig Leurs Rudy Belliardi Paul Didier Shinji Murayama Dr. Jörg Hähniche Eric Scott Technical Track 2017 Industry Conference & 18th Annual Meeting 20
21 Active Special Interest Groups and Working Groups EtherNet/IP In Process Industry Mirko Brcic (Endress+Hauser) CIP Safety Bruce Brown (Rockwell Automation) Common Industrial Cloud Interface Stephen Briant (Rockwell Automation) (new SIG) IO-Link Integration Frank Moritz (SICK) DeviceNet of Things Thomas Peter (Weidmueller) Machinery Information Beudert/Zuponcic/Leurs EtherNet/IP Physical Layer Bob Lounsbury (Rockwell Automation) DeviceNet Physical Layer Brad Woodman (Molex) EtherNet/IP Infrastructure George Ditzel (Schneider Electric) EtherNet/IP System Brian Batke (Rockwell Automation) Distributed Motion and Time Synchronization Steve Zuponcic (Rockwell Automation) CompoNet Tianbing Li (Omron) Conformance Qi Zeng (ODVA) Modbus Integration Todd Snide (Schneider Electric) Motor Control and Circuit Breaker - John Caspers (Rockwell Automation) (new SIG) CIP System Dave VanGompel (Rockwell Automation) Energy Applications Rick Blair (Schneider Electric) EtherNet/IP Roundtable Kevin Knake (HMS Industrial Networks) US Track Ulrich Kaemmerer (Schneider Electric) European Track Technical Track 2017 Industry Conference & 18th Annual Meeting 21
22 Specification Enhancement Summary 56 Specification Enhancements distributed over 3 publication cycles 2 Technical Documents Specification Volume PC to PC CIP Common (Vol 1) 16 EtherNet/IP (Vol 2) 8 CIP Safety (Vol 5) 7 CIP Security (Vol 8) 9 CIP Motion (Vol 9) 16 Technical Track 2017 Industry Conference & 18th Annual Meeting 22
23 Key Accomplishments since last Annual Meeting Topic SIG Summary CIP Motion Reorganization Motion & Time Sync Reorganize all the current material into one new volume CIP Security EtherNet/IP System First prototypes available and two interoperability tests EtherNet/IP CT13 and CT14 DeviceNet CT27 and CT28 Roundtable Diagnostic Activities Conformance Roundtable, CIP System, EtherNet/IP System Supporting slides First enhancements related to the ongoing diagnostic activities DLR Whitepaper EtherNet/IP Infrastructure New ODVA publication Time Sensitive Networking Motion & Time Sync Supporting slides Technical Track 2017 Industry Conference & 18th Annual Meeting 23
24 Conformance Test Updates EtherNet/IP CT13 and CT14 released DeviceNet CT27 and CT28 released Significant Enhancements to Common Object Tests Port, Energy and Power, PRP/HSR, TCP/IP, Ethernet, File, CoCo Diagnostic Counters From EtherNet/IP Roundtable initiative Technical Track 2017 Industry Conference & 18th Annual Meeting 24
25 Distributed Motion & Time Synchronization SIG In November 2015 the SIG changed its name from: The Distributed Motion SIG to The Distributed Motion & Time Synchronization SIG Extended charter to include emerging standards and technologies, including: Time Sensitive Networking Gigabit Ethernet Time Synchronization and TSN Activities Analysis of Frame Preemption, Stream Reservation Protocols, Gigabit Ethernet, and Scheduling on overall Performance in the CIP Motion architecture Technical Track 2017 Industry Conference & 18th Annual Meeting 25
26 Topic SIG Summary Key Planned Activities for Next Term Process EtherNet/IP for Process Finalize HART mapping on CIP CIP Security Phase 1.5 & 2 EtherNet/IP System Certificate enrollment CIP Authentication and Authorization DeviceNet of Things DeviceNet of Things, CIP System Supporting slides IO-Link IO-Link Integration Supporting slides Roundtable Activities Roundtable, CIP System, EtherNet/IP System Diagnostic project, LLDP investigation, CIP Security, Interoperability Technical Track 2017 Industry Conference & 18th Annual Meeting 26
27 DeviceNet of Things SIG Proposed plans for next months Complete work on the Physical Layer Spec Work on the Power Supply concept Test specification System integration in control / PLC system Scanner enhancements Profile description System Tests Technical Track 2017 Industry Conference & 18th Annual Meeting 27
28 IO-Link Integration SIG Proposed plans for next months Specification enhancements Finalization Publication in Volume 7B Conformance Test Plan Setup and finalization Technical Track 2017 Industry Conference & 18th Annual Meeting 28
29 THANK YOU
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