The Grand Challenge Project 3D-Mintegration
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1 The Grand Challenge Project 3D-Mintegration Results, opportunities and challenges Prof. Marc Desmulliez
2 What is 3D-MINTEGRATION about? The EPSRC-funded project has for aim to develop radically new ways of thinking for the end-to-end Design Processing Assembly Packaging Integration and Testing of complete 3D miniaturised/integrated 3D-MINTEGRATED products
3 Industrially focussed 23 companies providing 2.8M of support Market driven: The work is aimed at next generation automotive, aerospace, telecommunications, medical and consumer products Tangible deliverables: The project will push breakthrough processes into companies
4 Large 8 Institutions: Greenwich, Loughborough, Nottingham, Heriot- Watt, NPL, Cambridge, Cranfield, Brunel A 9.2M 4.5-year programme We have 100 Man/Years of research, a new equipment spend of 1.1m, and an existing equipment asset base of 7m Multiple span out projects at National and European levels
5 Radical - but organised The research is organised in 5 themes, spanning from raw materials (e.g. nano-particles) to products Packaging Materials 3D Processing Microassembly & Integration Products Design & Simulation Test & Measurement
6 .with a framework. Workpackage 1 Design & Simulation Chris Bailey Greenwich Workpackage 2 3D Processing David Allen Cranfield Workpackage 3 Microassembly Svetan Ratchev Nottingham Workpackage 4 Packaging & Integration Paul Conway Loughborough Workpackage 5 Test & Measurement Richard Leach NPL HUMMS demonstrator BCF MiniFluidic demonstrator Epigem Determine the key characteristics (most influential design variables) MiniEMS demonstrator NPL Project Management Design & Simulation Deliverables 3D Processing Deliverables Microassembly Deliverables Packaging & Integration Deliverables Test & Measurement Deliverables
7 Influence of 3D-M on the wealth of the Nation Generate sustainable energy-efficient products and manufacturing processes Reduce the UK s vulnerability to globally-strategic supply chains Create agile thinking processes in a new generation of applications-orientated product and process designers and developers
8 Four delivery channels Academic outputs Personnel development Knowledge transfer activities Immediate applications
9 Academic outputs to date JOURNAL CONFERENCE PAPER BOOK/ CHAPTER/ THESIS PATENT SOFTWARE DISSEMINATION Total Number of Publications Number of Refereed Publications (if different from above) Number of Publications That Contain An Industrial Co-Author Number of Publications That Contain Another Member of the Consortium
10 Academic Output Highlights 15 Keynote Presentations in International Conferences 2 Best paper awards (HDP-ICEPT 2008, HDP-ICEPT 2009) 1 Best poster presentation award (MicroTech - IMAPS UK 2008) 33 Invited talks
11 Personnel Development 22 Ph.D. students, 12 Research Fellows, 6 Technicians, and 2 Industrial advisers directly engaged by the 3D-M project, plus a further 21 Man-years of resource contributed by the IMRCs.
12 Community building Events Annual get-together of the whole community As-required demonstrator workshops involving all concerned Annual conference, streamed for external and internal audiences : the next one is TOMORROW, here! Web site Publications Annual Review in the form of a house magazine Doubles as a brochure for dissemination Monthly newsletter
13 Follow on projects (UK) IMRCs and IeMRC: Micromachining of probe. 100K (Cranfield) Megasonic electroplating. 455K (Heriot-Watt) Microsystems Applications. 450K (Cranfield) Process integration for manufacturing of microtooling. 650K (Nottingham) Prognostics. 250K (Greenwich) EPSRC-IKC on ultraprecision structured surfaces (Cambridge,Cranfield, UCL). 7M. TSB: Technologies for health call. MEMSpatch. 1.3M. 2 industrial partners (Nottingham) KTP: HUMMS. 380K. With industrial partners Ultra-Electronics BCF. (Heriot-Watt) Others: NMS Microprobe project. 450K (NPL). NMS Microprobe project. 780K.(NPL) Feasibility study Renishaw. 28K. (Heriot-Watt) Centre of Excellence in Customised Assembly CECA, funded by 5M HEIF Grant jointly with Sheffield and Loughborough Universities
14 Facilities Example of LTCC Step 1: Preconditioning Step 6: Firing Step 7: Post processing Step 2: Vias and cavity formation Step 5: Lamination Step 8: Singulation Step 3: Printing Step 4: Stacking
15 Knowledge Transfer Activities
16 Patents Microprobe design (PCT stage) Microwave curing (GB stage) originally an IeMRC feasiblity study project Self assembly of metal/polymer nanostructures onto substrates (GB stage) Laser welding technology for microfluidics (GB stage) Microforging (GB stage)
17 International engagement FP7 INTEG-MICRO to use precision machining techniques to machine 3D components in a reduced footprint machine. 12MEuros. 20 partners out of which 14 are industrial. FP6 co-ordinated Action MicroSapient. 1 MEuros. 12 partners of which 6 are industrial. FP7 FAMOBS to microwave cure components. Working with SME associations. 2.5 MEuros. 14 partners out of which 5 are industrial. FP7 co-ordinated Action CEPoSS Technology Platform on Smart System Integration. 1 MEuros. 20 partners of which 18 are industrial. High level involvement in global working groups/consortia
18 Industry predictions for 3D-MINTEGRATION processes Seven individual predictions of usage in each category, ranked by timescales Growth patterning far from market Micro imprinting far from market Not used at all Sampling Ramp up Widely used Multifunctional Interconnection a little closer to market Micro-machining slightly earlier uptake Design & Simulation slow start, but fast ramp to 2013 Integration & Encapsulation early adoption, medium ramp Microassembly imminent adoption, slower ramp Micro injection moulding already deployed, but much to do
19 Industrial take up Microprobe demonstrator by NPL for commercialisation Metrology, instrumentation market Optical metrology techniques by Taylor Hobson Ltd Instrumentation Microfluidic designs for blood separation by EPIGEM Biomedical, life sciences HUMMS demonstrator by Ultra Electronic (ex-bcf) Aerospace, transport
20 Instrumentation NPL acquired Zeiss micro-cmm equipment as part of CEMMNT NMS funding to shrink probe size required radical new 3D design concepts A 3D vibrating, high aspect ratio micro-cmm probe 3DM team Greenwich (modelling, simulation and optimisation), Cranfield (manufacture of flexures and piezo films), Cambridge (cost effective manufacturing strategies), Nottingham (assembly) Patent applied for and potential commercialisation routes investigated Potentially large market for micro-probes in milli/micro-manufacture, automotive, microfluidics, etc, Also, novel uses of flexure concept, adhesion/fundamental force probe, bio-manipulator, others
21 Software 3D-Mintevision Design and Simulation 3D-Fabrication Imprint Forming, FIB Micro-Injection Moulding Electro-deposition Micro-Assembly Micro-feeder Packaging Microwave Curing, Laser Joining Test and Measurement Micro-probe Demonstrators Mini-Fluidic; Micro-Probe 3D-Mintevision Design assistant Reduced order models Risk evaluation and risk mitigation Optimisation
22 Microfluidic systems Blood flow through T channels Cell separation system machined by fiber laser 3D cell separation system Plasma Cells
23 Success story the next generation Each year, the whole team of consortium members and 40+ researchers meets for a Community Event As a community, we have evolved to think radically, and to think in our own 3D-MINTEGRATION space...ready for the next challenge
24 Conceptual application: the i-ball
25 i-ball i-ball is a biologically-inspired washball, tossed in with the laundry to sample the wash water to monitor and adjust detergent levels and wash cycle energy, and to minimize the use of rinse water To analyze for health-indicating trace materials from soiled clothing A complex biomimetic system
26 i-ball Sealed microchannels with a width of 50um and a height of about 72um.
27 The way ahead Grow 3D-MINTEGRATION Downstream collaboration Develop applications, machines, services, New ways of thinking Commercial exploitation
28 More information David Topham Marc Desmulliez 4 th Annual 3D-Mintegration conference: tomorrow- Henry Ford College.
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