HCPL-7723/ MBd 2 ns PWD High Speed CMOS Optocoupler. Features. Applications

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HCPL-77/07 50 MBd ns PWD High Speed CMOS Optocoupler Data Sheet Lead (Pb) Free RoHS 6 fully compliant RoHS 6 fully compliant options available; -xxxe denotes a lead-free product Description Available in either 8-pin DIP or SO 8 package style respectively, the HCPL-77 or HCPL-07 optocoupler utilize the latest CMOS IC technology to achieve out standing speed performance of minimum 50 MBd data rate and ns maximum pulse width distortion. Basic building blocks of HCPL-77/07 are a CMOS LED driver IC, a high speed LED and a CMOS detector IC. A CMOS logic input signal controls the LED driver IC, which supplies current to the LED. The detector IC incorporates an integrated photodiode, a high speed transimpedance amplifier, and a voltage comparator with an output driver. Functional Diagram **V DD 8 V DD ** Features +5 V CMOS compatibility High speed: 50 MBd min. ns max. pulse width distortion ns max. prop. delay 6 ns max. prop. delay skew 0 kv/µs min. common mode rejection 40 to 85 C temperature range Safety and regulatory approvals: UL recognized 5000 Vrms for min. per UL577 for HCPL-77 for option 00 750 Vrms for min. per UL577 for HCPL-07 CSA component acceptance notice #5 IEC/EN/DIN EN 60747-5-5 Viorm = 60 Vpeak for HCPL-77 option 060 Viorm = 567 Vpeak for HCPL-07 option 060 V I NC* GND 4 LED SHIELD I O 7 6 5 NC* V O GND * PIN IS THE ANODE OF THE INTERNAL LED AND MUST BE LEFT UNCONNECTED FOR GUARANTEED DATASHEET PERFORMANCE. PIN 7 IS NOT CONNECTED INTERNALLY. ** A 0. µf BYPASS CAPACITOR MUST BE CONNECTED BETWEEN PINS AND 4, AND 5 AND 8. Applications Digital fieldbus isolation: CC-Link, DeviceNet, Profibus, SDS, Isolated A/D or D/A conversion Multiplexed data transmission High speed digital input/output Computer peripheral interface Microprocessor system interface TRUTH TABLE (POSITIVE LOGIC) V I, INPUT H L LED OFF ON V O, OUTPUT H L CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation, which may be induced by ESD.

Package Outline Drawings HCPL-77 8-Pin DIP Package 9.65 ± 0.5 (0.80 ± 0.00) 7.6 ± 0.5 (0.00 ± 0.00) TYPE NUMBER 8 7 6 A XXXXV 5 OPTION 060 CODE* DATE CODE 6.5 ± 0.5 (0.50 ± 0.00) YYWW 4.9 (0.047) MAX..56 ± 0. (0.40 ± 0.005).78 (0.070) MAX. 4.70 (0.85) MAX. 5 TYP. 0.54 + 0.076-0.05 (0.00 + 0.00) - 0.00).080 ± 0.0 (0.04 ± 0.0) 0.5 (0.00) MIN..9 (0.5) MIN. 0.65 (0.05) MAX..54 ± 0.5 (0.00 ± 0.00) DIMENSIONS IN MILLIMETERS AND (INCHES). *OPTION 00 AND 500 NOT MARKED. NOTE: FLOATING LEAD PROTRUSION IS 0.5 mm (6 mils) MAX.

HCPL-77 Package with Gull Wing Surface Mount Option 00 9.65 ± 0.5 (0.80 ± 0.00) LAND PATTERN RECOMMENDATION.06 (0.040) 8 7 6 5 6.50 ± 0.5 (0.50 ± 0.00) 0.9 (0.40) 4.7 (0.050).0 (0.080).9 (0.047) MAX..780 (0.070) MAX..56 ± 0. (0.40 ± 0.005) 9.65 ± 0.5 (0.80 ± 0.00) 7.6 ± 0.5 (0.00 ± 0.00) 0.54 + 0.076-0.05 (0.00 + 0.00) - 0.00).080 ± 0.0 (0.04 ± 0.0).54 0.65 ± 0.0 (0.00) (0.05 ± 0.005) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.0 mm (0.004 INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.5 mm (6 mils) MAX. HCPL-07 Small Outline SO-8 Package 0.65 ± 0.5 (0.05 ± 0.00) NOM. LAND PATTERN RECOMMENDATION.97 ± 0.7 (0.55 ± 0.005) PIN ONE 8 7 6 5 XXXV YWW 4 5.994 ± 0.0 (0.6 ± 0.008) 0.406 ± 0.076 (0.06 ± 0.00).70 (0.050) BSC TYPE NUMBER (LAST DIGITS) DATE CODE 0.64 (0.05).9 (0.075) 7.49 (0.95) * 5.080 ± 0.7 (0.00 ± 0.005) 7 45 X 0.4 (0.07).75 ± 0.7 (0.5 ± 0.005).54 (0.060) 0 ~ 7 0.8 ± 0.05 (0.009 ± 0.00) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) 5.07 ± 0.54 (0.05 ± 0.00) 0.05 (0.0) MIN. 0.0 ± 0.0 (0.008 ± 0.004) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.0 mm (0.004 INCHES) MAX. OPTION NUMBER 500 NOT MARKED. NOTE: FLOATING LEAD PROTRUSION IS 0.5 mm (6 mils) MAX.

Device Selection Guide 8-Pin DIP (00 mil) HCPL-77 Small Outline SO-8 HCPL-07 Ordering Information HCPL-07 and HCPL-77 are UL Recognized with 750 Vrms for minute per UL577. Option Part RoHS non RoHS Surface Gull Tape UL 5000 Vrms/ IEC/EN/DIN Number Compliant Compliant Package Mount Wing & Reel Minute rating EN 60747-5-5 Quantity -000E no option 00 mil DIP-8 50 per tube -00E -00 X X 50 per tube -500E -500 X X X 000 per reel -00E -00 X 50 per tube HCPL-77-0E -0 X X X 50 per tube -50E -50 X X X X 000 per reel -060E -060 X 50 per tube -60E -60 X X X 50 per tube -560E -560 X X X X 000 per reel -000E no option SO-8 X 00 per tube HCPL-07-500E -500 X X 500 per reel -060E -060 X X 00 per tube -560E -560 X X X 500 per reel To order, choose a part number from the part number column and combine with the desired option from the option column to form an order entry. Example : HCPL-77-560E to order product of Gull Wing Surface Mount package in Tape and Reel packaging with IEC/EN/DIN EN 60747-5-5 Safety Approval and RoHS compliant. Example : HCPL-07 to order product of Small Outline SO-8 package in Tube packaging and non RoHS compliant. Option datasheets are available. Contact your Avago sales representative or authorized distributor for information. Remarks: The notation #XXX is used for existing products, while (new) products launched since July 5, 00 and RoHS compliant will use XXXE. 4

Regulatory Information The HCPL-77/07 have been approved by the following organizations: UL Recognized under UL577, component recognition program, File E556. CSA Approved under CSA Component Acceptance Notice #5, File CA884. IEC/EN/DIN EN 60747-5-5 Approved with Maximum Working Insulation Voltage: Viorm = 567 Vpeak for HCPL-07, Viorm = 60 Vpeak for HCPL-77 Solder Reflow Profile Recommended reflow condition as per JEDEC Standard, J-STD-00 (latest revision). Non-Halide Flux should be used. Insulation and Safety Related Specifications Value Parameter Symbol 77 07 Units Conditions Minimum External Air Gap L(I0) 7. 4.9 mm Measured from input terminals to output (Clearance) terminals, shortest distance through air. Minimum External Tracking L(I0) 7.4 4.8 mm Measured from input terminals to output (Creepage) terminals, shortest distance path along body. Minimum Internal Plastic Gap 0.08 0.08 mm Insulation thickness between emitter and (Internal Clearance) detector; also known as distance through insulation. Tracking Resistance CTI 75 75 Volts DIN IEC /VDE 00 Part (Comparative Tracking Index) Isolation Group IIIa IIIa Material Group (DIN VDE 00, /89, Table ) 5

All Avago data sheets report the creepage and clearance inherent to the optocoupler component itself. These dimensions are needed as a starting point for the equipment designer when determining the circuit insulation requirements. However, once mounted on a printed circuit board, minimum creepage and clearance requirements must be met as specified for individual equipment standards. For creepage, the shortest distance path along the surface of a printed circuit board between the solder fillets of the input and output leads must be considered. There are recommended techniques such as grooves and ribs, which may be used on a printed circuit board to achieve desired creepage and clearances. Creepage and clearance distances will also change depending on factors such as pollution degree and insulation level. IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (Option 060) Characteristic Description Symbol HCPL-77 HCPL-07 Installation classification per DIN VDE 00, Table for rated mains voltage 50 Vrms I IV I IV for rated mains voltage 00 V rms I III I III for rated mains voltage 600 Vrms I IV I III Climatic Classification 55/85/ 55/85/ Pollution Degree (DIN VDE 00/9) Unit Maximum Working Insulation Voltage V IORM 60 567 V peak Input to Output Test Voltage, Method b* V IORM x.875 = V PR, 00% Production Test with t m= sec, Partial discharge < 5 pc Input to Output Test Voltage, Method a* V PR 8 06 V peak V IORM x.6 = V PR, Type and Sample Test, t m=0 sec, Partial discharge < 5 pc V PR 008 907 V peak Highest Allowable Overvoltage (Transient Overvoltage t ini = 60 sec) V IOTM 8000 6000 V peak Safety-limiting values maximum values allowed in the event of a failure Case Temperature T S 75 50 C Input Current IS, INPUT 0 50 ma Output Power PS, OUTPUT 600 600 mw Insulation Resistance at TS, VIO = 500 V RS 0 9 0 9 Ω *Refer to the optocoupler section of the Isolation and Control Component Designer s Catalog, under Product Safety Regulations section IEC/EN/ DIN EN 60747-5-5, for a detailed description of Method a and Method b partial discharge test profiles. 6

Absolute Maximum Ratings Parameter Symbol Min. Max. Units Storage Temperature TS 55 5 C Ambient Operating Temperature [] TA 40 85 C Supply Voltages VDD, VDD 0 6.0 Volts Input Voltage VI 0.5 VDD +0.5 Volts Output Voltage VO 0.5 VDD +0.5 Volts Average Output Current IO 0 ma Lead Solder Temperature 60 C for 0 sec.,.6 mm below seating plane Solder Reflow Temperature Profile See Solder Reflow Temperature Profile Section Recommended Operating Conditions Parameter Symbol Min. Max. Units Ambient Operating Temperature TA 40 85 C Supply Voltages VDD, VDD 4.5 5.5 V Logic High Input Voltage VIH.0 VDD V Logic Low Input Voltage VIL 0.0 0.8 V Input Signal Rise and Fall Times tr, tf.0 ms Electrical Specifications Test conditions that are not specified can be anywhere within the recommended operating range. All typical specifications are at TA = +5 C, VDD = VDD = +5 V. Parameter Symbol Min. Typ. Max. Units Test Conditions Logic Low Input Supply Current [] IDDL 8.4 0 ma VI = 0 V; Figure Logic High Input Supply Current [] IDDH 0.6 ma VI = VDD ; Figure Output Supply Current IDDL. 5 ma Figure IDDH.0 5 ma Figure 4 Input Current II 0 0 µa Logic High Output Voltage VOH 4.4 5.0 V IO = 0 µa, VI = VIH 4.0 4.8 V IO = 4 ma, VI = VIH Logic Low Output Voltage VOL 0 0. V IO = 0 µa, VI = VIL 0.5.0 V IO = 4 ma, VI = VIL 7

Switching Specifications Test conditions that are not specified can be anywhere within the recommended operating range. All typical specifications are at TA = +5 C, VDD = VDD = +5 V. Parameter Symbol Min. Typ. Max. Units Test Conditions Propagation Delay Time to Logic tphl 6 ns CL = 5 pf CMOS Signal Levels; Figure 5 Low Output [] Propagation Delay Time to Logic tplh 6 ns CL = 5 pf CMOS Signal Levels; Figure 5 High Output [] Pulse Width PW 0 ns CL = 5 pf CMOS Signal Levels Maximum Data Rate 50 MBd CL = 5 pf CMOS Signal Levels Pulse Width Distortion [4] tphl - tplh PWD ns CL = 5 pf CMOS Signal Levels; Figure 6 Propagation Delay Skew [5] tpsk 6 ns CL = 5 pf CMOS Signal Levels Output Rise Time (0% 90%) tr 8 ns CL = 5 pf CMOS Signal Levels Output Fall Time (90% - 0%) tf 6 ns CL = 5 pf CMOS Signal Levels Common Mode Transient Immunity CMH 0 5 kv/µs VCM = 000 V, TA = 5 C, at Logic High Output [6] VI = VDD, VO > 0.8 VDD Common Mode Transient Immunity CML 0 5 kv/µs VCM = 000 V, TA = 5 C, at Logic Low Output [6] VI = 0 V, VO < 0.8 V 8

Package Characteristics All Typical Specifications are at TA = 5 C. Parameter Symbol Min. Typ. Max. Units Test Conditions Input-Output Momentary 77 VISO 750 V rms RH 50%, t = min, Withstand Voltage [7,8,9] Option 00 5000 TA = 5 C 07 750 Input-Output Resistance [7] R I-O 0 Ω VI-O = 500 V dc Input-Output Capacitance C I-O 0.6 pf f = MHz Input Capacitance [0] C I.0 pf Input IC Junction-to-Case 77 θjci 45 C/W Thermocouple located at Thermal Resistance 07 60 center underside of package Output IC Junction-to-Case 77 θjco 45 C/W Thermal Resistance 07 5 Package Power Dissipation PPD 50 mw Notes:. Absolute Maximum ambient operating temperature means the device will not be damaged if operated under these conditions. It does not guarantee functionality.. The LED is ON when V I is low and OFF when V I is high.. tphl propagation delay is measured from the 50% level on the falling edge of the VI signal to the 50% level of the falling edge of the VO signal. t PLH propagation delay is measured from the 50% level on the rising edge of the VI signal to the 50% level of the rising edge of the V O signal. 4. PWD is defined as t PHL - t PLH. %PWD (percent pulse width distortion) is equal to the PWD divided by pulse width. 5. t PSK is equal to the magnitude of the worst case difference in t PHL and/or t PLH that will be seen between units at any given temperature within the recommended operating conditions. 6. CMH is the maximum common mode voltage slew rate that can be sustained while maintaining V O > 0.8 V DD. CML is the maximum common mode voltage slew rate that can be sustained while maintaining V O < 0.8 V. The common mode voltage slew rates apply to both rising and falling common mode voltage edges. 7. Device considered a two-terminal device: pins,,, and 4 shorted together and pins 5, 6, 7, and 8 shorted together. 8. In accordance with UL577, each HCPL-07 is proof tested by applying an insulation test voltage 4500 Vrms for second (leakage detection current limit, I I-O 5 µa). Each HCPL-77 is proof tested by applying an insulation test voltage 4500 Vrms for second (leakage detection current limit. I I-O 5 µa.) 9. The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to your equipment level safety specification or Avago Application Note 074 entitled Optocoupler Input-Output Endurance Voltage. 0. C I is the capacitance measured at pin (V I). 9

I DDL - LOGIC LOW OUTPUT SUPPLY I DDL - LOGIC LOW INPUT SUPPLY CURRENT (ma) CURRENT (ma) 9.0 8.5 8.0 7.5 7.0 6.5-40 -0 0 0 40 60 80 00 TA ( C) Figure : Typical Logic Low Input Supply Current vs. temperature.0.5.0.5.0-40 -0 0 0 40 60 80 00 TA ( C) Figure. Typical Logic Low Output Supply Current vs. temperature I DDH - LOGIC HIGH INPUT SUPPLY CURRENT (ma) I DDH - LOGIC HIGH OUTPUT SUPPLY CURRENT (ma) 0.6 0.55 0.5 0.45 0.4.5.5-40 -0 0 0 40 60 80 00 TA ( C) Figure. Typical Logic High Input Supply Current vs. temperature -40-0 0 0 40 60 80 00 TA ( C) Figure 4. Typical Logic High Output Supply Current vs. temperature T phl, T plh (ns) 0 8 6 4 T plh T phl 0-40 -0 0 0 40 60 80 00 TA ( C) Figure 5. Typical propagation delay vs. temperature PWD (ns).8.6.4. 0.8 0.6 0.4 0. 0-40 -0 0 0 40 TA ( C) 60 80 00 Figure 6. Typical pulse width distortion vs. temperature 0

Application Information Bypassing and PC Board Layout The HCPL-77/07 optocouplers are extremely easy to use. No external interface circuitry is required because the HCPL-77/07 use high-speed CMOS IC technology allowing CMOS logic to be connected directly to the inputs and outputs. As shown in Figure 7, the only external components required for proper operation are two bypass capacitors. Capacitor values should be between 0.0 µf and 0. µf. For each capacitor, the total lead length between both ends of the capacitor and the power-supply pins should not exceed 0 mm. Figure 8 illustrates the recommended printed circuit board layout for the HCPL-77/07. Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew Propagation Delay is a figure of merit which describes how quickly a logic signal propagates through a system as illustrated in Figure 9. The propagation delay from low to high (tplh) is the amount of time required for an input signal to propagate to the output, causing the output to change from low to high. Similarly, the propagation delay from high to low (tphl) is the amount of time required for the input signal to propagate to the output, causing the output to change from high to low. V DD V I C NC 70 YWW 8 7 6 NC C V DD V O GND 4 5 GND C, C = 0.0 µf TO 0. µf Figure 7. Functional diagram. V DD V DD V I C 70 YWW C V O GND GND C, C = 0.0 µf TO 0. µf Figure 8. Recommended printed circuit board layout. INPUT V I 50% 5 V CMOS 0 V t PLH t PHL OUTPUT 90% 90% V O 0% 0% V OH.5 V CMOS V OL Figure 9. Timing diagram to illustrate propagation delay, tplh and tphl.

Pulse-width distortion (PWD) is the difference between tphl and tplh and often determines the maximum data rate capability of a transmission system. PWD can be expressed in percent by dividing the PWD (in ns) by the minimum pulse width (in ns) being transmitted. Typically, PWD on the order of 0-0% of the minimum pulse width is tolerable. Propagation delay skew, tpsk, is an important parameter to consider in parallel data applica tions where synchronization of signals on parallel data lines is a concern. If the parallel data is being sent through a group of optocouplers, differences in propagation delays will cause the data to arrive at the outputs of the optocouplers at different times. If this difference in propagation delay is large enough it will determine the maximum rate at which parallel data can be sent through the optocouplers. Propagation delay skew is defined as the difference between the minimum and maximum propagation delays, either tplh or tphl, for any given group of optocouplers which are operating under the same conditions (i.e., the same drive current, supply voltage, output load, and operating temperature). As illustrated in Figure 0, if the inputs of a group of optocouplers are switched either ON or OFF at the same time, tpsk is the difference between the shortest propagation delay, either tplh or tphl, and the longest propagation delay, either tplh or tphl. As mentioned earlier, tpsk can determine the maximum parallel data transmission rate. Figure is the timing diagram of a typical parallel data application with both the clock and data lines being sent through the optocouplers. The figure shows data and clock signals at the inputs and outputs of the optocouplers. In this case the data is assumed to be clocked off of the rising edge of the clock. Propagation delay skew represents the uncertainty of where an edge might be after being sent through an optocoupler. Figure shows that there will be uncertainty in both the data and clock lines. It is important that these two areas of uncertainty not overlap, otherwise the clock signal might arrive before all of the data outputs have settled, or some of the data outputs may start to change before the clock signal has arrived. From these considerations, the absolute minimum pulse width that can be sent through optocouplers in a parallel application is twice tpsk. A cautious design should use a slightly longer pulse width to ensure that any additional uncertainty in the rest of the circuit does not cause a problem. The HCPL-77/07 optocouplers offer the advantage of guaranteed specifications for propagation delays, pulsewidth distortion, and propagation delay skew over the recommended temperature and power supply ranges. V I V O 50%.5 V, CMOS INPUTS DATA CLOCK t PSK V I 50% DATA V O.5 V, CMOS OUTPUTS CLOCK t PSK t PSK Figure 0. Timing diagram to illustrate propagation delay skew, tpsk. Figure. Parallel data transmission example. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright 005-0 Avago Technologies Limited. All rights reserved. Obsoletes AV0-0566EN AV0-064EN - February 6, 0

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Avago Technologies: HCPL-07 HCPL-07-000E HCPL-07-060 HCPL-07-060E HCPL-07-500 HCPL-07-500E HCPL-07-560 HCPL-07-560E