MURTG, SUR8TG, MURTG, SUR8TG Preferred Devices Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. Features Small Compact Surface Mountable Package with J Bend Leads Rectangular Package for utomated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (.77 V Max @., T J = C) Low Forward Voltage Drop (.7 V Max @., T J = C) EC Q Qualified and PPP Capable SUR8 Prefix for utomotive and Other pplications Requiring Unique Site and Control Change Requirements ll Packages are Pb-Free* Mechanical Characteristics: Case: Epoxy, Molded Weight: 7 mg (pproximately) Finish: ll External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 6 C Max. for Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Protection: Human Body Model > 4 V (Class ) Machine Model > 4 V (Class C) ULTRFST RECTIFIERS MPERES, VOLTS Ux Y WW CSE 4D PLSTIC MRKING DIGRM Ux YWW = Device Code x = C for MURT = D for MURT = ssembly Location = Year = Work Week = Pb Free Package ORDERING INFORMTION Device Package Shipping MURTG SUR8TG MURTG SUR8TG,/Tape & Reel,/Tape & Reel,/Tape & Reel,/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8/D. *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Preferred devices are recommended choices for future use and best overall value. Semiconductor Components Industries, LLC, January, Rev. Publication Order Number: MURT/D
MURTG, SUR8TG, MURTG, SUR8TG MXIMUM RTINGS Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MURTG/SUR8TG MURTG/SUR8TG verage Rectified Forward Current @ T L = C @ T L = C Non-Repetitive Peak Surge Current (Surge pplied at Rated Load Conditions Halfwave, Single Phase, 6 Hz) Rating Symbol Value Unit V RRM V RWM V R I F(V).. I FSM 4 Operating Junction Temperature Range T J 6 to +7 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. V THERML CHRCTERISTICS Characteristic Symbol Max Unit Thermal Resistance, Junction to Lead (T L = C) (Note ) Thermal Resistance, Junction to mbient (Note ) Psi JL (Note ) R J 4 6 C/W. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR 4.. In compliance with JEDEC, these values (historically represented by R JL ) are now referenced as Psi JL. ELECTRICL CHRCTERISTICS Maximum Instantaneous Forward Voltage (Note ) (i F =., T J = C) (i F =., T J = C) Characteristic Symbol Max Unit v F.9.77 V Maximum Instantaneous Reverse Current (Note ) (Rated DC Voltage, T J = C) (Rated DC Voltage, T J = C) Maximum Reverse Recovery Time (i F =., di/dt = / s). Pulse Test: Pulse Width = s, Duty Cycle.%. i R. t rr ns
MURTG, SUR8TG, MURTG, SUR8TG I R, REVERSE CURRENT ( ).. T J = 7 C T J = C T J = C I R, REVERSE CURRENT ( ) T J = 7 C T J = C T J = C.. 4 6 8 4 6 8 4 6 8 4 6 8 V R, REVERSE VOLTGE (VOLTS) V R, REVERSE VOLTGE (VOLTS) Figure. Typical Reverse Current Figure. Maximum Reverse Current I F, INSTNTNEOUS FORWRD CURRENT ()... T C = 7 C C C.4..6.7.8.9 V F, INSTNTNEOUS VOLTGE (VOLTS) I F, INSTNTNEOUS FORWRD CURRENT () C T C = 7 C C.....4..6.7.8.9. V F, INSTNTNEOUS VOLTGE (VOLTS) Figure. Typical Forward Voltage Figure 4. Maximum Forward Voltage
MURTG, SUR8TG, MURTG, SUR8TG C, CPCITNCE (pf) 4 4 NOTE: TYPICL CPCITNCE T V = 4 pf C, CPCITNCE (pf) 4 4 NOTE: MXIMUM CPCITNCE T V = 47 pf 4 8 6 4 8 6 4 4 8 6 4 8 6 4 V R, REVERSE VOLTGE (VOLTS) V R, REVERSE VOLTGE (VOLTS) Figure. Typical Capacitance Figure 6. Maximum Capacitance I F(V), VERGE FORWRD CURRENT () 4 SQURE WVE 8 9 4 6 7 8 I F(V), VERGE FORWRD CURRENT ()...7 SQURE WVE.. 4 6 8 4 6 8 T L, LED TEMPERTURE ( C) Figure 7. Current Derating, Lead T, MBIENT TEMPERTURE ( C) Figure 8. Current Derating, mbient (FR 4 Board with Minimum Pad) P F, VERGE POWER DISSIPTION (W)... SQURE WVE.... I F(V), VERGE FORWRD CURRENT (MPS) Figure 9. Power Dissipation 4
MURTG, SUR8TG, MURTG, SUR8TG PCKGE DIMENSIONS CSE 4D ISSUE F H E E NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y4.M, 98.. CONTROLLING DIMENSION: INCH.. 4D OBSOLETE, NEW STNDRD IS 4D. b D POLRITY INDICTOR OPTIONL S NEEDED (SEE STYLES) MILLIMETERS INCHES DIM MIN NOM MX MIN NOM MX.97...78.8.87.....4.6 b.7.4.6..7.64 c..8.4.6..6 D.9.6.9.9.. E 4.6 4. 4.7.6.7.8 H E 4.8..9.9.. L.76.4...4.6 STYLE : PIN. CTHODE (POLRITY BND). NODE L c SOLDERING FOOTPRINT* 4..7..787..787 SCLE 8: mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICTION ORDERING INFORMTION LITERTURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 6, Denver, Colorado 87 US Phone: 67 7 or 8 44 86 Toll Free US/Canada Fax: 67 76 or 8 44 867 Toll Free US/Canada Email: orderlit@onsemi.com N. merican Technical Support: 8 8 98 Toll Free US/Canada Europe, Middle East and frica Technical Support: Phone: 4 79 9 Japan Customer Focus Center Phone: 8 87 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MURT/D