P-channel 30 V, Ω typ., 12 A, STripFET VI DeepGATE Power MOSFET in a DPAK package. Features V GS = 10 V. R DS(on) * Q g industry benchmark

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Transcription:

P-channel 30 V, 0.024 Ω typ., 12 A, STripFET VI DeepGATE Power MOSFET in a DPAK package Features Datasheet - production data TAB Order code V DSS R DS(on) max I D P TOT DPAK 2 1 3 STD26P3LLH6 30 V 0.030 Ω (1) 1. @ V GS = 10 V R DS(on) * Q g industry benchmark 12 A 40 W Extremely low on-resistance R DS(on) High avalanche ruggedness Low gate input resistance Figure 1. Internal schematic diagram D(2 or TAB) Applications Switching applications LCC converters, resonant converters Description G(1) This device is a P-channel Power MOSFET developed using the 6 th generation of STripFET DeepGATE technology, with a new gate structure. The resulting Power MOSFET exhibits the lowest R DS(on) in all packages S(3) AM11258v1 Table 1. Device summary Order code Marking Package Packaging STD26P3LLH6 26P3LLH6 DPAK Tape and reel Note: For the P-channel Power MOSFETs the actual polarity of the voltages and the current must be reversed. February 2014 DocID023574 Rev 5 1/16 This is information on a product in full production. www.st.com

Contents STD26P3LLH6 Contents 1 Electrical ratings............................................ 3 2 Electrical characteristics..................................... 4 2.1 Electrical characteristics (curves)................................ 6 3 Test circuits............................................... 8 4 Package mechanical data..................................... 9 5 Packaging mechanical data.................................. 13 6 Revision history........................................... 15 2/16 DocID023574 Rev 5

Electrical ratings 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit V DS Drain-source voltage 30 V V GS Gate-source voltage ±20 V I (1) D Drain current (continuous) at T C = 25 C 12 A I (1) D Drain current (continuous) at T C = 100 C 8.5 A (1)(2) I DM Drain current (pulsed) 48 A (1) P TOT Total dissipation at T C = 25 C 40 W T stg Storage temperature -55 to 175 C T j Max. operating junction temperature 175 C 1. Limited by wire bonding. 2. Pulse width limited by safe operating area. Table 3. Thermal data Symbol Parameter Value Unit R thj-case Thermal resistance junction-case max 3.75 C/W Table 4. Avalanche characteristics Symbol Parameter Value Unit E AS Single pulse avalanche energy (starting T J =25 C, I D =6 A, I AS =12 A, V DD =25 V, V gs =10 V) 350 mj Note: For the P-channel Power MOSFETs the actual polarity of the voltages and the current must be reversed. DocID023574 Rev 5 3/16 16

Electrical characteristics STD26P3LLH6 2 Electrical characteristics (T CASE = 25 C unless otherwise specified) Table 5. Static Symbol Parameter Test conditions Min. Typ. Max. Unit V (BR)DSS I DSS Drain-source breakdown Voltage Zero gate voltage drain current (V GS = 0) I D = 250 μa, V GS = 0 30 V V DS = 30 V 1 μa V DS = 30 V, Tc = 125 C 10 μa I GSS Gate body leakage current V GS = ± 20 V, (V DS = 0) ±100 na V GS(th) Gate threshold voltage V DS = V GS, I D = 250 μa 1 2.5 V R DS(on) Static drain-source onresistance V GS = 10 V, I D = 6 A 0.024 0.03 Ω V GS = 4.5 V, I D = 6 A 0.038 0.045 Ω Table 6. Dynamic Symbol Parameter Test conditions Min Typ. Max. Unit C iss Input capacitance - 1450 - pf C oss Output capacitance V DS = 25 V, f=1 MHz, - 178 - pf C rss V GS = 0 Reverse transfer capacitance - 120 - pf Q g Total gate charge V DD = 24 V, I D = 12 A - 12 - nc Q gs Gate-source charge V GS = 4.5 V - 4.4 - nc Q gd Gate-drain charge (see Figure 14) - 5 - nc R g Gate input resistance f = 1 MHz, gate DC Bias = 0, test signal level = 20 mv, I D = 0-1.8 - Ω Note: For the P-channel Power MOSFETs the actual polarity of the voltages and the current must be reversed. 4/16 DocID023574 Rev 5

Electrical characteristics Table 7. Switching on/off (inductive load) Symbol Parameter Test conditions Min. Typ. Max. Unit t d(on) Turn-on delay time - 15 - ns V DD = 24 V, I D = 1.5 A, t r Rise time - 15 - ns R G = 4.7 Ω, V GS = 10 V t d(off) Turn-off delay time (see Figure 13) - 24 - ns t f Fall time - 21 - ns Table 8. Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit I SD Source-drain current - 12 A (1) I SDM Source-drain current (pulsed) - 48 A V (2) SD Forward on voltage I SD = 12 A, V GS = 0-1.1 V t rr Reverse recovery time I SD = 12 A, - 15 ns Q rr Reverse recovery charge di/dt = 100 A/μs, V DD = 16 V - 6.5 nc I RRM Reverse recovery current (see Figure 15) - 0.9 A 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration = 300 μs, duty cycle 1.5% Note: For the P-channel Power MOSFETs the actual polarity of the voltages and the current must be reversed. DocID023574 Rev 5 5/16 16

Electrical characteristics STD26P3LLH6 2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Thermal impedance ID (A) Tj=175 C Tc=25 C Single pulse AM15963v1 10 1 Operation in this area is Limited by max RDS(on) 100µs 1ms 10ms 0.1 0.1 1 10 VDS(V) Figure 4. Output characteristics Figure 5. Transfer characteristics ID (A) 35 10V 9V8V 7V 6V AM15964v1 ID (A) 35 V DS =1V AM15965v1 30 5V 30 25 20 4V 25 20 15 15 10 5 3V 10 5 0 0 0.2 0.4 0.6 0.8 1 1.2 VDS(V) Figure 6. Gate charge vs gate-source voltage 0 0 2 4 6 8 VGS(V) Figure 7. Static drain-source on-resistance VGS (V) 12 AM15966v1 RDS(on) (mω) 40.0 VGS=10V AM15967v1 10 8 30.0 6 20.0 4 2 10.0 0 0 4 8 12 16 20 24 28 Qg(nC) 0.0 0 2 4 6 8 10 ID(A) 6/16 DocID023574 Rev 5

Electrical characteristics Figure 8. Capacitance variations Figure 9. Normalized gate threshold voltage vs temperature C (pf) 1600 1400 1200 AM15968v1 Ciss VGS(th) (norm) 1 0.8 ID=250µA AM15969v1 1000 800 0.6 600 0.4 400 200 Coss Crss 0 0 5 10 15 20 25 VDS(V) Figure 10. Normalized on-resistance vs temperature 0.2 0-55 -30-5 20 45 70 95 120 TJ( C) Figure 11. Normalized V DS vs temperature RDS(on) (norm) 1.6 ID=6A AM15970v1 VDS (norm) 1.08 ID=1mA AM15971v1 1.4 1.2 1 0.8 0.6 0.4 1.06 1.04 1.02 1 0.98 0.2 0.96 0-55 -30 5 20 45 70 95 120 TJ( C) Figure 12. Source-drain diode forward characteristics 0.94-55 -30 5 20 45 70 95 120 TJ( C) VSD (V) AM15972v1 1 TJ=-55 C 0.9 0.8 TJ=25 C 0.7 TJ=175 C 0.6 0.5 2 4 6 8 10 ISD(A) DocID023574 Rev 5 7/16 16

Test circuits STD26P3LLH6 3 Test circuits Figure 13. Switching times test circuit for resistive load Figure 14. Gate charge test circuit AM11255v1 Figure 15. Test circuit for diode recovery behavior AM11256v1 Figure 16. Unclamped inductive load test circuit L VD 2200 μf 3.3 μf VDD ID Pw D.U.T. VGS AM11257v1 Figure 17. Unclamped inductive waveform Figure 18. Switching time waveform AM18080v1 V(BR)DSS ton toff VD tdon tr tdoff tf ID IDM 0 90% 10% VDS 10% 90% VDD VDD VGS 90% AM01472v1 0 10% AM01473v1 8/16 DocID023574 Rev 5

Package mechanical data 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DocID023574 Rev 5 9/16 16

Package mechanical data STD26P3LLH6 Figure 19. DPAK (TO-252) type A drawing 0068772_M_type_A 10/16 DocID023574 Rev 5

Package mechanical data Table 9. DPAK (TO-252) type A mechanical data Dim. mm Min. Typ. Max. A 2.20 2.40 A1 0.90 1.10 A2 0.03 0.23 b 0.64 0.90 b4 5.20 5.40 c 0.45 0.60 c2 0.48 0.60 D 6.00 6.20 D1 5.10 E 6.40 6.60 E1 4.70 e 2.28 e1 4.40 4.60 H 9.35 10.10 L 1.00 1.50 (L1) 2.80 L2 0.80 L4 0.60 1.00 R 0.20 V2 0 8 DocID023574 Rev 5 11/16 16

Package mechanical data STD26P3LLH6 Figure 20. DPAK (TO-252) type A footprint (a) Footprint_REV_M_type_A a. All dimensions are in millimeters 12/16 DocID023574 Rev 5

Packaging mechanical data 5 Packaging mechanical data Figure 21. Tape for DPAK (TO-252) 10 pitches cumulative tolerance on tape +/- 0.2 mm T Top cover tape P0 D P2 E B1 K0 B0 F W For machine ref. only including draft and radii concentric around B0 A0 P1 D1 User direction of feed R User direction of feed Bending radius AM08852v1 DocID023574 Rev 5 13/16 16

Packaging mechanical data STD26P3LLH6 REEL DIMENSIONS Figure 22. Reel for DPAK (TO-252) T 40mm min. Access hole At sl ot location B D C A N Full radius Tape slot in core for tape start 25 mm min. width G measured at hub AM08851v2 Table 10. DPAK (TO-252) tape and reel mechanical data Tape Reel Dim. mm mm Dim. Min. Max. Min. Max. A0 6.8 7 A 330 B0 10.4 10.6 B 1.5 B1 12.1 C 12.8 13.2 D 1.5 1.6 D 20.2 D1 1.5 G 16.4 18.4 E 1.65 1.85 N 50 F 7.4 7.6 T 22.4 K0 2.55 2.75 P0 3.9 4.1 Base qty. 2500 P1 7.9 8.1 Bulk qty. 2500 P2 1.9 2.1 R 40 T 0.25 0.35 W 15.7 16.3 14/16 DocID023574 Rev 5

Revision history 6 Revision history Table 11. Document revision history Date Revision Changes 22-Aug-2012 1 First release 31-Jan-2013 2 16-Jul-2013 3 Modified: R DS(on) on the title, Features table and Table 5 Modified: typical values on Table 6, 7, 8 Modified: V SD max value on Table 8 Updated: Section 4: Package mechanical data Modified: V GS and I D =100 C values in Table 2 Modified: R DS(on) max value in Table 5, Figure 13, 14 and 15 Inserted: Section 2.1: Electrical characteristics (curves) 10-Sep-2013 4 Updated Q g value in Table 6: Dynamic. 06-Feb-2014 5 Added: Table 4: Avalanche characteristics Modified: Figure 2, 5 and 12 Updated: Section 4: Package mechanical data Added: Figure 16, 17 and 18 Minor text changes DocID023574 Rev 5 15/16 16

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