DGD Ordering Information (Note 4) Marking Information YYWW DGD05473 HIGH FREQUENCY HIGH-SIDE AND LOW-SIDE GATE DRIVER IN W-DFN

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HIGH FREQUENCY HIGH-SIDE AND LOW-SIDE GATE DRIVER IN W-DFN3030-10 Description The is a high-frequency gate driver capable of driving N- channel MOSFETs. The floating high-side driver is rated up to 50V. The logic inputs are compatible with standard TTL and CMOS levels (down to 3.3V) to interface easily with MCUs. UVLO for high-side and low-side will protect a MOSFET with loss of supply. To protect MOSFETs, cross conduction prevention logic prevents the HO and LO outputs from being on at the same time. Fast and well-matched propagation delays allow a higher switching frequency, enabling a smaller, more compact power switching design, using smaller associated components. To minimize space an internal bootstrap diode is included. The is offered in the W-DFN3030-10 (Type TH) package and operates over an extended - 40 C to +125 C temperature range. Applications DC-DC Converters Motor Controls Battery Powered Hand Tools ecig Devices Class D Power Amplifiers Features 50V Floating high-side driver Drives two N-channel MOSFETs in a half-bridge configuration 1.5A source / 2.5A sink output current capability Internal bootstrap Diode included Undervoltage lockout for high-side and low-side drivers Delay matching maxmimum of 5ns Propagation delay typical of 20ns Logic input (HIN, LIN and EN) 3.3V capability Ultra low standby currents (<1µA) Extended temperature range: -40 C to +125 C Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony free. Green Device (Note 3) Mechanical Data Case: W-DFN3030-10 (Type TH) Case Material: Molded Plastic. Green Molding Compound UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 3 per J-STD-020 Terminals: Finish Matte Tin Finish Solderable per MIL-STD-202, Method 208 Weight: 0.017 grams (Approximate) Typical Configuration Top View W-DFN3030-10 (Type TH) Bottom View Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel FN-7 7 8 3,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See https:///quality/lead-free/ for more information about Diodes Incorporated s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http:///products/packages.html. Marking Information YYWW = Product Type Marking Code YY = Year (ex: 17 = 2017) WW = Week (01-53) 1 of 11

Pin Diagrams Top view: W-DFN3030-10 (Type TH) Pin Descriptions Pin Number Pin Name Function 1 V CC Low-Side and Logic Supply 2 NC No connect (No Internal Connection) 3 V B High-Side Floating Supply 4 HO High-Side Gate Drive Output 5 V S High-Side Floating Supply Return 6 EN Logic Input Enable, a Logic Low turns off Gate Driver 7 HIN Logic Input for High-Side Gate Driver, in Phase with HO 8 LIN Logic Input for Low-Side Gate Driver, in Phase with LO 9 COM Low-Side and Logic Return 10 LO Low-Side Gate Drive Output PAD Substrate Connect to COM on PCB Functional Block Diagram 2 of 11

Absolute Maximum Ratings (@T A = +25 C, unless otherwise specified.) Characteristic Symbol Value Unit High-Side Floating Positive Supply Voltage V B -0.3 to +60 V High-Side Floating Negative Supply Voltage V S V B-14 to V B+0.3 V High-Side Floating Output Voltage V HO V S-0.3 to V B+0.3 V Offset Supply Voltage Transient dv S / dt 50 V/ns Logic and Low-Side Fixed Supply Voltage V CC -0.3 to +14 V Low-Side Output Voltage V LO -0.3 to V CC+0.3 V Logic Input Voltage (HIN, LIN and EN) V IN -0.3 to V CC+0.3 V Bootstrap Diode Current (pulsed <10µs) I BD 1 A Thermal Characteristics (@T A = +25 C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation Linear Derating Factor (Note 5) P D 0.4 W Thermal Resistance, Junction to Ambient (Note 5) R θja 64 C/W Thermal Resistance, Junction to Case (Note 5) R θjc 42 C/W Operating Temperature T J +150 Lead Temperature (soldering, 10s) T L +300 C Storage Temperature Range T STG -55 to +150 Note: 5. When mounted on a standard JEDEC 2-layer FR-4 board. Recommended Operating Conditions Parameter Symbol Min Max Unit High-Side Floating Supply V B V S + 4.5 V S + 14 V High-Side Floating Supply Offset Voltage V S (Note 6) 50 (Note 7) V High-Side Floating Output Voltage V HO V S V B V Logic and Low Side Fixed Supply Voltage V CC 4.5 14 V Low-Side Output Voltage V LO 0 V CC V Logic Input Voltage (HIN, LIN and EN) V IN 0 5 V Ambient Temperature T A - 40 +125 C Notes: 6. Logic operation for V S of -5V to +60V. 7. Provided V B doesn t exceed absolute maximum rating of 50V. 3 of 11

DC Electrical Characteristics (V CC = V BS = 12V, COM = V S = 0V, @T A = +25 C, unless otherwise specified.) (Note 8) Parameter Symbol Min Typ Max Unit Conditions Logic 1 Input Voltage V IH 2.4 V Logic 0 Input Voltage V IL 0.8 V Enable Logic 1 Input Voltage V ENIH 1.6 V Enable Logic 0 Input Voltage V ENIL 0.7 V Input Voltage Hysteresis V INHYS 0.6 V Enable Input Voltage Hysteresis V ENINHYS 0.1 V High Level Output Voltage, V BIAS - V O V OH 0.45 0.6 V I O+ = 100mA Low Level Output Voltage, V O V OL 0.15 0.22 V I O- = 100mA Offset Supply Leakage Current I LK 1 5 µa V B = V S = 60V V CC Shutdown Supply Current I CCSD 0 1 µa V IN = 0V or 5V, V EN = 0V V CC Quiescent Supply Current I CCQ 130 200 µa V IN = 0V or 5V V CC Operating Supply Current I CCOP 7.3 ma fs = 500kHz, C L = 1000pF V BS Quiescent Supply Current I BSQ 40 100 µa V IN = 0V or 5V V BS Operating Supply Current I BSOP 7.3 ma fs = 500kHz. C L = 1000pF Logic 1 Input Bias Current I IN+ 50 µa V IN = 5V Logic 0 Input Bias Current I IN- 5 µa V IN = 0V Enable Logic 1 Input Bias Current I ENIN+ 43 60 µa V IN = 5V Enable Logic 0 Input Bias Current I ENIN- 0 5 µa V IN = 0V V BS Supply Undervoltage Positive Going Threshold V BSUV+ 3.4 3.8 4.2 V V BS Supply Undervoltage Negative Going Threshold V BSUV- 2.9 3.3 3.7 V V CC Supply Undervoltage Positive Going Threshold V CCUV+ 3.4 3.8 4.2 V V CC Supply Undervoltage Negative Going Threshold V CCUV- 2.9 3.3 3.7 V Output High Short Circuit Pulsed Current I O+ 1.0 1.5 A V O = 0V, PW 10µs Output Low Short Circuit Pulsed Current I O- 1.9 2.5 A V O = 15V, PW 10µs Forward Voltage of Bootstrap Diode V F1 0.67 V I F = 100µA Forward Voltage of Bootstrap Diode V F2 1.2 V I F = 100mA Note: 8. The V IN and I IN parameters are applicable to the logic pins: HIN, LIN and EN. The V O and I O parameters are applicable to the respective output pins: HO and LO. AC Electrical Characteristics (V CC = V BS = 12V, COM = V S = 0V, C L = 1000pF, @T A = +25 C, unless otherwise specified.) Parameter Symbol Min Typ Max Unit Conditions Turn-on Propagation Delay t ON 20 35 ns Turn-off Propagation Delay t OFF 23 56 ns V S = 50V Delay Matching, HO & LO turn-on t DM 5 ns Turn-on Rise Time t r 16 30 ns Turn-off Fall Time t f 12 25 ns 4 of 11

Timing Waveforms 5 of 11

Typical Performance Characteristics (@T A = +25 C, unless otherwise specified.) 6 of 11

Typical Performance Characteristics (continued) 7 of 11

Typical Performance Characteristics (cont.) 8 of 11

Typical Performance Characteristics (cont.) 9 of 11

Package Outline Dimensions Please see http:///package-outlines.html for the latest version. W-DFN3030-10 (Type TH) E A D A1 A3 E2 e D2 e1 b h L h W-DFN3030-10 (Type TH) Dim Min Max Typ A 0.70 0.80 0.75 A1 -- 0.05 0.02 A3 0.18 0.25 0.20 b 0.18 0.30 0.25 D 2.90 3.10 3.00 D2 2.40 2.60 2.50 e 0.50BSC e1 2.00BSC E 2.90 3.10 3.00 E2 1.45 1.65 1.55 h 0.20 0.30 0.25 L 0.30 0.50 0.40 All Dimensions in mm Seating Plane Suggested Pad Layout Please see http:///package-outlines.html for the latest version. W-DFN3030-10 (Type TH) X1 Y2 X2 Y1 Dimensions Value (in mm) C 0.500 X 0.300 X1 2.300 X2 2.600 Y 0.600 Y1 3.300 Y2 1.650 Y C X 10 of 11

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