N, HCNW, HCNW, HCNW, HCPL-, HCPL-, HCPL-, HCPL-, HCPL-, HCPL-, HCPL-, HCPL-, HCPL-, HCPL-, HCPL- High CMR, High Speed TTL Compatible Optocouplers Data Sheet Lead (Pb) Free RoHS fully compliant RoHS fully compliant options available; -xxxe denotes a lead-free product Description The N, HCPL-xx/xx/, HCNW/x are optically coupled gates that combine a GaAsP light emitting diode and an integrated high gain photo detector. An enable input allows the detector to be strobed. The output of the detector IC is an open collector Schottkyclamped transistor. The internal shield provides a guaranteed common mode transient immunity specification up to, V/µs at V cm = V. This unique design provides maximum AC and DC circuit isolation while achieving TTL compatibility. The optocoupler AC and DC operational param e ters are guaranteed from - C to + C allowing troublefree system performance. Functional Diagram N, HCPL-/ HCPL-// NC ANODE V CC V E CATHODE NC SHIELD V O GND LED ON OFF ON OFF ON OFF TRUTH TABLE (POSITIVE LOGIC) ENABLE OUTPUT H L H H L H L H NC L NC H HCPL-// HCPL-// ANODE V CC CATHODE CATHODE ANODE SHIELD V O V O GND TRUTH TABLE (POSITIVE LOGIC) LED OUTPUT ON L OFF H A. µf bypass capacitor must be connected between pins and. Features kv/µs minimum Common Mode Rejection (CMR) at V CM = kv for HCNW, HCPL-, HCPL-, HCPL-, HCPL- High speed: MBd typical LSTTL/TTL compatible Low input current capability: ma Guaranteed AC and DC performance over temperature: - C to + C Available in -Pin DIP, SOIC-, widebody packages Strobable output (single channel products only) Safety approval UL recognized - V rms for minute and V rms * for minute per UL CSA approved IEC/EN/DIN EN -- approved with V IORM = V for xx Option V IORM = V for N/xx Option V IORM = V for HCNW/x MIL-PRF- hermetic version available (HCPL-xx/xx) Applications Isolated line receiver Computer-peripheral interfaces Microprocessor system interfaces Digital isolation for A/D, D/A conversion Switching power supply Instrument input/output isolation Ground loop elimination Pulse transformer replacement Power transistor isolation in motor drives Isolation of high speed logic systems * V rms / Minute rating is for HCNW/X and Option (N, HCPL-///, HCPL-) products only. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
The N, HCPL-xx, HCPL-xx, HCPL-, HCNW, and HCNWx are suitable for high speed logic interfacing, input/output buffering, as line receivers in environments that conventional line receivers cannot tolerate and are recom mended for use in extremely high ground or induced noise environments. Selection Guide Widebody Minimum CMR -Pin DIP ( Mil) Small-Outline SO- ( Mil) Hermetic Input Single On- Single Dual Single Dual Single and Dual dv/dt V CM Current Output Channel Channel Channel Channel Channel Channel (V/µs) (V) (ma) Enable Package Package Package Package Package Packages YES N,, YES HCPL- HCNW NO HCPL- HCPL-,, YES HCPL- HCPL- HCNW NO HCPL- HCPL-,, YES HCPL- HCPL- HCNW, YES HCPL- [], YES HCPL- [] NO HCPL- HCPL-, YES HCPL-A [] HCPL-A [] NO HCPL-A [] HCPL-A [], [], YES HCPL-N [] HCPL-N [] NO HCPL-N [] HCPL-N [],. [] HCPL-9x [] HCPL-xx [] HCPL-xx [] Notes:. Technical data are on separate Avago publications.. kv/µs with V CM = kv can be achieved using Avago application circuit.. Enable is available for single channel products only, except for HCPL-9x devices.
Ordering Information HCPL-xxxx is UL Recognized with V rms for minute per UL. HCNWxxxx is UL Rcognized with V rms for minute per UL. Part Number N HCPL- HCPL- HCPL- HCPL- HCPL- RoHS Compliant Option Non RoHS Compliant -E No option Package Surface Mount Gull Wing Tape & Reel UL V rms / Minute Rating IEC/EN/DIN EN -- Quantity per tube -E # X X per tube -E # X X X per reel -E # mil X per tube -E # DIP- X X X per tube -E # X X X X per reel -E # X per tube -E - X X X X per reel -E No option per tube -E # X X per tube -E # X X X per reel -E # mil X per tube -E # DIP- X X X per tube -E # X X X X per reel -E # X per tube -E - X X X per tube -E No option per tube -E # X X per tube -E # X X X per reel -E # X per tube -E # mil DIP- X X X per tube -E # X X X X per reel -E # X per tube -E # X X X per tube -E # X X X X per reel -E No option per tube -E # X X per tube -E # mil X X X per reel -E # DIP- X per tube -E # X X X per tube -E - X X X X per reel -E No option per tube -E # X X per tube -E # mil X X X per reel -E # DIP- X per tube -E # X X X per tube -E # X X X X per reel
Part Number HCPL- HCPL- HCPL- HCPL- HCPL- HCPL- HCNW HCNW HCNW RoHS Compliant Option Non RoHS Compliant -E No option Package Surface Mount X Gull Wing Tape & Reel UL V rms / Minute Rating IEC/EN/DIN EN -- Quantity per tube -E # X X per reel SO- -E # X X per tube -E # X X X per reel -E No option X per tube -E # SO- X X per reel -E No option X X per tube -E # mil DIP- X X X X per tube -E # X X X X X per reel To order, choose a part number from the part number column and combine with the desired option from the option column to form an order entry. Combination of Option and Option is not available. Example : Example : HCPL--E to order product of mil DIP Gull Wing Surface Mount package in Tape and Reel packag ing with IEC/EN/DIN EN -- Safety Approval in RoHS compliant. HCPL- to order product of mil DIP package in tube packaging and non RoHS compliant. Option datasheets are available. Contact your Avago sales representative or authorized distributor for information. Notes: The notation #xxx is used for existing products, while (new) products launched since July, and RoHS compliant option will use -xxxe. Schematic N, HCPL-/ HCPL-// HCNW, HCNW/ ICC V CC + I O V O + V F HCPL-// HCPL-// I CC I O V CC V O V F SHIELD I E V E GND V F SHIELD I O V O USE OF A. µf BYPASS CAPACITOR CONNECTED BETWEEN PINS AND IS RECOMMENDED (SEE NOTE ). + SHIELD GND
Package Outline Drawings -pin DIP Package** (N, HCPL-///, HCPL-) 9. ±. (. ±.). ±. (. ±.) AVAGO LEAD-FREE DATE CODE PIN A NNNN YYWW EEE Z P DEVICE PART NUMBER TEST RATING CODE UL LOGO SPECIAL PROGRAM CODE LOT ID. ±. (. ±.).9 (.) MAX.. (.) MAX.. ±. (. ±.). (.) MAX. TYP.. +. -. (. +.) -.). ±. (. ±.) **JEDEC Registered Data (for N only).. (.) MIN..9 (.) MIN.. (.) MAX.. ±. (. ±.) DIMENSIONS IN MILLIMETERS (INCHES). *MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION "V" = OPTION OPTION NUMBERS AND NOT MARKED. NOTE: FLOATING LEAD PROTRUSION IS. mm ( mils) MAX. -pin DIP Package with Gull Wing Surface Mount Option (N, HCPL-///, HCPL-) 9. ±. (. ±.) LAND PATTERN RECOMMENDATION. (.). ±. (. ±.).9 (.). (.). (.).9 (.) MAX.. (.) MAX.. ±. (. ±.) 9. ±. (. ±.). ±. (. ±.). +. -. (. +.) -.). ±. (. ±.). (.) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY =. mm (. INCHES).. ±. (. ±.) NOTE: FLOATING LEAD PROTRUSION IS. mm ( mils) MAX.. ±. (. ±.) NOM.
Small-Outline SO- Package (HCPL-/////).9 ±. (. ±.) DEVICE PART NUMBER LEAD-FREE PIN. ±. (. ±.) NNNN Z YYWW EEE TEST RATING CODE DATE CODE LOT ID.99 ±. (. ±.). (.) BSC LAND PATTERN RECOMMENDATION.9 (.9).9 (.). (.) *. ±. (. ±.) X. (.). ±. (. ±.). (.) ~. ±. (.9 ±.) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH). ±. (. ±.) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY =. mm (. INCHES) MAX.. (.) MIN.. ±. (. ±.) NOTE: FLOATING LEAD PROTRUSION IS. mm ( mils) MAX. -Pin Widebody DIP Package (HCNW, HCNW/) DEVICE PART NUMBER LEAD-FREE. ±. (. ±.) A NNNNNNNN Z YYWW EEE AVAGO TEST RATING CODE DATE CODE LOT ID. MAX. (.) 9. ±. (. ±.) PIN. (.) MAX.. (.) MAX.. (.) TYP. TYP.. +. -. (. +.) -.). (.).9 (.). (.) MIN.. (.) TYP.. ±. (. ±.). (.). (.) DIMENSIONS IN MILLIMETERS (INCHES). NOTE: FLOATING LEAD PROTRUSION IS. mm ( mils) MAX.
-Pin Widebody DIP Package with Gull Wing Surface Mount Option (HCNW, HCNW/). ±. (. ±.) LAND PATTERN RECOMMENDATION 9. ±. (. ±.). (.). (.).9 (.9). (.) MAX.. ±. (. ±.). MAX. (.). (.) MAX.. ±. (. ±.). (.) BSC DIMENSIONS IN MILLIMETERS (INCHES).. ±. (. ±.) LEAD COPLANARITY =. mm (. INCHES).. ±. (.9 ±.) NOM.. +. -. (. +.) -.) NOTE: FLOATING LEAD PROTRUSION IS. mm ( mils) MAX. Test Rating Code, Z L Option xx V Option xx or xx Optional Identification Code A Avago UL Logo P Special Program Code Reflow Soldering Profile The recommended reflow soldering conditions are per JEDEC Standard J-STD- (latest revision). Non-halide flux should be used. Regulatory Information The N, HCPL-xx/xx/xx, and HCNW/xx have been approved by the following organizations: UL Recognized under UL, Component Recognition Program, File E. CSA Approved under CSA Component Acceptance Notice #, File CA. IEC/EN/DIN EN --
Insulation and Safety Related Specifications -pin DIP Widebody ( Mil) SO- ( Mil) Parameter Symbol Value Value Value Unit Conditions Minimum External L()..9 9. mm Measured from input terminals Air Gap to output terminals, shortest (External Clearance) distance through air. Minimum External L()... mm Measured from input terminals Tracking to output terminals, shortest (External Creepage) distance path along body. Minimum Internal... mm Through insulation distance, Plastic Gap conductor to conductor, usually (Internal Clearance) the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Minimum Internal NA NA. mm Measured from input terminals Tracking to output terminals, along (Internal Creepage) internal cavity. Tracking Resistance CTI V DIN IEC /VDE Part (Comparative Tracking Index) Isolation Group IIIa IIIa IIIa Material Group (DIN VDE, /9, Table ) Option - surface mount classification is Class A in accordance with CECC. IEC/EN/DIN EN -- Insulation Characteristics* (HCPL-xx Option Only) Description Symbol Characteristic Unit Installation classification per DIN VDE, Table for rated mains voltage V rms I-IV for rated mains voltage V rms I-IV for rated mains voltage V rms I-III Climatic Classification // Pollution Degree (DIN VDE /9) Maximum Working Insulation Voltage V IORM V Input-to-Output Test Voltage, Method b* V IORM x. = V PR, % Production Test with t m = sec, V PR Partial Discharge < pc V Input-to-Output Test Voltage, Method a* V IORM x. = V PR, Type and Sample Test, t m = sec, V PR 9 V Partial Discharge < pc Highest Allowable Overvoltage (Transient Overvoltage, t ini = sec) V IOTM V Safety Limiting Values (Maximum values allowed in the event of a failure) Case Temperature T S C Input Current** I S,INPUT ma Output Power** P S,OUTPUT mw Insulation Resistance at T S, V IO = V R S 9 Ω *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN --, for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
IEC/EN/DIN EN -- Insulation Characteristics* (HCPL-xx; xx; Nx Option Only) Description Symbol Characteristic Unit Installation classification per DIN VDE, Table for rated mains voltage V rms I-IV for rated mains voltage V rms I-IV Climatic Classification // Pollution Degree (DIN VDE /9) Maximum Working Insulation Voltage V IORM V Input to Output Test Voltage, Method b* V IORM x. = V PR, % Production Test with t m = sec, V PR Partial Discharge < pc V Input to Output Test Voltage, Method a* V IORM x. = V PR, Type and sample test, t m = sec, V PR Partial Discharge < pc V Highest Allowable Overvoltage (Transient Overvoltage, t ini = sec) V IOTM V Safety Limiting Values (Maximum values allowed in the event of a failure) Case Temperature T S C Input Current I S,INPUT ma Output Power P S,OUTPUT mw Insulation Resistance at T S, V IO = V R S 9 Ω *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN --, for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings, which must be ensured by protective circuits in application. IEC/EN/DIN EN -- Insulation Characteristics* (HCNW// Only) Description Symbol Characteristic Unit Installation classification per DIN VDE, Table for rated mains voltage V rms I-IV for rated mains voltage V rms I-III Climatic Classification // Pollution Degree (DIN VDE /9) Maximum Working Insulation Voltage V IORM V Input to Output Test Voltage, Method b* V IORM x. = V PR, % Production Test with t m = sec, V PR Partial Discharge < pc V Input to Output Test Voltage, Method a* V IORM x. = V PR, Type and sample test, t m = sec, V PR Partial Discharge < pc V Highest Allowable Overvoltage (Transient Overvoltage, t ini = sec) V IOTM V Safety Limiting Values (Maximum values allowed in the event of a failure) Case Temperature T S C Input Current I S,INPUT ma Output Power P S,OUTPUT mw Insulation Resistance at T S, V IO = V R S 9 Ω *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN --, for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings, which must be ensured by protective circuits in application. 9
Absolute Maximum Ratings* (No Derating Required up to C) Parameter Symbol Package** Min. Max. Units Note Storage Temperature T S - C Operating Temperature T A - C Average Forward Input Current Single -Pin DIP ma Single SO- Widebody Dual -Pin DIP, Dual SO- Reverse Input Voltage V R -Pin DIP, SO- V Widebody Input Power Dissipation P I Widebody mw Supply Voltage V CC V ( Minute Maximum) Enable Input Voltage (Not to V E Single -Pin DIP V CC +. V Exceed V CC by more than Single SO- mv) Widebody Enable Input Current I E ma Output Collector Current I O ma Output Collector Voltage V O V Output Collector Power P O Single -Pin DIP mw Dissipation Single SO- Widebody Dual -Pin DIP, Dual SO- Lead Solder Temperature T LS -Pin DIP C for sec., (Through Hole Parts Only). mm below seating plane Widebody C for sec., up to seating plane Solder Reflow Temperature SO- and See Package Outline Profile (Surface Mount Parts Only) Option Drawings section *JEDEC Registered Data (for N only). **Ratings apply to all devices except otherwise noted in the Package column. C to C on JEDEC Registration. Recommended Operating Conditions Parameter Symbol Min. Max. Units Input Current, Low Level L * µa Input Current, High Level [] H ** ma Power Supply Voltage V CC.. V Low Level Enable Voltage V EL. V High Level Enable Voltage V EH. V CC V Operating Temperature T A - C Fan Out (at R L = kω) [] N TTL Loads Output Pull-up Resistor R L k Ω *The off condition can also be guaranteed by ensuring that V FL. V. **The initial switching threshold is ma or less. It is recommended that. ma to ma be used for best performance and to permit at least a % LED degradation guardband. For single channel products only.
Electrical Specifications Over recommended temperature (T A = - C to + C) unless otherwise specified. All Typicals at V CC = V, T A = C. All enable test conditions apply to single channel products only. See note. Parameter Sym. Package Min. Typ. Max. Units Test Conditions Fig. Note High Level Output I OH * All. µa V CC =. V, V E =. V,,, Current V O =. V, = ma 9 Input Threshold I TH Single Channel.. ma V CC =. V, V E =. V,, 9 Current Widebody V O =. V, Dual Channel. I OL (Sinking) = ma Low Level Output V OL * -Pin DIP.. V V CC =. V, V E =. V,,,, 9 Voltage SO- = ma,, Widebody. I OL (Sinking) = ma High Level Supply I CCH Single Channel..* ma V E =. V V CC =. V Current. V E = V CC = ma Dual Channel Both Channels Low Level Supply I CCL Single Channel 9..* ma V E =. V V CC =. V Current. V E = V CC = ma Dual Channel Both Channels High Level Enable I EH Single Channel -. -. ma V CC =. V, V E =. V Current Low Level Enable I EL * -.9 -. ma V CC =. V, V E =. V 9 Current High Level Enable V EH. V 9 Voltage Low Level Enable V EL. V Voltage Input Forward V F -Pin DIP...* V T A = C = ma, Voltage SO-.. Widebody... T A = C.. Input Reverse BV R * -Pin DIP V I R = μa Breakdown SO- Voltage Widebody I R = μa, T A = C Input Diode DV F / -Pin DIP -. mv/ C = ma Temperature T A SO- Coefficient Widebody -.9 Input Capacitance C IN -Pin DIP pf f = MHz, V F = V SO- Widebody *JEDEC registered data for the N. The JEDEC Registration specifies C to + C. Avago specifies - C to + C.
Switching Specifications (AC) Over Recommended Temperature (T A = - C to + C), V CC = V, =. ma unless otherwise specified. All Typicals at T A = C, V CC = V. Parameter Sym. Package** Min. Typ. Max. Units Test Conditions Fig. Note Propagation Delay t PLH * ns T A = C R L = Ω, 9,,, Time to High C L = pf 9 Output Level Propagation Delay t PHL * ns T A = C,, Time to Low 9 Output Level Pulse Width t PHL - t PLH -Pin DIP. ns, 9,, 9 Distortion SO-, Widebody Propagation Delay t PSK ns,, Skew 9 Output Rise t r ns, 9 Time (-9%) Output Fall t f ns, 9 Time (9-%) Propagation Delay t ELH Single Channel ns R L = Ω,, Time of Enable C L = pf, from V EH to V EL V EL = V, V EH = V Propagation Delay t EHL Single Channel ns Time of Enable from V EL to V EH *JEDEC registered data for the N. **Ratings apply to all devices except otherwise noted in the Package column. Parameter Sym. Device Min. Typ. Units Test Conditions Fig. Note Logic High CM H N,, V/µs V CM = V V CC = V, = ma,,, Common HCPL-,, V CM = kv V O(MIN) = V,, 9 Mode HCPL-/ R L = Ω, T A = C Transient HCNW Immunity HCPL-/,, V CM = kv HCPL-/ HCNW HCPL-/,, V CM = kv HCPL-/ HCNW Logic Low CM L N,, V/µs V CM = V V CC = V, =. ma,,, Common HCPL-,, V CM = kv V O(MAX) =. V,, 9 Mode HCPL-/ R L = Ω, T A = C Transient HCNW Immunity HCPL-/,, V CM = kv HCPL-/ HCNW HCPL-/,, V CM = kv HCPL-/ HCNW
Package Characteristics All Typicals at T A = C. Parameter Sym. Package Min. Typ. Max. Units Test Conditions Fig. Note Input-Output I I-O * Single -Pin DIP µa % RH, t = s,, Insulation Single SO- V I-O = kv dc, T A = C Input-Output V ISO -Pin DIP, SO- V rms RH %, t = min,, Momentary With- Widebody T A = C, stand Voltage** OPT Input-Output R I-O -Pin DIP, SO- Ω V I-O = V dc,, Resistance Widebody T A = C T A = C Input-Output C I-O -Pin DIP, SO-. pf f = MHz, T A = C,, Capacitance Widebody.. Input-Input I I-I Dual Channel. µa RH %, t = s, Insulation V I-I = V Leakage Current Resistance R I-I Dual Channel Ω (Input-Input) Capacitance C I-I Dual -Pin DIP. pf f = MHz (Input-Input) Dual SO-. *JEDEC registered data for the N. The JEDEC Registration specifies C to C. Avago specifies - C to C. **The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN -- Insulation Characteristics Table (if applicable), your equipment level safety specification or Avago Application Note entitled Optocoupler Input-Output Endurance Voltage. For N, HCPL-//// only. Notes:. Each channel.. Peaking circuits may produce transient input currents up to ma, ns maximum pulse width, provided average current does not exceed ma.. Peaking circuits may produce transient input currents up to ma, ns maximum pulse width, provided average current does not exceed ma.. Derate linearly above C free-air temperature at a rate of. mw/ C for the SOIC- package.. Bypassing of the power supply line is required, with a. µf ceramic disc capacitor adjacent to each optocoupler as illustrated in Figure. Total lead length between both ends of the capacitor and the isolator pins should not exceed mm.. The JEDEC registration for the N specifies a maximum I OH of µa. Avago guarantees a maximum I OH of µa.. The JEDEC registration for the N specifies a maximum I CCH of ma. Avago guarantees a maximum I CCH of ma.. The JEDEC registration for the N specifies a maximum I CCL of ma. Avago guarantees a maximum I CCL of ma. 9. The JEDEC registration for the N specifies a maximum I EL of. ma. Avago guarantees a maximum I EL of -. ma.. The t PLH propagation delay is measured from the. ma point on the falling edge of the input pulse to the. V point on the rising edge of the output pulse.. The t PHL propagation delay is measured from the. ma point on the rising edge of the input pulse to the. V point on the falling edge of the output pulse.. t PSK is equal to the worst case difference in t PHL and/or t PLH that will be seen between units at any given temperature and specified test conditions.. See application section titled Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew for more information.. The t ELH enable propagation delay is measured from the. V point on the falling edge of the enable input pulse to the. V point on the rising edge of the output pulse.. The t EHL enable propagation delay is measured from the. V point on the rising edge of the enable input pulse to the. V point on the falling edge of the output pulse.. CM H is the maximum tolerable rate of rise of the common mode voltage to assure that the output will remain in a high logic state (i.e., V O >. V).. CM L is the maximum tolerable rate of fall of the common mode voltage to assure that the output will remain in a low logic state (i.e., V O <. V).. For sinusoidal voltages, ( dv CM / dt) max = πf CM V CM (p-p). 9. No external pull up is required for a high logic state on the enable input. If the V E pin is not used, tying V E to V CC will result in improved CMR performance. For single channel products only.. Device considered a two-terminal device: pins,,, and shorted together, and pins,,, and shorted together.. In accordance with UL, each optocoupler is proof tested by applying an insulation test voltage V rms for one second (leakage detection current limit, I I-O µa). This test is performed before the % production test for partial discharge (Method b) shown in the IEC/EN/DIN EN - - Insulation Characteristics Table, if applicable.. In accordance with UL, each optocoupler is proof tested by applying an insulation test voltage V rms for one second (leakage detection current limit, I I-O µa). This test is performed before the % production test for partial discharge (Method b) shown in the IEC/EN/DIN EN - - Insulation Characteristics Table, if applicable.. Measured between the LED anode and cathode shorted together and pins through shorted together. For dual channel products only.. Measured between pins and shorted together, and pins and shorted together. For dual channel products only
I OH HIGH LEVEL OUTPUT CURRENT µa - V CC =. V V O =. V V E =. V* = µa * FOR SINGLE CHANNEL PRODUCTS ONLY - - T A TEMPERATURE C Figure. Typical high level output current vs. temperature V O OUTPUT VOLTAGE V -PIN DIP, SO- R L = Ω R L = KΩ R L = KΩ V CC = V T A = C FORWARD INPUT CURRENT ma V O OUTPUT VOLTAGE V Figure. Typical output voltage vs. forward input current WIDEBODY R L = Ω R L = KΩ R L = KΩ V CC = V T A = C FORWARD INPUT CURRENT ma I TH INPUT THRESHOLD CURRENT ma V CC =. V V O =. V -PIN DIP, SO- R L = KΩ R L = Ω R L = KΩ - - - I TH INPUT THRESHOLD CURRENT ma WIDEBODY V CC =. V V O =. V R L = KΩ R L = Ω R L = KΩ - - - T A TEMPERATURE C Figure. Typical input threshold current vs. temperature T A TEMPERATURE C
V OL LOW LEVEL OUTPUT VOLTAGE V........ V CC =. V V E =. V* =. ma -PIN DIP, SO- I O = ma I O = 9. ma * FOR SINGLE CHANNEL PRODUCTS ONLY I O =. ma I O =. ma - - - V OL LOW LEVEL OUTPUT VOLTAGE V........ I O = ma I O = 9. ma WIDEBODY V CC =. V V E =. V =. ma I O =. ma I O =. ma - - - I OL LOW LEVEL OUTPUT CURRENT ma V CC =. V V E =. V* V OL =. V * FOR SINGLE CHANNEL PRODUCTS ONLY = - ma =. ma - - - T A TEMPERATURE C T A TEMPERATURE C T A TEMPERATURE C Figure. Typical low level output voltage vs. temperature Figure. Typical low level output current vs. temperature FORWARD CURRENT ma... -PIN DIP, SO- T A = C + V F - FORWARD CURRENT - ma... WIDEBODY T A = o C + V F -.............. V F FORWARD VOLTAGE V V F - FORWARD VOLTAGE - V Figure. Typical input diode forward characteristic dv F /dt FORWARD VOLTAGE TEMPERATURE COEFFICIENT mv/ C -. -. -. -. -. -. -PIN DIP, SO- -.. PULSE INPUT CURRENT ma dv F /dt FORWARD VOLTAGE TEMPERATURE COEFFICIENT mv/ C Figure. Typical temperature coefficient of forward voltage vs. input current -. -. -. -. -.9 WIDEBODY -.. PULSE INPUT CURRENT ma
PULSE GEN. Z O = Ω t f = t r = ns INPUT MONITORING NODE R M SINGLE CHANNEL V CC GND.µF BYPASS *C L + V PULSE GEN. Z O = Ω t f = t r = ns INPUT R L MONITORING NODE OUTPUT V O MONITORING NODE R M DUAL CHANNEL V CC GND.µF BYPASS + V R L C L * OUTPUT V O MONITORING NODE *C L IS APPROXIMATELY pf WHICH INCLUDES PROBE AND STRAY WIRING CAPACITANCE. INPUT =. ma =. ma t PHL tplh OUTPUT V O. V Figure. Test circuit for t PHL and t PLH t P PROPAGATION DELAY ns V CC =. V =. ma t PHL, R L = Ω KΩ KΩ t PLH, R L = Ω t PLH, R L = KΩ t PLH, R L = KΩ - - - T A TEMPERATURE C Figure 9. Typical propagation delay vs. temperature t P PROPAGATION DELAY ns 9 V CC =. V T A = C t PLH, R L = Ω t PLH, R L = KΩ t PLH, R L = KΩ t PHL, R L = Ω KΩ KΩ 9 PULSE INPUT CURRENT ma Figure. Typical propagation delay vs. pulse input current PWD - PULSE WIDTH DISTORTION - ns - - R L = kω R L = Ω R L = kω V CC =. V =. ma - - T A - TEMPERATURE - o C Figure. Typical pulse width distortion vs. temperature t r, t f RISE, FALL TIME ns 9 - V CC =. V =. ma R L = kω R L = kω R L = Ω t RISE t FALL R L = Ω, kω, kω - - T A TEMPERATURE C Figure. Typical rise and fall time vs. temperature
PULSE GEN. Z O = Ω t f = t r = ns INPUT VE MONITORING NODE + V. ma V CC. µf BYPASS *C L RL OUTPUT V O MONITORING NODE INPUT V E OUTPUT V O t EHL t ELH. V. V. V GND *C L IS APPROXIMATELY pf WHICH INCLUDES PROBE AND STRAY WIRING CAPACITANCE. Figure. Test circuit for t EHL and t ELH t E ENABLE PROPAGATION DELAY ns 9 - V CC =. V V EH =. V V EL = V =. ma t ELH, R L = kω t ELH, R L = kω t ELH, R L = Ω t EHL, R L = Ω, kω, kω - - T A TEMPERATURE C Figure. Typical enable propagation delay vs. temperature V FF B A VCC SINGLE CHANNEL. µf BYPASS R L + V OUTPUT V O MONITORING NODE V FF B A VCC DUAL CHANNEL R L. µf BYPASS + V OUTPUT V O MONITORING NODE GND GND V CM + PULSE GENERATOR Z O = Ω V CM V CM (PEAK) V CM + PULSE GENERATOR Z O = Ω V SWITCH AT A: = ma V V O V O (MIN.) SWITCH AT B: =. ma V V O (MAX.) O. V CM H CM L Figure. Test circuit for common mode transient immunity and typical waveforms
OUTPUT POWER P S, INPUT CURRENT I S HCPL- OPTION P S (mw) I S (ma) T S CASE TEMPERATURE C OUTPUT POWER P S, INPUT CURRENT I S HCNWXXXX P S (mw) I S (ma) T S CASE TEMPERATURE C Figure. Thermal derating curve, dependence of safety limiting value with case temperature per IEC/EN/DIN EN -- GND BUS (BACK) V CC BUS (FRONT) NC.µF ENABLE NC OUTPUT mm MAX. (SEE NOTE ) SINGLE CHANNEL DEVICE ILLUSTRATED. Figure. Recommended printed circuit board layout
SINGLE CHANNEL DEVICE V CC V V V CC Ω 9 Ω GND D* + VF SHIELD V E. µf BYPASS GND *DIODE D (N9 OR EQUIVALENT) IS NOT REQUIRED FOR UNITS WITH OPEN COLLECTOR OUTPUT. DUAL CHANNEL DEVICE CHANNEL SHOWN V CC V V V CC GND Ω D* + V F SHIELD 9 Ω. µf BYPASS GND Figure. Recommended TTL/LSTTL to TTL/LSTTL interface circuit 9
Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew Propagation delay is a figure of merit which describes how quickly a logic signal propagates through a system. The propaga tion delay from low to high (t PLH ) is the amount of time required for an input signal to propagate to the output, causing the output to change from low to high. Similarly, the propagation delay from high to low (t PHL ) is the amount of time required for the input signal to propagate to the output causing the output to change from high to low (see Figure ). Pulse-width distortion (PWD) results when t PLH and t PHL differ in value. PWD is defined as the difference between t PLH and t PHL and often determines the maximum data rate capa bil ity of a transmission system. PWD can be expressed in percent by dividing the PWD (in ns) by the minimum pulse width (in ns) being transmitted. Typically, PWD on the order of -% of the minimum pulse width is tolerable; the exact figure depends on the particular application (RS, RS, T-l, etc.). Propagation delay skew, t PSK, is an important parameter to consider in parallel data appli ca tions where synchronization of signals on parallel data lines is a concern. If the parallel data is being sent through a group of optocouplers, differ ences in propagation delays will cause the data to arrive at the outputs of the optocouplers at different times. If this difference in propagation delays is large enough, it will determine the maximum rate at which parallel data can be sent through the optocouplers. Propagation delay skew is defined as the difference between the minimum and maximum propagation delays, either t PLH or t PHL, for any given group of optocouplers which are operating under the same conditions (i.e., the same drive current, supply voltage, output load, and operating tempera ture). As illustrated in Figure 9, if the inputs of a group of optocouplers are switched either ON or OFF at the same time, t PSK is the difference between the shortest propagation delay, either t PLH or t PHL, and the longest propagation delay, either t PLH or t PHL. As mentioned earlier, t PSK can determine the maximum parallel data transmission rate. Figure is the timing diagram of a typical parallel data application with both the clock and the data lines being sent through optocouplers. The figure shows data and clock signals at the inputs and outputs of the optocouplers. To obtain the maximum data transmission rate, both edges of the clock signal are being used to clock the data; if only one edge were used, the clock signal would need to be twice as fast. Propagation delay skew repre sents the uncertainty of where an edge might be after being sent through an opto coupler. Figure shows that there will be uncertainty in both the data and the clock lines. It is important that these two areas of uncertainty not overlap, otherwise the clock signal might arrive before all of the data outputs have settled, or some of the data outputs may start to change before the clock signal has arrived. From these considera tions, the absolute minimum pulse width that can be sent through optocouplers in a parallel application is twice t PSK. A cautious design should use a slightly longer pulse width to ensure that any additional uncertainty in the rest of the circuit does not cause a problem. The t PSK specified optocouplers offer the advantages of guaranteed specifications for propagation delays, pulsewidth distortion and propagation delay skew over the recom mended temper a ture, input current, and power supply ranges. % INPUTS DATA V O. V CLOCK % DATA V O. V t PSK OUTPUTS CLOCK t PSK t PSK Figure 9. Illustration of propagation delay skew - t PSK Figure. Parallel data transmission example
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