19-558; Rev 1; 11/7 Quad SPDT Audio Switches General Description The low on-resistance (.61Ω typ) analog switches operate from a single 1.6V to 5.5V supply. The are quad, singlepole, double-throw (SPDT) switches and are configured to route audio signals. The are pin-to-pin compatible parts with the ST Microelectronics quad SPDT STG3699 analog switch. The MAX474 is a quad SPDT switch and the MAX474H is a quad SPDT switch that can be placed in a high-impedance mode. Switching logic is controlled by 2 control bits (CB1 and CB2). The MAX474/ MAX474H also feature a low on-resistance match (.6Ω) and low power-supply current (.3µA), which increases battery life. The are available in a tiny 3mm x 3mm, 16-pin TQFN-EP, and 2.5mm x 2.5mm, 16-pin ultrathin QFN packages. Voice Switching Cellular Phones PDAs and other Handheld Devices MP3 Player Notebook Computers BASEBAND (SPEECH) Applications Typical Operating Circuit NO1 NC1 NO2 NC2 1.6V to 5.5V COM1 COM2 INTERNAL SPEAKER Features Low On-Resistance (.61Ω typ).6ω (typ) Channel-to-Channel Matching.32Ω (typ) On-Resistance Flatness 1.6V to 5.5V Single-Supply Voltage High PSRR Reduces Supply Noise (-6dB typ).8% Total Harmonic Distortion -68dB typ Crosstalk (1kHz) -64dB typ Off-Isolation (1kHz) Low Supply Current (.3µA typ) Low Leakage Current (.1µA typ) Pin-to-Pin Compatible with ST Micro STG3699 (3mm x 3mm) 16-Pin TQFN, and (2.5mm x 2.5mm) 16-Pin Ultra-Thin QFN Packages TOP VIEW PART MAX474ETE+ MAX474EVE+ MAX474HETE+ MAX474HEVE+ NC4 13 COM4 Ordering Information PIN-PACKAGE 16 TQFN-EP (3mm x 3mm) 16 Ultra-Thin QFN (2.5mm x 2.5mm) 16 TQFN-EP (3mm x 3mm) 16 Ultra-Thin QFN (2.5mm x 2.5mm) NO4 CB2 NC3 12 11 1 9 TOP MARK Pin Configuration 8 COM3 PKG CODE AEV T1633-4 +AAA V162A2-1 AEW T1633-4 +AAB Note: All devices are guaranteed over the -4 C to +85 C temperature range. EP = Exposed pad. V162A2-1 NO3 NC3 CONTROL LOGIC CB1 CB2 COM3 BLOCKING CAPS EXTERNAL HEADPHONES NO1 COM1 14 15 16 MAX474 MAX474H *EP 7 6 5 NO3 NC2 MIDI (RINGER) NO4 NC4 MAX474 COM4 EXTERNAL HEADPHONES + 1 2 3 4 NC1 CB1 NO2 COM2 3mm x 3mm Thin QFN/ 2.5mm x 2.5mm Ultra-Thin QFN *CONNECT EP TO OR LEAVE EP UNCONNECTED. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim s website at www.maxim-ic.com.
ABSOLUTE MAXIMUM RATINGS (All voltages referenced to.), CB_...-.3V to +6.V COM_, NC_, NO_...-.3V to ( +.3V) Continuous Current NO_, NC_, COM_...±3mA Peak Current NO_, NC_, COM_ (pulsed at 1ms, 5% duty cycle)...±4ma Peak Current NO_, NC_, COM_ (pulsed at 1ms, 1% duty cycle)...±5ma Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS Continuous Power Dissipation (T A = +7 C) 16-Pin TQFN (3mm x 3mm), Single-Layer Board (derate 15.6mW/ C above +7 C)...125mW 16-Pin TQFN (3mm x 3mm), Multilayer Board (derate 2.8mW/ C above +7 C)...1667mW 16-Pin Ultra-Thin QFN (2.5mm x 2.5mm), MultiLayer Board (derate 11.5mW/ C above +7 C)...923.8mW Operating Temperature Range...-4 C to +85 C Junction Temperature...+15 C Storage Temperature Range...-65 C to +15 C Lead Temperature (soldering, 1s)...+3 C ( = +2.7V to +5.5V, T A = -4 C to +85 C, unless otherwise noted. Typical values are at T A = +25 C, = +3.3V.) (Note 1) POWER SUPPLY PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage Range 1.6 5.5 V = +5.5V, V CB _ = V or.3 1 = +5.5V, V CB _ =.5V or +1.6V.3 5 Supply Current I CC = +2.5V, V CB_ =.5V or +1.4V.1 µa ANALOG SWITCH Analog Signal Range V NC _, V NO _, V COM _, (Note 2) V On-Resistance R ON 1mA; CB_ = low or = 3.3V, I COM_ = high On-Resistance Match Between Channels ΔR ON = 3.3V, V NC _ or V NO _ =.875V; I COM_ = 1mA (Note 3) On-Resistance Flatness R FLAT(NO) to ; I COM_ = 1mA = 3.3V, V COM_ = (Note 4) T A = +25 C.61.9 T A = T MIN to T MAX 1 T A = +25 C.6 T A = T MIN to T MAX.1 T A = +25 C.32.72 T A = T MIN to T MAX.87 Ω Ω Ω NO_, NC_ Off-Leakage Current I NO _ (OFF), I NC_(OFF) = 5.5V; V NC _ or V NO _ =.3V, 5.5V; V COM _ = 5.5V or.3v -1.1 +1 µa COM_ On-Leakage Current I COM _ (ON) unconnected; V COM _ =.3V, 5.5V, or = 5.5V, V NC _ or V NO _ =.3V, 5.5V, or unconnected -1.1 +1 µa 2
ELECTRICAL CHARACTERISTICS (continued) ( = +2.7V to +5.5V, T A = -4 C to +85 C, unless otherwise noted. Typical values are at T A = +25 C, = 3.3V.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DYNAMIC CHARACTERISTICS R For N O_, V N O_ = 1V 7 Turn-On Time t L = 32Ω, C L = ON 35pF, Figure 2 For N C _, V N C _ = 1V 21 R For N O_, V N O_ = 1V 21 Turn-Off Time t L = 32Ω, C L = OFF 35pF, Figure 2 For N C _, V N C _ = 1V 55 Charge Injection Q V GEN _ = V; R GEN = Ω; C L = 1nF; Figure 3 Off-Isolation V ISO C L = 5pF; R L = 32Ω; f = 1kHz; V COM _ = 1V RMS ; Figure 4 (Note 5) Crosstalk V CT C L = 5pF; R L = 32Ω; f = 1kHz; V COM _ = 1V RMS ; Figure 4 Power-Supply Rejection Ratio PSRR f = 2kHz, V COM_ = 1V RMS, R L = 5Ω, C L = 5pF ns ns 2 pc -64 db -68 db -6 db Total Harmonic Distortion THD f = 2Hz to 2kHz, V P-P =.5V, R L = 32Ω.8 % NO_, NC_ Off-Capacitance C NC_(OFF), C NO _ (OFF) f = 1MHz, Figure 5 4 pf COM_ On-Capacitance C COM _ (ON) f = 1MHz, Figure 5 15 pf DIGITAL INPUTS (CB_) Input Logic-High V IH = 1.6V to 2.7V 1.4 = 2.7V to 5.5V 1.6 V Input Logic-Low V IL.5 V Input Leakage Current I IN -1.1 +1 µa Note 1: For TQFN (3mm x 3mm) electrical specifications are production tested at T A = +85 C and guaranteed by design at T A = +25 C and -4 C. For Ultra-Thin QFN (2.5mm x 2.5mm) electrical specifications are production tested at T A = +25 C and guaranteed by design at T A = +85 C and -4 C. Note 2: Signals on COM_, NO_, or NC_ exceeding are clamped by internal diodes. Limit forward-diode current to maximum current rating. Note 3: ΔR ON = R ON(MAX) - R ON(MIN). Note 4: Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the specified analog signal ranges. Note 5: Off-isolation = 2log1 [V COM_ / V NO_ ], V COM_ = output, V NO_ = input to off switch. 3
( = 3.3V, T A = +25 C, unless otherwise noted) ON-RESISTANCE (Ω).7.6.5.4.3.2 = 3V ON-RESISTANCE vs. COM VOLTAGE T A = -4 C T A = +85 C T A = +25 C.5 1. 1.5 2. 2.5 3. COM VOLTAGE (V) MAX474/4H toc1 ON-RESISTANCE (Ω).6.5.4.3.2.1 = 5V T A = -4 C ON-RESISTANCE vs. COM VOLTAGE T A = +85 C 1 2 3 4 5 COM VOLTAGE (V) Typical Operating Characteristics T A = +25 C MAX474/4H toc2 TIME (ns) 6 4 2 NC TURN-ON/NO TURN-OFF TIME vs. SUPPLY VOLTAGE NO TURN-OFF TIME NC TURN-ON TIME 1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.3 SUPPLY VOLTAGE (V) MAX474/4H toc3 TURN-ON/TURN-OFF TIME (ns) 18 16 14 12 1 8 6 NO TURN-ON/NC TURN-OFF TIME vs. SUPPLY VOLTAGE NO TURN-ON TIME MAX474/4H toc4 TURN-ON/TURN-OFF TIME (ns) 1 8 6 4 NO TURN-ON/NC TURN-OFF TIME vs. TEMPERATURE = 3V NO t ON NC t OFF MAX474/4H toc5 TURN-ON/TURN-OFF TIME (ns) 5 4 3 2 NC TURN-ON/NO TURN-OFF TIME vs. TEMPERATURE = 3V NC t ON MAX474/4H toc6 4 NC TURN-OFF TIME NO t OFF 2 1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.3 SUPPLY VOLTAGE (V) 2-4 -15 1 35 6 85 TEMPERATURE ( C) 1-4 -15 1 35 6 85 TEMPERATURE ( C) LOGIC THRESHOLD (V) 2. 1.6 1.2.8.4 LOGIC THRESHOLD vs. SUPPLY VOLTAGE V CB RISING V CB FALLING MAX474/4H toc7 SUPPLY CURRENT (na) 1 9 8 7 6 5 4 3 2 1 = 3V = 2.5V SUPPLY CURRENT vs. LOGIC INPUT VOLTAGE = 3V = 2.5V MAX474/4H toc8 CHARGE INJECTION ( pc) 25 2 15 1 5 = 2.V CHARGE INJECTION vs. COM VOLTAGE = 5.V MAX474/4H toc9 1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.3 SUPPLY VOLTAGE (V).5 1. 1.41.5 2. 2.5 3. LOGIC INPUT VOLTAGE (V) 1 2 3 4 5 V COM (V) 4
Typical Operating Characteristics (continued) ( = 3.3V, T A = +25 C, unless otherwise noted) 1, LEAKAGE CURRENT (pa) OFF-ISOLATION (db) 1, 1 1 1 1.1-2 -4-6 LEAKAGE CURRENT vs. TEMPERATURE I COM(ON) I COM(OFF) -4-15 1 35 6 85 TEMPERATURE ( C) OFF-ISOLATION vs. FREQUENCY MAX474/4H toc1 MAX474/4H toc12 ON-LOSS (db) CROSSTALK (db) -2-4 FREQUENCY RESPONSE -6.1.1 1 1 1-2 -4-6 FREQUENCY (MHz) CROSSTALK vs. FREQUENCY MAX474/4H toc11 MAX474/4H toc13-8.1.1.1 1 1 FREQUENCY (MHz) -8.1.1.1 1 1 FREQUENCY (MHz) 1 TOTAL HARMONIC DISTORTION vs. FREQUENCY R L = 32Ω MAX474/4H toc14 7 6 5 POWER-SUPPLY REJECTION RATIO vs. FREQUENCY MAX474/4H toc15 THD (%).1 PSRR (db) 4 3 2 1.1 1 1 1k 1k 1k FREQUENCY (Hz).1.1.1 1 1 FREQUENCY (MHz) 5
PIN NAME FUNCTION 1 NC1 Analog Switch 1 Normally Closed Terminal 2 CB1 Digital Control Input for Analog Switch 1 and Analog Switch 2 3 NO2 Analog Switch 2 Normally Open Terminal 4 COM2 Analog Switch 2 Common Terminal 5 NC2 Analog Switch 2 Normally Closed Terminal 6 Ground 7 NO3 Analog Switch 3 Normally Open Terminal 8 COM3 Analog Switch 3 Common Terminal 9 NC3 Analog Switch 3 Normally Closed Terminal 1 CB2 Digital Control Input for Analog Switch 3 and Analog Switch 4 11 NO4 Analog Switch 4 Normally Open Terminal 12 COM4 Analog Switch 4 Common Terminal 13 NC4 Analog Switch 4 Normally Closed Terminal 14 Positive Supply Voltage 15 NO1 Analog Switch 1 Normally Open Terminal 16 COM1 Analog Switch 1 Common Terminal EP EP Exposed Pad. Connect to or leave unconnected for normal operation. Pin Description Detailed Description The quad SPDT audio switches are low on-resistance, low supply current, high powersupply rejection ratio (PSRR) devices that operate from a +1.6V to +5.5V single supply. The MAX474/ MAX474H have two digital control inputs, CB1 and CB2, where each bit controls a pair of switches (see Tables 1 and 2). Applications Information The logic inputs accept up to +5.5V, regardless of supply voltage. For example with a +3.3V supply, CB1 and CB2 can be driven low to and high to +5.5V, allowing for mixed logic levels in a system. Driving CB1 and CB2 rail-to-rail minimizes power consumption. For a 3.3V supply voltage, the logic thresholds are +.5V (low) and +1.6V (high). Analog Signal Levels Analog signals that range over the entire supply voltage range ( to ) can be passed with very little change in on-resistance (see the Typical Operating Characteristics). The switches are bidirectional, so the NO_, NC_, and COM_ terminals can be used as either inputs or outputs. Table 1. MAX474 Truth Table CONTROL SWITCH STATE CB2 CB1 Switch 3/4 Switch 1/2 COM = NC COM = NC 1 COM = NC COM = NO 1 COM = NO COM = NC 1 1 COM = NO COM = NO Table 2. MAX474H Truth Table CONTROL SWITCH STATE CB2 CB1 Switch 3/4 Switch 1/2 COM = NC COM = NC 1 High-Z High-Z 1 COM = NO COM = NC 1 1 COM = NO COM = NO 6
NC1 NO1 NC2 NO2 CB1 CB2 NC3 NO3 NC4 NO4 SWITCH 1 SWITCH 2 SWITCH 3 SWITCH 4 MAX474 CONTROL LOGIC COM1 COM2 COM3 COM4 NC1 NO1 NC2 NO2 CB1 CB2 NC3 NO3 NC4 NO4 Hi Z Hi Z Hi Z Hi Z MAX474H CONTROL LOGIC SWITCH 1 SWITCH 2 SWITCH 3 SWITCH 4 COM1 COM2 COM3 COM4 Figure 1. Functional Diagram Test Circuits/Timing Diagrams MAX474 MAX474H V NC_ OR V NO _ NO_ OR NC_ COM_ LOGIC INPUT V 5% tr < 5ns tf < 5ns LOGIC INPUT CB_ R L C L SWITCH OUTPUT V t ON t OFF.8 x V UT.8 x C L INCLUDES FIXTURE AND STRAY CAPACITANCE. CB DEPENDS ON SWITCH CONFIGURATION; INPUT POLARITY DETERMINED BY SENSE OF SWITCH. Figure 2. Switching Time Power-Supply Sequencing and Overvoltage Protection Caution: Do not exceed the Absolute Maximum Ratings since stresses beyond the listed ratings may cause permanent damage to the device. Proper power-supply sequencing is recommended for all CMOS devices. Improper supply sequencing can force the switch into latch-up, causing it to draw excessive supply current. The only way out of latch-up is to recycle the power and reapply properly. Connect all ground pins first, then apply power to, and finally apply signals to NO_, NC_, and COM_. Follow the reverse order upon power-down. PROCESS: BICMOS Chip Information 7
MAX474 MAX474H V GEN R GEN Figure 3. Charge injection NC_ OR NO_ COM_ CB_ V IL TO V IH C L Test Circuits/Timing Diagrams (continued) VOUT CB_ CB_ OFF OFF ON ON Q = (Δ )(C L ) Δ OFF OFF LOGIC INPUT WAVEFORMS INVERTED FOR SWITCHES THAT HAVE THE OPPOSITE LOGIC SENSE. V OR 5Ω CB_ NC_ 1μF MAX474 MAX474H COM_ NO_ V IN MEAS NETWORK ANALYZER 5Ω 5Ω REF OFF-ISOLATION = 2log OFF-LOSS = 2log CROSSTALK = 2log V IN V IN V IN 5Ω 5Ω MEASUREMENTS ARE STANDARDIZED AGAINST SHORT AND OPEN AT SOCKET TERMINALS. OFF-ISOLATION IS MEASURED BETWEEN COM_ AND OFF NO_ OR NC_ TERMINALS. ON-LOSS IS MEASURED BETWEEN COM_ AND ON NO_ OR NC_ TERMINAL ON EACH SWITCH. CROSSTALK IS MEASURED FROM ONE CHANNEL TO THE OTHER CHANNEL. SIGNAL DIRECTION THROUGH SWITCH IS REVERSED; WORST VALUES ARE RECORDED. Figure 4. Off-Isolation, On-Loss, and Crosstalk 8
CAPACITANCE ANALYZER f = 1MHz 1μF COM_ NC_ OR NO_ Figure 5. Channel Off/On-Capacitance MAX474 MAX474H CB_ V IL OR V IH 9
Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) 12, 16L QFN.EPS PACKAGE OUTLINE, 12,16L QFN, 3x3x.9 MM 21-12 G 1 2 1
Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) PACKAGE OUTLINE, 12,16L QFN, 3x3x.9 MM 21-12 G 1 2 11
Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) DETAIL A DETAIL B ULTRA THIN QFN.EPS DETAIL A DETAIL B 12
REVISION NUMBER REVISION DATE DESCRIPTION Revision History PAGES CHANGED 5/6 Initial release 1 11/7 Adding ultra-thin QFN package 1, 2, 3, 1 13 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 12 San Gabriel Drive, Sunnyvale, CA 9486 48-737-76 13 27 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc. Boblet