MCP6031/2/3/ µa, High Precision Op Amps. Features. Description. Applications. Design Aids. Package Types. Typical Application

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0.9 µa, High Precision Op Amps Features Rail-to-Rail Input and Output Low Offset Voltage: ±150 µv (maximum) Ultra Low Quiescent Current: 0.9 µa Wide Power Supply Voltage: 1.8V to 5.5V Gain Bandwidth Product: 10 khz Unity Gain Stable Chip Select (CS) capability: MCP6033 Extended Temperature Range: - -40 C to +125 C No Phase Reversal Applications Toll Booth Tags Wearable Products Battery Current Monitoring Sensor Conditioning Battery Powered Design Aids SPICE Macro Models FilterLab Software Mindi Circuit Designer & Simulator MAPS (Microchip Advanced Part Selector) Analog Demonstration and Evaluation Boards Application Notes Typical Application 1.4V to 5.5V I DD 10Ω 100 kω MCP6031 1MΩ V I DD V DD = ----------------------------------------- OUT ( 10 V/V) ( 10Ω) High Side Battery Current Sensor V DD Description The Microchip Technology Inc. MCP6031/2/3/4 family of operational amplifiers (op amps) operate with a single supply voltage as low as 1.8V, while drawing ultra low quiescent current per amplifier (0.9 µa, typical). This family also has low input offset voltage (±150 µv, maximum) and rail-to-rail input and output operation. This combination of features supports battery-powered and portable applications. The MCP6031/2/3/4 family is unity gain stable and has a gain bandwidth product of 10 khz. These specs make these op amps appropriate for low frequency applications, such as battery current monitoring and sensor conditioning. The MCP6031/2/3/4 family is offered in single (MCP6031), single with power saving Chip Select (CS) input (MCP6033), dual (MCP6032), and quad (MCP6034) configurations. The MCP6031/2/3/4 family is designed with Microchip s advanced CMOS process. All devices are available in the extended temperature range, with a power supply range of 1.8V to 5.5V. Package Types MCP6031 DFN, SOIC, MSOP NC 1 V IN V IN + 2 3 V SS 4 1 V SS 2 V IN + 3 A 1 V INA 2 V INA + 3 V SS 4 8 MCP6031 SOT-23-5 MCP6032 SOIC, MSOP NC 7 V DD 6 5 NC 6 5 B V INB V INB + MCP6033 DFN, SOIC, MSOP NC 1 V IN V IN + 2 3 V SS 4 8 CS 7 V DD 6 5 NC MCP6034 SOIC, TSSOP 5 V DD A 1 14 D V INA 2 13 V IND 4 V IN V INA + 3 12 V IND + V DD 4 11 V SS V INB + 5 10 V INC + V INB 6 9 V INC 8 7 V DD B 7 8 C 2008 Microchip Technology Inc. DS22041B-page 1

1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings V DD V SS...7.0V Current at Input Pins...±2 ma Analog Inputs (V IN +, V IN -)... V SS 1.0V to V DD + 1.0V All Other Inputs and Outputs... V SS 0.3V to V DD + 0.3V Difference Input Voltage... V DD V SS Output Short-Circuit Current...continuous Current at Output and Supply Pins...±30 ma Storage Temperature...-65 C to +150 C Maximum Junction Temperature (T J )...+150 C ESD protection on all pins (HBM; MM)... 4 kv; 400V Notice: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. See 4.1.2 Input Voltage And Current Limits DC ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, V DD = +1.8V to +5.5V, V SS =GND, T A = +25 C, V CM = V DD /2, V DD /2, V L = V DD /2, R L = 1 MΩ to V L and CS is tied low. (Refer to Figure 1-2 and Figure 1-3). Input Offset Input Offset Voltage V OS -150 +150 µv V DD = 3.0V, V CM = V DD /3 Input Offset Drift with Temperature ΔV OS /ΔT A ±3.0 µv/ C T A = -40 C to +125 C, V DD = 3.0V, V CM = V DD /3 Power Supply Rejection Ratio PSRR 70 88 db V CM = V SS Input Bias Current and Impedance Input Bias Current I B ±1.0 100 pa I B 60 pa T A = +85 C I B 2000 5000 pa T A = +125 C Input Offset Current I OS ±1.0 pa Common Mode Input Impedance Z CM 10 13 6 Ω pf Differential Input Impedance Z DIFF 10 13 6 Ω pf Common Mode Common Mode Input Voltage V CMR V SS 0.3 V DD + 0.3 V Range Common Mode Rejection Ratio CMRR 70 95 db V CM = -0.3V to 2.1V, V DD = 1.8V 72 93 db V CM = -0.3V to 5.8V, 70 89 db V CM = 2.75V to 5.8V, 72 93 db V CM = -0.3V to 2.75V, Open-Loop Gain DC Open-Loop Gain (Large Signal) A OL 95 115 db 0.2V < < (V DD 0.2V) R L = 50 kω to V L DS22041B-page 2 2008 Microchip Technology Inc.

DC ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, V DD = +1.8V to +5.5V, V SS =GND, T A = +25 C, V CM = V DD /2, V DD /2, V L = V DD /2, R L = 1 MΩ to V L and CS is tied low. (Refer to Figure 1-2 and Figure 1-3). Output Maximum Output Voltage Swing V OL, V OH V SS + 10 V DD 10 mv R L = 50 kω to V L, 0.5V input overdrive Output Short-Circuit Current I SC ±5 ma V DD = 1.8V ±23 ma Power Supply Supply Voltage V DD 1.8 5.5 V Quiescent Current per Amplifier I Q 0.4 0.9 1.35 µa I O = 0, V CM = V DD, AC ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, T A = +25 C, V DD = +1.8 to +5.5V, V SS = GND, V CM = V DD /2, V DD /2, V L = V DD /2, C L = 60 pf, R L = 1 MΩ to V L and CS is tied low. (Refer to Figure 1-2 and Figure 1-3). AC Response Gain Bandwidth Product GBWP 10 khz Phase Margin PM 65 G = +1 V/V Slew Rate SR 4.0 V/ms Noise Input Noise Voltage E ni 3.9 µvp-p f = 0.1 Hz to 10 Hz Input Noise Voltage Density e ni 165 nv/ Hz f = 1 khz Input Noise Current Density i ni 0.6 fa/ Hz f = 1 khz 2008 Microchip Technology Inc. DS22041B-page 3

MCP6033 CHIP SELECT ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, V DD = +1.8V to +5.5V, V SS =GND, T A = +25 C, V CM =V DD /2, =V DD /2, V L = V DD /2, C L = 60 pf, R L = 1 MΩ to V L and CS is tied low (Refer to Figure 1-1). CS Low Specifications CS Logic Threshold, Low V IL V SS 0.2V DD V CS Input Current, Low I CSL -10 pa CS = V SS CS High Specifications CS Logic Threshold, High V IH 0.8V DD V DD V CS Input Current, High I CSH 10 pa CS = V DD GND Current I SS -400 pa CS = V DD Amplifier Output Leakage I O(LEAK) 10 pa CS = V DD CS Dynamic Specifications CS Low to Amplifier Output Turn-on Time CS High to Amplifier Output High-Z t ON 4 100 ms CS 0.2V DD to = 0.9V DD /2, G = +1 V/V, V IN = V DD /2, R L = 50 kω to V L = V SS. t OFF 10 µs CS 0.8V DD to = 0.1V DD /2, G = +1 V/V, V IN = V DD /2, R L = 50 kω to V L = V SS. CS Hysteresis V HYST 0.3V DD V CS V IL V IH t ON t OFF High-Z High-Z I SS -400 pa -0.9 µa -400 pa I CS 10 pa FIGURE 1-1: Timing Diagram for the CS Pin on the MCP6033. DS22041B-page 4 2008 Microchip Technology Inc.

TEMPERATURE SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, V DD = +1.8V to +5.5V and V SS = GND. Temperature Ranges Operating Temperature Range T A -40 +125 C Note Storage Temperature Range T A -65 +150 C Thermal Package Resistances Thermal Resistance, 5L-SOT-23 θ JA 256 C/W Thermal Resistance, 8L-DFN (2x3) θ JA 84 C/W Thermal Resistance, 8L-SOIC θ JA 163 C/W Thermal Resistance, 8L-MSOP θ JA 206 C/W Thermal Resistance, 14L-SOIC θ JA 120 C/W Thermal Resistance, 14L-TSSOP θ JA 100 C/W Note: The internal junction temperature (T J ) must not exceed the absolute maximum specification of +150 C. 1.1 Test Circuits The test circuits used for the DC and AC tests are shown in Figure 1-2 and Figure 1-3. The bypass capacitors are laid out according to the rules discussed in Section 4.6 Supply Bypass. V DD V IN 0.1 µf 2.2 µf R N MCP603X V DD /2 R G R F C L V L R L FIGURE 1-2: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. V DD V DD /2 0.1 µf 2.2 µf R N MCP603X V IN C L R L R G R F V L FIGURE 1-3: AC and DC Test Circuit for Most Inverting Gain Conditions. 2008 Microchip Technology Inc. DS22041B-page 5

D N E1 E NOTE 1 1 2 3 b e h h α A A2 φ c A1 L L1 β 2008 Microchip Technology Inc. DS22041B-page 27

PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Device Temperature Range Package Device: MCP6031: Single Op Amp MCP6031T: Single Op Amp (Tape and Reel) MCP6032: Dual Op Amp MCP6032T: Dual Op Amp (Tape and Reel) MCP6033: Single Op Amp with Chip Select MCP6033T: Single Op Amp with Chip Select (Tape and Reel) MCP6034: Quad Op Amp MCP6034T: Quad Op Amp (Tape and Reel) Temperature Range: E = -40 C to +125 C Package: MC = Plastic Dual Flat, No Lead, (2x3 DFN ) 8-lead ** MS = Plastic MSOP, 8-lead OT = Plastic Small Outline Transistor, 5-lead * SL = Plastic SOIC (150 mil Body), 14-lead SN = Plastic SOIC, (150 mil Body), 8-lead ST = Plastic TSSOP (4.4mm Body), 14-lead * This package is only available on the MCP6031 device. ** These packages are only available on the MCP6031 and MCP6033 devices. Examples: a) MCP6031-E/SN: 8LD SOIC package. b) MCP6031T-E/SN: Tape and Reel, 8LD SOIC package. c) MCP6031-E/MS: 8LD MSOP package. d) MCP6031T-E/MS: Tape and Reel, 8LD MSOP package. e) MCP6031-E/MC: 8LD DFN package. f) MCP6031T-E/MC: Tape and Reel, 8LD DFN package. g) MCP6031T-E/OT: Tape and Reel, 5-LD SOT-23 package. a) MCP6032-E/SN: 8LD SOIC package. b) MCP6032T-E/SN: Tape and Reel, 8LD SOIC package. c) MCP6032-E/MS: 8LD MSOP package d) MCP6032T-E/MS: Tape and Reel 8LD MSOP package. a) MCP6033-E/SN: 8LD SOIC package. b) MCP6033T-E/SN: Tape and Reel, 8LD SOIC package. c) MCP6033-E/MS: 8LD MSOP package. d) MCP6033T-E/MS: Tape and Reel, 8LD MSOP package. e) MCP6033-E/MC: 8LD DFN package. f) MCP6033T-E/MC: Tape and Reel, 8LD DFN package. a) MCP6034-E/SL: 14LD SOIC package. b) MCP6034T-E/SL: Tape and Reel, 14LD SOIC package. c) MCP6034-E/ST: 14LD TSSOP package. d) MCP6034T-E/ST: Tape and Reel, 14LD TSSOP package. 2008 Microchip Technology Inc. DS22041B-page 31