Applications for Mask-less E-Beam Lithography between R&D and Manufacturing

Applications for Mask-less E-Beam Lithography between R&D and Manufacturing May 24, 2006 Lithography Forum Johannes Kretz

Table of Contents E-Beam Lithography at Qimonda in Dresden Project Environment (Qimonda, Fraunhofer, VISTEC, IMS) Technical Results Future: ML2 Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 2

Table of Contents E-Beam Lithography at Qimonda in Dresden Project Environment (Qimonda, Fraunhofer, VISTEC, IMS) Technical Results Future: ML2 Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 3

Motivation Decision Mid 2004 for acquisition of a Variable Shaped Electron Beam Lithography in Dresden for shared use of Infineon and AMD E-Beam Business Cases for support of R&D existing E-Beam has great potential to facilitate optical litho, technology development and product engineering (mask cost, time to silicon) Further, more sophisticated applications to a later date conceivable Therefore participation of Infineon/Qimonda in European Programs for Mask less Lithograph (ML2) Manufacturing Lithography Strategy of Qimonda unchanged Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 4

Center of Competence E-Beam at QD P RDC Own Group at Qimonda Dresden Research & Development Center (Head: Berndt Tropper) with additional resources from optical litho department, integration and etch (total: 9 persons) Main objective: device learning <50nm nodes Tool-set at Fraunhofer CNT Main tool usage and responsibility for E-Beam cluster Leica SB351 + Linux fracturing cluster TEL ACT-12 dedicated to E-Beam 200m and 300mm capability, currently focus on 300mm Cooperation with VISTEC and IMS Chips (Stuttgart) for resist screening Resist process transfer from IMS Chips Setup of lithography service for internal customers Use for external customers possible (patterning only) Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 5

E-Beam Direct Write: Possible Applications Test Structures for technology learning and tool qualification Personalization ASIC Structuring Ground rule, cell concept and device learning Metal fix applications for 130nm and 90nm technologies Increasing complexity Chip shuttle for macro verification Main focus Qimonda Main focus for logic companies Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 6

Timeline E-Beam Project 2005 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12 Site Accept E-Beam Tool Delivery CNT Transfer Resist Process Final Acceptance 2006 2007 Support Device 1 layer Ready for Service Center for (external) customers Column Upgrade Support Device >1 layer 45nm node capability 32nm node capability Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 7

E-Beam Cluster in CNT Clean room Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 8

Table of Contents E-Beam Lithography at Qimonda in Dresden Project Environment (Qimonda, Fraunhofer, VISTEC, IMS) Technical Results Future: ML2 Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 9

Project Construct Collaboration between Qimonda, CNT and external Partners Resist benchmarking & process development @ IMS Chips Timeframe: October 04 Mid 08 National Funding (BMBF with Fraunhofer: SWITCH, SOHAR) European Programs (FOREMOST) Synergies to other (NGL) technologies Mask applications Nano-imprint (resist process) EUV S J DD Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 10

Mission or Fraunhofer CNT Center Nanoelectronic Technologies a public-private partnership the most efficient platform to develop innovative processing solutions for fast implementation in microelectronic devices in the nanoelectronic era in Germany / Europe page 11

Research Challenge: Fast Integration of Innovative Processes/Technologies and Equipment into Manufacturing Sequential > 5 years Basic Research Applied Research Development Product Technology Pilot Product Volume Ramp No Feedback Independent Technology driven Integrated Basic Research Applied Research ~ 3 years Development Product Technology Pilot Product Volume Ramp Fast Feedback from market Interacting Application driven CNT page 12

European Nanotechnology Platform - Concept page 13

CNT Competence Areas for High-Performance Data Processing and Logic Areas Competence Reference Fab Materials Unit Process & Modules Equipment New materials - storage cell - isolation concepts - conductor -transistor Metrology and Analytics Innovative Process Solutions Enabling Patterning AMD Fab 36 300mm IFX SC300 300mm page 14

CNT Layout acces to CNT offices page 15

Table of Contents E-Beam Lithography at Qimonda in Dresden Project Environment (Qimonda, Fraunhofer, VISTEC, IMS) Technical Results Future: ML2 Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 16

Resist Benchmarking at IMS Chips Extensive benchmarking of >30 positive and negative chemically amplified resists for direct write applications performed at IMS Chips Multiple (small volume) samples supplied by all major resist vendors Identification of p& n-cars for 50nm DRAM node applications meeting basic resist requirements Resist improvement clearly visible Multiple learning cycles observed with several suppliers Commercialization of most advanced samples Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 17

P-CAR Benchmarking Result (dense pattern) 50nm 55nm 60nm 70nm 100nm Resist F Resist G Resist I Resist J Resist K Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 18

Status Exposure Results: Negative Resist 50nm L/S iso dense (7-lines) dense (wide lines) 70nm Dots (Pitch 180nm) Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 19

Status Exposure Results: Positive Resist 50nm L/S iso dense (7-lines) dense (wide lines) 70nm CH (Pitch 180nm) Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 20

Table of Contents E-Beam Lithography at Qimonda in Dresden Project Environment (Qimonda, Fraunhofer, VISTEC, IMS) Technical Results Future: ML2 Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 21

PML2 Project Status IMS Nanofabrication IMS-Jena

PML2 E - beam evolution at Vistec Device engineering Fast prototyping Low volume production Litho ++ Litho+ Litho VB6 SB350DW PML2 R&D Project Gaussian Beam Shaped Shaped Beam Beam Multi Beam Array Multi Beam 1 Gaussian pixel / flash Beam 100 pixels / flash > 10,000 pixels / flash Increasing throughput Increasing complexity SEMATECH Litho Forum Vancouver, 22-May-2005 IMS Nanofabrication 23

PML2 Multi e-beam, single column Single Electron source 5keV Condenser Optics Programmable Aperture Plate System (APS) 100keV 200x Reduction Projection Electrostatic / Magnetic Optics Scanning Wafer Stage SEMATECH Litho Forum Vancouver, 22-May-2005 IMS Nanofabrication 24

PML2 Throughput estimation Feature POC tool Beta tool Technology node 45 nm 45 nm Resist 36 µc/cm² 18 µc/cm² APS size aperture size/ number 20x20 mm² 5µm/ 0.3Mio 40x40 mm² 5µm/ 1.2Mio Blanking rate 1 MHz 8 MHz Current in column 50% beams on 0.45 µa 3.5 µa Total blur < 10 nm 13 nm v-stage 0.025 m/s 0.2 m/s Throughput (12 wafer) 0.1 WPH 1.3 WPH Potential: 5 WPH Potential: 5 WPH sophisticated stage required (0.5 1m/s) Results are based on: - 0.1s stage turn-around time, 120s overhead/ wafer - calculation of 3rd / 5th order electron optical aberrations - Monte Carlo simulation of all space charge effects (ray tracing) SEMATECH Litho Forum Vancouver, 22-May-2005 IMS Nanofabrication 25

Summary VSB E-Beam Lithography established in Dresden Patterning Ready for Internal and External Customers Use for 300mm applications for future device and technology learning Use of FhG network and National / European funding for process development Process-learning for future mask-less litho tools Strong potential for mask-less lithography in R&D Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 26

Acknowledgement The Qimonda part of the work for this paper was partly supported by the EFRE fund of the European Community and by funding of the State Saxony of the Federal Republic of Germany (project number 10746) and partly by the Federal Ministry of Education and Research of the Federal Republic of Germany (Project No 01M3167A). The authors are responsible for the content of the paper. Thanks to: Center of Competence E-Beam, Frank-Michael Kamm VISTEC Jena Karl-Heinz Kliem, Elke Kilgus, Monika Böttcher, Uli Denker, Lutz Bettin, Bernd Brendel, Dirk Beyer, Hans-Joachim Döring IMS Chips Mathias Irmscher, Anatol Schwersenz, Holger Sailer Fraunhofer CNT Peter Kücher Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 27

Team of E-Beam Competence Center Christian Arndt (optical litho) Maik Bootsmann (integration) Kang-Hoon Choi (resist, track, metrology) Christoph Hohle (resist screening and process) Katja Keil, PhD Johannes Kretz (project manager) Tarek Lutz (device, alignment, proximity, tool) M. Tesauro (etch) Frank Thrum (Data Prep, KERF, fracturing) Qimonda Johannes Kretz QD P RDC EBEAM May 24, 2006 Page 28

Thank you The World s Leading Creative Memory Company Johannes Kretz