MSR56G, MSRF56G Switch-mode Soft Recovery Power Rectifier These state of the art devices are designed for boost converter or hard switched converter applications, especially for Power Factor Correction application. It could also be used as a free wheeling diode in variable speed motor control applications and switching mode power supplies. Features Soft Recovery with Low Reverse Recovery Charge (Q RR ) and Peak Reverse Recovery Current (I RRM ) Epoxy meets UL 9 V @ 25 in Low Forward Voltage Low Leakage Current High Temperature Glass Passivated Junction These are Pb Free Devices Mechanical Characteristics: Case: Epoxy, Molded Weight:.9 Grams (pproximately) Finish: ll External Surfaces Corrosion Resistant and Terminal Leads Readily Solderable Lead Temperature for Soldering Purposes: 26 C Max. for Seconds MXIMUM RTINGS Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage verage Rectified Forward Current (t Rated V R, T C = 25 C) Rating Symbol Value Unit Peak Repetitive Forward Current (t Rated V R, Square Wave, 2 khz,t C = 25 C) Non Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 6 Hz) Operating Junction and Storage Temperature Range THERML CHRCTERISTICS V RRM V RWM V R 6 V I O 5 I FRM I FSM T J, T stg 65 to +5 C Parameter Symbol Value Unit MSR56G: Thermal Resistance Junction to Case Junction to mbient MSRF56G: Thermal Resistance Junction to Case Junction to mbient R JC.6 R J 72.8 R JC.25 R J 75 C/W C/W Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. SOFT RECOVERY POWER RECTIFIER 5 MPERES, 6 VOLTS ORDERING INFORMTION Device Package Shipping MSR56G TO 22C CSE 22B STYLE MRKING DIGRMS Y WW G K MSRF56G Y WWG MSR56 K TO 22C (Pb Free) TO 22 FULLPK CSE 22G STYLE = ssembly Location = Year = Work Week = Pb Free Package = Diode Polarity TO 22FP (Pb Free) YWWG MSRF56 K 5 Units/Rail 5 Units/Rail Semiconductor Components Industries, LLC, 2 February, 2 Rev. 7 Publication Order Number: MSR56/D
MSR56G, MSRF56G ELECTRICL CHRCTERISTICS Instantaneous Forward Voltage (Note ) (I F = 5 ) Maximum Typical Instantaneous Reverse Current (V R = 6 V) Maximum Typical Characteristic Symbol Value Unit Reverse Recovery Time (Note 2) (V R = V, I F =, di/dt = / s) Maximum Typical V F T J = 25 C T J = 5 C V.8.5..2 I R T J = 25 C T J = 5 C 5. 5 t rr T J = 25 C T J = C ns Typical Recovery Softness Factor (V R = V, I F =, di/dt = / s) s = t b /t a.67.7 Typical Peak Reverse Recovery Current (V R = V, I F =, di/dt = / s) I RRM 2..2 Typical Reverse Recovery Charge (V R = V, I F =, di/dt = / s) Q RR 78 nc Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.. Pulse Test: Pulse Width 8 s, Duty Cycle 2% 2. T RR measured projecting from 25% of I RRM to zero current 5 5 65 5 V F @ 5 C V F @ 5 C I F, INSTNTNEOUS FORWRD CURRENT (MPS) zl V F @ 25 C V F @ C I F, INSTNTNEOUS FORWRD CURRENT (MPS) V F @ 25 C V F @ C..7..5.9 2. 2.7 V F, INTNTNEOUS VOLTGE (VOLTS) Figure. Maximum Forward Voltage..5.7.9...5.7.9 2. V F, INSTNTNEOUS FORWRD CURRENT (MPS) Figure 2. Typical Forward Voltage 2
MSR56G, MSRF56G I R, REVERSE CURRENT ( ) I R @ 5 C I R @ C I R @ 25 C I R, REVERSE CURRENT ( ). I R @ 5 C I R @ C I R @ 25 C 2 5 6 V R, REVERSE VOLTGE (VOLTS) Figure. Maximum Reverse Current. 2 5 6 V R, REVERSE VOLTGE (VOLTS) Figure. Typical Reverse Current I F(V), VERGE FORWRD 25 2 dc T J = 5 C 5 Square Wave 5 5 5 T C, CSE TEMPERTURE ( C) Figure 5. Current Derating P F(V), VERGE POWER DISSIPTION (WTTS) 2 Square Wave 2 2 I F(V), VERGE FORWRD CURRENT (MPS) dc Figure 6. Power Dissipation T J = 5 C 5 5 T J = 25 C T J = 25 C C, CPCITNCE (pf) 25 2 5 C, CPCITNCE (pf) 25 2 5 5 5 2 V R, REVERSE VOLTGE (VOLTS) Figure 7. Maximum Capacitance 5 2 5 V R, REVERSE VOLTGE (VOLTS) Figure 8. Typical Capacitance
MSR56G, MSRF56G 6 8 Time (nsec) 5 2 t b vs. di/dt @ 25 C T rr vs. di/dt @ 25 C t a vs. di/dt @ 25 C Time (nsec) 6 2 t rr t a t b 25 75 25 25 75 25 75 di/dt (/ S) TEMPERTURE ( C) Figure 9. Typical Trr vs. di/dt Figure. Typical Trr vs. Temperature I RRM, PEK RECOVERY CURRENT (MPS) 2 I F = T J = 25 C 25 75 25 75 225 25 75 25 di/dt (/ S) di F /dt (/ S)) Figure. Typical Peak Reverse Recovery Current Q RR, REVERSE RECOVERY CHRGE (nc) 5 2 I F = T J = 25 C Figure 2. Typical Reverse Recovery Charge E OFF, SWITCHING OFF LOSSES ( J) 65 55 I F = 5 V R = V 5 25 25 75 25 di F /dt (/ S) Figure. Typical Switching Off Losses
MSR56G, MSRF56G R(t), TRNSIENT THERML RESISTNCE ID =.5..5 Single Pulse... t, Time (S) Figure. Transient Thermal Response r(t), TRNSIENT THERML RESPONSE (NORMLIZED) ( C/W).. D =.5.2.5.2. SINGLE PULSE P (pk) t t 2 DUTY CYCLE, D = t /t 2 Z JC (t) = r(t) R JC R JC =.6 C/W MX D CURVES PPLY FOR POWER PULSE TRIN SHOWN RED TIME T t T J(pk) - T C = P (pk) Z JC (t)...... t, TIME (s). Figure 5. Thermal Response, (MSRF56) Junction to Case (R JC ) 5
MSR56G, MSRF56G r(t), TRNSIENT THERML RESPONSE (NORMLIZED) ( C/W).... D =.5.2.5.2. SINGLE PULSE.... t, TIME (s) P (pk) t t 2 DUTY CYCLE, D = t /t 2 Z JC (t) = r(t) R JC R JC =.6 C/W MX D CURVES PPLY FOR POWER PULSE TRIN SHOWN RED TIME T t T J(pk) - T C = P (pk) Z JC (t). Figure 6. Thermal Response, (MSRF56) Junction to mbient (R J ) 6
MSR56G, MSRF56G PCKGE DIMENSIONS TO 22 TWO LED CSE 22B ISSUE F Q H L B G D K F T U R J C S NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y.5M, 982. 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MX MIN MX.595.62 5. 5.75 B.8.5 9.65.29 C 6 9.6.82 D.25.9.6. F 2 6.6.9 G 9.2.8 5. H 2.79. J..25.6.6 K.5.562 2.7.27 L.5.6..52 Q 2 2.5. R.8 2. 2.79 S.5.55..9 T.25.255 5.97 6.8 U..5..27 STYLE : PIN. CTHODE 2. N/. NODE. CTHODE E/2 Q L X b2 e e E 2 L D X b C P M B M.25 M B M TO 22 FULLPK, 2 LED CSE 22G ISSUE C H c B NOTE 2 SETING PLNE STYLE : PIN. CTHODE 2. N/. NODE NOTES:. DIMENSIONING ND TOLERNCING PER SME Y.5M, 99. 2. CONTROLLING DIMENSION: MILLIMETERS.. CONTOUR UNCONTROLLED IN THIS RE.. DIMENSIONS D ND E DO NOT INCLUDE MOLD FLSH ND GTE PROTRUSIONS. MOLD FLSH ND GTE PROTRUSIONS NOT TO EXCEED PER SIDE. THESE DIMENSIONS RE TO BE MESURED T OUTERMOST EXTREME OF THE PLSTIC BODY. 5. DIMENSION b2 DOES NOT INCLUDE DMBR PROTRUSION. LED WIDTH INCLUDING PROTRUSION SHLL NOT EXCEED 2.. MILLIMETERS DIM MIN MX..7 2.5 2.9 2 2.5 2.9 b.5.8 b2.. c.9.79 D.22 5.88 E 9.65.67 e 2.5 BSC e 5.8 BSC H 5.97 6.8 L 2.7.7 L --- 2.8 P.. Q 2.8.2 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. listing of SCILLC s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICTION ORDERING INFORMTION LITERTURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 56, Denver, Colorado 827 US Phone: 675 275 or 8 86 Toll Free US/Canada Fax: 675 276 or 8 867 Toll Free US/Canada Email: orderlit@onsemi.com N. merican Technical Support: 8 282 9855 Toll Free US/Canada Europe, Middle East and frica Technical Support: Phone: 2 79 29 Japan Customer Focus Center Phone: 8 587 5 7 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MSR56/D