MT8X Product Description The MT8X family is produced by BCD technology with both high performance and high reliability. The Hall IC internally includes an on-chip Hall voltage generator, a voltage regulator for operation with supply voltage of.8v to 6V, temperature compensation circuitry, smallsignal amplifier, Hall IC with dynamic offset cancellation system, chmitt trigger and an open collector output. It also includes an clamp diode at output and reversed power supply protection enhances the robustness of Hall IC. The Hall IC designed to respond to a single poles. While the magnetic flux density(b) is larger than operating point (BOP), the output will be turned on (Low), the output is held until the magnetic flux density(b) is lower than releasing point (BRP), then turn off (High). The MT8X family provides a variety of packages to customers: OT-/OT- (Thin Outline)/OT-89B for surface mount and flat TO-9 for through-hole mount. All packages are RoH compliant. Feature AEC-Q Automotive Qualified BCD Technology Uni-polar witch.8~6v Operating Range -4 ~5 Operating Temperature Package Option: Flat TO-9 / Flat TO-9 (Radial Lead) / OT- / OT- (Thin Outline) / OT-89B Magnetic ensitivity Option: MT8 (BOP=4Gs, BRP=5Gs) MT8 (BOP=55Gs, BRP=Gs) MT8 (BOP=85Gs, BRP=5Gs) Open-Drain Output -4V ersed Power upply Protection Output Limiting Current Protection RoH Compliant: /65/EU Product Overview of MT8X Part o. MT8XA MT8XA-T MT8XAT Description Flat TO-9, bulk packaging (pcs/bag) Flat TO-9, radial lead, bulk packaging (pcs/bag) OT-, tape & reel (pcs/bag) 4 Applications Automotive, Home appliances, Industrial peed Detection Position Detection Magnetic Encoder olid-tate witch Proximity witch 5. Pin Configuration and Functions VCC Out OT- OT- (Thin Outline) Flat TO-9 (Radial Lead) Flat TO-9 OT-89B Description OT- Top-View TO-9 Top-View Power OT- Thin Outline Top-View Output Open-Drain OT-89B Top-View TO-9 Radial Lead Top-View Ground MT8XET OT- (Thin Outline), tape & reel (pcs/bag) MT8XBT OT-89B, tape & reel (pcs/bag) Figure. Pin Configuration & Functions.
MT8X Table of Contents Product Description.......... Feature..... Product Overview of MT8X.. 4 Applications. 5 Pin Configuration and Functions.. 6 Definition of witching Function. 7 Function Description..... 8 Feature Description 9 Functional Block Diagram..4 Electrical and Magnetic Characteristics 4. Absolute Maximum Ratings.4. Electrical pecifications..5. Magnetic Characteristics 5.4 ED Ratings..5.5 Characteristic Performance..6.6 Typical Output Waveform..7 Typical Application Circuit.7 Package Material Information 8. OT- Package Information... 8. OT- (Thin Outline) Package Information....9. Flat TO-9 Package Information..4 Flat TO-9 (Radial Lead) Package Information.5 OT-89B Package Information... ersion History Originally Version. Version Update MT8 & MT8 eries Update OT- (Thin Outline) Package. Version Update Flat TO-9 (Radial Lead) Package 4. Version Update AEC-Q Automotive Qualified.
Motion MT8X 6 Definition of witching Function Figure. & Figure. shows the device functionality and hysteresis orth BOP BRP outh orth BRP BOP outh Figure. witching Function Uni-polar (orth) OT- Figure. witching Function Uni-polar (outh) OT- (Thin Outline) / Flat TO-9 / OT-89B 7 Function Description BOP: Operating Point, Magnetic flux density applied on the branded side of the package which turns the output driver O (V=Low) BRP: Releasing Point, Magnetic flux density applied on the branded side of the package which turns the output driver OFF (V=High) BHYT: Hysteresis Window, BOP - BRP Devices that have a lower magnetic threshold (V=High) detect magnets at a farther distance. Higher thresholds (V=Low) generally require a closer distance or larger magnet. 8 Feature Description The MT8X device is sensitive to the magnetic field component that is perpendicular to the top of the package OT- Flat TO-9 OT- OT-89B OT- Flat TO-9 (Thin Outline) OT- (Thin Outline) OT-89B PCB V = Low PCB V= High Figure.4 Flux Direction Polarity.
MT8X 9 Functional Block Diagram Reference Regulator Dynamic Offset Cancelation Limiting Current Protection ED Out Hall Plate ITA COMP Output Driver ED Figure.5 Functional Block Diagram Electrical and Magnetic Characteristics. Absolute Maximum Ratings Absolute maximum ratings are limited values to be applied individually, and beyond which the serviceability of the circuit may be impaired. Functional operability is not necessarily implied. Exposure to absolute maximum rating conditions for an extended period of time may affect device reliability. ymbol Parameters Min Max Units VCC upply Voltage - 65 V VRCC erse Battery Voltage -4 - V V Output Voltage - 65 V I Continuous Output Current - 5 ma TA Operating Ambient Temperature -4 5 T torage Temperature -5 5 TJ Junction Temperature - 65 B Magnetic Flux Density o Limit Gs 4.
MT8X. Electrical pecifications At TA=-4~5, =.8V~6V (unless otherwise specified) ymbol Parameters Test Condition Min Typ Max Unit VCC upply Voltage Operating.8-6 V ICC upply Current B<BRP - 4 6 ma IOCP hort Circuit Protection Current B>BOP, V= - 5 - ma VDO Output aturation Voltage I=mA, B>BOP - -.4 V IOFF Output Leakage Current V=4V, B < BRP - - ua TR Output Rise Time RL=KOhm, CL=pF - -. us TF Output Fail Time RL=KOhm, CL=pF - -. us TPO Power on Time d/dt>5v/u B>BOP(MAX) - - us FC Chopping Frequency - 8 - KHz F ampling Frequency - - KHz Thermal Resistance of OT- - - /W RTH Thermal Resistance of OT- (Thin Outline) - - /W Thermal Resistance of TO-9 - - /W Thermal Resistance of OT-89B - - /W. Magnetic Characteristics At VCC=.8V~6V (unless otherwise specified) Part o. ymbol Min Typ Max Unit BOP, TA =5 4 7 Gs MT8 eries BRP, TA =5 75 5 5 Gs BHYT, TA =5 5 5 Gs BOP, TA =5 55 Gs MT8 eries BRP, TA =5 65 55 Gs BHYT, TA =5 45 6 Gs BOP, TA =5 6 85 Gs MT8 eries BRP, TA =5 5 5 75 Gs BHYT, TA =5 5 5 Gs.4 ED Ratings ymbol Reference Values Unit VED Human-body model (HBM) AEC-Q- Class II Grade Charged-device model (CDM) AEC-Q- ± V 5.
Magnetic Field Intensity (Gs) Magnetic Field Intensity (Gs) Magnetic Field Intensity (Gs) Magnetic Field Intensity (Gs) Magnetic Field Intensity (Gs) Magnetic Field Intensity (Gs) upply Current (ma) MT8X.5 Characteristic Performance At VCC=5V 6 5 4-4 5 85 5 5 Figure.6 upply Current vs. Temperature MT8 MT8 MT8 65 5 5 5 9 75 6 45 Bop Brp 5-4 5 85 5 5 5 5 5 Bop Brp -4 5 85 5 5 9 8 7 6 5 4 Bop Brp -4 5 85 5 5 Figure.7 Magnetic Characteristics vs. Temperature (BOP & BRP) MT8 MT8 MT8 6 6 6 5 5 5 4 4 4-4 5 85 5 5-4 5 85 5 5-4 5 85 5 5 Figure.8 Magnetic Characteristics vs. Temperature (BHYT) 6.
RL MT8X.6 Typical Output Waveform MT8A as example BOP B BRP T V High Low T Figure.9 Digital Output vs. Magnetic Flux Density Typical Application Circuit MT8AT as example ote: Recommended value for RL is KOhms to KOhms C=nF Out Figure. Typical Application Circuit C=nF 7.
MT8X Package Material Information (For Reference Only ot for Tooling Use). OT- Package Information XXXXY XXXXY DateCode: week (A~z) Product ID Figure. OT- Chip Marking pec ensing Center Figure. OT- Package Drawing ymbol Dimensions in Millimeters Dimensions in Inches Min Max Min Max A.5.5.4.49 A....4 A.5.5.4.45 b..5.. c...4.8 D.8...9 E.5.7.59.67 E.65.95.4.6 e.95 TYP.7 TYP e.8..7.79 L..6..4 θ 8 8 x.46 TYP.57 TYP y.8 TYP. TYP z.6 TYP.4 TYP 8.
MT8X. OT- (Thin Outline) Package Information XXXXY XXXXY DateCode: week (A~z) Product ID Figure. OT- (Thin Outline) Chip Marking pec ensing Center Figure.4 OT- (Thin Outline) Package Drawing ymbol Dimensions in Millimeters Dimensions in Inches Min Max Min Max A.9.5.5.45 A....4 A.9.5.5.4 b..5.. c.8.5..6 D.8...8 E..4.47.55 E.5.55.89. e.95 TYP.7 TYP e.8..7.79 L.55 REF. REF L..5.. θ 8 8 x.46 TYP.57 TYP y.65 TYP.6 TYP z.5 TYP. TYP 9.
MT8X. Flat TO-9 Package Information XXXX YWW XXXX YWW Product ID DateCode: week (~55) DateCode: year (~9) Figure.5 Flat TO-9 Chip Marking pec ensing Center Figure.6 Flat TO-9 Package Drawing ymbol Dimensions in Millimeters Dimensions in Inches Min Max Min Max A.4.6.56.64 A.66.86.6.4 b.5.48..9 b.4.5.6. c..5.. D.9 4..54.6 D.8.68.9.6 E.5.5..8 e.7 TYP.5 TYP e.44.64.96.4 L 4.5 4.75.565.58 θ 45 TYP 45 TYP x.5 TYP.8 TYP y.545 TYP.6 TYP z.5 TYP. TYP.
MT8X.4 Flat TO-9 Package Information (Radial Lead) XXXX YWW XXXX Product ID YWW DateCode: week (~55) DateCode: year (~9) Figure.7 Flat TO-9 (Radial Lead) Chip Marking pec ensing Center Figure.8 Flat TO-9 (Radial Lead) Package Drawing ymbol Dimensions in Millimeters Dimensions in Inches Min Max Min Max A.4.6.56.64 A.66.86.6.4 b.5.48..9 b.4.5.6. c..5.. D.9 4..54.6 D.8.68.9.6 E.5.5..8 e.54 TYP. TYP e 5. TYP.97 TYP L. TYP.79 TYP L.88 TYP.546 TYP θ 45 TYP 45 TYP x.5 TYP.8 TYP y.545 TYP.6 TYP z.5 TYP. TYP.
MT8X.5 OT-89B Package Information XXXX XXXX YWW YWW Product ID DateCode: week (~55) DateCode: year (~9) Figure.9 OT-89B Chip Marking pec ensing Center Figure. OT-89B Package Drawing ymbol Dimensions in Millimeters Dimensions in Inches Min Max Min Max A..4.48.56 A....4 b..5.. c.5.5.. D 4.4 4.6.7.8 b.6.8.6.7 E.4.6.94. HE 4. 4.4.57.7 e.4.6.55.6 L.5.55.4. x.5 TYP.89 TYP y.5 TYP.49 TYP z. TYP. TYP.