HCPL-0L/00L/L/0L Low Input Current, High Gain, LVTTL/LVCMOS Compatible Optocouplers Data Sheet Description These high gain series couplers use a Light Emitting Diode and an integrated high gain photodetector to provide extremely high current transfer ratio between input and output. Separate pins for the photodiode and output stage result in LVTTL compatible saturation voltages and high speed operation. Where desired, the V CC and terminals may be tied together to achieve conventional photo-darlington operation. A base access terminal allows a gain bandwidth adjustment to be made. These optocouplers are for use in LVTTL/LVCMOS or other low power applications. A 00% minimum current transfer ratio is guaranteed over 0 to +0 C operating range for only 0. ma of LED current. The HCPL-00L and HCPL-0L are surface mount devices packaged in an industry standard SOIC- footprint. The SOIC- does not require "through holes" in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes. Functional Diagram Features.V/V Dual Supply Voltages Low power consumption High current transfer ratio Low input current requirements 0. ma LVTTL/LVCMOS compatible output Performance guaranteed over temperature 0 C to +0 C Base access allows gain bandwidth adjustment High output current 0 ma Safety approval, UL, IEC/EN/DIN EN 0--, CSA Applications Ground isolate most logic families LVTTL/LVCMOS Low input current line receiver High voltage insulation EIA RS-C line receiver Telephone ring detector V AC line voltage status indicator low input power dissipation Low power systems ground isolation HCPL-0L/00L HCPL-L/0L NC V CC ANODE V CC ANODE V B CATHODE CATHODE CATHODE NC GND ANODE GND TRUTH TABLE LED ON LOW OFF HIGH SHIELD A 0. µf bypass capacitor connected between pins and is recommended. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
Ordering Information HCPL-0L, HCPL-L, HCPL-00L and HCPL-0L are UL Recognized with 0 Vrms for minute per UL and are approved under CSA Component Acceptance Notice #, File CA. Option Part RoHS non RoHS Surface Gull Tape UL 000 Vrms/ IEC/EN/DIN Number Compliant Compliant Package Mount Wing & Reel Minute rating EN 0-- Quantity -000E no option 00 mil DIP- 0 per tube HCPL-0L -00E -00 X X 0 per tube HCPL-L -00E -00 X X X 000 per reel -00E -00 X 00 per tube -0E -0 X X X X 00 per reel -000E no option SO- X 00 per tube HCPL-00L -00E -00 X X 00 per reel HCPL-0L -00E -00 X X 00 per tube -0E -0 X X X 00 per reel To order, choose a part number from the part number column and combine with the desired option from the option column to form an order entry. Example : HCPL-L-00E to order product of 00 mil DIP Gull Wing Surface Mount package in Tape and Reel packaging with IEC/EN/DIN EN 0-- Safety Approval and RoHS compliant. Example : HCPL-L to order product of 00 mil DIP package in Tube packaging and non RoHS compliant. Option datasheets are available. Contact your Avago sales representative or authorized distributor for information. Remarks: The notation #XXX is used for existing products, while (new) products launched since July, 00 and RoHS compliant will use XXXE.
Selection Guide -Pin DIP (00 Mil) Small Outline SO- Single Channel Dual Channel Single Channel Dual Channel Minimum Input Package HCPL- Package HCPL- Package HCPL- Package HCPL- ON Current ( ) Minimum CTR 0L L 00L 0L 0. ma 00% Schematic V CC + I CC VCC I CC ANODE + V F - CATHODE I O V F - I O GND - I O SHIELD I B V B V F + SHIELD GND USE OF A 0. µf BYPASS CAPACITOR CONNECTED BETWEEN PINS AND IS RECOMMENDED HCPL-0L/HCPL-00L HCPL-L/HCPL-0L
UR Package Outline Drawings -Pin DIP Package 9. ± 0. (0.0 ± 0.00). ± 0. (0.00 ± 0.00) TYPE NUMBER A XXXXZ OPTION CODE* DATE CODE. ± 0. (0.0 ± 0.00) YYWW UL RECOGNITION.9 (0.0) MAX.. ± 0. (0.0 ± 0.00). (0.00) MAX..0 (0.) MAX. + 0.0 TYP. 0. - 0.0 (0.00 + 0.00) - 0.00).9 (0.) MIN. 0. (0.00) MIN..00 ± 0.0 (0.0 ± 0.0) Small Outline SO- Package TYPE NUMBER (LAST DIGITS) 0. (0.0) MAX.. ± 0. (0.00 ± 0.00) OPTION 00 CODE DIMENSIONS IN MILLIMETERS AND (INCHES). * MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 00 "V" = OPTION 00 OPTION NUMBERS 00 AND 00 NOT MARKED. NOTE: FLOATING LEAD PROTRUSION IS 0. mm (0 mils) MAX. LAND PATTERN RECOMMENDATION.9 ± 0. (0. ± 0.00) XXXV YWW.99 ± 0.0 (0. ± 0.00) DATE CODE.9 (0.9) PIN ONE 0.0 ± 0.0 (0.0 ± 0.00).0 (0.00) BSC.9 (0.0) *.00 ± 0. (0.00 ± 0.00) X 0. (0.0) 0. (0.0). ± 0. (0. ± 0.00). (0.00) 0 ~ 0. ± 0.0 (0.009 ± 0.00) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH).0 ± 0. (0.0 ± 0.00) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.0 mm (0.00 INCHES) MAX. OPTION NUMBER 00 NOT MARKED. NOTE: FLOATING LEAD PROTRUSION IS 0. mm ( mils) MAX. 0.0 (0.0) MIN. 0.0 ± 0.0 (0.00 ± 0.00)
Solder Reflow Temperature Profile TEMPERATURE ( C) 00 00 PREHEATING RATE C + C/-0. C/SEC. REFLOW HEATING RATE. C ± 0. C/SEC. 0 C 0 C 0 C C + C/-0. C. C ± 0. C/SEC. PEAK TEMP. C 0 SEC. 0 SEC. SOLDERING TIME 00 C PEAK TEMP. 0 C PEAK TEMP. 0 C 00 PREHEATING TIME 0 C, 90 + 0 SEC. 0 SEC. ROOM TEMPERATURE 0 0 TIME (SECONDS) TIGHT TYPICAL LOOSE 0 00 0 00 0 Note: Non-halide flux should be used. Recommended Pb-Free IR Profile TEMPERATURE T p T L T smax T smin C 0-00 C RAMP-UP C/SEC.MAX. 0+0/- C t p TIMEWITHIN CofACTUAL PEAKTEMPERATURE 0-0SEC. RAMP-DOWN C/SEC.MAX. t s PREHEAT 0to0SEC. t L 0to0SEC. t CtoPEAK TIME NOTES: THE TIME FROM C to PEAK TEMPERATURE = MINUTES MAX. T smax = 00 C, T smin = 0 C Note: Non-halide flux should be used. Regulatory Information The devices contained in this data sheet have been approved by the following organizations: UL Approval under UL, Component Recognition Program, File E. CSA Approval under CSA Component Acceptance Notice #, File CA. IEC/EN/DIN EN 0-- Approved under IEC 0--:99 + A:00 EN 0--:00 + A:00 DIN EN 0-- (VDE 0 Teil ):00-0 (Option 00 only)
Insulation and Safety Related Specifications -Pin DIP (00 Mil) SO- Parameter Symbol Value Value Units Conditions Minimum External Air L (0)..9 mm Measured from input terminals to output Gap (External Clearance) terminals, shortest distance through air. Minimum External Tracking L (0).. mm Measured from input terminals to output (External Creepage) terminals, shortest distance path along body. Minimum Internal Plastic 0.0 0.0 mm Through insulation distance, conductor to Gap (Internal Clearance) conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Tracking Resistance CTI 00 00 Volts DIN IEC /VDE 00 Part. (Comparative Tracking Index) Isolation Group IIIa IIIa Material Group (DIN VDE 00, /9, Table ). IEC/EN/DIN EN 0-- Insulation Related Characteristics -pin DIP Description Symbol (00 mil) SO- Units Installation classification per DIN VDE 00/.9, Table for rated mains voltage 0 V rms I-IV for rated mains voltage 00 V rms I-IV I-III for rated mains voltage 00 V rms I-III I-II Climatic Classification /00/ /00/ Pollution Degree (DIN VDE 00/.9) Maximum Working Insulation Voltage V IORM 0 V peak Input to Output Test Voltage, Method b* V PR =. x V IORM, 00% Production Test with t P = sec, V PR 0 V peak Partial Discharge < pc Input to Output Test Voltage, Method a* V PR =. x V IORM, Type and Sample Test, V PR 9 9 V peak t P = 0 sec, Partial Discharge < pc Highest Allowable Overvoltage* V IOTM 000 000 V peak (Transient Overvoltage, t ini = 0 sec) Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure, Thermal Derating curve.) Case Temperature T S 0 C Current (Input Current, P S = 0) I S,INPUT 00 0 ma Output Power P S,OUTPUT 00 00 mw Insulation Resistance at T S, V IO = 00 V R S 0 9 0 9 Ω *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN 0--, for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
Absolute Maximum Ratings (No Derating Required up to + C) Parameter Symbol Min. Max. Units Storage Temperature T S C Operating Temperature T A 0 C Average Forward Input Current (AVG) 0 ma Peak Forward Input Current (PEAK) 0 ma (0% Duty Cycle, ms Pulse Width) Peak Transient Input Current (TRAN).0 A (< µs Pulse Width, 00 pps) Reverse Input Voltage V R V Input Power Dissipation P I mw Output Current (Pin ) I O 0 ma Emitter Base Reverse Voltage (Pin -) V EB 0. V Supply Voltage and Output Voltage V CC 0. V Output Power Dissipation P O 00 mw Total Power Dissipation P T mw Lead Solder Temperature (for Through Hole Devices) Reflow Temperature Profile (for SOIC- and Option #00) 0 C for 0 sec.,. mm below seating plane. See Package Outline Drawings section. Recommended Operating Conditions Parameter Symbol Min. Max. Units Power Supply Voltage V CC..0 V Forward Input Current (ON) (ON) 0..0 ma Forward Input Voltage (OFF) V F(OFF) 0 0. V Operating Temperature T A 0 0 C
Electrical Specifications 0 C T A +0 C,. V V CC. V, 0. ma (ON) ma, 0 V V F(OFF) 0. V, unless otherwise specified. All typicals at T A = C. (See Note.) Device Parameter Sym. HCPL- Min. Typ.* Max. Units Test Conditions Fig. Note Current Transfer CTR 00 00 000 % = 0. ma V CC =. V, Ratio = 0. V Logic Low L 0.0 0. V =. ma, V CC =. V Output Voltage I O = ma 0.0 0. V =.0 ma, I O = ma Logic High I OH µa = V CC =. V = 0 ma Output Current Logic Low I CCL 0L/00L 0.. ma V CC =. V = =. ma Supply Current L/0L 0.. ma = = Open Logic High I CCH 0L/00L 0.00 µa V CC =. V = = 0 ma Supply Current L/0L 0.00 µa = = Open Input Forward V F.. V T A = C =. ma, Voltage Input Reverse BV R.0 V I R = 0 µa, Breakdown Voltage T A = C Temperature Coefficient VF/ -. mv/ C =. ma of Forward Voltage TA Input Capacitance C IN 0 pf f = MHz, V F = 0 *All typical values at T A = C and V CC =. V, unless otherwise noted. Electrical Specifications 0 C T A 0 C,. V V CC V, 0. ma (ON) ma, 0 V V F(OFF) 0. V, unless otherwise specified. All Typicals at T A = C. (See note.) Parameter Sym. Device Min. Typ.* Max. Units Test Conditions Fig. Note Current Transfer Ratio CTR 00 00 00 % =. ma, V CC =.V, = 0.V, Logic Low Output Voltage L 0. 0. V =. ma, I O =. ma, V CC =.V Logic High Output Current I OH 0. 0 μa = V CC = V, = 0 ma Logic Low I CCL 0.9 ma V CC = V, = =. ma Supply Current V 0 = V 0 = Open Logic High I CCH 0.00 0 μa V CC = V, = = 0 ma, Supply Current V 0 = V 0 = Open Input Forward Voltage V F.. V T A = C. V =. ma Input Reverse BV R V I R = 0 μa, T A = C Breakdown Voltage Temperature Coefficient VF/ -. mv/ C =. ma of Forward Voltage TA Input Capacitance C IN 0 pf f = MHz, V F = 0 *All typical values at T A = C and V CC = V, unless otherwise noted.
Switching Specifications (AC) Over Recommended Operating Conditions (T A = 0 C to +0 C), V CC =. V, unless otherwise specified. (See Note.) Parameter Sym. Min. Typ.* Max. Units Test Conditions Fig. Note Propagation Delay t PHL 0 µs = 0. ma, Rl =. kω Time to Logic Low at Output Propagation Delay t PLH 90 µs = 0. ma, R L =. kω Time to Logic High at Output Common Mode CM H 000 0000 V/µs = 0 ma, T A = C,,, Transient Immunity Rl =. kω at Logic High V CM = 0 V p-p Level Output Common Mode CM L 000 0000 V/µs =. ma, T A = C,,, Transient Immunity Rl =. kω at Logic Low V CM = 0 V p-p Level Output *All typical values at T A = C and V CC =. V, unless otherwise noted. Switching Specifications (AC) Over recommended operating conditions (T A = 0 C to 0 C), V CC = V, unless otherwise specified. (See note.) Parameter Sym. Min. Typ.* Max. Units Test Conditions Fig. Note Propagation Delay t PHL =. ma, R L =. kω,,, 9 Time to LogicLow at Output Propagation Delay t PLH 0 =. ma, R L =. kω,, 9 Time to Logic High at Output Common Mode Transient CM H 000 0000 V/μs = 0 ma, T A = C, 0,, Immunity at Logic R L =. kω High Output V CM = 0 Vp-p Common Mode Transient CM H 000 0000 V/μs =. ma, T A = C, 0,, Immunity at Logic R L =. kω Low Output V CM = 0 Vp-p *All typical values at T A = C and V CC = V, unless otherwise noted. 9
Package Characteristics Parameter Sym. Device HCPL- Min. Typ.* Max. Units Test Conditions Fig. Note Input-Output V ISO 0 V rms RH 0%,, 9 Momentary t = min., Withstand T A = C Voltage** Resistance R I-O 0 Ω V I-O = 00 Vdc (Input-Output) RH % Capacitance C I-O 0. pf f = MHz (Input-Output) Input-Input I I-I 0.00 µa RH % Insulation V I-I = 00 Vdc Leakage Current Input-Input R I-I 0 Ω Insulation Leakage Current Capacitance C I-I 0L 0.0 pf (Input-Input) L 00L 0. 0L *All typical values at TA = C, unless otherwise noted. **The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 0-- Insulation Characteristics Table (if applicable), your equipment level safety specification or Avago Application Note 0 entitled "Optocoupler Input-Output Endurance Voltage." Notes:. Pin should be the most negative voltage at the detector side.. Each channel.. DC CURRENT TRANSFER RATIO (CTR) is defined as the ratio of output collector current, I O, to the forward LED input current,, times 00%.. Device considered a two-terminal device: pins,,, and shorted together, and pins,,, and shorted together.. Measured between pins and shorted together, and pins and shorted together.. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dv CM /dt of the common mode pulse, V CM, to assure that the output will remain in a Logic High state (i.e., >.0 V). Common mode transient immunity in a Logic Low level is the maximum tolerable (negative) dv CM /dt of the common mode pulse, V CM, to assure that the output will remain in a Logic Low state (i.e., < 0. V).. In applications where dv/dt may exceed 0,000 V/µs (such as static discharge) a series resistor, R CC, should be included to protect the detector IC from destructively high surge currents. The recommended value is R CC = 0 Ω.. Use of a 0. µf bypass capacitor connected between pins and adjacent to the device is recommended. 9. In accordance with UL, each optocoupler is proof tested by applying an insulation test voltage > 00 V rms for second (leakage detection current limit, I I-O < µa). 0. In accordance with UL, each optocoupler is proof tested by applying an insulation test voltage > 000 V rms for second (leakage detection current limit, I I-O < µa).. Measured between the LED anode and cathode shorted together and pins through shorted together.. Derate linearly above C free-air temperature at a rate of. mw/ C for the SO- package. 0
CTR - CURRENT TRANSFER RATIO - % 000 00 00 00 00 C V CC =. V = 0. V 0 C C 0 C -0 C CTR - CURRENT TRANSFER RATIO - % 00 000 00 000 00 V CC =.0 V = 0. V T A = 0 C T A = C T A = 0 C T A = C T A = -0 C I O - OUTPUT CURRENT - ma 00 0.0 0. T A = C T A = 0 C T A = C T A = 0 C T A = -0 C 0 0..0 0 0 0..0 0 0.0 0.0 0. 0 - FORWARD CURRENT - ma - FORWARD CURRENT - ma - INPUT DIODE FORWARD CURRENT - ma Figure. Current transfer ratio vs. forward current Figure. Current transfer ratio vs. forward current Figure. Output current vs. input diode forward current I O - OUTPUT CURRENT - ma 00 0.0 V CC =.0 V = 0. V T A = C T A = C T A = -0 C - FORWARD CURRENT - ma 000 00 0.0 0. 0.0 + V F - T A = C T A = 0 C T A = C T A = 0 C V F - FORWARD VOLTAGE - V.... =. ma 0. 0. 0 0.00.... T A = -0 C... -0-0 -0 0 0 0 0 0 00 - INPUT DIODE FORWARD CURRENT - ma V F - FORWARD VOLTAGE - V T A - TEMPERATURE - C Figure. Output current vs. input diode forward current Figure. Input diode forward current vs. forward voltage Figure. Forward voltage vs. temperature 0. V PULSE GEN. Z O = 0 W t r= ns R L. V (SATURATED RESPONSE) t PHL 0% 0% L t PLH 0% DUTY CYCLE I/f < 00 µs I MONITOR F 0. µf C L = pf* R M (NON-SATURATED RESPONSE) 90% 0% 0% 90%. V * INCLUDES PROBE AND FIXTURE CAPACITANCE t f tr Figure. Switching test circuit
V t PHL 0. V V L PULSE GEN. Z O = 0 W t r= ns I MONITOR F R M 0.µF R L + V C = pf L. V t PLH L Figure. Switching test circuit V CM 0 V 0 V 0% t r 90% 90% 0% t r, t f = ns tf A B R CC (SEE NOTE ) R L +. V SWITCH AT A: I = 0 ma F. V V FF SWITCH AT B: I =. ma F L V CM + - PULSE GEN. Figure 9. Test circuit for transient immunity and typical waveforms t r, t f = ns V CM 0 V 0% 90% 90% 0% 0 V t r t f V FF B A R CC (SEE NOTE ) 0 W 0. µf R L + V SWITCH AT A: I = 0 ma F V SWITCH AT B: I =. ma F L V CM + - PULSE GEN. Figure 0. Test circuit for transient immunity and typical waveforms For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright 00-00 Avago Technologies Limited. All rights reserved. Obsoletes AV0-0EN AV0-0EN - April, 00