19-1857; Rev ; 11/ EVALUATION KIT AVAILABLE General Description The low-power, 8-bit, dual-channel, analog-to-digital converters (ADCs) feature an internal track/hold (T/H) voltage reference (/), clock, and serial interface. The is specified from +2.7V to +5.5V and consumes only 135µA at 1ksps. The is specified from +2.7V to +3.6V, and the is specified from +4.5V to +5.5V, each consumes only 175µA at 1ksps. The full-scale analog input range is determined by the internal reference of +2.48V () or +4.96V (), or by an externally applied reference ranging from +1V to (). All devices feature an automatic shutdown mode that reduces supply current to <1µA when the device is not in use. The 3-wire serial interface directly connects to SPI, QSPI, and MICROWIRE devices without external logic. Conversions up to 1ksps are performed using an internal clock. The are available in an 8-pin SOT23 package with a footprint that is only 11% of an 8-pin plastic DIP. Applications Low-Power, Handheld Portable Devices System Diagnostics Battery-Powered Test Equipment Solar-Powered Remote Systems Receive Signal Strength Indicators 4mA to 2mA Powered Remote Data Acquisition Systems Features Single Supply +2.7V to +3.6V () +2.7V to +5.5V () +4.5V to +5.5V () Internal Track/Hold: 1kHz Sampling Rate Internal Reference +2.48V () +4.96V () Reference Input Range: to () SPI/QSPI/MICROWIRE-Compatible Serial Interface Small 8-Pin SOT23 Package Automatic Power-Down Analog Input Range: to V REF Low Power 175µA at 1ksps (typ) (/) 135µA at 1ksps (typ) () 18µA at 1ksps (typ) 1µA (typ) in Power-Down Mode PART Ordering Information TEMP. RANGE PIN- PA CK A G E TO P M A RK M A X1 1 1 7 EKA -4 C to +85 C 8 SOT23 AADW M A X1 1 1 8 E K A -4 C to +85 C 8 SOT23 AADX M A X1 1 1 9 E K A -4 C to +85 C 8 SOT23 AADY Pin Configuration TOP VIEW SPI/QSPI are trademarks of Motorola, Inc. MICROWIRE is a trademark of National Semiconductor, Corp. CHO CH1 1 2 3 4 8 7 6 5 (REF) I.C Functional Diagram appears at end of data sheet. ( ) ARE FOR ONLY SOT23 Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
ABSOLUTE MAXIMUM RATINGS to...-.3v to +6.V CH,CH1, REF to...-.3v to ( +.3V) Digital Output to...-.3v to ( +.3V) Digital Input to...-.3v to +6.V Maximum Current into Any Pin...±5mA Continuous Power Dissipation (T A = +7 C) 8-Pin SOT23 (derate 8.9mW/ C above +7 C)...714mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS ( = +2.7V to +3.6V (), = +4.5V to +5.5V (), = REF = +2.7V to +5.5V (),T A = T MIN to T MAX, unless otherwise noted.) DC ACCURACY Operating Temperature Range EKA...-4 C to + 85 C EKA...-4 C to + 85 C EKA...-4 C to + 85 C Storage Temperature Range...-6 C to +15 C Lead Temperature (soldering, 1s)...+3 C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Resolution 8 Bits Relative Accuracy (Note 1) INL ±1 LSB Differential Nonlinearity DNL ±1 LSB Offset Error ±.5 LSB Gain Error Gain Temperature Coefficient, REF = ±1 LSB / ±5 %FSR ±5 / ±9 Total Unadjusted Error TUE ±.5 ±1 LSB ppm/ C Channel-to-Channnel Offset Matching ±.1 LSB DYNAMIC PERFORMANCE (25kHz sinewave input, V IN = V REF(pp), f = 5MHz, f sample = 1ksps, R IN = 1Ω) Signal-to-Noise Plus Distortion SINAD 48 db Total Harmonic Distortion (Up to the 5th Harmonic) THD -69 db Spurious-Free Dynamic Range SFDR 66 db Small Signal Bandwidth f -3dB 4 MHz ANALOG INPUT Input Voltage Range V REF V Input Leakage Current V CH _ = or ±.7 ±1 µa Input Capacitance C IN 18 pf INTERNAL REFERENCE 2.48 Voltage V REF 4.96 V 2
ELECTRICAL CHARACTERISTICS (continued) ( = +2.7V to +3.6V (), = +4.5V to +5.5V (), = REF = +2.7V to +5.5V (),T A = T MIN to T MAX, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS EXTERNAL REFERENCE ( ONLY) Input Voltage Range 1. V Input Current Ave, = REF = +5.5V at 1ksps 1 2 µa POWER REQUIREMENTS 2.7 5.5 2.7 5.5 Supply Voltage 4.5 5.5 Supply Current (Note 2) I DD, f SAMPLE = 1ksps, zero-scale input /, f SAMPLE = 1ksps, zero-scale input, f SAMPLE = 1ksps, zero-scale input /, f SAMPLE = 1ksps, zero-scale input 182 23 135 19 19 25 14 21 Shutdown.8 1 Supply Rejection Ratio PSRR Full-scale or input ±.5 ±1 LSB/V DIGITAL INPUTS ( AND ) Input High Voltage V IH 2 V Input Low Voltage V IL.8 V Input Hystersis V HYST V Input Current High I IH ±1 µa Input Current Low I IL ±1 µa Input Capacitance C IN 2 pf DIGITAL OUTPUT () Output High Voltage V OH I SOURCE = 2mA -.5 V I SINK = 2mA V Output Low Voltage V OL I SINK = 4mA.8 V V µa Three-State Leakage Current I L ±.1 ±1 µa Three-State Output Capacitance C OUT 4 pf TIMING CHARACTERISTICS (Figures 6a 6d) High Time t csh 1 ns Low Time t csi 1 ns Conversion Time t conv 7.5 µs Serial Clock High Time t ch 75 ns Serial Clock Low Time t cl 75 ns Serial Clock Period t cp 2 ns Falling of to Active t csd C LOAD = 1pF, Figure 1 1 ns 3
ELECTRICAL CHARACTERISTICS (continued) ( = +2.7V to +3.6V (), = +4.5V to +5.5V (), = REF = +2.7V to +5.5V (),T A = T MIN to T MAX, unless otherwise noted.) Typical Operating Characteristics ( = +3V (), = +5V (), = V REF = +3V (), f = 5MHz, f SAMPLE = 1ksps, C LOAD = 1pF, T A = +25 C, unless otherwise noted.) INL (LSB) 1..8.6 - - -.6 -.8-1. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Serial Clock Falling Edge to Serial Clock Rising Edge to High-Z Last Serial Clock to Next (Successive Conversions on CH) INTEGRAL NONLINEARITY vs.output CODE 5 1 15 2 25 3 OUTPUT CODE /18/19 toc1 t cd DNL (LSB) C LOAD = 1pF 1..8.6 - - -.6 -.8-1. DIFFERENTIAL NONLINEARITY vs.output CODE 5 1 15 2 25 3 OUTPUT CODE /18/19 toc2 SHUTDOWN CURRENT (μa).7.6.5.3.1 1 1 t chz C LOAD = 1pF, Figure 2 1 5 ns t ccs 5 ns Note 1: Relative accuracy is the deviation of the analog value at any code from its theoretical value after the full-scale range and offset have been calibrated. Note 2: Input =, with logic input levels of and. SHUTDOWN SUPPLY CURRENT vs. SUPPLY VOLTAGE ns 2.5 3.5 4.5 5.5 /18/19 toc3 SUPPLY CURRENT (μa) SUPPLY CURRENT vs. CONVERSION RATE 1. = V REF = V DIGITAL 1. = +5V 1. = +3V /18/19 toc4 SUPPLY CURRENT (μa) SUPPLY CURRENT vs. SUPPLY VOLTAGE 16 14 12 11 8 6 4 2 D OUT = = V REF = V DIGITAL INPUTS /18/19 toc5 SUPPLY CURRENT (μa) 15 1 5 SUPPLY CURRENT vs. TEMPERATURE = +5V = +3V D OUT = = V REF = V DIGITAL INPUTS /18/19 toc6.1.1.1 1 1 1 CONVERSION (ksps) 2.5 3.5 4.5 5.5-4 -15 1 35 6 85 TEMPERATURE ( C) 4
Typical Operating Characteristics (continued) ( = +3V (), = +5V (), = V REF = +3V (), f = 5MHz, f SAMPLE = 1ksps, C LOAD = 1pF, T A = +25 C, unless otherwise noted.) SUPPLY CURRENT (μa) CONVERSION TIME (μs) / SUPPLY CURRENT vs. CONVERSION RATE 1. 1. 1. = +5V.1.1.1 1 1 1 5.5 5.4 5.3 5.2 5.1 CONVERSION (ksps) = +3V CONVERSION TIME vs. SUPPLY VOLTAGE /18/19 toc7 /18/19 toc11 SUPPLY CURRENT (μa) CONVERSION TIME (μs) 2 15 1 5 / SUPPLY CURRENT vs. SUPPLY VOLTAGE D OUT = = V DIGITAL INPUTS 2.5 3.5 4.5 5.5 5.5 5.4 5.3 5.2 5.1 CONVERSION TIME vs. TEMPERATURE = +3V = +5V /18/19 toc8 /18/19 toc12 SUPPLY CURRENT (μa) AMPLITUDE (db) 2 15 1 5-2 -4-6 -8-1 / SUPPLY CURRENT vs. TEMPERATURE VDD = +3V D OUT = = V DIGITAL INPUTS VDD = +5V -4-15 1 35 6 85 TEMPERATURE (V) FFT PLOT /18/19 toc9 /18/19 toc13 5. 2.5 3.5 4.5 5.5 5. -4-15 1 35 6 85 TEMPERATURE ( C) -12 1k 2k 3k 4k 5k ANALOG INPUT FREQUENCY (Hz) GAIN ERROR (LSB) - GAIN ERROR vs. SUPPLY VOLTAGE V REF = 2.48V /18/19 toc14 GAIN ERROR (LSB).5.3.1 -.1 - -.3 GAIN ERROR vs. TEMPERATURE = +3V V REF = 2.48V /18/19 toc15 GAIN ERROR (LSB) - - -.6 -.8 GAIN ERROR vs. REFERENCE VOLTAGE = +5.5V /18/19 toc16 - - 2.5 3.5 4.5 5.5 -.5-4 -15 1 35 6 85 TEMPERATURE ( C) -1. 1 2 3 4 5 REFERENCE VOLTAGE (V) 5
Typical Operating Characteristics (continued) ( = +3V (), = +5V (), = V REF = +3V (), f = 5MHz, f SAMPLE = 1ksps, C LOAD = 1pF, T A = +25 C, unless otherwise noted.) OFFSET ERROR (LSB) GAIN ERROR (%FSR).5.3.1 -.1 - -.3 - -.5 1.4 1.2 1..8.6 OFFSET ERROR vs. SUPPLY VOLTAGE V REF = 2.48V 2.5 3. 3.5 4. 4.5 5. 5.5 / GAIN ERROR vs. SUPPLY VOLTAGE = +3V = +5V /18/19 toc17 /18/19 toc2 OFFSET ERROR (LSB) GAIN ERROR (%FSR).5.3.1 -.1 - -.3 - -.5 2. 1.5 1..5 -.5-1. -1.5 OFFSET ERROR vs. TEMPERATURE = +3V V REF = 2.48V -4-15 1 35 6 85 TEMPERATURE ( C) / GAIN ERROR vs. TEMPERATURE = +3V MAX1116 = +5V /18/19 toc18 /18/19 toc21 OFFSET ERROR (LSB) AMPLITUDE (db).5.3.1 -.1 - -.3 - -.5-2 -4-6 -8-1 OFFSET ERROR vs. REFERENCE VOLTAGE = 5.5V 1 2 3 4 5 REFERENCE VOLTAGE (V) FFT PLOT f SAMPLE = 1kHz f IN = 25.1kHz A IN =.9 x V REFp-p /18/19 toc19 /18/19 toc22 2.5 3.5 4.5 5.5-2. -4-15 1 35 6 85 TEMPERATURE ( C) -12 1k 2k 3k 4k 5k ANALOG INPUT FREQUENCY (Hz) OFFSET ERROR (LSB).5.3.1 -.1 - -.3 - -.5 / OFFSET ERROR vs. SUPPLY VOLTAGE VDD = +3V VDD = +5V 2.5 3. 3.5 4. 4.5 5. 5.5 /18/19 toc23 OFFSET ERROR (LSB).5.3.1 -.1 - -.3 - -.5 / OFFSET ERROR vs. TEMPERATURE VDD = +3V VDD = +5V -4-15 1 35 6 85 TEMPERATURE ( C) /18/19 toc24 6
Typical Operating Characteristics (continued) ( = +3V (), = +5V (), = V REF = +3V (), f = 5MHz, f SAMPLE = 1ksps, C LOAD = 1pF, T A = +25 C, unless otherwise noted.) 21.% 17.5% 14.% 1.5% 7.% 3.5% REFERENCE VOLTAGE vs. NUMBER OF PIECES 3.98 4.2 4.6 4.1 4.14 4.18 REFERENCE VOLTAGE (V) MAX1115 toc25 21.% 17.5% 14.% 1.5% PIN NAME FUNCTION 1 VDD Positive Supply Voltage 2 CH CH Analog Voltage Input 3 CH1 CH1 Analog Voltage Input 4 Ground 7.% 3.5% REFERENCE VOLTAGE vs. NUMBER OF PIECES 1.982 2.8 2.34 2.6 2.86 2.112 REFERENCE VOLTAGE (V) 5 I.C.(REF) Internally Connected. Connect to ground. (Reference Input, only.) /18/19 toc26 Pin Description 6 Convert/Start Input. initiates a power-up and starts a conversion on its falling edge. 7 Serial Data Output. Data is clocked out on the falling edge of. goes low at the start of a conversion and presents the MSB at the completion of a conversion. goes high impedance once data has been fully clocked out. 8 Serial Clock. Used for clocking out data on. 7
ANALOG INPUTS 1μF 3kΩ CH CH1 REF*.1μF 1μF C LOAD 3kΩ C LOAD a) V OL TO V OH b) HIGH-Z to V OL AND V OH to V OL Figure 1. Load Circuits for Enable Time CPU I/O SCK (SK) MISO (SI) CH CH1 3kΩ CAPACITIVE DAC C HOLD 16pF HOLD C LOAD R IN 6.5kΩ TRACK 3kΩ C LOAD a) V OH TO HIGH-Z b) V OL TO HIGH-Z Figure 2. Load Circuits for Disable Time COMPARATOR * ONLY AUTOZERO RAIL Figure 3. Typical Operating Circuit Figure 4. Equivalent Input Circuit Detailed Description The ADCs use a successive-approximation conversion technique and input T/H circuitry to convert an analog signal to an 8-bit digital output. The SPI/QSPI/MICROWIRE compatible interface directly connects to microprocessors (µps) without additional circuity (Figure 3). Track/Hold The input architecture of the ADC is illustrated in Figure 4 s equivalent-input circuit and is composed of the T/H, the input multiplexer, the input comparator, the switched capacitor DAC, and the auto-zero rail. The acquisition interval begins with the falling edge of. During the acquisition interval, the analog inputs (CH, CH1) are connected to the holding capacitor (C HOLD ). Once the acquisition has completed, the T/H switch opens and C HOLD is connected to, retaining the charge on C HOLD as a sample of the signal at the analog input. Sufficiently low source impedance is required to ensure an accurate sample. A source impedance <1.5kΩ is recommended for accurate sample settling. A 1pF capacitor at the ADC inputs will also improve the accuracy of an input sample. Conversion Process The conversion process is internally timed. The total acquisition and conversion process takes <7.5µs. Once an input sample has been acquired, the comparator s negative input is then con- 8
nected to an autozero supply. Since the device requires only a single supply, the negative input of the comparator is set to equal /2. The capacitive DAC restores the positive input to /2 within the limits of 8- bit resolution. This action is equivalent to transferring a charge QIN = 16pF x V IN from C HOLD to the binaryweighted capacitive DAC, which in turn forms a digital representation of the analog-input signal. Input Voltage Range Internal protection diodes that clamp the analog input to and allow the input pins (CH, CH1) to swing from ( -.3V) to ( +.3V) without damage. However, for accurate conversions, the inputs must not exceed ( + 5mV) or be less than ( - 5mV). Input Bandwidth The ADC s input tracking circuitry has a 4MHz smallsignal bandwidth, so it is possible to digitize highspeed transient events and measure periodic signals with bandwidths exceeding the ADC s sampling rate by using undersampling techniques. To avoid high-frequency signals being aliased into the frequency band of interest, anti-alias filtering is recommended. Serial Interface The have a 3-wire serial interface. The and inputs are used to control the device, while the three-state pin is used to access the conversion results. The serial interface provides connection to microcontrollers (µcs) with SPI, QSPI, and MICROWIRE serial interfaces at clock rates up to 5MHz. The interface supports either an idle high or low format. For SPI and QSPI, set CPOL = CPHA = or CPOL = CPHA = 1 in the SPI control registers of the µc. Figure 5 shows the common serial-interface connections. See Figures 6a 6d for details on the serial interface timing and protocol. Digital Inputs and Outputs The perform conversions using an internal clock. This frees the µp from the burden of running the SAR conversion clock and allows the conversion results to be read back at the µp s convenience at any clock rate up to 5MHz. The acquisition interval begins with the falling edge of. can idle between conversions in either a high or low state. If idled in a low state, must be brought high for at least 5ns, then brought low to initiate a conversion. To select CH1 for conversion, the pin must be brought high and low for a second time (Figures 6c and 6d). After is brought low, allow 7.5μs for the conversion to be completed. While the internal conversion is in progress, is low. The MSB is present at the pin immediately after conversion is completed. The conversion result is clocked out at the pin and is coded in straight binary (Figure 7). Data is clocked out at s falling edge in MSB-first format at rates up to 5MHz. Once all data bits are clocked out, goes high impedance (1ns to 5ns after the rising edge) of the eighth pulse. a) SPI b) QSPI c) MICROWIRE I/O SCK MISO SS CS SCK MISO SS I/O SK SI +3V +3V Figure 5. Common Serial-Interface Connections 9
ACTIVE POWER-DOWN MODE t csh CH CH t conv t ch t cp t ccs IDLE LOW IDLE LOW t csd t cd t cl t chz D7 (MSB) D6 D5 D4 D3 D2 D1 D Figure 6a. Conversion and Interface Timing, Conversion on CH with Idle Low ACTIVE POWER-DOWN MODE t csh CH CH IDLE HIGH t conv t ch t cp t ccs IDLE HIGH t csd t cd t cl t chz D7 (MSB) D6 D5 D4 D3 D2 D1 D Figure 6b. Conversion and Interface Timing, Conversion on CH with Idle High During the conversion process, is ignored. Only after a conversion is complete will cause serial data to be output. Falling edges on, during an active conversion process, interrupt the current conversion and cause the input multiplexer to switch to CH1. To reinitiate a conversion on CH, it is necessary to allow for a conversion to be complete and all of the data to be read out. Once a conversion has been completed, the will go into AutoShutdown mode (<1µA typ) until the next conversion is initiated. AutoShutdown is a trademark of Maxim Integrated Products. 1
ACTIVE POWER-DOWN MODE t csh t csl CH CH1 CH t conv t ch t cp t ccs IDLE LOW t csd t cd t cl t chz D OUT D7 (MSB) D6 D5 D4 D3 D2 D1 D Figure 6c. Conversion and Interface Timing, Conversion on CH1 with Idle Low ACTIVE POWER-DOWN MODE t csh t csl CH1 IDLE LOW CH CH1 CH CH1 t conv t ch t cp t ccs IDLE HIGH IDLE HIGH t csd t cd t cl t chz D OUT D7 (MSB) D6 D5 D4 D3 D2 D1 D Figure 6d. Conversion and Interface Timing, Conversion on CH1 with Idle High 11
11111111 1111111 1111111 OUTPUT CODE FULL-SCALE TRANSITION 11 1 1 1 2 3 INPUT VOLTAGE (LSB) FS FS - 1 1/2 LSB Figure 7. Input/Output Transfer Function FS = V REF 1LSB = V REF 256 Applications Information Power-On Reset When power is first applied, the // are in AutoShutdown state (<1μA typ). A conversion can be started by toggling high to low. Powering up the with low will not start a conversion. Conversions initiated prior to the external reference settling () will result in errors. Thus, it is necessary to allow the external reference to stabilize prior to initiating a conversion. AutoShutDown and Supply Current Requirements The are designed to automatically shutdown once a conversion is complete without any external control. An input sample and conversion process will typically take 5µs to complete, during which time the supply current to the analog sections of the device is fully on. All analog circuitry is shutdown after a conversion completes, which results in a supply current of <1µA (see Shutdown Current vs. Supply Voltage Plot in the Typical Operating Characteristics). The digital conversion result is maintained in a static register and is available for access through the serial interface at any time. The power consumption consequence of this architecture is dramatic when relatively slow conversion rates are needed. For example, at a conversion rate of 1ksps, the average supply current for the is *OPTIONAL SYSTEM POWER SUPPLIES 1μF.1μF Figure 8. Power-Supply Connections D +3V/+5V 15µA, while at 1ksps it drops to 1.5µA and at.1ksps it is just.3µa, or a miniscule 1µW of power consumption (see Average Supply Current vs. Conversion Rate Plot in the Typical Operating Characteristics). External Voltage Reference () Connect an external reference between +1V and at the REF pin. The DC input impedance at REF is extremely high, consisting of leakage current only (1nA typ). During a conversion, the reference must be able to deliver up to 2µA average load current and have an output impedance of 1Ω or less. If the reference has higher output impedance or is noisy, bypass it close to the REF pin with a 1nF or larger capacitor. Transfer Function Figure 7 depicts the input/output transfer function. Output coding is binary with a +2.48V reference 1LSB = 8mV (V REF /256). Layout, Grounding, Bypassing For best performance, the board layout should ensure that digital and analog signal lines are separated from each other. Do not run analog and digital (especially clock) lines parallel to one another or run digital lines underneath the ADC package. Figure 8 shows the recommended system-ground connections. A single-point analog ground (star-ground point) should be established at the ADC ground. Connect all analog grounds to the star ground. The ground return to the power supply for the star ground 1Ω* DIGITAL CIRCUITRY 12
CH CH1 INPUT MULTIPLEXER INPUT TRACK AND HOLD INTERNAL REFERENCE +2.96V OR +4.96V CONTROL LOGIC AND INTERNAL OCSILLATOR 8-BIT SAR ADC Functional Diagrams OUTPUT SHIFT REGISTER OUT should be low impedance and as short as possible for noise-free operation. High-frequency noise in the power supply may affect the comparator in the ADC. Bypass the supply to the star ground with a.1µf capacitor close to the pin of the. Minimize capacitor lead lengths for best supply-noise rejection. If the power supply is noisy, a 1µF capacitor in conjunction with a 1Ω series resistor can be connected to form a lowpass filter. Chip Information TRANSISTOR COUNT: 2 PROCESS: BiCMOS 13
Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) MARKING SOT23, 8L.EPS PACKAGE OUTLINE, SOT-23, 8L BODY 21-78 G 1 1 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 14 Maxim Integrated Products, 12 San Gabriel Drive, Sunnyvale, CA 9486 48-737-76 2 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.