Features. Description. AM01476v1. Table 1. Device summary. Order code Marking Packages Packaging. STF6N95K5 6N95K5 TO-220FP Tube

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N-channel 950 V, 1 Ω typ., 9 A MDmesh K5 Power MOSFET in a TO-220FP package Features Datasheet - production data Order code V DS R DS(on) max. I D P TOT STF6N95K5 950 V 1.25 Ω 9 A 25 W TO-220FP 1 2 3 Figure 1. Internal schematic diagram Industry s lowest R DS(on) * area Industry s best figure of merit (FoM) Ultra-low gate charge 100% avalanche tested Zener-protected Applications Switching applications G(1) D(2) Description This very high voltage N-channel Power MOSFET is designed using MDmesh K5 technology based on an innovative proprietary vertical structure. The result is a dramatic reduction in onresistance and ultra-low gate charge for applications requiring superior power density and high efficiency. S(3) AM01476v1 Table 1. Device summary Order code Marking Packages Packaging STF6N95K5 6N95K5 TO-220FP Tube September 2015 DocID026412 Rev 2 1/14 This is information on a product in full production. www.st.com

Contents STF6N95K5 Contents 1 Electrical ratings............................................ 3 2 Electrical characteristics..................................... 4 2.1 Electrical characteristics (curves)................................ 6 3 Test circuits.............................................. 9 4 Package mechanical data.................................... 10 5 Revision history........................................... 13 2/14 DocID026412 Rev 2

Electrical ratings 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit V GS Gate- source voltage ± 30 V I D Drain current (continuous) at T C = 25 C 9 (1) A I D Drain current (continuous) at T C = 100 C 6 (1) A (2) I DM Drain current (pulsed) 36 A P TOT Total dissipation at T C = 25 C 25 W I AR (3) E AS V ISO dv/dt (4) dv/dt (5) Max current during repetitive or single pulse avalanche Single pulse avalanche energy (starting T J = 25 C, I D =I AS, V DD = 50 V) Insulation withstand voltage (RMS) from all three leads to external heat sink (t=1 s; T C =25 C) T j Operating junction temperature T stg Storage temperature 1. Limited by package. 2. Pulse width limited by safe operating area. 3. Pulse width limited by T Jmax. 4. I SD 9 A, di/dt 100 A/µs, V DS(peak) V (BR)DSS 5. V DS 760 V 3 A 90 mj 2500 V Peak diode recovery voltage slope 4.5 V/ns MOSFET dv/dt ruggedness 50 V/ns - 55 to 150 C Table 3. Thermal data Symbol Parameter Value Unit R thj-case Thermal resistance junction-case max 5 C/W R thj-amb Thermal resistance junction-amb max 62.5 C/W DocID026412 Rev 2 3/14 14

Electrical characteristics STF6N95K5 2 Electrical characteristics (T CASE = 25 C unless otherwise specified) Table 4. On/off states Symbol Parameter Test conditions Min. Typ. Max. Unit V (BR)DSS I DSS Drain-source breakdown voltage Zero gate voltage drain current V GS = 0, I D = 1 ma 950 V V GS = 0, V DS = 950 V 1 µa V GS = 0, V DS = 950 V, Tc=125 C 50 µa I GSS Gate body leakage current V DS = 0, V GS = ± 20 V ±10 µa V GS(th) Gate threshold voltage V DS = V GS, I D = 100 µa 3 4 5 V R DS(on) Static drain-source on-resistance V GS = 10 V, I D = 3 A 1 1.25 Ω Table 5. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit C iss Input capacitance - 450 - pf C oss Output capacitance V GS =0, V DS =100 V, f=1 MHz - 30 - pf C rss Reverse transfer capacitance - 1.6 - pf C o(tr) (1) Equivalent capacitance time related V GS = 0, V DS = 0 to 760 V - 45 - pf (2) Equivalent capacitance C o(er) - 19 - pf energy related R G Intrinsic gate resistance f = 1MHz, I D =0-7 - Ω Q g Total gate charge V DD = 760 V, I D = 6 A, - 13 - nc Q gs Gate-source charge V GS =10 V, - 3 - nc Q gd Gate-drain charge (see Figure 16) - 7 - nc 1. Time related is defined as a constant equivalent capacitance giving the same charging time as C oss when V DS increases from 0 to 80% V DSS 2. energy related is defined as a constant equivalent capacitance giving the same stored energy as C oss when V DS increases from 0 to 80% V DSS 4/14 DocID026412 Rev 2

Electrical characteristics Table 6. Switching times Symbol Parameter Test conditions Min. Typ. Max. Unit t d(on) Turn-on delay time - 12 - ns t r Rise time V DD = 475 V, I D = 3 A, R G =4.7 Ω, V GS =10 V - 12 - ns t d(off) Turn-off delay time (see Figure 18) - 33 - ns t f Fall time - 21 - ns Table 7. Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit I SD Source-drain current - 9 A I SDM Source-drain current (pulsed) - 36 A V (1) SD Forward on voltage I SD = 6 A, V GS =0-1.6 V t rr Reverse recovery time I SD = 6 A, V DD = 60 V - 372 ns Q rr Reverse recovery charge di/dt = 100 A/µs, - 4 µc I RRM Reverse recovery current (see Figure 17) - 22 A t rr Reverse recovery time I SD = 6 A,V DD = 60 V - 522 ns Q rr Reverse recovery charge di/dt=100 A/µs, Tj=150 C - 5 µc I RRM Reverse recovery current (see Figure 17) - 20 A 1. Pulsed: pulse duration = 300µs, duty cycle 1.5% Table 8. Gate-source Zener diode Symbol Parameter Test conditions Min Typ. Max. Unit V (BR)GSO Gate-source breakdown voltage I GS = ± 1mA, I D =0 30 - - V The built-in back-to-back Zener diodes have specifically been designed to enhance the device's ESD capability. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device's integrity. These integrated Zener diodes thus avoid the usage of external components. DocID026412 Rev 2 5/14 14

Electrical characteristics STF6N95K5 2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Thermal impedance ID (A) 10 1 0.1 Operation in this area is Limited by max RDS(on) AM07106v1 Tj=150 C Tc=25 C Single pulse 10µs 100µs 1ms 10ms 0.01 0.1 1 10 100 VDS(V) Figure 4. Output characteristics Figure 5. Transfer characteristics ID (A) 12 10 VGS=10V AM07108v1 ID (A) 8 VDS=15V AM07109v1 8 7V 6 6 4 4 2 5V 6V 0 0 10 VDS(V) 2 5 15 20 25 Figure 6. Gate charge vs gate-source voltage VGS (V) 12 10 8 6 4 2 VDS AM07110v1 VDS (V) VDD=760V 700 ID=6A 600 500 400 300 200 100 0 0 0 2 4 6 8 10 12 14 Qg(nC) 0 0 4 VGS(V) 2 6 Figure 7. Static drain-source on-resistance AM07111v1 RDS(on) (Ohm) 1.03 VGS=10V 1.01 0.99 0.97 0.95 0.93 0.91 0.89 0.87 0.5 1.0 1.5 2.0 2.5 3.0 ID(A) 8 6/14 DocID026412 Rev 2

Electrical characteristics Figure 8. Capacitance variations Figure 9. Output capacitance stored energy C (pf) AM07112v1 Eoss (µj) 22 AM07113v1 20 1000 Ciss 18 16 100 14 12 10 10 Coss 8 6 1 0.1 1 10 100 VDS(V) Crss Figure 10. Normalized gate threshold voltage vs temperature 4 2 0 0 100 200 300 400 500 600 700 800 900 VDS(V) Figure 11. Normalized on-resistance vs temperature VGS(th) (norm) 1.2 1.1 ID=100 µa AM07114v1 RDS(on) (norm) 2.5 VGS=10V AM07115v1 1.0 2.0 0.9 0.8 1.5 0.7 1.0 0.6 0.5 0.4-75 -25 25 75 125 TJ( C) Figure 12. Source-drain diode forward characteristics 0.5 0-75 -25 25 75 125 TJ( C) Figure 13. Normalized V (BR)DSS vs temperature VSD (V) AM07118v1 V(BR)DSS (norm) ID=1 ma AM07116v1 0.95 TJ=-50 C 1.2 0.85 0.75 0.65 TJ=150 C TJ=25 C 1.1 1.0 0.9 0.8 0.55 2.0 3.0 4.0 5.0 6.0 ISD(A) 0.7-75 -25 25 75 125 TJ( C) DocID026412 Rev 2 7/14 14

Electrical characteristics STF6N95K5 Figure 14. Maximum avalanche energy vs starting Tj EAS (mj) 100 ID=3 A 90 VDD=50 V 80 70 60 50 40 30 20 AM07117v1 10 0 0 20 40 60 80 100 120 140 TJ( C) 8/14 DocID026412 Rev 2

Test circuits 3 Test circuits Figure 15. Switching times test circuit for resistive load Figure 16. Gate charge test circuit VDD VGS VD RG RL D.U.T. 2200 μf 3.3 μf VDD Vi=20V=VGMAX 2200 μf 12V IG=CONST 2.7kΩ 47kΩ 100Ω 100nF D.U.T. 1kΩ VG PW 47kΩ PW 1kΩ AM01468v1 AM01469v1 Figure 17. Test circuit for inductive load switching and diode recovery times Figure 18. Unclamped inductive load test circuit G 25 Ω D S A D.U.T. B A FAST DIODE B A B D L=100μH 3.3 1000 μf μf VDD VD ID L 2200 μf 3.3 μf VDD G RG S Vi D.U.T. AM01470v1 Pw AM01471v1 Figure 19. Unclamped inductive waveform Figure 20. Switching time waveform V(BR)DSS ton toff VD tdon tr tdoff tf ID IDM 0 90% 10% VDS 10% 90% VDD VDD VGS 90% AM01472v1 0 10% AM01473v1 DocID026412 Rev 2 9/14 14

Package mechanical data STF6N95K5 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 10/14 DocID026412 Rev 2

Package mechanical data Figure 21. TO-220FP drawing 7012510_Rev_K_B DocID026412 Rev 2 11/14 14

Package mechanical data STF6N95K5 Table 9. TO-220FP mechanical data Dim. mm Min. Typ. Max. A 4.4 4.6 B 2.5 2.7 D 2.5 2.75 E 0.45 0.7 F 0.75 1 F1 1.15 1.70 F2 1.15 1.70 G 4.95 5.2 G1 2.4 2.7 H 10 10.4 L2 16 L3 28.6 30.6 L4 9.8 10.6 L5 2.9 3.6 L6 15.9 16.4 L7 9 9.3 Ø 3 3.2 12/14 DocID026412 Rev 2

Revision history 5 Revision history Table 10. Document revision history Date Revision Changes 27-May-2014 1 03-Sep-2015 2 First release. Part number previously included in datasheet DocID16958 Updated Table 2.: Absolute maximum ratings Minor text changes. DocID026412 Rev 2 13/14 14

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