Q2L Series (C-Rated) SIDACtor SLIC Device The Q2L SIDACtor SLIC series provides unidirectional transient voltage protection in a low profile, Chip Scale Package (CSP). The small package QFN (Quad Flatpak No- Lead) is ideal for dense board applications that have multiple lines per card. The high density SLIC cards will benefit from this CSP technology by being able to fit more protection in a smaller PCB area. Features Agency Approvals Agency Agency File Number E13383 RoHS compliant Chip Scale Package (CSP) sizing Wide range of I PP ratings including: 5A for 2x1μs GR 189 waveform 2A for 5x31/1x7μs ITU/YDT waveform 1A for 1x1μs GR 189 waveform 15A for 1x56µs TIA-968-A Unidirectional transient voltage protection Small footprint (QFN) Teccor brand SIDACtor technology Protection solution to meet YD/T 95 YD/T 993 YD/T 182 GR 189 IEC 61-4-5 ITU K.2/21 Basic/Enhanced TIA-968-A Electrical Characteristics Part Number Marking V DRM @I DRM =5µA V S @1V/µs I S I T V T @I T =1 amp Capacitance @1MHz @ V bias Volts Volts mamps mamps Amps Volts pf Min Max Min Max Min Max P641Q22CLRP P61C 58 77 15 8 2.2 5 35 75 P721Q22CLRP P71C 65 88 15 8 2.2 5 25 45 P91Q22CLRP P91C 75 98 15 8 2.2 5 55 85 P111Q22CLRP P1C 95 13 15 8 2.2 5 5 75 P131Q22CLRP P13C 12 16 15 8 2.2 5 45 7 P171Q22CLRP P17C 16 2 15 8 2.2 5 45 7 All measurements are made at an ambient temperature of 25 C. V DRM is measured at I DRM. V F = 5V for all ratings. V F is measured at 1V/µs Special voltage (V S and V DRM ) and holding current ( ) requirements are available upon request. Parallel capacitive loads may affect electrical parameters. Cathode is marked by a line.
Surge Ratings I pp I TSM di/dt Series 2x1µs 1.2x5µs/8x2µs 1x16µs 1x56µs 1x1µs AC 6Hz Amps Amps Amps Amps Amps Amps Amps/µs Min Min Min Min Min Min Max C 5 4 2 15 1 3 5 I PP applies to -4 C through +85 C temperature range. I PP is a repetitive surge rating and is guaranteed for the life of the product. Thermal Considerations Package Symbol Parameter Value Unit QFN T J Operating Junction Temperature Range -4 to +15 C T S Storage Temperature Range -65 to +15 C PIN 1 PIN 2 R uja Thermal Resistance: Junction to Ambient 12 C/W V-I Characteristics t r x t d Pulse Waveform +I -V V S V DRM V T V F I DRM I S I T +V IPP Peak Pulse Current %IPP 1 5 Peak Value Waveform = t r x t d t r = rise time to peak value t d = decay time to half value Half Value -I t r t d t Time (µs) Normalized V S Change Versus Junction Temperature Normalized DC Holding Current Versus Case Temperature Percent of V S Change % 14 12 1 8 6 4 2-4 -6 25 C -8-4 -2 2 4 6 8 1 12 14 16 (T C = 25 C) Ratio of 2. 1.8 1.6 1.4 1.2 1..8.6 25 C.4-4 -2 2 4 6 8 1 12 14 16 Case Temperature (T C ) C Junction Temperature (T J ) C 2
Soldering Parameters Reflow Condition Pb Free assembly - Temperature Min (T s(min) ) 15 C Pre Heat - Temperature Max (T s(max) ) 19 C - Time (min to max) (t s ) 9 12 seconds Average ramp up rate (Liquidus Temp (T L ) to peak 5 C/second max T S(max) to T L - Ramp-up Rate Reflow - Temperature (T L ) (Liquidus) 217 C 2 C/second max - Time (min to max) (t s ) 6 9 seconds Peak Temperature (T P ) 25 +/-5 C Time within 5 C of actual peak Temperature (t p ) Ramp-down Rate Time 25 C to peak Temperature (T P ) Do not exceed 26 C 2 4 seconds 4 C/second max 8 minutes Max. Reference Tech Brief (EC642) for additional soldering information and placement guidlines. Environmental Specifications Operating/Storage Temperature -4 C to ~ +15 C Physical Specifications Passive Aging 125 C, 1 hours Meet Spec Terminal Material Matte Tin-plated Copper Humidity Aging +85 C, 85% R.H. 1 hours Meet Spec Lead Solderability ANSI/J-STD-2 Thermal Shock MIL-STD-22 Method 17G +85 C/-4 C 1 times Meet spec Solvent Resistance MIL-STD-22, Method 215 No Change Vibration MIL-STD-883C, Method 27.1, Condition A No Change Dimensions TOP VIEW A B J BOTTOM VIEW C E F 1.5 (.59 ) 1.27 (.5 ) 2.54 (.1 ) Dimensions Inches Millimeters Min Typ Max Min Typ Max A.126.13.134 3.2 3.3 3.4 B.126.13.134 3.2 3.3 3.4 END VIEW N2 N1 K1 H SIDE VIEW M1 M2 K2 Recommended Soldering Pad Outline (Reference Only) C.75.79.83 1.9 2. 2.1 E.11.15.19.285.385.485 F.88.92.96 2.23 2.33 2.43 H.35.39.43.9 1. 1.1 J..4.8..1.2 K1.4.8.12.1.2.3 K2.4.8.12.1.2.3 M1.63.67.71 1.61 1.71 1.81 M2.45.49.53 1.153 1.253 1.353 N1.95.99.13 2.42 2.52 2.62 N2.82.86.9 2.8 2.18 2.28
Part Marking System Part Numbering System First Line: Product Name (See marking column in table on Page 1) Second Line: Lot number DEVICE TYPE P : SIDACtor MEDIAN VOLTAGE xxx : xxx volts CONSTRUCTION VARIATION 1 : Unidirectional SLIC device Pxxx1Q22CLRP PACKING STYLE RP : Reel Pack : Packaging: (Embossed carrier tape and reel per EIA 481-1, 12mm tape in 13 reel, 5, pieces per reel) L : RoHS Compliant SURGE Ipp Rating C : 5AMP 2x1µs 1AMP 1x1µs PACKAGE TYPE Q22 : QFN, 3.3mm x 3.3mm, two leaded package Packaging Package Type Packing Quantity Added Suffix Industry Standard QFN Embossed Carrier Reel Pack 5 RP EIA-481-1 Tape and Reel Specification A D Reel Dimension K T W COVER TAPE Tape Dimension Items END TRAILER 16mm MIN B D P1 P P2 CARRIER TAPE Tape Leader and Trailer Dimensions C D1 COVER TAPE LEADER 4mm MIN W1 A N CARRIER TAPEE1 START B F E2 W Symbols Inches Millimeters Minimum Maximum Minimum Maximum A Reel Diameter N/A 12.992 N/A 33. B Drive Spoke Width.59 N/A 1.5 N/A C Arbor Hole Diameter.54.531 12.8 13.5 D Drive Spoke Diameter.795 N/A 2.2 N/A N Hub Diameter 1.969 N/A 5. N/A W1 Reel Inner Width at Hub.488.567 12.4 14.4 A Pocket Width at bottom.138.146 3.5 3.7 B Pocket Length at bottom.138.146 3.5 3.7 D Feed Hole Diameter.59.63 1.5 1.6 D1 Pocket Hole Diameter.59 N/A 1.5 N/A E1 Feed hole position 1.65.73 1.65 1.85 E2 Feed hole position 2.4.48 1.15 1.35 F Feed hole center-pocket hole.215.219 5.45 5.55 K Pocket Depth.39.51 1. 1.3 P Feed Hole Pitch.153.161 3.9 4.1 P1 Component Spacing.311.319 7.9 8.1 P2 Feed hole center-pocket hole.77.81 1.95 2.5 T Carrier Tape Thickness.1.14.25.35 W Embossed Carrier Tape Width.453.484 11.5 12.3 W Cover Tape Width.358.366 9.1 9.3
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