YJG85G06A. N-Channel Enhancement Mode Field Effect Transistor

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Transcription:

RoHS COMPLIANT N-Channel Enhancement Mode Field Effect Transistor Product Summary VDS ID ID (Package limited) RDS(ON)( at VGS=10V) RDS(ON)( at VGS=4.5V) 100% UIS Tested 100% VDS Tested 60V 130A 85A <3.0 mohm <4.5 mohm General Description Split Gate Trench MOSFET technology Excellent package for heat dissipation High density cell design for low RDS(ON) Applications DC-DC Converters Power management functions Synchronous-rectification applications Absolute Maximum Ratings (T A =25 unless otherwise noted) Parameter Symbol Limit Unit Drain-source Voltage V DS 60 V Gate-source Voltage V GS ±20 V Drain Current I D 130 A Drain Current A T C =25 85 T C =100 67 I D A Pulsed Drain Current B I DM 390 A Avalanche energy C EAS 270 mj Total Power Dissipation D P D 105 W Thermal Resistance Junction-to-Case R θjc 1.2 Thermal Resistance Junction-to-Ambient E R θja 55 / W Junction and Storage Temperature Range T J,T STG -55~+150 Ordering Information (Example) PREFERED P/N PACKING CODE Marking MINIMUM PACKAGE(pcs) INNER BOX QUANTITY(pcs) OUTER CARTON QUANTITY(pcs) DELIVERY MODE YJG85G06A F2 YJG85G06A 3000 6000 60000 13 reel 1 / 7

Electrical Characteristics (T J =25 unless otherwise noted) Parameter Symbol Conditions Min Typ Max Units Static Parameter Drain-Source Breakdown Voltage BV DSS V GS = 0V, I D =250μA 60 V Zero Gate Voltage Drain Current I DSS V DS =60V,V GS =0V 1 μa Gate-Body Leakage Current I GSS V GS = ±20V, V DS =0V ±100 na Gate Threshold Voltage V GS(th) V DS = V GS, I D =250μA 1.0 1.7 2.5 V V GS = 10V, I D =20A 2.5 3.0 Static Drain-Source On-Resistance R DS(ON) V GS = 4.5V, I D =10A 3.5 4.5 mω Diode Forward Voltage V SD I S =20A,V GS =0V 1.2 V Maximum Body-Diode Continuous Current I S 85 A Dynamic Parameters Input Capacitance C iss 5377 Output Capacitance C oss V DS =25V,V GS =0V,f=1MHZ 1666 pf Reverse Transfer Capacitance C rss 77.7 Switching Parameters Total Gate Charge Q g 66.1 Gate-Source Charge Q gs V GS =10V,V DS =30V,I D =25A 10.7 Gate-Drain Charge Q gd 10.9 nc Reverse Recovery Chrage Q rr 73 I F =25A, di/dt=100a/us Reverse Recovery Time t rr 68 Turn-on Delay Time t d(on) 22.5 Turn-on Rise Time t r 6.7 V GS =10V,V DD =30V,I D =25A R GEN =2Ω Turn-off Delay Time t d(off) 80.3 ns Turn-off fall Time t f 26.9 Note: A. The maximum current rating is package limited. B. Repetitive rating; pulse width limited by max. junction temperature. C. V DD =50 V, R G =25 Ω, L=0.5 mh, starting T j =25. D. P D is based on max. junction temperature, using junction-case thermal resistance. E. The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with Ta=25. 2 / 7

Typical Performance Characteristics YJG85G06A Figure1. Output Characteristics Figure2. Transfer Characteristics Figure3. Capacitance Characteristics Figure4. Gate Charge Figure5. Drain-Source on Resistance Figure6. Drain-Source on Resistance 3 / 7

Figure7. Safe Operation Area Figure8. Drain-source breakdown voltage 4 / 7

Test circuits and waveforms 5 / 7

PDFN5060-8L Package information YJG85G06A 6 / 7

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