Common-Drain Dual N-Channel Enhancement Mode MOSFET

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Transcription:

DESCRIPTION The SPN8206 is the logic enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored to minimize on-state resistance. These devices are particularly suited for low voltage application, notebook computer power management and other battery powered circuits where high-side switching. APPLICATIONS Power Management in Note book Portable Equipment Battery Powered System DC/DC Converter Load Switch DSC LCD Display inverter FEATURES PIN CONFIGURATION(TDFN 6P) 20V/5.0A,RDS(ON)= 8.2mΩ@VGS= 4.5V 20V/3.0A,RDS(ON)= 11.0mΩ@VGS= 2.5V Super high density cell design for extremely low RDS (ON) Exceptional on-resistance and maximum DC current capability ESD capability 2KV TDFN -6P package design PART MARKING 2013/10/21 Ver.1 Page 1

PIN DESCRIPTION Pin Symbol Description 1 S1 Source 2 S1 Source 3 G1 Gate 4 G2 Gate 5 S2 Source 6 S2 Source Exposed Backside Metal D1/D2 Drain ORDERING INFORMATION Part Number Package Part Marking SPN8206TDN6RGB TDFN- 6P 8206 SPN8206TDN6RGB : 7 Tape Reel ; Pb Free ; Halogen - Free ABSOULTE MAXIMUM RATINGS (TA=25 Unless otherwise noted) Parameter Symbol Typical Unit Drain-Source Voltage VDSS 20 V Gate Source Voltage VGSS ±12 V Continuous Drain Current(TJ=150 ) TA=25 ID 11 TA=70 8.0 A Pulsed Drain Current IDM 70 A Power Dissipation TA=25 PD 1.5 TA=70 1.0 Operating Junction Temperature TJ -55/150 Storage Temperature Range TSTG -55/150 Thermal Resistance-Junction to Ambient RθJA 80 /W W 2013/10/21 Ver.1 Page 2

ELECTRICAL CHARACTERISTICS (TA=25 Unless otherwise noted) Static Parameter Symbol Conditions Min. Typ Max. Unit Drain-Source Breakdown Voltage V(BR)DSS VGS=0V,ID=250uA 20 Gate Threshold Voltage VGS(th) VDS=VGS,ID=250uA 0.5 1.5 Gate Leakage Current IGSS VDS=0V,VGS=±12V ±10 ua VDS=16V,VGS=0.0V 1 Zero Gate Voltage Drain Current IDSS VDS=16V,VGS=0.0V ua 10 TJ=55 VGS = 4.5V,ID=5.5A 8.2 VGS = 4.0V,ID=5.5A 8.5 Drain-Source On-Resistance RDS(on) VGS = 3.7V,ID=5.5A 9.0 mω VGS = 3.1V,ID=5.5A 9.4 VGS = 2.5V,ID=5.5A 11.0 Diode Forward Voltage VSD IS=1A,VGS=0V 1.2 V Dynamic V Total Gate Charge Qg 15 Gate-Source Charge Qgs VDS=16V, VGS=4.5V ID=11A 3 Gate-Drain Charge Qgd 7 Input Capacitance Ciss 1310 VDS=10V, VGS=0V Output Capacitance Coss 264 f=1mhz Reverse Transfer Capacitance Crss 235 Turn-On Time Turn-Off Time td(on) VDS=16V, ID=5.5A, VGS=4.5V, RG=6.0Ω 31 tr 87 td(off) 69 tf 37 nc pf ns 2013/10/21 Ver.1 Page 3

TYPICAL CHARACTERISTICS 2013/10/21 Ver.1 Page 4

TYPICAL CHARACTERISTICS 2013/10/21 Ver.1 Page 5

TYPICAL CHARACTERISTICS 2013/10/21 Ver.1 Page 6

TDFN- 6P PACKAGE OUTLINE 2013/10/21 Ver.1 Page 7

Information provided is alleged to be exact and consistent. SYNC Power Corporation presumes no responsibility for the penalties of use of such information or for any violation of patents or other rights of third parties which may result from its use. No license is granted by allegation or otherwise under any patent or patent rights of SYNC Power Corporation. Conditions mentioned in this publication are subject to change without notice. This publication surpasses and replaces all information previously supplied. SYNC Power Corporation products are not authorized for use as critical components in life support devices or systems without express written approval of SYNC Power Corporation. The SYNC Power logo is a registered trademark of SYNC Power Corporation 2013 SYNC Power Corporation Printed in Taiwan All Rights Reserved SYNC Power Corporation 7F-2, No.3-1, Park Street NanKang District (NKSP), Taipei, Taiwan 115 Phone: 886-2-2655-8178 Fax: 886-2-2655-8468 http://www.syncpower.com 2013/10/21 Ver.1 Page 8