REISIONS LTR DESCRIPTION DTE PPROED Correc vendor par in secion 6.3. - phn 12-06-04 Thomas M. Hess B Updae boilerplae o curren MIL-PRF-38535 requiremens. - PHN 18-04-16 Thomas M. Hess Prepared in accordance wih SME Y14.24 endor iem drawing RE PGE RE PGE RE STTUS OF PGES RE B B B B B B B B B B B B B B PGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/ Original dae of drawing YY MM DD PREPRED BY Phu H. Nguyen CHECKED BY Phu H. Nguyen 12-05-01 PPROED BY Thomas M. Hess TITLE DL LND ND MRITIME 43218-3990 hp://www.landandmariime.dla.mil/ MICROCIRCUIT, DIGITL, 9 CHNNEL RS- 422/ RS-485 TRNSCEIER, MONOLITHIC SILICON CODE IDENT. NO. RE B PGE 1 OF 14 MSC N/ DISTRIBUTION STTEMENT. pproved for public release. Disribuion is unlimied. 5962-049-18
1. SCOPE 1.1 Scope. This drawing documens he general requiremens of a high performance 9 channel RS-422/ RS-485 ransceiver microcircui, wih an operaing emperaure range of -40 C o +85 C. 1.2 endor Iem Drawing dminisraive Conrol Number. The manufacurer s PIN is he iem of idenificaion. The vendor iem drawing esablishes an adminisraive conrol number for idenifying he iem on he engineering documenaion: 1.2.1 Device ype(s). - 01 X E Drawing Device ype Case ouline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) Device ype Generic Circui funcion 01 SN65HD09-EP 9 channel RS-422/ RS-485 ransceiver 1.2.2 Case ouline(s). The case oulines are as specified herein. Ouline leer Number of pins JEDEC PUB 95 Package syle X 56 JEDEC MO-153 Plasic small ouline 1.2.3 Lead finishes. The lead finishes are as specified below or oher lead finishes as provided by he device manufacurer: Finish designaor B C D E F Z Maerial Ho solder dip Tin-lead plae Gold plae Palladium Gold flash palladium Tin-lead alloy Oher DL LND ND MRITIME RE B PGE 2
1.3 bsolue maximum raings. 1/ Supply volage range, (CC)... -0.3 o 6.0 2/ Bus volage range... -10 o 15 Daa I/O and conrol ( side) volage range... -0.3 o CC + 0.5 Receiver oupu curren (IO)... ±40 m Elecrosaic discharge: B side and GND, ESD HBM... 12 k B side and GND, ESD MM... 400 ll erminals, ESD HBM... 4 k ll erminals, ESD MM... 400 Coninuous oal power dissipaion... Inernally limied 3/ Dissipaion raings Thermal characerisics Package T 25 C Operaing facor 4/ above T = 25 C T = 70 C Power raing T = 70 C Power raing Case X 2500 mw 20 mw/ C 1600 mw 1300 mw Typical Juncion o ambien hermal resisance (θj) 50 C/W Juncion o case (op) hermal resisance (θj) 27 Thermal shudown emperaure (TSD) 165 C 1.4 Recommended operaing condiions. Supply volage, (CC)... 4.75 o 5.25 Minimum high level inpu volage, (IH) (excep nb+, nb-) 5/... 2.0 Maximum low level inpu volage, (IL) (excep nb+, nb-) 5/... 0.8 olage a any bus erminal, (O, I, IC) (separaely or common mode) (nb+ or nb-)... - 7.0 o 12.0 Oupu curren: Driver... -60 m o 60 m Receiver... -8 m o 8 m Operaing free air emperaure, (T)... -40 C o 85 C 2. PPLICBLE DOCUMENTS JEDEC SOLID STTE TECHNOLOGY SSOCITION (JEDEC) JEP95 Regisered and Sandard Oulines for Semiconducor Devices (pplicaions for copies should be addressed o he Elecronic Indusries lliance, 3103 Norh 10h Sree, Suie 240 S, rlingon, 22201-2107 or online a hps://www.jedec.org) Uni 1/ Sresses beyond hose lised under absolue maximum raings may cause permanen damage o he device. These are sress raings only, and funcional operaion of he device a hese or any oher condiions beyond hose indicaed under recommended operaing condiions is no implied. Exposure o absolue maximum raed condiions for exended periods may affec device reliabiliy. 2/ ll volage values are wih respec o he GND erminals. 3/ The maximum operaing juncion emperaure is inernally limied. Use he Dissipaion Raing Table o operae below his emperaure. 4/ This is inverse of he juncion o ambien emperaure when board mouned and wih no air flow. 5/ n = 1 9. DL LND ND MRITIME RE B PGE 3
3. REQUIREMENTS 3.1 Marking. Pars shall be permanenly and legibly marked wih he manufacurer s par number as shown in 6.3 herein and as follows:. Manufacurer s name, CGE code, or logo B. Pin 1 idenifier C. ESDS idenificaion (opional) 3.2 Uni conainer. The uni conainer shall be marked wih he manufacurer s par number and wih iems and C (if applicable) above. 3.3 Elecrical characerisics. The maximum and recommended operaing condiions and elecrical performance characerisics are as specified in 1.3, 1.4, and able I herein. 3.4 Design, consrucion, and physical dimension. The design, consrucion, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case ouline. The case ouline shall be as shown in 1.2.2 and figure 1. 3.5.2 connecions. The erminal connecions shall be as shown in figure 2. 3.5.3 funcion. The erminal funcion shall be as shown in figure 3. 3.5.4 Logic diagram. The logic diagram shall be as shown in figure 4. 3.5.5 Driver es circui, RS-422 and RS-485 loading. The driver es circui, RS-422 and RS-485 loading shall be as shown in figure 5. 3.5.6 Driver es circui, pull-up and pull down loading. The driver es circui, pull-up and pull-down loading shall be as shown in figure 6. 3.5.7 Driver delay and ransiion ime es waveforms. The Driver delay and ransiion ime es waveforms shall be as shown in figure 7. 3.5.8 Receiver propagaion delay and ransiion ime es circui. The receiver propagaion delay and ransiion ime es circui shall be as shown in figure 8. 3.5.9 Receiver delay and ransiion ime waveforms. The receiver delay and ransiion ime waveforms shall be as shown in figure 9. 3.5.10 Driver enable and disable ime es circui. The driver enable and disable ime es circui shall be as shown in figure 10. 3.5.11 Driver enable ime waveforms. The driver enable ime waveforms shall be as shown in figure 11. 3.5.12 Receiver enable and disable ime es circui. The receiver enable and disable ime es circui shall be as shown in figure 12. 3.5.13 Receiver enable and disable ime waveforms. The receiver enable and disable ime waveforms shall be as shown in figure 13. DL LND ND MRITIME RE B PGE 4
Driver differenial oupu volage magniude TBLE I. Elecrical performance characerisics. 1/ Tes Symbol Condiions DD Limis 2/ Min Max RS-422 load RL = 100 Ω See figure 5 0.56 RS-485 load RL = 54 Ω 1.4 TYP Pull up Pull-down load See figure 6 1 High level oupu volage OH side, IOH = -8 m, ID = 200 m See figure 8 4 B side, See figure 6 3 TYP Low level oupu volage OL side, IOH = 8 m, ID = -200 m See figure 8 0.8 Receiver posiive going differenial inpu hreshold volages Receiver negaive going differenial inpu hreshold volages Receiver inpu hyseresis (IT+ - IT-) Bus inpu curren B side, See figure 6 1 TYP IT+ IOH = -8 m See figure 8 0.2 IT- IOH = 8 m See figure 8-0.2 hys CC = 5, T = 25 C 24 m II IH = 12, CC = 5 IH = 12, CC = 0 1 Oher inpu a 0 IH = -7, CC = 5-0.8 IH = -7, CC = 0-0.8 Uni 1 m High level inpu curren n, BSR, DE/RE, and CRE, IIH IH = 2-100 µ CDE0, CDE1, and CDE2 IH = 2 100 Low level inpu curren n, BSR, DE/RE, and CRE, IIL IH = 0.8-100 CDE0, CDE1, and CDE2 IH = 0.8 100 Shor circui oupu curren IOS nb+ on nb- ±260 m High impedance sae oupu curren Supply curren IOZ ICC n nb+ or nb- See IIH and IIL See III Disabled 10 m ll drivers enabled, no load 60 ll receivers enabled, no load 45 Oupu capaciance CO nb+ or nb- o GND 18 TYP pf Power dissipaion capaciance 3/ Cpd Receiver 40 TYP pf Driver 100 TYP See foonoe a end of able. DL LND ND MRITIME RE B PGE 5
TBLE I. Elecrical performance characerisics - Coninued. 1/ Driver swiching characerisics Tes Symbol Condiions Propagaion delay ime, PHL or PLH (see figure 6 and 7) pd 2.5 13.5 ns Pulse skew, PHL - PLH sk(p) 5 2/ Limis Fall ime f S1 o B, See figure 7 4 TYP Rise ime r See figure 7 8 TYP Enable ime, conrol inpus o acive oupu en 50 Disable ime, conrol inpus o high impedance oupu dis 225 Propagaion delay ime, high level o high impedance oupu PHZ See figure 10 and 11 225 Propagaion delay ime, low level o high impedance oupu PLZ 225 Propagaion delay ime, high impedance o high level oupu PZH 50 Propagaion delay ime, high impedance o low level oupu PZL 50 Receiver swiching characerisics Propagaion delay ime, PHL or PLH (see figure 6 and 7) pd 8 14.5 ns Skew limi, maximum pd minimum pd 4/ sk(lim) 5 Pulse skew, PHL - PLH sk(p) 5 Transiion ime (r or f) See figure 9 2 TYP Enable ime, conrol inpus o acive oupu en 31 TYP Disable ime, conrol inpus o high impedance oupu dis 41 TYP Propagaion delay ime, high level o high impedance oupu PHZ See figure 12 and 13 34 TYP Propagaion delay ime, low level o high impedance oupu PLZ 14 TYP Propagaion delay ime, high impedance o high level oupu PZH 30 TYP Propagaion delay ime, high impedance o low level oupu PZL 30 TYP 1/ Tesing and oher qualiy conrol echniques are used o he exen deemed necessary o assure produc performance over he specified emperaure range. Produc may no necessarily be esed across he full emperaure range and all parameers may no necessarily be esed. In he absence of specific parameric esing, produc performance is assured by characerizaion and/or design. 2/ Over recommended operaing free air emperaure range (unless oherwise noed). ll ypical values are wih respec o CC = 5, and T = 25 C. 3/ Cpd deermines he no-load dynamic supply curren consumpion, IS = CPD x CC x f + ICC. 4/ This parameer is applicable a one CC and operaing emperaure wih he recommended operaing condiions and o any wo devices. Min Max Uni DL LND ND MRITIME RE B PGE 6
Case X e b 0.08 M c 56 29 0-8 E1 E GGE PLNE 1 28 L 0.25 DETIL D SEE DETIL 1 SETING PLNE 0.10 Dimensions Symbol Millimeers Symbol Millimeers Min Max Min Max 1.20 E 7.90 8.30 1 0.05 0.15 E1 6.00 6.20 b 0.17 0.27 e 0.50 TYP c 0.15 NOM L 0.50 0.75 D 13.90 14.10 NOTES: 1. ll linear dimensions are in millimeers. 2. This drawing is subjec o change wihou noice. 3. Body dimensions do no include mold prorusions no exceed 0.15. 4. Falls wihin JEDEC MO-153. FIGURE 1. Case ouline. DL LND ND MRITIME RE B PGE 7
Name number symbol number symbol Case ouline X number symbol number symbol 1 GND 15 GND 29 1B- 43 GND 2 BSR 16 GND 30 1B+ 44 GND 3 CRE 17 GND 31 2B- 45 CC 4 1 18 CC 32 2B+ 46 6B- 5 1DE/RE 19 5 33 3B- 47 6B+ 6 3 20 5DE/RE 34 3B+ 48 7B- 7 2DE/RE 21 6 35 4B- 49 7B+ 8 CC 22 6DE/RE 36 4B+ 50 8B- 9 3DE/RE 23 7 37 5B- 51 8B+ 10 4 24 7DE/RE 38 5B+ 52 9B- 11 4DE/RE 25 8 39 CC 53 9B+ 12 CC 26 8DE/RE 40 GND 54 CDE0 13 GND 27 9 41 GND 55 CDE1 14 GND 28 9DE/RE 42 GND 56 CDE2 No. I/O FIGURE 2. connecions. Descripion 1 o 9 4, 6, 8, 10, 19,21, 23, I/O 25, 27 1 o 9 carry daa o and from he communicaion conroller 1b- o 9B- 29, 31, 33, 35, 37, I/O 46, 48, 50, 52 1B- o 9B- are he invered daa signals of he balanced pair o/from he bus 1B+ o 9B+ 30, 32, 34, 36, 38, I/O 47, 49, 51, 53 1B+ o 9B+ are he noninvered daa signals of he balanced pair o/from he bus BSR 2 I BSR is he bi significan response. BSR disables receivers 1 hrough 8 and enables wired OR drivers when BSR and DE/RE and CDE1 and CDE2 are high. Channel 9 is placed in a high impedance sae wih BSR high CDE0 54 I CDE0 is he common driver enable 0. Is inpu signal enables all drivers when CDE0 and 1DE/RE - 9DE/RE are high. CDE1 55 I CDE1 is he common driver enable 1. Is inpu signal enables drivers 1 o 4 when CDE1 is high and BSR is low. CDE2 56 I CDE2 is he common driver enable 2. When CDE2 is high and BSR is low, drivers 5 o 8 are enabled. CRE 3 I CRE is he common receiver enabled. When high, CRE diables receiver channel 5 o 9. 1DE/RE o 9DE/RE 5, 7, 9, 11, 20, 22, 24, 26, 28 I 1DE/RE - 9DE/RE are direcion conrols ha ransmi daa o he bus when i and CDE0 are high. Daa is received from he bus when 1DE/RE o 9DE/RE and CRE and BSR are low and CDE1 and CDE2 are low GND 1, 13, 14, 15, 16, 17, 40, 41, 42, 43, 44 Power CC 12, 18, 39, 45 Power Supply volage. 1. 1 mus be conneced o signal ground for proper operaion. GND is he circui ground. ll GND erminals excep erminal 1 are physically ied o he die pad for improved hermal conduciviy. 1/ FIGURE 3. funcion. DL LND ND MRITIME RE B PGE 8
CDE0 CDE1 BSR 1 1B+ 1DE/RE 2 2DE/RE 3 3DE/RE 4 4DE/RE CHNNEL 2 CHNNEL 3 CHNNEL 4 CDE2 CRE 5 5B+ 6B+ 6B- 7B+ 7B- 8B+ 8B- 9B+ 9B- 5B- 5DE/RE 6 6DE/RE 7 7DE/RE 8 8DE/RE 4 9DE/RE CHNNEL 6 CHNNEL 7 CHNNEL 8 BSR BSR CRE CDE0 2B+ 2B- 3B+ 3B- 4B+ 4B- 1B- FIGURE 4. Logic diagram. DL LND ND MRITIME RE B PGE 9
R L /2 INPUT B+ B- R L /2 C L =50 pf ±20% OC C L INCLUDES FIXTURE ND INSTRUMENTTION CPCITNCE FIGURE 5. Driver es circui, RS-422 and RS 485 loading. 5 PU PD 165 INPUT SEE NOTE 1 I 1 I O B+ OD O 15 pf 75 S1 165 375 375 I I O B- S2 O 15 pf SEE NOTE 2 NOTES: 1. CDEO and DE/RE are a 2, BSR is a 0.8, and all ohers are open. 2. ll nine drivers are enabled, simply loaded, and swiching. FIGURE 6. Driver es circui, Pull up and pull down loading. 3 INPUT 1.5 0 PLH PHL OUTPUT, OD r f OD(H) 90% 0 10% OD(L) S1 TO PU OR PD FIGURE 7. Driver delay and ransiion ime es waveforms. DL LND ND MRITIME RE B PGE 10
GENERTOR SEE NOTE 1 50 INPUT B+ I O ID OUTPUT GENERTOR SEE NOTE 1 INPUT B- 50 SEE NOTE 2 O C L =15 pf NOTES: 1. CDE0, CDE1, CDE2, BSR, CRE, and DE/RE are a 0.8. 2. ll nine receivers are enabled and swiching. FIGURE 8. Receiver propagaion delay and ransiion ime es circui. INPUT B- 3 1.5 INPUT B+ 0 PLH PHL OUTPUT r f OH 90% 1.4 10% OL NOTES: 1. ll inpu pulses are supplied by a generaor having he following characerisics: r 6 ns, f 6 ns, PRR 1 MHz, duy cycle = 50%, ZO = 50 Ω. 2. ll resisances are in Ω and ±5%, unless oherwise indicaed. 3. ll capaciances are in pf and ±10%, unless oherwise indicaed. 4. ll indicaed volages are ±10 m. FIGURE 9. Receiver delay and ransiion ime waveforms. 4.5 PU PD 165 B+ S1 165 0 OR 3 OD 50 pf 75 375 375 DE/RE SEE TBLE 1 B- 50 SEE pf NOTE S2 INPUT NOTE: 1. Includes probe and jig capaciance in wo places. FIGURE 10. Driver enable and disable ime es circui. DL LND ND MRITIME RE B PGE 11
Driver BSR CDE0 CDE1 CDE2 CRE 1-8 H H L L X 9 L H H H H INPUT,DE/RE PZH PHZ 3 1.5 0 OUTPUT, OD OUTPUT, OD PZL PLZ OD(H) 0-1 1 0 OD(L) a 3 S1 o PD a 0 S1 o PU NOTES: 1. ll inpu pulses are supplied by a generaor having he following characerisics: r 6 ns, f 6 ns, PRR 1 MHz, duy cycle = 50%, ZO = 50 Ω. 2. ll resisances are in Ω and ±5%, unless oherwise indicaed. 3. ll capaciances are in pf and ±10%, unless oherwise indicaed. 4. ll indicaed volages are ±10 m. FIGURE 11. Driver enable ime waveforms. T 0 or 3 B+ 620 OUTPUT INPUT DE/RE SEE NOTE 1 3 or 0 B- 40 pf SEE NOTE 2 NOTES: 1. CDE0 is high, CDE1, CDE2, BSR, and CRE are low, all ohers are open. 2. Includes probe and jig capaciance. FIGURE 12. Receiver enable and disable ime es circui. DL LND ND MRITIME RE B PGE 12
INPUT PLZ PZL 3 1.4 0 OUTPUT 1.4 B+a0 B-a3 T = CC OD INDETERMINTE OUTPUT PHZ PZH 1.4 B+a0 B-a3 T =0 OD INDETERMINTE NOTES: 1. ll inpu pulses are supplied by a generaor having he following characerisics: r 6 ns, f 6 ns, PRR 1 MHz, duy cycle = 50%, ZO = 50 Ω. 2. ll resisances are in Ω and ±5%, unless oherwise indicaed. 3. ll capaciances are in pf and ±10%, unless oherwise indicaed. 4. ll indicaed volages are ±10 m. FIGURE 13. Receiver enable and disable ime waveforms. DL LND ND MRITIME RE B PGE 13
4. ERIFICTION 4.1 Produc assurance requiremens. The manufacurer is responsible for performing all inspecion and es requiremens as indicaed in heir inernal documenaion. Such procedures should include proper handling of elecrosaic sensiive devices, classificaion, packaging, and labeling of moisure sensiive devices, as applicable. 5. PREPRTION FOR DELIERY 5.1 Packaging. Preservaion, packaging, labeling, and marking shall be in accordance wih he manufacurer s sandard commercial pracices for elecrosaic discharge sensiive devices. 6. NOTES 6.1 ESDS. Devices are elecrosaic discharge sensiive and are classified as ESDS class 1 minimum. 6.2 Configuraion conrol. The daa conained herein is based on he salien characerisics of he device manufacurer s daa book. The device manufacurer reserves he righ o make changes wihou noice. This drawing will be modified as changes are provided. 6.3 Suggesed source(s) of supply. Idenificaion of he suggesed source(s) of supply herein is no o be consrued as a guaranee of presen or coninued availabiliy as a source of supply for he iem. DL Land and Mariime mainains an online daabase of all curren sources of supply a hp://www.landandmariime.dla.mil/programs/smcr/. endor iem drawing adminisraive conrol number 1/ Device manufacurer CGE code endor par number Top side marking -01XE 01295 SN65HD09IDGGREP SN65HD09EP 1/ The vendor iem drawing esablishes an adminisraive conrol number for idenifying he iem on he engineering documenaion. CGE code Source of supply 01295 Texas Insrumens, Inc. Semiconducor Group 8505 Fores Lane P.O. Box 660199 Dallas, TX 75243 Poin of conac: U.S. Highway 75 Souh P.O. Box 84, M/S 853 Sherman, TX 75090-9493 DL LND ND MRITIME RE B PGE 14