NCS, NCV, NCS, NCV, NCS, NCV Operational mplifier, Rail-to-Rail Input and Output, MHz The NCS series operational amplifiers provide rail to rail input and output operation, MHz bandwidth, and are available in single, dual, and quad configurations. Rail to rail operation gives designers use of the entire supply voltage range while taking advantage of the MHz bandwidth. The NCS can operate on supply voltages from.8 to. V over a temperature range from to C. t a.8 V supply, this device has a slew rate of. V/ s while consuming only of quiescent current per channel. Since this is a CMOS device, high input impedance and low bias currents make it ideal for interfacing to a wide variety of signal sensors. The NCS devices are available in a variety of compact packages. Features Rail to Rail Input and Output Wide Supply Range:.8 to. V Wide Bandwidth: MHz High Slew Rate:. V/ s at V S =.8 V Low Supply Current: per Channel at V S =.8 V Low Input Bias Current: p Typical Wide Temperature Range: to C vailable in a Variety of Packages NCV Prefix for utomotive and Other pplications Requiring Unique Site and Control Change Requirements; EC Q Qualified and PPP Capable These Devices are Pb Free, Halogen Free/BFR Free and are RoHS Compliant SC7 CSE 9 Micro8 /MSOP8 CSE 8 TSSOP 8 CSE 98S SOIC CSE 7 TSOP /SOT CSE 8 8 SOIC 8 CSE 7 TSSOP CSE 98G UDFN CSE 7P pplications Unity Gain Buffer Battery Powered / Low Quiescent Current pplications Low Cost Current Sensing utomotive DEVICE MRKING INFORMTION See general marking information in the device marking section on page of this data sheet. ORDERING INFORMTION See detailed ordering and shipping information on page of this data sheet. Semiconductor Components Industries, LLC, January, Rev. Publication Order Number: NCS/D
NCS, NCV, NCS, NCV, NCS, NCV MRKING DIGRMS Single Channel Configuration NCS, NCV XXM SC7 CSE 9 XXXYW TSOP /SOT CSE 8 XX M UDFN CSE 7P Dual Channel Configuration NCS, NCV 8 XXXX YW 8 XXXXXX LYW XXX YWW Micro8 /MSOP8 CSE 8 SOIC 8 CSE 7 TSSOP 8 CSE 98S Quad Channel Configuration NCS, NCV XXXX XXXX LYW XXXXX WLYWWG TSSOP CSE 98G SOIC CSE 7 XXXXX = Specific Device Code = ssembly Location WL, L = Wafer Lot Y = Year WW, W = Work Week G or = Pb Free Package (Note: Microdot may be in either location)
NCS, NCV, NCS, NCV, NCS, NCV Single Channel Configuration NCS, NCV OUT VDD IN+ + VDD VSS OUT VSS + VSS NC + VDD IN+ IN IN OUT IN IN+ SOT (TSOP ) SN Pinout Dual Channel Configuration NCS, NCV SC7, SOT (TSOP ) SQ, SN Pinout OUT Quadruple Channel Configuration NCS, NCV UDFN. x. OUT OUT IN IN+ VSS + + 8 7 VDD OUT IN IN+ IN IN+ VDD IN+ IN + + + + 9 IN IN+ VSS IN+ IN OUT 7 8 OUT Figure. Pin Connections ORDERING INFORMTION Device Configuration utomotive Marking Package Shipping NCSSQTG NCSSNTG K SOT /TSOP No NCSSNTG K SOT /TSOP NCSMUTG Single P UDFN NCVSQTG H SC7 H SC7 NCVSNTG K SOT /TSOP Yes NCVSNTG K SOT /TSOP NCVMUTG P UDFN NCSDMRG K Micro8/MSOP8 NCSDRG No NCS SOIC 8 NCSDTBRG K TSSOP 8 Dual NCVDMRG K Micro8/MSOP8 NCVDRG Yes NCS SOIC 8 NCVDTBRG K TSSOP 8 NCS_ NCS_ No TBD SOP NCS_ TBD TSSOP NCV_ Quad TBD SOIC TBD SOIC NCV_ Yes TBD SOP NCV_ TBD TSSOP Contact local sales office for more information For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8/D *NCV Prefix for utomotive and Other pplications Requiring Unique Site and Control Change Requirements; EC Q Qualified and PPP Capable.
NCS, NCV, NCS, NCV, NCS, NCV BSOLUTE MXIMUM RTINGS (Note ) Rating Symbol Limit Unit Supply Voltage (V DD V SS ) (Note ) V S 7 V Input Voltage V I V SS. to V DD +. V Differential Input Voltage V ID ±V s V Maximum Input Current I I ± m Maximum Output Current I O ± m Continuous Total Power Dissipation (Note ) P D mw Maximum Junction Temperature T J C Storage Temperature Range T STG to C Mounting Temperature (Infrared or Convection sec) T mount C ESD Capability (Note ) Human Body Model Machine Model Charge Device Model ESD HBM ESD MM ESD CDM Latch Up Current (Note ) I LU m Moisture Sensitivity Level (Note ) MSL Level Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.. Refer to ELECTRICL CHRCTERISTICS for Safe Operating rea.. Continuous short circuit operation to ground at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of C. Output currents in excess of the maximum output current rating over the long term may adversely affect reliability. Shorting output to either VDD or VSS will adversely affect reliability.. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per EC Q (JEDEC standard: JESD ) ESD Machine Model tested per EC Q (JEDEC standard: JESD ). Latch up Current tested per JEDEC standard: JESD78. Moisture Sensitivity Level tested per IPC/JEDEC standard: J-STD- V THERML INFORMTION Parameter Symbol Channels Package Junction to mbient Thermal Resistance J Single Dual Quad SC 7 SOT /TSOP UDFN Single Layer Board (Note ) Multi Layer Board (Note 7) Micro8/MSOP8 7 SOIC 8 9 TSSOP 8 9 SOIC SOP TSSOP. Value based on S standard PCB according to JEDEC with. oz copper and a mm copper area 7. Value based on SP standard PCB according to JEDEC 7 with. oz copper and a mm copper area Unit C/W OPERTING RNGES Parameter Symbol Min Max Unit Operating Supply Voltage V S.8. V Differential Input Voltage V ID V S V Input Common Mode Range V ICM V SS. V DD +. V mbient Temperature T C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.
NCS, NCV, NCS, NCV, NCS, NCV ELECTRICL CHRCTERISTICS T V S =.8 V T = C; R L k ; V CM = V OUT = mid supply unless otherwise noted. Boldface limits apply over the specified temperature range, T = C to C. (Note 8) Parameter Symbol Conditions Min Typ Max Unit INPUT CHRCTERISTICS Input Offset Voltage V OS.. mv mv Offset Voltage Drift V OS / T V/ C Input Bias Current (Note 8) I IB p p Input Offset Current (Note 8) I OS p p Channel Separation XTLK DC db Differential Input Resistance R ID G Common Mode Input Resistance R IN G Differential Input Capacitance C ID pf Common Mode Input Capacitance C CM pf Common Mode Rejection Ratio CMRR V CM = V SS. to V DD +. 8 7 db V CM = V SS +. to V DD. OUTPUT CHRCTERISTICS Open Loop Voltage Gain VOL 8 db 8 Short Circuit Current I SC Output to positive rail, sinking current 9 m Output to negative rail, sourcing current Output Voltage High V OH Voltage output swing from positive rail 9 mv Output Voltage Low V OL Voltage output swing from negative rail 9 mv C CHRCTERISTICS Unity Gain Bandwidth UGBW MHz Slew Rate at Unity Gain SR V ID =. Vpp, Gain =. V/ s Phase Margin m Gain Margin m db Settling Time t S V IN =. Vpp, Settling time to.%. s Gain = Settling time to.% Open Loop Output Impedance Z OL f = Hz. NOISE CHRCTERISTICS Total Harmonic Distortion plus Noise THD+N V IN =. Vpp, f = khz, v =. % Input Referred Voltage Noise e n f = khz nv/ Hz f = khz Input Referred Current Noise i n f = khz f/ Hz SUPPLY CHRCTERISTICS Power Supply Rejection Ratio PSRR No Load 7 9 db Power Supply Quiescent Current I DD Per channel, no load 7 8. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
NCS, NCV, NCS, NCV, NCS, NCV ELECTRICL CHRCTERISTICS T V S =. V T = C; R L k ; V CM = V OUT = mid supply unless otherwise noted. Boldface limits apply over the specified temperature range, T = C to C. (Note 9) Parameter Symbol Conditions Min Typ Max Unit INPUT CHRCTERISTICS Input Offset Voltage V OS.. mv mv Offset Voltage Drift V OS / T V/ C Input Bias Current (Note 9) I IB p p Input Offset Current (Note 9) I OS p p Channel Separation XTLK DC db Differential Input Resistance R ID G Common Mode Input Resistance R IN G Differential Input Capacitance C ID pf Common Mode Input Capacitance C CM pf Common Mode Rejection Ratio CMRR V CM = V SS. to V DD +. 7 db V CM = V SS +. to V DD. 8 OUTPUT CHRCTERISTICS Open Loop Voltage Gain VOL 9 db 8 Short Circuit Current I SC Output to positive rail, sinking current 9 m Output to negative rail, sourcing current Output Voltage High V OH Voltage output swing from positive rail mv Output Voltage Low V OL Voltage output swing from negative rail mv C CHRCTERISTICS Unity Gain Bandwidth UGBW MHz Slew Rate at Unity Gain SR V IN =. Vpp, Gain =. V/ s Phase Margin m Gain Margin m db Settling Time t S V IN =. Vpp, Settling time to.%. s Gain = Settling time to.%. Open Loop Output Impedance Z OL f = Hz. NOISE CHRCTERISTICS Total Harmonic Distortion plus Noise THD+N V IN =. Vpp, f = khz, v =. % Input Referred Voltage Noise e n f = khz nv/ Hz f = khz Input Referred Current Noise i n f = khz f/ Hz SUPPLY CHRCTERISTICS Power Supply Rejection Ratio PSRR No Load 7 9 db Power Supply Quiescent Current I DD Per channel, no load 8 9. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
NCS, NCV, NCS, NCV, NCS, NCV ELECTRICL CHRCTERISTICS T V S =. V T = C; R L k ; V CM = V OUT = mid supply unless otherwise noted. Boldface limits apply over the specified temperature range, T = C to C. (Note ) Parameter Symbol Conditions Min Typ Max Unit INPUT CHRCTERISTICS Input Offset Voltage V OS.. mv mv Offset Voltage Drift V OS / T V/ C Input Bias Current (Note ) I IB p p Input Offset Current (Note ) I OS p p Channel Separation XTLK DC db Differential Input Resistance R ID G Common Mode Input Resistance R IN G Differential Input Capacitance C ID pf Common Mode Input Capacitance C CM pf Common Mode Rejection Ratio CMRR V CM = V SS. to V DD +. 79 db V CM = V SS +. to V DD. OUTPUT CHRCTERISTICS Open Loop Voltage Gain VOL 9 db 8 Short Circuit Current I SC Output to positive rail, sinking current 9 m Output to negative rail, sourcing current Output Voltage High V OH Voltage output swing from positive rail mv Output Voltage Low V OL Voltage output swing from negative rail mv C CHRCTERISTICS Unity Gain Bandwidth UGBW MHz Slew Rate at Unity Gain SR V ID = Vpp, Gain =. V/ s Phase Margin m Gain Margin m db Settling Time t S V IN = Vpp, Settling time to.%. s Gain = Settling time to.%. Open Loop Output Impedance Z OL f = Hz. NOISE CHRCTERISTICS Total Harmonic Distortion plus Noise THD+N V IN = Vpp, f = khz, v =. % Input Referred Voltage Noise e n f = khz nv/ Hz f = khz Input Referred Current Noise i n f = khz f/ Hz SUPPLY CHRCTERISTICS Power Supply Rejection Ratio PSRR No Load 7 9 db Power Supply Quiescent Current I DD Per channel, no load. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 7
NCS, NCV, NCS, NCV, NCS, NCV TYPICL PERFORMNCE CHRCTERISTICS T = C, R L k, V CM = V OUT = mid supply unless otherwise specified 8 8 SUPPLY CURRENT ( ) T = C T = C SUPPLY CURRENT ( ) V S =. V V S =. V T = C 8......... 8 V S =.8 V 8 SUPPLY VOLTGE (V) TEMPERTURE ( C) Figure. Quiescent Current per Channel vs. Supply Voltage Figure. Quiescent Current vs. Temperature.. OFFSET VOLTGE (mv)..... T = C T = C T = C OFFSET VOLTGE (mv)..... V S =.8 V V S =. V V S =. V......... 8 SUPPLY VOLTGE (V) TEMPERTURE ( C) Figure. Offset Voltage vs. Supply Voltage Figure. Offset Voltage vs. Temperature OFFSET VOLTGE (mv).7 V S =. V units..... COMMON MODE VOLTGE (V). Figure. Offset Voltage vs. Common Mode Voltage.7 GIN (db) 8 Gain R L = k C L = pf T = C k k k Phase Margin M FREQUENCY (Hz) M 8 M Figure 7. Open loop Gain and Phase Margin vs. Frequency 9 PHSE MRGIN ( ) 8
NCS, NCV, NCS, NCV, NCS, NCV TYPICL PERFORMNCE CHRCTERISTICS T = C, R L k, V CM = V OUT = mid supply unless otherwise specified PHSE MRGIN ( ) 7 V S =. V R L = k T = C THD+N (%).. V S =. V f IN = khz V =.... CPCITIVE LOD (pf) OUTPUT VOLTGE (Vpp) Figure 8. Phase Margin vs. Capacitive Load Figure 9. THD + N vs. Output Voltage THD+N (%).. V = V S =.8 V V S =. V VOLTGE NOISE (nv/ Hz) V S =. V. k V S =. V k k k k k FREQUENCY (Hz) FREQUENCY (Hz) Figure. THD + N vs. Frequency Figure. Input Voltage Noise vs. Frequency CURRENT NOISE (f/ Hz) 9 8 7 k V S =. V k k PSRR (db) 9 8 7 V S =.8 V, PSRR+ V S =.8 V, PSRR V S =. V, PSRR+ k V S =. V, PSRR k k M FREQUENCY (Hz) FREQUENCY (Hz) Figure. Input Current Noise vs. Frequency Figure. PSRR vs. Frequency 9
NCS, NCV, NCS, NCV, NCS, NCV TYPICL PERFORMNCE CHRCTERISTICS T = C, R L k, V CM = V OUT = mid supply unless otherwise specified CMRR (db) 8 V S =. V V S =. V V S =.8 V V = OUTPUT VOLTGE TO POSITIVE RIL (mv) V S =.8 V V S =. V V S =. V k k k M.. 7.... FREQUENCY (Hz) Figure. CMRR vs. Frequency OUTPUT CURRENT (m) Figure. Output Voltage High to Rail OUTPUT VOLTGE TO NEGTIVE RIL (mv) V S =.8 V V S =. V V S =. V VOLTGE (V)..8.......8. Input Output OUTPUT CURRENT (m) TIME ( s) Figure. Output Voltage Low to Rail Figure 7. Non Inverting Small Signal Transient Response..8. Input Output..8. Input Output.. VOLTGE (V)... VOLTGE (V)......8..8. TIME ( s) TIME ( s) Figure 8. Inverting Small Signal Transient Response Figure 9. Non Inverting Large Signal Transient Response
NCS, NCV, NCS, NCV, NCS, NCV TYPICL PERFORMNCE CHRCTERISTICS T = C, R L k, V CM = V OUT = mid supply unless otherwise specified.. Input Output VOLTGE (V).... CURRENT (p) I IB+ I IB. I OS. 8 TIME ( s) TEMPERTURE ( C) Figure. Inverting Large Signal Transient Response Figure. Input Bias and Offset Current vs. Temperature CURRENT (p) 8 I IB+ VOLTGE ( V) I OS I IB........... 7 8 9 COMMON MODE VOLTGE (V) TIME (s) Figure. Input Bias Current vs. Common Mode Voltage Figure.. Hz to Hz Noise k CHNNEL SEPRTION (db) 8 OUTPUT IMPEDNCE ( ) k. V = V S =.8 V V S =. V k k k FREQUENCY (Hz) M Figure. Channel Separation vs. Frequency M. k k FREQUENCY (Hz) k Figure. Output Impedance vs. Frequency M
NCS, NCV, NCS, NCV, NCS, NCV TYPICL PERFORMNCE CHRCTERISTICS T = C, R L k, V CM = V OUT = mid supply unless otherwise specified... SR+ SLEW RTE (V/ s)....9.8 SR.7.. 8 TEMPERTURE ( C) Figure. Slew Rate vs. Temperature
NCS, NCV, NCS, NCV, NCS, NCV PCKGE DIMENSIONS SC 88 (SC 7 /SOT ) CSE 9 ISSUE L S G B D PL. (.8) M B M N NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y.M, 98.. CONTROLLING DIMENSION: INCH.. 9 OBSOLETE. NEW STNDRD 9.. DIMENSIONS ND B DO NOT INCLUDE MOLD FLSH, PROTRUSIONS, OR GTE BURRS. INCHES MILLIMETERS DIM MIN MX MIN MX.7.87.8. B.... C...8. D.... G. BSC. BSC H ---. ---. J.... K.... N.8 REF. REF S.79.87.. C J H K SOLDER FOOTPRINT..97....7...9.78 SCLE : mm inches
NCS, NCV, NCS, NCV, NCS, NCV PCKGE DIMENSIONS X X. NOTE T. B. T B H G TOP VIEW SIDE VIEW C D X. C B S C SETING PLNE J K TSOP CSE 8 ISSUE L DETIL Z END VIEW M DETIL Z NOTES:. DIMENSIONING ND TOLERNCING PER SME Y.M, 99.. CONTROLLING DIMENSION: MILLIMETERS.. MXIMUM LED THICKNESS INCLUDES LED FINISH THICKNESS. MINIMUM LED THICKNESS IS THE MINIMUM THICKNESS OF BSE MTERIL.. DIMENSIONS ND B DO NOT INCLUDE MOLD FLSH, PROTRUSIONS, OR GTE BURRS. MOLD FLSH, PROTRUSIONS, OR GTE BURRS SHLL NOT EXCEED. PER SIDE. DIMENSION.. OPTIONL CONSTRUCTION: N DDITIONL TRIMMED LED IS LLOWED IN THIS LOCTION. TRIMMED LED NOT TO EXTEND MORE THN. FROM BODY. MILLIMETERS DIM MIN MX. BSC B. BSC C.9. D.. G.9 BSC H.. J.. K.. M S.. SOLDERING FOOTPRINT*.9.7.9.7..9..9.7.8 SCLE : mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
NCS, NCV, NCS, NCV, NCS, NCV PCKGE DIMENSIONS X. C D ÉÉ ÉÉ B UDFN.x.,.P CSE 7P ISSUE O NOTES:. DIMENSIONING ND TOLERNCING PER SME Y.M, 99.. CONTROLLING DIMENSION: MILLIMETERS.. DIMENSION b PPLIES TO PLTED TERMINL ND IS MESURED BETWEEN. ND. mm FROM TERMINL.. COPLNRITY PPLIES TO THE EXPOSED PD S WELL S THE TERMINLS. PIN ONE E DETIL REFERENCE OPTIONL MILLIMETERS X CONSTRUCTION DIM MIN MX... C.. EXPOSED Cu MOLD CMPD. REF TOP VIEW b.. D. BSC () E. BSC DETIL B e. BSC D... C E.. K. DETIL B L.. X. C OPTIONL L.. CONSTRUCTION SIDE VIEW C SETING PLNE SOLDERMSK DEFINED MOUNTING FOOTPRINT* DETIL D. X L L L X K E X b e. C B BOTTOM VIEW. C NOTE X...9. PITCH X. DIMENSIONS: MILLIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
NCS, NCV, NCS, NCV, NCS, NCV PCKGE DIMENSIONS H E D E Micro8 CSE 8 ISSUE J NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y.M, 98.. CONTROLLING DIMENSION: MILLIMETER.. DIMENSION DOES NOT INCLUDE MOLD FLSH, PROTRUSIONS OR GTE BURRS. MOLD FLSH, PROTRUSIONS OR GTE BURRS SHLL NOT EXCEED. (.) PER SIDE.. DIMENSION B DOES NOT INCLUDE INTERLED FLSH OR PROTRUSION. INTERLED FLSH OR PROTRUSION SHLL NOT EXCEED. (.) PER SIDE.. 8- OBSOLETE, NEW STNDRD 8-. PIN ID T SETING PLNE.8 (.) e b 8 PL.8 (.) M T B S S c L MILLIMETERS INCHES DIM MIN NOM MX MIN NOM MX....8.... b...... c..8...7.9 D.9....8. E.9....8. e. BSC. BSC L...7...8 H E.7.9..87.9.99 RECOMMENDED SOLDERING FOOTPRINT* 8X.8 8X.8.. PITCH DIMENSION: MILLIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
NCS, NCV, NCS, NCV, NCS, NCV PCKGE DIMENSIONS X B Y Z H 8 G D S C. (.) M Z Y S X S. (.) M SETING PLNE Y. (.) SOIC 8 NB CSE 7 7 ISSUE K M N X M K SOLDERING FOOTPRINT*.. J NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y.M, 98.. CONTROLLING DIMENSION: MILLIMETER.. DIMENSION ND B DO NOT INCLUDE MOLD PROTRUSION.. MXIMUM MOLD PROTRUSION. (.) PER SIDE.. DIMENSION D DOES NOT INCLUDE DMBR PROTRUSION. LLOWBLE DMBR PROTRUSION SHLL BE.7 (.) TOTL IN EXCESS OF THE D DIMENSION T MXIMUM MTERIL CONDITION.. 7 THRU 7 RE OBSOLETE. NEW STNDRD IS 7 7. MILLIMETERS INCHES DIM MIN MX MIN MX.8..89.97 B.8...7 C..7..9 D.... G.7 BSC. BSC H.... J.9..7. K..7.. M 8 8 N.... S.8..8. STYLE : PIN. SOURCE. GTE. SOURCE. GTE. DRIN. DRIN 7. DRIN 8. DRIN 7..7.....7. SCLE : mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 7
NCS, NCV, NCS, NCV, NCS, NCV PCKGE DIMENSIONS TSSOP 8 CSE 98S ISSUE C. (.8) T. (.8) T L U U.7 (.) T SETING PLNE S PIN IDENT S D X L/ C 8 8x V K REF. (.) M T U S V S G B U J N DETIL E N J ÉÉÉÉ ÉÉÉÉ ÇÇÇÇ K K SECTION N N. (.) M W NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y.M, 98.. CONTROLLING DIMENSION: MILLIMETER.. DIMENSION DOES NOT INCLUDE MOLD FLSH. PROTRUSIONS OR GTE BURRS. MOLD FLSH OR GTE BURRS SHLL NOT EXCEED. (.) PER SIDE.. DIMENSION B DOES NOT INCLUDE INTERLED FLSH OR PROTRUSION. INTERLED FLSH OR PROTRUSION SHLL NOT EXCEED. (.) PER SIDE.. TERMINL NUMBERS RE SHOWN FOR REFERENCE ONLY.. DIMENSION ND B RE TO BE DETERMINED T DTUM PLNE -W-. MILLIMETERS INCHES DIM MIN MX MIN MX.9... B...9.77 C ---. ---. D.... F..7..8 G. BSC. BSC J.9...8 J.9... K.9..7. K.9..7. L. BSC. BSC M 8 8 F DETIL E 8
NCS, NCV, NCS, NCV, NCS, NCV PCKGE DIMENSIONS H 8. M B M e D 7 X b B E. M C S B S C SETING PLNE SOIC NB CSE 7 ISSUE K DETIL h X M L DETIL NOTES:. DIMENSIONING ND TOLERNCING PER SME Y.M, 99.. CONTROLLING DIMENSION: MILLIMETERS.. DIMENSION b DOES NOT INCLUDE DMBR PROTRUSION. LLOWBLE PROTRUSION SHLL BE. TOTL IN EXCESS OF T MXIMUM MTERIL CONDITION.. DIMENSIONS D ND E DO NOT INCLUDE MOLD PROTRUSIONS.. MXIMUM MOLD PROTRUSION. PER SIDE. MILLIMETERS INCHES DIM MIN MX MIN MX..7..8.....9..8. b..9..9 D 8. 8.7.7. E.8...7 e.7 BSC. BSC H.8..8. h....9 L....9 M 7 7 SOLDERING FOOTPRINT*. X.8.7 PITCH X.8 DIMENSIONS: MILLIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 9
NCS, NCV, NCS, NCV, NCS, NCV PCKGE DIMENSIONS. (.) T. (.) T L. (.) T SETING PLNE U U S X L/ PIN IDENT. S D C G X K REF V. (.) M T U S V S 8 7 B U H N TSSOP CSE 98G ISSUE B N J J F DETIL E DETIL E. (.) K K M ÇÇÇ ÉÉÉ SECTION N N W NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y.M, 98.. CONTROLLING DIMENSION: MILLIMETER.. DIMENSION DOES NOT INCLUDE MOLD FLSH, PROTRUSIONS OR GTE BURRS. MOLD FLSH OR GTE BURRS SHLL NOT EXCEED. (.) PER SIDE.. DIMENSION B DOES NOT INCLUDE INTERLED FLSH OR PROTRUSION. INTERLED FLSH OR PROTRUSION SHLL NOT EXCEED. (.) PER SIDE.. DIMENSION K DOES NOT INCLUDE DMBR PROTRUSION. LLOWBLE DMBR PROTRUSION SHLL BE.8 (.) TOTL IN EXCESS OF THE K DIMENSION T MXIMUM MTERIL CONDITION.. TERMINL NUMBERS RE SHOWN FOR REFERENCE ONLY. 7. DIMENSION ND B RE TO BE DETERMINED T DTUM PLNE W. MILLIMETERS INCHES DIM MIN MX MIN MX.9..9. B...9.77 C..7 D.... F..7.. G. BSC. BSC H.... J.9...8 J.9... K.9..7. K.9..7. L. BSC. BSC M 8 8 SOLDERING FOOTPRINT 7.. PITCH X. Micro8 is a trademark of International Rectifier X. DIMENSIONS: MILLIMETERS ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. listing of SCILLC s product/patent coverage may be accessed at /site/pdf/patent Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICTION ORDERING INFORMTION LITERTURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 9 E. nd Pkwy, urora, Colorado 8 US Phone: 7 7 or 8 8 Toll Free US/Canada Fax: 7 7 or 8 87 Toll Free US/Canada Email: orderlit@onsemi.com N. merican Technical Support: 8 8 98 Toll Free US/Canada Europe, Middle East and frica Technical Support: Phone: 79 9 Japan Customer Focus Center Phone: 8 87 ON Semiconductor Website: Order Literature: http:///orderlit For additional information, please contact your local Sales Representative NCS/D