Agilent EEsof EDA.
|
|
- Deborah Rodgers
- 5 years ago
- Views:
Transcription
1 Agilent EEsof EDA This document is owned by Agilent Technologies, but is no longer kept current and may contain obsolete or inaccurate references. We regret any inconvenience this may cause. For the latest information on Agilent s line of EEsof electronic design automation (EDA) products and services, please go to:
2 RF SiP/Module Workshop Hands-on Labs RF SiP/Module Design Made Simple! Page 1
3 Workshop Objectives Provides an hand-on experience on RF SiP/Module design Provides an hand-on experience of ADS design tools and utilities in RF SiP/Module design Page 2
4 Agenda Electro-Magnetic Simulation Technologies Overview Stack-Up Designs Scalable Passive Model Development with AMC (Advanced Model Composer) Passive Component Characterization and Modeling Design Kits Multilayer Circuit Design 3D Interconnect Designs Page 3
5 Electro-Magnetic Simulation Technologies Overview Page 4
6 Why Electromagnetic Simulation? Solution are based on Maxwell s Equations It can account for: It can account for all Parasitic interactions Packaging effects Distributed nature of fields inside the structure High Frequency RF Designs / High Speed Digital designs It can simulate arbitrary geometric models It is not bounded by Analytical equation s accuracy limits Directly compatible with popular Mechanical CAD tools Page 5
7 Electromagnetic vs. Circuit Simulation EM Analyzes physical structure based on EM theory (Maxwell s Equations) Considers all coupling Passive components only Generally slower simulations Circuit Simulators Analyzes circuit schematic using built-in models Considers explicit coupling Passive & Active components Generally faster simulations 1 L= 10 mil W= 10 mil L= 15 mil W= 10 mil L= 120 mil W= 10 mil L= 15 mil W= 10 mil L= 10 mil W= 10 mil 3 S= 15 mil 2 L= 10 mil W= 10 mil L= 15 mil W= 10 mil L= 10 mil W= 10 mil 4 Page 6
8 EM Simulation Technologies Today Method of Moments (e.g. Agilent Momentum) Finite Element Method (e.g. Agilent EMDS) Finite Difference Time Domain (e.g Agilent AMDS) Page 7
9 2.5D / 3D-Planar Methods: Method of Moments This is the method for solving problems where the fields depend on 3 space dimension, while their sources (currents) are mainly confined planes with two space dimensions Typical geometries which can be solved using MoM techniques are planar structures such as Microstrip circuits, Co-planar circuits, Patch antennas and General multi-layer structures that contain planar conductor pattern etc Page 8
10 3D Methods: Finite Element and FDTD These are the methods for solving problems where both the field and source functions depend on three space dimensions This category comprises all volumic full-wave general purpose formulations. Most popular 3D solution methods are Finite Elements (Frequency Domain) and FDTD (Time Domain) Page 9
11 Momentum 3D-Planar Electromagnetic Simulator Physical Structure z Air multilayered medium 3D planar metallization H(r) E(r) ε, µ σ h 1 Layer [1] 1 1, 1 ε, µ σ h 2 Layer [2] 2 2, 2 Port 1 source ε, µ σ h 3 Layer [3] 3 3, 3 Gnd source ω load J s (r) Port 2 load [S] S-parameters Your Virtual Network Analyzer Page 10
12 Momentum 3D-Planar Electromagnetic Simulator Momentum simulation process: Substrate database generation Green function calculation Mesh generation B 1 (r) B 2 (r) B 3 (r) I 1 I 2 I 3 S 1 S 2 [Z].[I]=[V] [S] Adaptive frequency loop For every frequency: Matrix Load: calculate [Z] elements Square dense Computationally intensive Matrix Solve: [Z].[I] = [V] Direct and iterative solvers, support of machine optimized libraries Page 11
13 EMDS: 3D EM modeling using FEM EMDS (Electro-Magnetic Design System) Full 3D EM Frequency domain FEM Great cost-performance (starting from less than US$20k) Standalone package and integration into ADS Page 12
14 EMDS simulation capabilities Application of EMDS for design & verification: Arbitrarily 3D shaped structures Conductors, resistors, isotropic & anisotropic dielectrics, isotropic & anisotropic linear magnetic materials Unlimited number of ports and/or circuit sources Frequencies greater than zero Absorbing boundary condition (free space) To compute: Network parameters (S, Y, Z) Electric and Magnetic Fields Multi-Mode impedance & propagation constants Antenna parameters (gain, directivity, polarization ) Page 13
15 EMDS Technology Finite Element Method (FEM) Generate mesh of tetrahedrons Approximate electric field over each tetrahedron with a second-order polynomial containing unknown coefficients Solve resulting matrix to determine values for the polynomial coefficients Page 14
16 Comparing MoM and FEM Stable at DC MoM Strips, slots, and vias in infinite, planar dielectrics (3D planar) Full-wave and Quasi-static modes User controlled metal surface meshing with rectangular, triangular and polygon cells Dense matrix, compression techniques Simulation time: O(N 3 ) (direct), O(N 2 ) (iterative), O(NlogN) (iterative/compr.) Memory: O(N 2 ), O(NlogN) FEM Arbitrarily shaped 3D metals and dielectrics Full-wave mode Unstable at DC Adaptive tetrahedral (volumetric) mesh Sparse matrix Simulation time: square Memory: linear to square Page 15
17 Questions Q: What is the most efficient EM simulation technology for multilayer applications? A: 3D planar (Momentum) Q: What is the most efficient EM simulation technology for 3D interconnect designs? A: 3D full-wave (EMDS and AMDS) Page 16
18 Congratulations! You have successfully completed the EM Technology Overview workshop Page 17
19 Stack-Up Designs Source: Intel Page 18
20 Sample Stack-up Configuration Substrate Dupont 943 Green Tape TM LTCC Stack-up configuration 8 metallization layers 7 substrate layers, H=23.1 mil Conductor Thickness, T=0.35 mil Dielectric Constant, Er=7.4 Loss Tangent, Tan d= Conductivity Au : 4.521E7 S/m 23.1mil Ag : 6.301E7 S/m 1.7mil 4.5mil 1.7mil 4.5mil Au, 0.35mil Ag, 0.35mil Page 19
21 Sample Layout Layers Strip & Via Layers Metal Layers D01-L1C D05-L2C Pin Pad Layer GND Layer D03-L1V D07-L2V D10-L3V D14-L4V D18-L5V D20-L6V D22-L2V D08-L3C D12-L4C D16-L5C D19-L6C D21-L7C D23-L8C GND Layer Via Layers Page 20
22 ADS Stack-up Definition - 3 Steps 3 steps to define stack-up configuration with Momentum substrate definition dialog 1 Invoke the menu Define substrate layers 2 3 Define Strip & Via (layout) layers Page 21
23 Pre-Computation of Substrate Menu: Momentum (RF)>Substrate>Precompute SUBSTRATE GENERATION (Intel Core2 CPU 2GHz) Process size : 6.77 MB User Time : 0h10m59s Elapsed Time : 0h11m 4s Momentum RF with DC ~ 10GHz frequency range Page 22
24 Lab Exercise Substrate Stack-up Objective Creating a substrate stack-up definition for the stack-up configuration below Open the design, Lab_Stackup_design Read Lab_Stackup_design_layer.lay file with Options>Layer menu Define the stack-up as shown below (Metal: Perfect conductor, Via: 2D via) Save the stack-up as Lab_Multilayer_Stackup Page 23
25 Using Supplied Substrates 1 There are many precomputed substrate definitions for typical stack-ups in ADS Alumina RT Duroid PCB 2 Page 24
26 Using User-Defined Substrate Stack-up User-defined substrate stack-ups can be loaded by browsing.slm files 1 2 Page 25
27 Tips On Multi-Layered Vias Q: How do you define multilayer via stackup in Momentum? 1. By creating new via layers for multilayer vias Easy to place vias But there might be many via layers to create 2. By stacking individual via layers Only same number of via layers as substrate layers But difficult to stack vias for multi-layer and sometimes prone to errors Page 26
28 Cavity Stack-Up Definition Use via layer to define dielectric bricks Example Spiral inductor w/ an air cavity Choose dielectric brick (air) layer for the layout layer Set material type to Dielectric (Eps) Set Real value of Eps to 1 Then click Via to map the dielectric brick to the substrate layers Cavity Note: This only works with EMDS for ADS not Momentum. Page 27
29 Lab Exercise Loading GT943 Stack-up Objective Loading the pre-defined GT943 stack-up for a design Open the layout design Lab_loading_stackup Select menu Momentum (RF)>Substrate>Open Find and load GT943_7Layers_Subst00_2Dv.slm Page 28
30 Congratulations! You have successfully completed the Stack-Up Designs workshop Page 29
31 Scalable Passive Model Development with AMC (Advanced Model Composer) Page 30
32 Advanced Model Composer (AMC) component : tee_s : symmetrical tee model is function of : substrate frequency range layout parameters W12 & W3 W12 W3 Momentum calculates S-data W12 W3 single frequency single W12, W3 freq W12 W3 continuous frequency single W12, W3 freq ADS Model Composer builds parameterized models for passive components continuous frequency range & discrete and/or continuously varying layout parameters W3 W3 W3 W12 freq W12 freq W12 freq continuous frequency discrete W12 discrete W3 continuous frequency discrete W12 continuous W3 continuous frequency continuous W12 continuous W3 Page 31
33 More On AMC AMC uses an adaptive rational/polynomial curve fitting algorithm, which is a multi-dimensional version of Momentum s Adaptive Frequency Sampling (AFS) algorithm. The.rat (=RATional) files generated by Momentum s AFS algorithm contain information about the rational fitting model of single Momentum simulations. There can be multiple.rat files in the model database for a single layout component. The AMC algorithms combine multiple.rat files into one global.pml (Passive Model Library) file. This file contains the multi-dimensional rational/polynomial model that is used to represent the S-data in the userdefined parameter/design space. Note Multiple.rat files that build up a.pml can be deleted. However, this is not necessary and may not be advisable as these.rat files can be re-used in a future AMC model generation. Page 32
34 Examples - Capacitor characterization with AMC 2 Layers parallel plate series capacitor Vector Single perturbed parameter Variable=EdgeDistFromCenter (10~50mils) Results in the area from 20x20 to 100x100 mil 2 Fast model development time EdgeDistFromCenter 0h 2m19s with 512MB RAM and 2GHz processor PC Page 33
35 Comparison of AMC model vs. EM Simulation 50x50mil and 75x75mil parallel plates capacitors compared 50x50mil Excellent agreement Simulation speed improvement, over 70x AMC=0.89 sec Momentum=1min 4sec Once the model is calculated, AMC provides a fast and accurate model development solution AMC EM 75x75mil Page 34
36 Examples Helical Inductor 2-Layer Helical Inductor on the layer L3C and L4C Substrate Stack-up GT943_7Layers_Subst00_2Dv.slm with Perfect Conductor 2D Via Try new 3D Previewer with ADS 2006 Update2 Find it under EMDS menu pick 4.5mil 3D View 2D View Page 35
37 AMC Model Generation 3 Steps Step 1-A: Create Layout Component Parameters Only one perturbation parameter Center2Edge 4 edges will be perturbed by a single vector Type = Nominal/Perturbed 0.3mm 0.5mm Center2Edge Page 36
38 AMC Model Generation 3 Steps Step 1-B: Create Layout Component Parameters Click Edit/View Perturbation menu Set perturbation for all four directions Select all vertices of right hand side Apply dx=0.2 dy=0 to those vertices Repeat for other four sides Click OK to complete the edit dx=0.2mm Page 37
39 AMC Model Generation 3 Steps Step 2: Create Layout Component Menu: Momentum (RF)>Component>Create/Update It creates layout look-alike schematic symbol for schematic Library Browser Page 38
40 AMC Model Generation 3 Steps Step 3: Generate AMC model Menu: Momentum (RF)>Component>Advanced Model Composer>Create Model Set layout parameters Sweep Type: Continuous Range Min 0.25mm to Max 1.2mm Then Apply and OK This will launch model generation process Page 39
41 Lab Exercise Creating AMC Models Objective Creating an AMC model for a given Helical Inductor Using the library browser to place the component in ADS schematic window Using 3D viewer to check the 3D drawing Open the design, Lab_creating_AMC_model Stack-up: GT943_7Layers_Subst00_2Dv.slm layer.lay: AMC_DK_GT943_7LAYERS_2Dv_layout.lay Check the 3D drawing with EMDS 3D viewer ( EMDS>3D EM Preview ) Create a model for the size from 0.5x0.5mm to 1.0x1.0mm Frequency 1 ~ 5GHz Once the model generation is finished, check the library browser if there are new three designs created Layout component, Momentum perturbed design, and work design Page 40
42 Congratulations! You have successfully completed the EM Technology Overview workshop Page 41
43 Passive Component Characterization and Modeling Page 42
44 p -Network Inductor Characterization p- network model parameter extraction by y-parameters Calculation of Q Converts 2-port S-parameter to 1-port S-parameter Calculates Q value from the 1-port S-parameter Imaginary (S11) Q = Real (S11) [ S ] Y1=y11+y21 Y2=y22+y12 Y3=-(y21+y12)/2 Calculation of effective L Effective Inductance Y3 L eff = Imaginary (Z11)? Y1 Y2 Page 43
45 ADS Measurement Equations for p -Network Inductor Model Use ADS measurement equations to extract p-network model parameters Initial Estimated Values Page 44
46 Examples - L3C-L4C Helical Inductor Model Extraction Modeling Frequency Model verification for 100MHz ~ 10GHz frequency range Helical Inductor Size 0.6x0.6mm, where Center2Edge=0.3mm Calculated Model Parameters Page 45
47 Comparison Of Modeled vs. EM Phase(S21) Excellent agreement! S11 S22 Page 46
48 Characterization for L3C-L4C Helical Inductor Q-factor, Inductance, and SRF with Center2Edge=0.3mm Q-factor and Inductance with swept Center2Edge (0.3 ~ 0.8mm) Can get inductance and Qfactor vs size of Helical inductor m_length: ADS swept variable for Center2Edge Page 47
49 Comparison of Various Inductors* Q factor Helical Inductor has the best Q value over the frequency range of use However it is decreased faster due to the increased capacitance with higher frequencies Helical inductor also has the biggest inductance value over others Meander shows a very flat inductance over the frequency range of use L Q Inductance * Note: The length of inductors are same Page 48
50 Helical Inductors on A Different Layer Combination Inductors on thinner layers generally give larger inductance but show lower SRF due to increased parasitics D01-L1C D05-L2C D08-L3C D12-L4C D16-L5C D19-L6C D21-L7C D23-L8C Q factor Inductance Inductance Lowered SRF for L4,5,6C Helical Inductors Page 49
51 Lab Exercise AMC Inductor Characterization Objective Creating a p-network model for Helical inductor Use the AMC model from previous lab Lab_creating_AMC_model Use ADS schematic design Lab_AMC_Pi_Model_Extraction to calculate p-network parameters Comparing modeled (p-network) vs. AMC model Build a schematic entry for the p-network using Lab_Pi_Model_Network Use Lab_Compare_Model_vs_AMC to compare the results S11 and S22 Page 50
52 Multilayer Inter-digital Capacitor Multilayer inter-digital capacitor on 3 layers, L3C, L4C, and L5C Capacitance area: 1mm x 1mm Characteristic 2.45GHz 3.7GHz 1mm 1mm Page 51
53 Swept Simulation of Multilayer Inter-digital Capacitor AMC Model Swept simulation of capacitor size Swept the size (m_length variable) from 0.05mm to 0.5mm This results in 0.1x0.1mm 2 ~ 1x1mm 2 capacitor 0.3x0.3mm gives ~400fF capacitance Page 52
54 Lab Exercise Objective Performing a swept simulation of AMC model for the size Ploting inductance and Q factor vs. swept parameter Use the Helical inductor from previous lab Lab_creating_AMC_model 0.5x0.5mm ~ 1.0x1.0mm Frequency 1 ~ 5GHz Open the design Lab_AMC_sweep Set the variable to m_length Simulate and plot the effective inductance and Q factor vs. inductor size Page 53
55 Broadband SPICE Page 54
56 Basic of the Broadband SPICE tool S-data S-data of passive components? equivalent circuit models. Flowchart of the tool Rational fit Passivity enforced? No A rational fit is performed on the input S- parameters The fitting procedure is based on the vector fitting algorithm (for more details: see *) The passivity enforcement step modifies the residues of the model in order to obtain a passive model. *: Rational Approximation of Frequency Domain Responses by Vector Fitting Bjørn Gustavsen and Adam Semlyen, IEEE Transactions on Power Delivery, Vol.14, No. 3, July Passivity enforcement Spice2 needed? S2Y transformation END Yes Yes No Page 55
57 Broadband Spice Broadband SPICE tool start-up: Menu (Schematic) Tools>Spice Model Generator>Start Broad Band Generator Steps: Choose input file type Dataset, Citifile, touchstone, Mom rational file (.rat) Browse input file with Browse button in Input dialog window Select output file type Choose output file name prefix Choose output directory or browse to select Page 56
58 Broad Band SPICE Model Generator Example Example Helical Spiral Inductor Page 57
59 Broad Band SPICE Model Generator Example Example Model Generation Page 58
60 Verification Simulation Setup o Double-click on the BBS2P item to bring up the Edit Parameter window. o Click on the Browse button next to File Name to browse the generated ADS network o Change files of type from.bbn to All Files (*.*) o Select the file ~networks/bbspiceds_heli_l03_l04_0_3m m_single.ckt o Then click on Open and OK. Page 59
61 Verification Results Excellent agreement! Page 60
62 Lab Exercise Broadband Spice Model Generation Objective Creating a broadband spice model for Helical inductor from the previous lab Page 61
63 Congratulations! You have successfully completed the Passive Component Characterization and Modeling workshop Page 62
64 ADS Design Kits Page 63
65 A Design Kit What is Design Kit? A kit typically created for each process and each CAD tool with the components and models by IC foundries However the design kit technology can be used for any other technologies to create a set of libraries ADS Design Kit Menu Page 64
66 Design Kit Installation 1. See what kits are installed DesignKit/List Design Kits Page 65
67 Design Kit Installation 2. Install Design Kit if the kit isn t installed DesignKit/Install Design Kits Unzip the design kit package that comes in a zip format Browse the design kit directory 3 Levels installation User Project Site Page 66
68 Lab Installation of NEC Design Kit File: NEC_mdl_kit_v1.5.zip NEC transistor library version update.asp File Location ~Workshop/NEC_mdl_kit_v1.5.zip Verify the design kit installation Page 67
69 Verify Design Kit Installation 1 Check if the design kit is installed and enabled 2 Check the palette in schematic Page 68
70 Creating AMC Design Kit (1) AMC models can be packaged into a design kit Menu Momentum (RF)>Component>Advanced Model Composer>Design Kit Steps 1. Open a AMC original design that would go into a design kit 2. Click the design kit menu 3. Work with Design kit dialog See next page Page 69
71 Creating AMC Design Kit (2) 1 Assign the name of component By default, AMC design kit is created under the directory $HOME/hpeesof/amc/design_kit 2 3 Enter the component description Select Model 4 Finish! Repeat these processes with all components that will go into the design kit. Page 70
72 Lab Exercise Installation of AMC Design Kit Objective Installing an AMC design kit Checking the installation with the library browser Copy amc directory (given by instructor) to $HOME/hpeesof Install the kit Check the installation Page 71
73 Congratulations! You have successfully completed the Design Kit workshop Page 72
74 Multilayer Circuit Design Page 73
75 Balun A Balun is a device that converts balanced impedance to unbalanced and vice versa Also Balun provides Impedance transformation Balanced to unbalanced transformation The word Balun is a contraction of balanced to unbalanced transformer Page 74
76 Transmission Line Balun Transmission Line Balun Each quarter wave length transmission lines can be represented by pi-type equivalent Therefore the transmission line balun can be transformed into a LC balun circuit Reference: Design Method of a Dual Band Balun and Divider 2002 IEEE MTT-S Digest Jung-Hyun Sung, Dal Ahn LC Equivalent Network Page 75
77 LC Balun Final Schematic High Pass Low Pass Resonance at f o Page 76
78 LC Balun Design at 2.44GHz Inductance = 4.58nH Capacitance = 0.928pF Page 77
79 Lab Exercise LC Balun Design Objective Designing a LC balun at 5GHz and find LC values Open the design Lab_LumpedPassiveEquiv_Balun Change wo value to 5GHz Simulate and plot the value of Lo and Co Page 78
80 LC Balun with AMC components Design the LC Balun with AMC components Inductor size: 0.295mm x 0.295mm = 4.58nH Capacitor size: 0.24mm x 0.24mm = 0.928pF Frequency: 1.8 ~ 3GHz de-tuned Page 79
81 Tuning AMC Design Use ADS tuning feature to tune the AMC design for a better performance The size of Inductor, 0.31mm, improves the performance of LC balun on loss and phase characteristic Page 80
82 Completed LC Balun ADS Layout Component Size 2.6mm x 2mm 6 land patterns 1 input and 2 outputs, 3 ground pins Component shapes are maintained but vias and some transmission lines are added to make proper connections 3D View Page 81
83 Simulation Result of Completed LC Balun Page 82
84 Lab Exercise Objective Designing the LC balun at 5GHz (from the previous lab) with the AMC design kit installed Use the AMC design kit installed from the previous lab Choose appropriate inductors and capacitors from the design kit Find the physical size of AMC components that meet L and C values for the design Simulate and check the performance Page 83
85 Congratulations! You have successfully completed the Multilayer Circuit Design workshop Page 84
86 3D Interconnect Designs Page 85
87 Bondwire Interconnects Simulation Most versatile and widely used microwave interconnect technique to connect ICs to ICs, ICs to circuits, and circuits to circuits. Alternative techniques such as BGA, top layer interconnect, etc can be high performance, but have high overhead to implement. Bondwires generally require full-wave 3D EM simulations Two options for 3D EM simulations EMDS stand-alone EMDS for ADS Bondwire Substrate 1 Substrate 2 Page 86
88 Bondwires in ADS Two bondwire shapes are available in ADS BONDW_Shape (Philips/TU Delft Bondwire Parameterized Shape) BONDW_Usershape (Philips/TU Delft Bondwire Model with User- Defined Shape) Page 87
89 Example Bondwire Simulation with EMDS for ADS Steps: 1. Create a bondwire shape in ADS schematic 2. Open a layout window from the schematic 3. Create the layout with bondwires The cavity represented by via in EMDS stack-up 4. Setup EMDS simulation and simulate Page 88
90 Lab Exercise Objective Simulating the bondwire interconnect with a different bond height, 75um Open the schematic design LAY_Bondwire_2Subst Change MaxH to 75um Open the layout Lab_Bondwire_2Subst Check the drawing with EMDS previewer Simulate the structure with EMDS>Simulation>S-Parameters Simulate and plot db(s11) and db(s22) Page 89
91 Congratulations! You have successfully completed the 3D Interconnect Designs workshop Page 90
92 For more information about Agilent EEsof EDA, visit: Agilent Updates Get the latest information on the products and applications you select. Agilent Direct Quickly choose and use your test equipment solutions with confidence. For more information on Agilent Technologies products, applications or services, please contact your local Agilent office. The complete list is available at: Americas Canada (877) Latin America United States (800) Asia Pacific Australia China Hong Kong India Japan 0120 (421) 345 Korea Malaysia Singapore Taiwan Thailand Europe & Middle East Austria Belgium 32 (0) Denmark Finland 358 (0) France * *0.125 /minute Germany ** **0.14 /minute Ireland Israel /544 Italy Netherlands 31 (0) Spain 34 (91) Sweden Switzerland United Kingdom 44 (0) Other European Countries: Revised: March 27, 2008 Product specifications and descriptions in this document subject to change without notice. Agilent Technologies, Inc. 2008
MMIC/RFIC Packaging Challenges Webcast (July 28, AM PST 12PM EST)
MMIC/RFIC Packaging Challenges Webcast ( 9AM PST 12PM EST) Board Package Chip HEESOO LEE Agilent EEsof 3DEM Technical Lead 1 Agenda 1. MMIC/RFIC packaging challenges 2. Design techniques and solutions
More informationEM Insights Series. Episode #1: QFN Package. Agilent EEsof EDA September 2008
EM Insights Series Episode #1: QFN Package Agilent EEsof EDA September 2008 Application Overview Typical situation IC design is not finished until it is packaged. It is now very important for IC designers
More informationAgilent EEsof EDA.
Agilent EEsof EDA This document is owned by Agilent Technologies, but is no longer kept current and may contain obsolete or inaccurate references. We regret any inconvenience this may cause. For the latest
More informationWhen Should You Apply 3D Planar EM Simulation?
When Should You Apply 3D Planar EM Simulation? Agilent EEsof EDA IMS 2010 MicroApps Andy Howard Agilent Technologies 1 3D planar EM is now much more of a design tool Solves bigger problems and runs faster
More informationMultilayer VIA simulations using ADS Anurag Bhargava, Application Consultant, Agilent EEsof EDA, Agilent Technologies
Multilayer VIA simulations using ADS Anurag Bhargava, Application Consultant, Agilent EEsof EDA, Agilent Technologies Many a time designers find themselves in pretty confusing start when it comes to simulating
More informationEMDS for ADS Momentum
EMDS for ADS Momentum ADS User Group Meeting 2009, Böblingen, Germany Prof. Dr.-Ing. Frank Gustrau Gustrau, Dortmund User Group Meeting 2009-1 Univ. of Applied Sciences and Arts (FH Dortmund) Presentation
More informationUsing Sonnet EM Analysis with Cadence Virtuoso in RFIC Design. Sonnet Application Note: SAN-201B July 2011
Using Sonnet EM Analysis with Cadence Virtuoso in RFIC Design Sonnet Application Note: SAN-201B July 2011 Description of Sonnet Suites Professional Sonnet Suites Professional is an industry leading full-wave
More information--- An integrated 3D EM design flow for EM/Circuit Co-Design
ADS users group meeting 2009 Rome 13/05, Böblingen 14-15/05, Massy 16/06 --- An integrated 3D EM design flow for EM/Circuit Co-Design Motivations and drivers for co-design Throw-The-Die-Over-The-Wall,
More informationKeysight EEsof EDA Microwave Discrete and Microstrip Filter Design. Demo Guide
Keysight EEsof EDA Microwave Discrete and Microstrip Filter Design Demo Guide 02 Keysight Microwave Discrete and Microstrip Filter Design - Demo Guide Theory Microwave filters play an important role in
More informationAgilent AN Balanced Circuit Measurement with an Impedance Analyzer/LCR Meter/Network Analyzer Application Note
Agilent AN 346-2 Balanced Circuit Measurement with an Impedance Analyzer/LCR Meter/Network Analyzer Application Note Introduction How a balanced circuit differs from an unbalanced circuit A balanced circuit
More informationInnovations in EDA Webcast Series
Welcome Innovations in EDA Webcast Series August 2, 2012 Jack Sifri MMIC Design Flow Specialist IC, Laminate, Package Multi-Technology PA Module Design Methodology Realizing the Multi-Technology Vision
More informationRF Board Design for Next Generation Wireless Systems
RF Board Design for Next Generation Wireless Systems Page 1 Introduction Purpose: Provide basic background on emerging WiMax standard Introduce a new tool for Genesys that will aide in the design and verification
More informationUWB Antenna Measurements with the 20 GHz E5071C ENA Network Analyzer
UWB Antenna Measurements with the 20 GHz E5071C ENA Network Analyzer Application Note Minimize cost of test with the 20 GHz ENA s high performance and fast measurement speed Quickly leverage your current
More informationSolutions for Solar Cell and Module Testing
Solutions for Solar Cell and Module Testing Agilent 663XB Power Supplies Connected in Anti-Series to Achieve Four-Quadrant Operation for Solar Cell and Module Testing Application Note Overview To fully
More informationMEMS On-wafer Evaluation in Mass Production Testing At the Earliest Stage is the Key to Lowering Costs
MEMS On-wafer Evaluation in Mass Production Testing At the Earliest Stage is the Key to Lowering Costs Application Note Recently, various devices using MEMS technology such as pressure sensors, accelerometers,
More informationRadar System Design and Interference Analysis Using Agilent SystemVue
Radar System Design and Interference Analysis Using Agilent SystemVue Introduction Application Note By David Leiss, Sr. Consultant EEsof EDA Anurag Bhargava, Application Engineer EEsof EDA Agilent Technologies
More informationAgilent PN 4395-1 Agilent 4395A Network/Spectrum/ Impedance Analyzer Silicon Investigations Repair Information - Contact Us 920-955-3693 www.siliconinvestigations.com ADSL Copper Loop Measurements Product
More informationAgilent N8480 Series Thermocouple Power Sensors. Technical Overview
Agilent N8480 Series Thermocouple Power Sensors Technical Overview Introduction The new N8480 Series power sensors replace and surpass the legacy 8480 Series power sensors (excluding the D-model power
More informationAgilent Correlation between TDR oscilloscope and VNA generated time domain waveform
Agilent Correlation between TDR oscilloscope and VNA generated time domain waveform Application Note Introduction Time domain analysis (TDA) is a common method for evaluating transmission lines and has
More informationDiscovering New Techniques of Creating, Editing, and Transferring Arbitrary Waveforms
Discovering New Techniques of Creating, Editing, and Transferring Arbitrary Waveforms Introduction Today, during the designing of electronic components and circuits for computers, peripherals, and consumer
More informationUsing a Network and Impedance Analyzer to Evaluate 13.56 MHz RFID Tags and Readers/Writers Silicon Investigations Repair Information - Contact Us 920-955-3693 www.siliconinvestigations.com Application
More informationAgilent EEsof EDA.
Agilent EEsof EDA This document is owned by Agilent Technologies, but is no longer kept current and may contain obsolete or inaccurate references. We regret any inconvenience this may cause. For the latest
More informationAgilent NFA Noise Figure Analyzer
Agilent NFA Noise Figure Analyzer Configuration Guide Dedicated Noise Figure Analyzer Hard specifications to 26.5 GHz Works with N4000A SNS or 346 Series noise sources Noise figure measurements to 110
More informationN2790A 100 MHz, N2791A 25 MHz and N2891A 70 MHz High-voltage Differential Probes
N2790A 100 MHz, N2791A 25 MHz and N2891A 70 MHz High-voltage Differential Probes Data Sheet Oscilloscope users often need to make floating measurements where neither point of the measurement is at earth
More informationProcess Control Calibration Made Easy with Agilent U1401A
Process Control Calibration Made Easy with Agilent U1401A Application Note This application note explains how the Agilent U1401A with simultaneous source and measure functions eases technicians calibration
More informationThe wireless industry
From May 2007 High Frequency Electronics Copyright Summit Technical Media, LLC RF SiP Design Verification Flow with Quadruple LO Down Converter SiP By HeeSoo Lee and Dean Nicholson Agilent Technologies
More informationSynthesis of Optimal On-Chip Baluns
Synthesis of Optimal On-Chip Baluns Sharad Kapur, David E. Long and Robert C. Frye Integrand Software, Inc. Berkeley Heights, New Jersey Yu-Chia Chen, Ming-Hsiang Cho, Huai-Wen Chang, Jun-Hong Ou and Bigchoug
More informationComparing Contact Performance on PCBA using Conventional Testpads and Bead Probes
Comparing Contact Performance on PCBA using Conventional Testpads and Bead Probes White Paper Andrew Tek, Agilent Technologies Introduction This white paper captures the details of an evaluation performed
More informationAgilent 4294A Precision Impedance Analyzer, 40 Hz to 110 MHz. Configuration Guide
Agilent 4294A Precision Impedance Analyzer, 40 Hz to 110 MHz Configuration Guide Ordering Guide The following steps will guide you through configuring your 4294A. Standard Furnished Item CD-ROM Manual
More informationAgilent N8973A, N8974A, N8975A NFA Series Noise Figure Analyzers. Data Sheet
Agilent N8973A, N8974A, N8975A NFA Series Noise Figure Analyzers Data Sheet Specifications Specifications are only valid for the stated operating frequency, and apply over 0 C to +55 C unless otherwise
More informationON-CHIP TECHNOLOGY INDEPENDENT 3-D MOD- ELS FOR MILLIMETER-WAVE TRANSMISSION LINES WITH BEND AND GAP DISCONTINUITY
Progress In Electromagnetics Research B, Vol. 22, 171 185, 2010 ON-CHIP TECHNOLOGY INDEPENDENT 3-D MOD- ELS FOR MILLIMETER-WAVE TRANSMISSION LINES WITH BEND AND GAP DISCONTINUITY G. A. Wang, W. Woods,
More informationAgilent U9397A/C FET Solid State Switches (SPDT)
Agilent U9397A/C FET Solid State Switches (SPDT) U9397A 300 khz to 8 GHz U9397C 300 khz to 18 GHz Technical Overview Key Features Prevent damage to sensitive components with low video leakage < 10 mvpp
More informationTwo-Way Radio Testing with Agilent U8903A Audio Analyzer
Two-Way Radio Testing with Agilent U8903A Audio Analyzer Application Note Introduction As the two-way radio band gets deregulated, there is a noticeable increase in product offerings in this area. What
More informationAgilent EEsof EDA.
Agilent EEsof EDA This document is owned by Agilent Technologies, but is no longer kept current and may contain obsolete or inaccurate references. We regret any inconvenience this may cause. For the latest
More informationMaking a S11 and S21 Measurement Using the Agilent N9340A
Making a S11 and S21 Measurement Using the Agilent N9340A Application Note Introduction Spectrum characteristics are important in wireless communication system maintenance. Network and spectrum analyzers
More informationGenesys 2012 Tutorial 2 - Using Momentum Analysis for Microwave Planar Circuits: Circuit and EM Co-Simulation
Genesys 2012 Tutorial 2 - Using Momentum Analysis for Microwave Planar Circuits: Circuit and EM Co-Simulation Here we demonstrate the process of running circuit and EM (electromagnetic) co-simulation.
More informationAgilent 87405B. Preamplifier 10 MHz to 4 GHz. Technical Overview. Features. Benchtop/General Purpose Use
Agilent 8705B Preamplifier 10 MHz to GHz Technical Overview Features db Gain 5 db Noise Figure Probe-power bias connection via probe port from Agilent s spectrum analyzers Compact Size Benchtop/General
More informationAgilent 8761A/B Microwave Switches
Agilent 8761A/B Microwave Switches Technical Overview Product Description The Agilent Technologies 8761A and 8761B are single-pole, double-throw coaxial switches with excellent electrical and mechanical
More informationDevelopment of Model Libraries for Embedded Passives Using Network Synthesis
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II: ANALOG AND DIGITAL SIGNAL PROCESSING, VOL 47, NO 4, APRIL 2000 249 Development of Model Libraries for Embedded Passives Using Network Synthesis Kwang Lim Choi
More informationFront-To-Back MMIC Design Flow with ADS. Speed MMICs to market Save money and achieve high yield
Front-To-Back MMIC Design Flow with ADS Speed MMICs to market Save money and achieve high yield 1 Unique Tools for Robust Designs, First Pass, and High Yield Yield Sensitivity Histogram (YSH) to components
More informationHigh Frequency Structure Simulator (HFSS) Tutorial
High Frequency Structure Simulator (HFSS) Tutorial Prepared by Dr. Otman El Mrabet IETR, UMR CNRS 6164, INSA, 20 avenue Butte des Coësmes 35043 Rennes, FRANCE 2005-2006 TABLE OF CONTENTS INTRODUCTION...
More informationAgilent U1881A and U1882A Power Measurement Application for Agilent InfiniiVision and Infiniium Oscilloscopes
Agilent U1881A and U1882A Power Measurement Application for Agilent InfiniiVision and Infiniium Oscilloscopes Data Sheet Fast, automatic and reliable characterization of switching mode power devices Today
More informationDesign and Matching of a 60-GHz Printed Antenna
Application Example Design and Matching of a 60-GHz Printed Antenna Using NI AWR Software and AWR Connected for Optenni Figure 1: Patch antenna performance. Impedance matching of high-frequency components
More informationMultipurpose Lab Station by Agilent Technologies
Multipurpose Lab Station by Agilent Technologies The Agilent Multipurpose Lab Station is an integrated system comprised of a: 1 2 3 4 5 6 7 8 Mixed signal oscilloscope (MSO) or digital signal oscilloscope
More informationIEEE Standard Boundary Scan Testing on Agilent Medalist i3070 In Circuit Systems
IEEE 1149.6 Standard Boundary Scan Testing on Agilent Medalist i3070 In Circuit Systems White Paper By Jun Balangue, Technical Marketing Engineer, Agilent Technologies, Inc. Abtract: This paper outlines
More informationAgilent 87075C Multiport Test Set
Agilent 87075C Multiport Test Set Technical Overview A complete 75 Ω system for cable TV device manufacturers Now, focus on testing, not reconnecting! For use with the Agilent 8711 C-Series of network
More informationAgilent 2-Port and 4-Port PNA-X Network Analyzer
Agilent 2-Port and 4-Port PNA-X Network Analyzer N5244A - MHz to 43.5 GHz N5245A - MHz to 5. GHz with Option H29 Data Sheet and Technical Specifications Documentation Warranty THE MATERIAL CONTAINED IN
More information544 IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 31, NO. 3, AUGUST /$ IEEE
544 IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 31, NO. 3, AUGUST 2008 Modeling and Measurement of Interlevel Electromagnetic Coupling and Fringing Effect in a Hierarchical Power Distribution Network
More informationAgilent 87222C/D/E Coaxial Transfer Switches dc to 26.5, 40, 50 GHz
Agilent 87C/D/E Coaxial Transfer Switches dc to 6.5, 0, 50 GHz Technical Overview High Performance Transfer Switches for Micro wave and RF Instrumentation and Systems Exceptional repeatability for more
More informationCitation Electromagnetics, 2012, v. 32 n. 4, p
Title Low-profile microstrip antenna with bandwidth enhancement for radio frequency identification applications Author(s) Yang, P; He, S; Li, Y; Jiang, L Citation Electromagnetics, 2012, v. 32 n. 4, p.
More informationADS-SystemVue Linkages
ADS-SystemVue Linkages Uniting System, Baseband, and RF design flows for leading-edge designs Superior RF models and simulators Convenient, polymorphic algorithmic modeling, debug, and test May 2010 Page
More informationAgilent EEsof EDA.
Agilent EEsof EDA This document is owned by Agilent Technologies, but is no longer kept current and may contain obsolete or inaccurate references. We regret any inconvenience this may cause. For the latest
More informationDesign and Analysis of Novel Compact Inductor Resonator Filter
Design and Analysis of Novel Compact Inductor Resonator Filter Gye-An Lee 1, Mohamed Megahed 2, and Franco De Flaviis 1. 1 Department of Electrical and Computer Engineering University of California, Irvine
More informationAgilent 8762F Coaxial Switch 75 ohm
Agilent 8762F Coaxial Switch 75 ohm Technical Overview DC to 4 GHz Exceptional repeatability over 1 million cycle life Excellent isolation The 8762F brings a new standard of performance to 75 ohm coaxial
More informationAgilent N4000A, N4001A, N4002A SNS Series Noise Sources 10 MHz to 26.5 GHz
Agilent N4000A, N4001A, N4002A SNS Series Noise Sources 10 MHz to 26.5 GHz Technical Overview Advances in Noise Figure Accuracy N4000A Used for low noise figure devices or devices sensitive to mismatch
More informationKeysight TC GHz Frequency Doubler
Keysight TC221 50 GHz Frequency Doubler 1GC1-8038 Data Sheet Features Conversion Efficiency: 12 db Typical 1/2 and 3/2 spurs: 15 dbc Typical Broad Bandwidth, 20 50 GHz Output Frequency Introduction The
More informationAgilent N9310A RF Signal Generator. All the capability and reliability of an Agilent instrument you need at a price you ve always wanted
Agilent N9310A RF Signal Generator All the capability and reliability of an Agilent instrument you need at a price you ve always wanted Reliable Performance. Essential Test Capability The N9310A RF signal
More informationSignal Integrity Modeling and Simulation for IC/Package Co-Design
Signal Integrity Modeling and Simulation for IC/Package Co-Design Ching-Chao Huang Optimal Corp. October 24, 2004 Why IC and package co-design? The same IC in different packages may not work Package is
More informationELE3310 Basic Electromagnetics Lab Session 1
ELE3310 Basic Electromagnetics Lab Session 1 Gao Xin By modifying CST MICROWAVE STUDIO 2006 tutorials Geometric Construction and Solver Settings Introduction and Model Dimensions In this tutorial you will
More informationsurface mount chip capacitor model
S (db) CAP-PPI-78N- surface mount chip capacitor model Model Features* Broadband validation: DC 4 GHz Equivalent circuit based Substrate scalable:(.9 H/Er 6.5 mil) Part value scalable: (. to pf) Land Pattern
More informationKeysight Technologies Using a Network and Impedance Analyzer to Evaluate MHz RFID Tags and Readers/Writers
Keysight Technologies Using a Network and Impedance Analyzer to Evaluate 13.56 MHz RFID Tags and Readers/Writers Application Note L C R f 0 = 2 1 π L C Introduction RFIDs, also called non-contact IC cards
More informationAgilent Maximizing Measurement Speed Using P-Series Power Meters
Agilent Maximizing Measurement Speed Using P-Series Power Meters Application Note A winning solution in the combination of bandwidth and performance 30 MHz video bandwidth Single-shot real time and repetitive
More informationKeysight Technologies Split Post Dielectric Resonators for Dielectric Measurements of Substrates. Application Note
Keysight Technologies Split Post Dielectric Resonators for Dielectric Measurements of Substrates Application Note Introduction The Keysight Technologies, Inc. split post dielectric resonator (SPDR) provides
More informationBrief Overview of EM Computational Modeling Techniques for Real-World Engineering Problems
Brief Overview of EM Computational Modeling Techniques for Real-World Engineering Problems Bruce Archambeault, Ph.D. IEEE Fellow, IBM Distinguished Engineer Emeritus Bruce@brucearch.com Archambeault EMI/EMC
More informationDemystifying Vias in High-Speed PCB Design
Demystifying Vias in High-Speed PCB Design Keysight HSD Seminar Mastering SI & PI Design db(s21) E H What is Via? Vertical Interconnect Access (VIA) An electrical connection between layers to pass a signal
More informationAgilent Introduction to the Fixture Simulator Function of the ENA Series RF Network Analyzers: Network De-embedding/Embedding and Balanced Measurement
Agilent Introduction to the Fixture Simulator Function of the ENA Series RF Network Analyzers: Network De-embedding/Embedding and Balanced Measurement Product Note E5070/71-1 Introduction In modern RF
More informationMethodology for MMIC Layout Design
17 Methodology for MMIC Layout Design Fatima Salete Correra 1 and Eduardo Amato Tolezani 2, 1 Laboratório de Microeletrônica da USP, Av. Prof. Luciano Gualberto, tr. 3, n.158, CEP 05508-970, São Paulo,
More informationKeysight Technologies N1918A Power Analysis Manager and U2000 Series USB Power Sensors. Demo Guide
Keysight Technologies N1918A Power Analysis Manager and U2000 Series USB Power Sensors Demo Guide Introduction This demonstration guide helps you to get familiar with the basic setup and configuration
More informationAgilent HMMC-3124 DC-12 GHz Packaged High Efficiency Divide-by-4 Prescaler 1GC TR1-7" diameter reel/500 each 1GC BLK-bubble strip/10 each
Agilent HMMC-3124 DC-12 GHz Packaged High Efficiency Divide-by-4 Prescaler 1GC1-8207-TR1-7" diameter reel/500 each 1GC1-8207-BLK-bubble strip/10 each Data Sheet Features Wide Frequency Range: 0.2-12 GHz
More informationHow to anticipate Signal Integrity Issues: Improve my Channel Simulation by using Electromagnetic based model
How to anticipate Signal Integrity Issues: Improve my Channel Simulation by using Electromagnetic based model HSD Strategic Intent Provide the industry s premier HSD EDA software. Integration of premier
More informationA passive circuit based RF optimization methodology for wireless sensor network nodes. Article (peer-reviewed)
Title Author(s) Editor(s) A passive circuit based RF optimization methodology for wireless sensor network nodes Zheng, Liqiang; Mathewson, Alan; O'Flynn, Brendan; Hayes, Michael; Ó Mathúna, S. Cian Wu,
More informationCircular polarization 10GHz slot antenna
Circular polarization 10GHz slot antenna Agilent Momentum&EMDS Nicolae CRISAN, PhD 1 Objectives: Design a rectangular microstrip slot antenna Geometry: square 11.9x11.9 [mm] Two input ports: 50 [Ohm] Dielectric:
More informationLTE Small-Cell Base Station Antenna Matched for Maximum Efficiency
Application Note LTE Small-Cell Base Station Antenna Matched for Maximum Efficiency Overview When designing antennas for base stations and mobile devices, an essential step of the design process is to
More informationAgilent Spectrum Visualizer (ASV) Software. Data Sheet
Agilent Spectrum Visualizer (ASV) Software Data Sheet Technical Overview The Agilent spectrum visualizer (ASV) software provides advanced FFT frequency domain analysis for the InfiniiVision and Infiniium
More informationDepartment of Electrical Engineering University of North Texas
Name: Shabuktagin Photon Khan UNT ID: 10900555 Instructor s Name: Professor Hualiang Zhang Course Name: Antenna Theory and Design Course ID: EENG 5420 Email: khan.photon@gmail.com Department of Electrical
More informationAntenna Design: Simulation and Methods
Antenna Design: Simulation and Methods Radiation Group Signals, Systems and Radiocommunications Department Universidad Politécnica de Madrid Álvaro Noval Sánchez de Toca e-mail: anoval@gr.ssr.upm.es Javier
More informationAgilent NFA Noise Figure Analyzer
Agilent NFA Noise Figure Analyzer Configuration Guide Dedicated Noise Figure Analyzer Hard specifications to 26.5 GHz Works with N4000A SNS or 346 Series noise sources Noise figure measurements to 110
More informationAgilent InfiniiMax III probing system
Agilent InfiniiMax III probing system Data Sheet World s highest speed and highest performing probe system Full 30 GHz bandwidth to the probe tip Industry s lowest probe and scope system noise Industry
More informationKeysight 8474B/C/E Planar-Doped Barrier Diode Detectors 0.01 to 50 GHz. Data Sheet
Keysight 8474B/C/E Planar-Doped Barrier Diode Detectors.1 to 5 GHz Data Sheet Introduction Features and Description Exceptional flatness Broadband from.1 to 5 GHz Extremely temperature stable Environmentally
More informationKeysight TC950 DC 75 GHz SPDT GaAs MMIC Switch
Keysight TC950 DC 75 GHz SPDT GaAs MMIC Switch 1GG6-8054 Data Sheet Features Frequency Range: DC-75 GHz Insertion Loss: 2.6 db typical @ 50 GHz Isolation: 29 db typical @ 50 GHz Return Loss: >10 db (Both
More informationAgilent E4438C/E8267D Option 422 Scenario Generator for GPS
Agilent E4438C/E8267D Option 422 Scenario Generator for GPS Technical Overview Create GPS Scenarios with Ease The Option 422 scenario generator software enhances the functionality of the Global Positioning
More information10 COVER FEATURE CAD/EDA FOCUS
10 COVER FEATURE CAD/EDA FOCUS Effective full 3D EMI analysis of complex PCBs by utilizing the latest advances in numerical methods combined with novel time-domain measurement technologies. By Chung-Huan
More informationCreating Arbitrary Waveforms in the U2300A Series and U2500A Series Data Acquisition Devices
Creating Arbitrary Waveforms in the U2300A Series and U2500A Series Data Acquisition Devices Application Note Introduction The U2300A Series and U2500A Series data acquisition device (DAQ) families are
More informationLTCC modules for a multiple 3-bit phase shifter with RF-MEMS-switch integration
LTCC modules for a multiple 3-bit phase shifter with RF-MEMS-switch integration Thomas Bartnitzek, Edda Müller, VIA electronic GmbH, Hermsdorf, Germany Raymond van Dijk, TNO-DSS, The Hague, Netherlands
More informationKeysight TC231P 0-20 GHz Integrated Diode Limiter
Keysight TC231P 0-20 GHz Integrated Diode Limiter 1GC1-8235 Data Sheet Features Two Independent Limiters for Single ended or Differential Signals Can be Biased for Adjustable Limit Level and Signal Detection
More informationAnalysis of Microstrip Circuits Using a Finite-Difference Time-Domain Method
Analysis of Microstrip Circuits Using a Finite-Difference Time-Domain Method M.G. BANCIU and R. RAMER School of Electrical Engineering and Telecommunications University of New South Wales Sydney 5 NSW
More informationCell size and box size in Sonnet RFIC inductor analysis
Cell size and box size in Sonnet RFIC inductor analysis Purpose of this document: This document describes the effect of some analysis settings in Sonnet: Influence of the cell size Influence of thick metal
More informationAdvanced Design System - Fundamentals. Mao Wenjie
Advanced Design System - Fundamentals Mao Wenjie wjmao@263.net Main Topics in This Class Topic 1: ADS and Circuit Simulation Introduction Topic 2: DC and AC Simulations Topic 3: S-parameter Simulation
More informationSlot Antennas For Dual And Wideband Operation In Wireless Communication Systems
Slot Antennas For Dual And Wideband Operation In Wireless Communication Systems Abdelnasser A. Eldek, Cuthbert M. Allen, Atef Z. Elsherbeni, Charles E. Smith and Kai-Fong Lee Department of Electrical Engineering,
More informationKeysight M9485A PXIe Multiport Vector Network Analyzer
Keysight M9485A PXIe Multiport Vector Network Analyzer 02 Keysight M9485A PXIe Multiport Vector Network Analyzer - Brochure High-Performance PXI Multiport Vector Network Analyzer (VNA) Innovative solution
More informationA Time-Saving Method for Analyzing Signal Integrity in DDR Memory Buses
A Time-Saving Method for Analyzing Signal Integrity in DDR Memory Buses Application Note 1591 This application note covers new tools and measurement techniques for characterizing and validating signal
More informationFDTD SPICE Analysis of High-Speed Cells in Silicon Integrated Circuits
FDTD Analysis of High-Speed Cells in Silicon Integrated Circuits Neven Orhanovic and Norio Matsui Applied Simulation Technology Gateway Place, Suite 8 San Jose, CA 9 {neven, matsui}@apsimtech.com Abstract
More informationProjects in microwave theory 2009
Electrical and information technology Projects in microwave theory 2009 Write a short report on the project that includes a short abstract, an introduction, a theory section, a section on the results and
More informationAN1229 Application note
Application note SD2932 RF MOSFET for 300 W FM amplifier Introduction This application note gives a description of a broadband power amplifier operating over the frequency range 88-108 MHz using the new
More informationKeysight Technologies 85072A 10-GHz Split Cylinder Resonator. Technical Overview
Keysight Technologies 85072A 10-GHz Split Cylinder Resonator Technical Overview 02 Keysight 85072A 10-GHz Split Cylinder Resonator - Technical Overview Part of the complete turn-key solution for the IPC
More informationIncluding the proper parasitics in a nonlinear
Effects of Parasitics in Circuit Simulations Simulation accuracy can be improved by including parasitic inductances and capacitances By Robin Croston California Eastern Laboratories Including the proper
More informationIntroduction: Planar Transmission Lines
Chapter-1 Introduction: Planar Transmission Lines 1.1 Overview Microwave integrated circuit (MIC) techniques represent an extension of integrated circuit technology to microwave frequencies. Since four
More informationFDTD CHARACTERIZATION OF MEANDER LINE ANTENNAS FOR RF AND WIRELESS COMMUNICATIONS
Progress In Electromagnetics Research, PIER 4, 85 99, 999 FDTD CHARACTERIZATION OF MEANDER LINE ANTENNAS FOR RF AND WIRELESS COMMUNICATIONS C.-W. P. Huang, A. Z. Elsherbeni, J. J. Chen, and C. E. Smith
More informationKeysight Technologies Power of Impedance Analyzer
Keysight Technologies Power of Impedance Analyzer - Comparison to Network Analyzer Application Note Uncover real characteristics Introduction Keysight s impedance analyzers are the only instruments on
More informationCHAPTER 4. Practical Design
CHAPTER 4 Practical Design The results in Chapter 3 indicate that the 2-D CCS TL can be used to synthesize a wider range of characteristic impedance, flatten propagation characteristics, and place passive
More information