--- An integrated 3D EM design flow for EM/Circuit Co-Design

Transcription

1 ADS users group meeting 2009 Rome 13/05, Böblingen 14-15/05, Massy 16/ An integrated 3D EM design flow for EM/Circuit Co-Design

2 Motivations and drivers for co-design Throw-The-Die-Over-The-Wall, the old way breaks down due to much smaller form factors of packages, chips, and so on Multichip modules, and stacked die become more common are now forcing IC and package designers to work together more closely Devices much closer in proximity induce parasitic couplings between them Increased use of multilayer embedded structures Requires more thorough circuit and EM (electromagnetic)-simulation and analysis among the IC, package, and pc board Chips Packages RF SiP SiP SMD PoP Board

3 Co-design case study Top layout view Die paddle Silicon Sub RF Board Input LTCC Balun DFN Package Output LTCC Balun

4 Sequential design process (1) Design of Differential RFIC PA RFIC PA Ideal Balun for Simulation Test

5 Sequential design process (2) Design of LTCC Balun S11 S21 & S31 Design Frequency: 2.45GHz

6 Sequential design process (3) Design of DFN package EM simulation Board 3D Bond Wire Connections Board Connections PCB via from Package to GND

7 Is the design completed? Every aspect of designs is done! IC design Balun design Package design Will the final (put all together) work as expected?

8 Integration (2) Simulation of Balun + RFIC PA + Package + Board Package S-Parameter Input Balun S-Parameter RFIC PA Sub-Circuit Output Balun S-Parameter

9 Design integration observations Pin Connectivity not obvious Pin Connectivity of different components is time consuming. It took 10 min to an ADS experienced user to create the final design. Pin Connectivity is error prone Now (only now!) we are going to discover the result of the integration of our different blocs.

10 Unexpected Parasitic Resonance! Parasitic resonances due to the interaction RFIC and package!

11 Customer experience with the non-integrated approach Non-Integrated EM Flow Minutes in the chart above represent additional design overhead

12 Chip-Package-Board (System) Co-Design Methodology Concurrently design chips, packages, and boards together to produce the cost effective, optimized electronic system that meets the performance goals both in frontend and backend design process Replace Throw-The-Die-Over-The-Wall old way ADS offers the best design platform for high speed and high frequency co-design Chips Packages RF SiP SiP SMD PoP Board

13 Use Agilent 3D EM without leaving ADS! ADS Layout with standard 3D components EMDS in ADS ADS circuit simulation with 3D components 3DEM integration in ADS design flow reduces design time, and risk of errors. Eliminate: - Transfer of design from ADS to stand-alone EM tool through GDS or Gerber files. - New assignment of material properties for each GDS or Gerber import. - New assignment of ports for each GDS or Gerber import. - Import of S parameters in ADS with the use of Layout Components

14 Why do we need 3D Fullwave EM for LTCC or Laminate designs? 3D View of the LTCC balun over the PC Board extended on the Z-axis by the ADS layout 3D viewer. L/C balun passives Balun design includes integrated inductors and capacitances. Dielectric bricks are not laterally infinite 3D Fullwave EM addresses these issues! Board

15 Why do we need 3D Fullwave EM for Package designs? 3D View of DFN package over RF Board. Extended on Z-axis 8 pin connections Package pins below the structure soldered on the RF Board Bond Wire connections have an arbitrary 3D shape 3D Fullwave EM addresses these issues! Board Board Connections 3D Bond Wire Connections PCB via from Package to GND

16 EMPro Core Custom 3D Components design kit ADS Layout EMPro Core Flow: Custom 3D components generation in EMPro Connectors, Solderballs, Solder bumps, shield, packages.. Any arbitrary 3D components ADS Design kit generation in EMPro Use 3D component from ADS 3D component design kit EM/circuit co-simulation of 3D components with other circuit components either in ADS layout or schematic NEW!

17 3D parameterized components Library Direct insertion into layout: Connectors Packages Wire bonds Solder balls Solder bumps Spiral inductors S1 D1 D2 S2 L2 L1 Solder Ball Bottom Drawing Layer Number of Facets (or Angle) Number of Rows Number of Columns Thickness for solder mask H

18 3D EM Design Flow with 3D Components Design Kit in ADS Install 3D Component Design Kit Place 3D component from the palette Edit 3D Component Parameters Complete ADS Layout Done! 3D EM Simulation 3D EM (FEM) Simulation Setup Check 3D View All in ADS!

19 Product Vision Two operation modes of platform EMPro Standalone Integrated in ADS ADS schematic ADS layout EMPro (3D editor) FEM FDTD Momentum FEM FDTD Same product!

20 Summary of Integrated 3D EM Design Flow in ADS Integrated EM saves cycle time Non-Integrated EM Flow Integrated EM Flow

21 Summary of benefits Use of Layout components avoids connectivity errors. Each of the 3DEM based models can be parameterized. Thus allowing sweep, tuning, and optimization. No need to export your layout to an external tool for 3DEM simulations. Layout changes are automatically taken into account by the integrated 3DEM FEM solver. The 3D component library provides ready-to-use components like solder balls, connectors, SMA launches, Allows you to get the fastest return out of your 3DEM tool investments

22 Conclusion Concurrently design chips, packages, and boards together to produce the cost effective, optimized electronic system that meets the performance goals. The integrated 3D EM design flow saves cycle time and increases first pass design success. To learn more, visit :