DG2706. High Speed, Low Voltage, 3, Quad SPDT CMOS Analog Switch. Vishay Siliconix DESCRIPTION FEATURES APPLICATIONS

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1 High Speed, Low Voltage, 3, Quad SPDT CMOS Analog Switch DESCRIPTION The DG2706 is a high speed, low voltage, low On-resistance, quad SPDT (single pole double throw) analog switch. It operates from a.6 V to 4.3 V single power supply and achieves 3 switch On-resistance. When turned on, each switch conducts equally in both directions. Its switch on resistance flatness is 0.6 and channel to channel matching is of 0.3 when powered with single 3. V supply. All channels guaranteed break before make switching. Control logic input has 0. V to.6 V logic threshold. It features a 90 MHz - 3 db bandwidth, - 90 db crosstalk and - 70 db off-isolation at MHz. The DG2706 is an ideal fit for low voltage battery powered devices switching audio, video, multi-media data streams, and control signals between different functional circuits or ports. The DG2707 comes in a small miniqfn-6 lead package (.8 mm x 2.6 mm x 0.7 mm). As a committed partner to community and the environment, manufactures this product with the lead(pb)-free device terminations and is 0 % RoHS compliant. FEATURES Operation voltage range:.6 V to 4.3 V Guaranteed On-resistance: 3.0 at 3. V Low voltage logic threshold Low crosstalk: - 70 db High off-isolation: - 90 db Ultra small package: miniqfn6 of.8 mm x 2.6 mm APPLICATIONS Dual SIM card switch A/V and analog signal routing Battery operated devices Data acquisition systems Communications systems Medical and ATE equipments FUNCTIONAL BLOCK DIAGRAM AND P CONFIGURATION miniqfn-6l NO4 NC NC4 NO 4 VXX 7 6 NO3 NC Pin : LONG LEAD NC 2 NO2 Device Marking: VXX Traceability Code: V is DG2706DN XX = Date/Lot Top View ORDERG FORMATION Temp. Range Package Part Number - 40 C to 8 C miniqfn-6 DG2706DN-T-E4

2 TRUTH TABLE DG2706 QUAD SPDT, miniqfn-6l Select Input On Switches (Pin ) 2 (Pin 3) Description (Pin) Common (Pin) 0 X NC (Pin ) (Pin 6) X NO (Pin ) 0 X NC4 (Pin 4) 4 (Pin 3) X NO4 (Pin 2) 0 NC2 (Pin 6) X 2 (Pin ) NO2 (Pin 4) 0 NC3 (Pin 9) X 3 (Pin 3) NO3 (Pin 7) ABSOLUTE MAXIMUM RATGS (T A = 2 C, unless otherwise noted) Parameter Limit Unit Reference to to.0,, NC, NO a to ( + 0.3) V Current (Any terminal except NO, NC or ) 30 Continuous Current (NO, NC, or ) ± 20 ma Peak Current (Pulsed at ms, % Duty Cycle) ± 00 Storage Temperature (D Suffix) - 6 to C Thermal Resistance (Package) b miniqfn-6 2 C/W Power Dissipation (Package) b miniqfn-6 c, d 2 mw Notes: a. Signals on NC, NO, or or exceeding will be clamped by internal diodes. Limit forward diode current to maximum current ratings. b. All leads welded or soldered to PC board. c. Derate 6.6 mw/ C above 70 C d. Manual soldering with iron is not recommended for leadless components. The miniqfn-6 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper lip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. 2

3 SPECIFICATIONS ( = 3. V) Parameter Symbol Test Conditions Otherwise Unless Specified Temp. b Limits - 40 C to 8 C Min. d Typ. c Max. d Analog Switch Analog Signal Range e V ANALOG R DS(on) Full 0 V On-Resistance R DS(on) = 3. V, I NO/NC = ma, V =.0 V Room 3. Full 6 R ON Match R (ON) = 3. V, I NO/NC = ma, V =.0 V Room 0.3 R ON Resistance Flatness R ON = 3. V, I NO/NC = ma, Room 0.6 Channel Off Leakage Current I NO/NC(off) = 3.6 V, V NO/NC = 0. V/3 V, Room Full - - I (off) V = 3 V/0. V Room - Full - Channel-On Leakage Room - I Current (on) = 3.6 V, V NO/NC, V = 3 V/0. V Full Digital Control Input High Voltage V H Full.6 Input Low Voltage V L Full 0.4 V Input Current I L or I H V = 0 or Full - µa Dynamic Characteristics Break-Before-Make Time t BBM Room Full Room 20 4 Enable Turn-On Time t ON(EN) V NO, V NC =. V, R L = 0, C L = 3 pf Full ns Room 3 Enable Turn-Off Time t OFF(EN) Full 4 Charge Injection d Q J C L = nf, R GEN = 0, V NC/NO = 2 V Room 3 pc Off-Isolation d OIRR Room - 70 = 3. V, f = MHz, R L = 0, C L = pf Crosstalk d, f X TALK Room - 90 db Bandwidth d BW = 3. V, R L = 0, C L = pf, - 3 db Room 90 MHz Total Harmonic Distortion d THD = 3. V, R LOAD = 600 Room 0.02 % N O, N C Off Capacitance d CS NC(off) 6 CS NO(on) = 3. V, f = MHz Room pf Channel-On Capacitance d C (on) 3 Power Supply Power Supply Range V Power Supply Current I+ V = 0 or Full µa Notes: a. Room = 2 C, Full = as determined by the operating suffix. b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet. c. Typical values are for design aid only, not guaranteed nor subject to production testing. d. Guarantee by design, not subjected to production test. e. V = input voltage to perform proper function. f. Crosstalk measured between channels. Unit na Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 3

4 TYPICAL CHARACTERISTICS (T A = 2 C, unless otherwise noted) RON - On-Resistance (Ω) =.6 V T = 2 C I ON = ma R ON - On-Resistance (Ω) =.6 V, I ON = ma + 8 C + 2 C - 40 C 6 4 = 3. V = 3.6 V V D - Analog Voltage (V) R ON vs. V D and Single Supply Voltage V D - Analog Voltage (V) R ON vs. Analog Voltage and Temperature = 3. V, I ON = ma DG2706 R L = 600 Ω V Signal = V RMS R ON - On-Resistance (Ω) C + 2 C - 40 C THD (%) =.6 V = 3.6 V = 3. V V D - Analog Voltage (V) R ON vs. Analog Voltage and Temperature Frequency (Hz) Switching Threshold vs. Supply Voltage = 3.6 V, I ON = ma ma ma R ON - On-Resistance (Ω) C + 8 C + 2 C I+ - Supply Current (A) 0 µa µa µa 0 na na = 3.6 V = 3. V =.6 V na V D - Analog Voltage (V) R ON vs. Analog Voltage and Temperature 0 pa 0 K K 0K M M Input Switching Frequency (Hz) Supply Current vs. Input Switching Frequency 4

5 TYPICAL CHARACTERISTICS (T A = 2 C, unless otherwise noted) Leakage Currrent (pa) 00 0 = 3. V I NO/NC(off) I (on) I (off) Temperature ( C) Leakage Current vs. Temperature Loss, OIRR, X TALK (db) = 3. V R L = 0 Ω OIRR Loss X TALK - 0 0K M M 0M G Frequency (Hz) Insertion Loss, Off-Isolation Crosstalk vs. Frequency..4 VT - Switching Threshold (V) Supply Voltage (V) Switching Threshold vs. Supply Voltage

6 TEST CIRCUITS Switch Input Logic Input NO or NC Switch Output R L 0 Ω V OUT C L 3 pf Logic Input Switch Output V H V L 0 V 0 % t r t f < ns < ns 0.9 x V OUT 0 V t ON t OFF C L (includes fixture and stray capacitance) ( ) R V OUT = V L R + L R ON Logic "" = Switch on Logic input waveforms inverted for switches that have the opposite logic sense. Figure. Switching Time Logic Input V H t r < ns t f < ns V NO NO V O V L V NC NC R L 0 Ω C L 3 pf V NC = V NO V O 90 % Switch Output 0 V t D t D C L (includes fixture and stray capacitance) Figure 2. Break-Before-Make Interval V gen + R gen V = 0 - NC or NO V OUT C L = nf V OUT On ΔV OUT Off On Q = ΔV OUT x C L depends on switch configuration: input polarity determined by sense of switch. Figure 3. Charge Injection 6

7 TEST CIRCUITS nf nf NC or NO 0 V, 2.4 V R L 0 V, 2.4 V NC or NO Meter HP492A Impedance Analyzer or Equivalent Analyzer Off Isolation V = 20 log V NO /NC f = MHz Figure 4. Off-Isolation Figure. Channel Off/On Capacitance maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see /ppg?

8 Thin miniqfn6 Case Outline Package Information A D B Terminal tip (4) 6 x b M M C AB C C E L C Pin # identifier () x L e Top view Bottom view C Seating plane Side view A3 A 0. C 0. C DIMENSIONS MILLIMETERS () CHES M. NOM. MAX. M. NOM. MAX. A A A3 0. ref ref. b D e 0.40 BSC 0.06 BSC E L L N (3) 6 6 Nd (3) 4 4 Ne (3) 4 4 Notes () Use millimeters as the primary measurement. (2) Dimensioning and tolerances conform to ASME Y4.M (3) N is the number of terminals. Nd and Ne is the number of terminals in each D and E site respectively. (4) Dimensions b applies to plated terminal and is measured between 0. mm and 0.30 mm from terminal tip. () The pin identifier must be existed on the top surface of the package by using identification mark or other feature of package body. (6) Package warpage max. 0.0 mm. ECN: T Rev. B, 09-May-6 DWG: 6023 Revision: 09-May-6 Document Number: For technical questions, contact: analogswitchtechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HERE AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?900

9 PAD Pattern REMENDED MIMUM PADS FOR MI QFN 6L 0.62 (0.022) (0.07) 0.22 (0.0089) (0.42) (0.082).200 (0.0472) 2.0 (0.0827) Mounting Footprint Dimensions in mm (inch) Document Number: 667 Revision: 0-Mar-

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