高速數位電路與無線通訊系統之電磁相容技術發展與應用
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1 高速數位電路與無線通訊系統之電磁相容技術發展與應用 林漢年 / 主任 逢甲大學通訊工程系 /IC-EMC 研究發展中心 ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
2 2 Outline Introduction to EMI and RFI for High-Speed Systems Trend of Wireless Communications and Automotive Development Platform Noise Impact on Throughput EMI Analysis of Key Components in Mobile Device Application of Noise Budget and Analysis Model for System Integration Conclusion ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
3 What is EMI and EMC? Natural Sources: Lightning, Electrostatic Discharge (ESD) - Artificial Noise: EFT dv/dt di/dt EMI 干擾源 信號源 耦合路徑 信號接收器 ( 敏感設備 ) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
4 EMI vs. RF Interference Calculations: ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
5 High Speed Digital System Trends More complex designs, more power on chip, and more susceptible Most powerful EM sources RF MCU DSP Memory Bus control ADC DAC Test Most susceptible parts ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
6 ANSYS, Inc. August 31, 2016 ANSYS UGM 2016 Problems by Power/Ground Noise
7 Challenges in High Speed Digital Design ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
8 Triangle of EMC related Issues EMC Normal Mode Radiation Common Mode Radiation Interference SI (Signal Integrity) Delay/Timing Control Reflection Noise Crosstalk Noise Eye Opening Jitter 8 PI (Power Integrity) PWR/GND Plane Resonance SSN PWR Supply Impedance Decoupling ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
9 9 Outline Introduction to EMI and RFI for High-Speed Systems Trend of Wireless Communications and Automotive Development Platform Noise Impact on Throughput EMI Analysis of Key Components in Mobile Device Application of Noise Budget and Analysis Model for System Integration Conclusion ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
10 10 The mobile communication and trend toward higher data bandwidth ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
11 11 Evolution of Wireless Devices RF SAR OTA TP? Applications Innovation IP-LBS-HD Resolution,. 1G 2G 2.5G 3G 4G-5G analog voice communication digital services quicker data access (384kbps) higher speed connectivity (2Mbps) high speed Broadband (>20Mbps) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
12 Antenna Near Field and Far Field ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
13 What s the OTA Measurement? OTA: Over-the-Air The purpose is to measure the 3-dimensions (X, Y, Z) antenna pattern for transmit power and receiver sensitivity for wireless devices. (Regulation) (CTIA) ANSYS, Inc. August 31, 2016 ANSYS UGM
14 What is On-Board Self Jamming? LTE Lots of on-board antennas/wireless modules in Modern Mobile Phone!! ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
15 車輛 EMC 環境 EV 充電環境 Amateur Radio Aviation Radar Broadcasting Tower 傳統道路環境 Cellular phone Protection of receiver ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
16 Advanced Driver Assistance Systems (ADAS) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
17 Complex Automobiles Electronic 當車輛使用電源線與 AC 電力網路連線進行充電時, 則須符合 AC 電網 EMC 相關規範 使用範圍多廣, 須依政府法令規定 使用範圍多深, 視車廠品質確保程度而定 ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
18 18 Outline Introduction to EMI and RFI for High-Speed Systems Trend of Wireless Communications and Automotive Development Platform Noise Impact on Throughput EMI Analysis of Key Components in Mobile Device Application of Noise Budget and Analysis Model for System Integration Conclusion ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
19 19 Figure of Merit for MIMO Systems - Throughput De-Sense represented by Noise PDF at different channel ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
20 Hybrid: OTA + Conduction Full Anechoic RF Chamber with fixed multi-path & in-line programmable attenuation between the AP & DUT to simulate changing RF conditions NOTE: A phase shifter (Butler matrix) is used to emulate multi-path Unless otherwise requested, channels used by default (Ch MHz or Ch MHz) Traffic type used by default (TCP) iperf commands: Sender: iperf c <IP_OF_SERVER> -w 256K l 1470 P4 fm i1 t<duration> Receiver: iperf s w 256K ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
21 Setup for Throughput Measurement (Server) (AP) (DUT ) Conduction Test Setup OTA Test Setup ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
22 22 Throughput(Mbps) AP2 & AP3 - CH 01 (Tx mode) CH01 TX Total Attenuation (db) AP2 AP3 AP2-AP n TX (20MHz) AP2 AP Total Attenuation(dB) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
23 23 Throughput(Mbps) AP2 & AP3 - CH 01 (Rx mode) CH01 RX Total Attenuation (db) AP2 AP3 AP2-AP n RX (20MHz) AP2 AP Total Attenuation(dB) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
24 24 Throughput(Mbps) AP2 & AP3 - CH 06 (Tx mode) CH06 TX Total Attenuation (db) AP2 AP3 AP2-AP n TX (20MHz) AP2 AP Total Attenuation(dB) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
25 25 Throughput(Mbps) AP2 & AP3 - CH 06 (Rx mode) CH06 RX Total Attenuation (db) AP2 AP3 AP2-AP n RX (20MHz) AP2 AP Total Attenuation(dB) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
26 26 Throughput(Mbps) AP2 & AP3 - CH 11 (Tx mode) CH11 TX Total Attenuation (db) AP2 AP3 AP2-AP n TX (20MHz) AP2 AP Total Attenuation(dB) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
27 Throughput(Mbps) AP2 & AP3 - CH 11 (Rx mode) CH11 RX Total Attenuation (db) AP2 AP3 AP2-AP n RX (20MHz) AP2 AP Total Attenuation(dB) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
28 28 Mbps Mpbs 13.3 Notebook: CH01(1/3) (AP-2) 實測衰減 110deg (Ant 130cm) CH01 CH01 86db 86db Tx Rx 衰減器 A 衰減器 C Average (AP-3) 實測衰減 110deg (Ant 130cm) CH01 CH01 86db 86db Tx Rx 衰減器 A 衰減器 C Average CH01 Tx degree Tx-Ap2 CH01 Rx Tx-Ap degree Rx-Ap2 Rx-Ap ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
29 29 Mbps Mbps 13.3 Notebook: CH06(2/3) (AP-2) 實測衰減 110deg (Ant 130cm) CH06 CH06 86db 86db Tx Rx 衰減器 A 衰減器 C Average (AP-3) 實測衰減 110deg (Ant 130cm) CH06 CH06 86db 86db Tx Rx 衰減器 A 衰減器 C Average CH06 Tx Tx-Ap2 degree CH06 Rx Tx-Ap degree Rx-Ap2 Rx-Ap ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
30 30 Mbps Mbps 13.3 Notebook: CH11(3/3) (AP-2) 實測衰減 110deg (Ant 130cm) CH11 CH11 86db 86db Tx Rx 衰減器 A 衰減器 C Average (AP-3) 實測衰減 110deg (Ant 130cm) CH11 CH11 86db 86db Tx Rx 衰減器 A 衰減器 C Average CH11 Tx Tx-Ap2 degree CH11 Rx Tx-Ap degree Rx-Ap2 Rx-Ap ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
31 31 Mbps Mbps 15 Notebook: CH01(1/3) (AP-2) 實測衰減 110deg (Ant 105cm) CH01 CH01 86db 86db Tx Rx 衰減器 A 衰減器 C Average (AP-3) 實測衰減 110deg (Ant 105cm) CH01 CH01 86db 86db Tx Rx 衰減器 A 衰減器 C Average CH01 Tx Tx-Ap2 degree CH01 Rx Tx-Ap degree Rx-Ap2 Rx-Ap ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
32 32 Mbps Mbps 15 Notebook: CH06(2/3) (AP-2) 實測衰減 110deg (Ant 105cm) CH06 CH06 86db 86db Tx Rx 實測衰減 110deg (Ant 105cm) CH06 衰減器 A CH06 86db 86db Tx Rx 衰減器 C 衰減器 A 衰減器 C Average (AP-3) Average CH06 Tx degree Tx-Ap2 Tx-Ap3 Ch06 Rx degree Rx-Ap2 Rx-Ap ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
33 33 Mbps Mbps 15 Notebook: CH11(3/3) (AP-2) 實測衰減 110deg (Ant 105cm) CH11 CH11 86db 86db Tx Rx 衰減器 A 衰減器 C (AP-3) 實測衰減 110deg (Ant 105cm) CH11 CH11 86db 86db Tx Rx 衰減器 A 衰減器 C CH11 Tx degree Tx-Ap2 Tx-Ap CH11 Rx Average Average degree Rx-Ap2 Rx-Ap ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
34 34 Setup for Antenna Port Noise inside view Complete set up view Back view ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
35 35 dbm Platform Noise (WLAN_Main) Platform_noise Background Platform noise Main WLAN_Main_LF15V Frequency(GHz) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
36 36 dbm Platform Noise(WLAN_AUX) Platform_noise Background Platform noise AUX WLAN_AUX_LF15V Frequency(GHz) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
37 37 Surface Scan to Locate Noise Source Front view Complete setup view ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
38 38 Current RFI Mitigation Practices ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
39 39 屏蔽材料對於雜訊抑制效果比較 未加材料 _Probe 0 加入材料 ( 石墨烯 )_Probe ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
40 40 屏蔽材料對於雜訊抑制效果比較 未加材料 _Probe 90 加入材料 ( 石墨烯 )_Probe ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
41 41 屏蔽材料對於雜訊抑制效果比較 未加材料 _Probe 0 加入材料 ( 石墨烯 )_Probe ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
42 42 屏蔽材料對於雜訊抑制效果比較 未加材料 _Probe 90 加入材料 ( 石墨烯 )_Probe ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
43 43 Throughput 量測 量測場地示意圖 實際量測場地 DUT Antenna AP Controller ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
44 44 Throughput (Uplink) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
45 45 Throughput (Downlink) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
46 46 Throughput (Bidirectional) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
47 47 Outline Introduction to EMI and RFI for High-Speed Systems Trend of Wireless Communications and Automotive Development Platform Noise Impact on Throughput EMI Analysis of Key Components in Mobile Device Application of Noise Budget and Analysis Model for System Integration Conclusion ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
48 Internal EMI Sources Fields Conduction E & H Fields on Structure Parasitic effects Capacitive Coupling SI, Crosstalk Inductive Coupling Layout and placement PCB, Chassis, Connectors, External Cables Radiated Coupling (CM, DM) Aperture/Resonant effects SPD Shielding Power distribution Signal distribution Ground loop Conductive Coupling Filtering Induced Current & Charge on Structure or victim components ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
49 49 Estimating RF Interference Levels in Mixed Digital/RF Designs ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
50 RFI/EMI Analysis for RF Devices Near Field Far Field Possible coupling paths Radiation through aperture in chassis and picked up by antenna. Direct field coupling inside chassis, heat-sink radiation, high speed signal trace radiation, etc. Coupling through power distribution system. Coupling through loop formed by chassis and ground planes ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
51 ANSYS, Inc. August 31, 2016 ANSYS UGM 2016 Near field Coupling Path Loss
52 Platform Noise is a problem today and will get worse if we do nothing Platform RF Interference severely impacts wireless performance. Getting worse for future platforms More Victim Radios Licensed Radios (more stringent reqs.) Higher GHz Sources (I/O & Components) UMD devices force noise closer to radios ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
53 53 The difference between wireless link rate, actual file transfer and web browsing speed RF S/N Performance TIS (Sensitivity) Platform Noise Coupling (Physical Layer) Data Rate Throughput quality of experience (QoE) High Speed Digital (ICs/Modules) User Scenario (Application Layer) Webpage Loading ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
54 ANSYS, Inc. August 31, 2016 ANSYS UGM 2016 Aspect of EMC stages
55 Critical industrial needs for EMC ANSYS, Inc. August 31, 2016 ANSYS UGM
56 Development trends for new EMC-strategies product ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
57 Key Components for Wireless Devices ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
58 Link budget vs. Noise budget Link Budget - Specify all the component - Specification like insertion loss, VSWR, NF, from antenna to I/Q demodulator. ANTENNA GAIN DIPLEXER INSERTION LOSS MISMATCHING LOSS LNA GAIN LNA NOISE FIGURE SAW FILTER LOSS MIXER CONVERSTION LOSS SAW FILTER LOSS I/Q CONVERSTION LOSS 58 Noise Budget - Specify the Noise power Specification for different component at different location Noise Power CPU NORTH BRIDGE(LVDS DIRVER.) MEMORY LVDS SOKET LVDS FLAT FLEX CABLE LCD PANEL (T-CON, BACKLIGHT) WEB CAM MINI COAXIAL CABLE FOR RF SOUTH BRIDGE ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
59 59 Outline Introduction to EMI and RFI for High-Speed Systems Trend of Wireless Communications and Automotive Development Platform Noise Impact on Throughput EMI Analysis of Key Components in Mobile Device Application of Noise Budget and Analysis Model for System Integration Conclusion ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
60 Equipment designers want to predict EMC before fabrication Siemens Automotive Toulouse Most of the time, EMC measurements are performed once the equipment is built. No improvements can be done at conception phase. Predict EMC performances IC, board, equipment optimizations However, need of non-confidential IC models (black box models) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
61 61 Application Concept of Noise Budget Interference Source Interference Frequencies Interference Position Communications Performance ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
62 Predict system-level performance from component-level information Old Approach: Put the components in a typical system and measurement the system performance. Better Approach: Fully characterize the components themselves, then model system behavior ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
63 Compatibility Analysis Model Magnetic Probe TEM Cell BCI. N Limit (dbm) = ESD Waveform EFT Waveform EMI Spectrum S M (dbm) + G A (dbi) SNR (db) Generic Standards Basic Standards Product Family Standards Product Standards ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
64 Mechanisms for ICEM parasitic emission Couple through supply lines (PI) Direct Radiated coupling Couple through input/output lines (SI) Component measurements should characterize the source in order to build models that can be used at the system level. Otherwise, they are mostly useless! ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
65 65 Standard methods for emission characterization of ICs ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
66 66 Standard methods for immunity characterization of ICs ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
67 Intra-System EMI and PCB level EMC System level EMC must be taken care at component level ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
68 Pre-Layout Placement Design Major players in this interference problem Digital IC Noise Source a library model RF Interference Coupling Path modeling or measurement RF antenna Victim a library model Noise voltage at RF receiver can be quickly estimated ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
69 Two Source Reconstruction Approaches Source reconstruction based on TEM cell measurement - Test PCB - Dipole extraction from TEM measurement - Correlation to far-field measurement Source reconstruction based on near-field scanning measurement - Calculation of equivalent dipole array from near-field scanning - Reconstruction of fields at any location from dipole array ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
70 70 Horizontal and vertical magnetic near field scan of a SoC (a) 2D horizontal scan (b) Vertical scan plot from a full 3D near-field scan (Nexio from 2016 IEEE Electromagnetic Compatibility Magazine Volume 5 Quarter 1) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
71 Hierarchy Measurement and Modeling for EMC IEC IEC IEC IEC ESA 模組 : ISO RF/Antenna 模組整車 : ISO CISPR 12/25 ECE R10 Wireless: 3GPP; CTIA 環境電磁場 ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
72 ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
73 73 Outline Introduction to EMI and RFI for High-Speed Systems Trend of Wireless Communications and Automotive Development Platform Noise Impact on Throughput EMI Analysis of Key Components in Mobile Device Application of Noise Budget and Analysis Model for System Integration Conclusion ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
74 EMC Design Strategies 1. 頻譜控制 (Spectrum Management) 干擾源 4. 接地設計 (grounding) 5. 佈線設計 (Layout Design) Radiated Field 3. 屏蔽材料 (shielding) Conducted 2. 濾波元件 (Filter) TVS/filter 受害者 ( 敏感設備 ) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
75 75 Emerging Platform Trends Ultra-mobile, ultra-compact and consumer platforms will drive pervasive changes in chip-level RFI & EMI just as they are doing to chip power and packaging. More radios and RF coexistence Pocket-sized form factors Increasing data rates & performance requirements Usage driven performance criteria Pressure to eliminate shields & reduce size will be intense. SiP s don t allow for board-level fixes. Silicon must be right. No time for multiple design spins ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
76 EMC Challenge and Development for Future From Inter-System Regulations Requirement Regulatory Design: SAR HAC RF RSE AGPS (Debugging with Antenna Design RF Absorber shielding and filtering) Full Automobiles Through Intra-System Coupling Analysis OTA Performance Requirement for Wireless Communications (Edge of Link) MIMO (Throughput) Automobile Modules To Silicon Chip and Package Level Request Noise budget for IC EMC measurement IC EMI Noise Modeling S/N Prediction (Placement Coupling) ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
77 Isotropic Radiator Concept for Noisy IC Placement ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
78 Before Components EMC Adoption Conductive tapes everywhere ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
79 After Components EMC Adoption Solutions are on component side ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
80 感谢聆听 ANSYS, Inc. August 31, 2016 ANSYS UGM 2016
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