1/12. Photocoupler LTV-M456 series. Intelligent Power Module and Gate Drive Interface Optocoupler 1. DESCRIPTION. 1.1 Features. Functional Diagram

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1 Photocoupler Intelligent Power Module and Gate Drive Interface Optocoupler 1. DESCRIPTION The contain a AlGaAs LED optically coupled to an integrated high gain photo detector. Minimized propagation delay difference between devices, make these optocouplers excellent solutions for improving inverter efficiency through reduced switching dead time. Specifications and performance plots are given for typical IPM applications. Analog applications. 1.1 Features Functional Diagram Performance specified for common IPM applications over industrial temperature range. ANODE 1 6 V cc Short maximum propagation delays Minimized pulse width distortion (PWD) 5 Vo Very high common mode rejection (CMR) High CTR CATHODE 3 4 SHIELD GND Safety approval: UL/ cul 1577, 375 Vrms/1 min VDE DIN EN , V IORM = 567 Vpeak Note: A.1µF bypass capacitor must be connected between Pin 4 and Specifications Truth Table Wide operating temperature range: 4 C to 1 C. Maximum propagation delay t PHL = 4ns, t PLH = 55ns Maximum pulse width distortion (PWD) = 45ns 15 kv/µs minimum common mode transient immunity (CMTI) at V CM = 15 V. CTR > 44% at I F = 1 ma LED ON OFF V O LOW HIGH 1.3 Applications IPM Isolation Isolated IGBT/MOSFET Gate Drive AC and Brushless DC Motor Drives Industrial Inverters 1/12 Part No. :

2 Photocoupler 2. PACKAGE DIMENSIONS 2.1 LTV-M456 Date Code *1 Factory Code *2. VDE Option *3 Notes : 1. Year date code digit work week. 3. Factory identification mark (W :China-CZ) or V for VDE option. * Dimensions are in Millimeters and (Inches). 2/12 Part No. :

3 Photocoupler 3. TAPING DIMENSIONS 3.1 LTV-M456 Description Symbol Dimension in mm (inch) Tape wide W 12±.3 (.63) Pitch of sprocket holes P 4±.1 (.15) Distance of compartment Distance of compartment to compartment F 5.5±.1 (.295) P 2 2±.1 (.79) P 1 8±.1 (.472) 3.2 Quantities Per Reel Package Type Quantities (pcs) 3 3/12 Part No. :

4 4. RATING AND CHARACTERISTICS 4.1 Absolute Maximum Ratings Photocoupler Parameter Symbol Min. Max. Unit Note Average Input Current I F(avg) 25 ma Input Peak Transient Input Current (<1μs pulse width, 3pps) I F(tran) 1. A Reverse Input Voltage V R 5 V Output Collector Current I O(avg) 15 ma Output Voltage (Pin 5-4) V O V Output Supply Voltage (Pin 6-4) V CC V Output Power Dissipation P o 1 mw Total Power Dissipation P T 145 mw Operating Temperature T opr -4 1 Storage Temperature T stg o C o C Note: Ambient temperature = 25 o C, unless otherwise specified. Stresses exceeding the absolute maximum ratings can cause permanent damage to the device. Exposure to absolute maximum ratings for long periods of time can adversely affect reliability. Note: A ceramic capacitor (.1 µf) should be connected between pin 6 and pin 4 to stabilize the operation of a high gain linear amplifier. Otherwise, this Photocoupler may not switch properly. The bypass capacitor should be placed within 1 cm of each pin. 4.2 Recommended Operating Conditions Parameter Symbol Min Max Unit Operating Temperature T A -4 1 o C Supply Voltage V CC V Output Voltage V O 3 V Input Current (ON) I FL(ON) 1 2 ma Input Voltage (OFF) V F(OFF) -5.8 V 4/12 Part No. :

5 Photocoupler 4.3 ELECTRICAL OPTICAL CHARACTERISTICS Parameter Symbol Min. Typ. Max. Unit Test Condition Figure Note Input Forward Voltage V F V I F = 1mA 4 Input Input Forward Voltage V F/ T -1.6 mv/ C I F = 1mA Temperature Input Reverse Voltage BV R 5 V I R = 1µA Input Threshold V O =.8 V, I TH ma 1 1 Current I O =.75mA Input Capacitance C IN 34 pf Current Transfer Rtion CTR % f = 1 MHz, V F = V I F = 1mA, V O =.6V 2 Low Level Output Current I OL ma I F = 1 ma, V O =.6 V 1,2 Output High Level Supply Current Low Level Supply Current I CCH ma I CCL ma V F =.8 V, V O = Open I F = 1 ma, V O = Open 1 1 High level output current Low Level Output Voltage I OH 1 5 µa V F =.8 V 3 V OL.15.4 V I O = 2.4 ma Over recommended operating conditions unless otherwise specified. T A = -4 C to +1 C, V CC = +4.5 V to 3 V, I F(on) = 1 ma to 2 ma, V F(off) = -5 V to.8 V Note 1: Use of a.1 µf bypass capacitor connected between pins 4 and 6 can improve performance by filtering power supply line noise. Note 2: CURRENT TRANSFER RATIO in percent is defined as the ratio of output collector current (I O) to the forward LED input current (I F) times 1. 5/12 Part No. :

6 4.4 SWITCHING SPECIFICATION Photocoupler Parameter Symbol Min. Typ. Max. Uni Test Condition Fig. Note Propagation Delay Time to C L= 1pF t PHL Low Output Level 125 C L= 1pF 5,7-11 1, 2 I F(on)= 1mA, C Propagation Delay Time to L= 1pF V F(off)=.8 V, t PLH High Output Level 17 ns C L= 1pF V CC= 15. V, Pulse Width Distortion PWD 3 45 C L= 1pF V THLH= 2. V, V THHL= 1.5 V 3 Propagation Delay t PLH - Difference Between Any t PHL Parts Output High Level IF = ma, Common Mode Transient CM H 15 3 kv/µs V CC = 15. V, 5 V O > 3. V Immunity C L= 1 pf, 6 V CM= 15V P-P Output Low Level Common IF = 1 ma, CM L 15 3 kv/µs Mode Transient Immunity V O < 1. V T A= 25 C 6 Over recommended operating conditions unless otherwise specified. T A = -4 C to +1 C, V CC = +4.5 V to 3 V, I F(on) = 1 ma to 2 ma, V F(off) = -5 V to.8 V Note 1: Use of a.1 µf bypass capacitor connected between pins 4 and 6 can improve performance by filtering power supply line noise. Note 2: Pulse: f = 2 khz, Duty Cycle = 1%. Note 3: Pulse Width Distortion (PWD) is defined as t PHL - t PLH for any given device. Note 4: The difference between t PLH and t PHL between any two parts under the same test condition. Note 5: Common mode transient immunity in a Logic High level is the maximum tolerable dv CM/dt of the common mode pulse, V CM, to assure that the output will remain in a Logic High state (i.e., V O > 3. V). Note 6: Common mode transient immunity in a Logic Low level is the maximum tolerable dv CM/dt of the common mode pulse, V CM, to assure that the output will remain in a Logic Low state (i.e., V O < 1. V). 6/12 Part No. :

7 5. ISOLATION CHARACTERISTIC Photocoupler Parameter Symbo Min. Typ. Max. Unit Test Condition Note Withstand Insulation Test Voltage V ISO 375 V RH 4%-6%, t = 1min, T A = 25 C 1, 2 Input-Output Resistance R I-O 1 12 Ω V I-O = 5V DC 1 Input-Output Capacitance C I-O.92 pf f = 1MHz, T A = 25 C 1 All Typical values at T A = 25 C unless otherwise specified. Note 1: Device is considered a two terminal device: pins 1 and 3 are shorted together and pins 4, 5 and 6 are shorted together. Note 2: According to UL1577, each photocoupler is tested by applying an insulation test voltage 45V RMS for one second (leakage current less than 1uA). This test is performed before the 1% production test for partial discharge 6. TYPICAL PERFORMANCE CURVES & TEST CIRCUITS I O - Output Current (ma) C 25 C V O =.6V.6 1 C T A - Temperature - o C I F - Forward Current (ma) Normalized Output Current (A) I F = 1 ma V o =.6 V Figure 1: Typical Transfer Characteristics Figure 2: Normalized Output Current vs. Temperature 7/12 Part No. :

8 Photocoupler I OH - High Level Output Current (µa) v F =.8V V CC = V O = 4.5 OR 3V T A - Temperature - o C Figure 3: High Level Output Current vs. Temperature I F - Forward Current (ma) 1 TA = 25 o C V F - Forward Voltage (V) Figure 4: Input Current vs. Forward Voltage 1 6 I F I F = 1 ma uF 2kΩ V o CL V CC = 15V + - V O V T H H L t p H L t f 9 % 9 % 1 % 1 % t r V t p L H T H L H Figure 5 : Propagation Delay Test Circuit. SW B IF A uF 2kΩ VO 1 pf V CC = 15V VCM V VO SW A: IF=mA t δv δt = VCM t Vcc V FF V CM = 15V + - VO SW B: IF=1mA VOL Figure 6 : CMR Test Circuit and Waveforms 8/12 Part No. :

9 Photocoupler t P - Propagation Delay (ns) I F = 1 ma V CC = 15 V C L = 1 pf R L = 2 kω(external) T A - Temperature - o C Figure 7: Propagation Delay vs. Temperature T PHL T PLH t p - Propagation Delay (ns) I F = 1 ma V CC = 15 V C L = 1 pf T A = 25 o C T PHL T PLH R L - Load Resistance - kω Figure 8: Propagation Delay vs. Load Resistance t p - Propagation Delay (ns) I F = 1 ma V CC = 15 V R L = 2kΩ T A = 25 o C T PHL T PLH t p - Propagation Delay (ns) I F = 1 ma C L = 1 pf R L = 2 kω T A = 25 o C T PHL T PLH C L - Load Capacitance - pf V CC - Supply Voltage (V) Figure 9: Propagation Delay vs. Load Capacitance. Figure 1: Propagation Delays vs. Supply Voltage t p - Propagation Delay (ns) v CC = 15 V 1 C L = 1 pf T 5 R L = 2 kω PHL T A = 25 o C T PLH I F - Forward Current (ma) Figure 11: Propagation Delay vs. Input Current. 9/12 Part No. :

10 7. TEMPERATURE PROFILE OF SOLDERING 7.1 IR Reflow soldering (JEDEC-STD-2C compliant) Photocoupler One time soldering reflow is recommended within the condition of temperature and time profile shown below. Do not solder more than three times. Profile item Conditions Preheat - Temperature Min (T Smin) - Temperature Max (T Smax) - Time (min to max) (ts) 15 C 2 C 9±3 sec Soldering zone - Temperature (T L) - Time (t L) Peak Temperature (T P) Ramp-up rate Ramp-down rate 217 C 6 ~ 1 sec 26 C 3 C / sec max. 3~6 C / sec Ramp-up 2 sec TP 26 C Temperature ( C) Tsmin 15 C TL 217 C Tsmax 2 C 6-1 sec tl (Soldering) Ramp-down 25 C 6 ~ 12 sec ts (Preheat) Time (sec) 1/12 Part No. :

11 7.2 Wave soldering (JEDEC22A111 compliant) One time soldering is recommended within the condition of temperature. Photocoupler Temperature: 26+/-5 C Time: 1 sec. Preheat temperature:25 to 14 C Preheat time: 3 to 8 sec. 7.3 Hand soldering by soldering iron Allow single lead soldering in every single process. One time soldering is recommended. Temperature: 38+/-5 C Time: 3 sec max. 11/12 Part No. :

12 8. NAMING RULE Photocoupler Part Number Options LTV-M456 LTVM456-V Definition of Suffix M456 no suffix V Remark LiteOn model name Pin 1 location at upper right of the tape VDE approved option 9. NOTES LiteOn is continually improving the quality, reliability, function or design and LiteOn reserves the right to make changes without further notices. The products shown in this publication are designed for the general use in electronic applications such as office automation equipment, communications devices, audio/visual equipment, electrical application and instrumentation. For equipment/devices where high reliability or safety is required, such as space applications, nuclear power control equipment, medical equipment, etc, please contact our sales representatives. When requiring a device for any specific application, please contact our sales in advice. If there are any questions about the contents of this publication, please contact us at your convenience. The contents described herein are subject to change without prior notice. Immerge unit s body in solder paste is not recommended. 12/12 Part No. :

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