PLC LEONI Splitter Components PLWL. The Quality Connection

Transcription

1 PLC LEONI Splitter Components PLWL The Quality Connection

2 Topics 1) History 2) Technology 3) PLC components for standard applications in telecommunication (FTTH) 4) Special PLC components 4) Product flow LFO,

3 Product flow - 3 LFO splitter activity in Waghaeusel LFO,

4 1) History Planar waveguide are known since 1969, when Miller (Bell Labs) published a first paper describing the basics of planar waveguides First paper published on PLWL components by ion-exchange in glass by Koizumi et al. (Nippon Sheet Glass) 1983 First R&D activities at Schott Glas as well as at Carl Zeiss 1987 IOT as a JV of Schott and Zeiss was founded 1990 Commercial and technical collaboration with NSG 1993 First splitter components supplied by IOT to Deutsche Telekom (OPAL 93) 1994 First large FTTH project of Deutsche Telecom (OPAL 94); IOT could win contract for supplying 65% of splitters (1x8, 1x16 and 1x32), competitors AOFR and Corning 1996 to 2000 IOT was taken over by JDS Uniphase JDS Uniphase Photonics 2003 JDSU Photonics closed and IOTech founded 2004 IOTech and Pyramid Optics merged 2007 LEONI Fiber Optics took over all operations of IOTech LFO,

5 1) History 2 A) Main projects for PLWL components supplied by IOT / JDSU Photonics / IOTech : OPAL 93 *) FTTH OPAL 94 *) FTTH (OPAL 93 / mio. subscribers) OTIAN (BT) FTTH Personal Handy Phone System (J) backbone system for cellular network Ciena (USA) DWDM long distance network Tyco (B) long distance submarine system Since 2006 new FTTH projects in Europe etc VDI/VDE-Award for Innovative Material Application *) Reference: Dipl.-Ing Detlef Kolligs T-Com, Darmstadt d.kolligs@telekom.de LFO,

6 PLC Technology with layer deposition deposition of silica deposition of 2. silica layer silicon (Silica) deposition of doped silica E.g. SiO 2 /GeO 2 photolithographic mask PLC chip silica on silica or silica on silicon reactive ion etching of doped silca layer Stress between different layers causes higher polarization effects! High temperature dependency of PDL Increased PDL LFO,

7 Fused coupler technology I 0 I 1 Coupling region I 0 I 1 I Wavelength flattened couplers (+/- 25 (40) nm) very wavelength dependent! Wavelength [nm] LFO,

8 Application classification PLWL-Komponenten werden eingeteilt in: Standard components Applications: Telecommunikation especially subscriber loop FTTH Special components Applications: Telecommunikation, Sensors, Metrology, Bio-medical technologies, Optical signal transmission, others Market: Mass market with typically large volumes >> p.a. Market: Niche markt a few 100 to several pcs On a long term scale a few applications may be transferred into a mass market LFO,

9 Technology - principles SM Planar waveguide types (cross section) n 2 n 2 > n 1 n 2 n 1 n 1 SM fiber surface waveguide buried waveguide step index waveguide rib waveguide buried gradient index waveguide LFO-type LFO,

10 Ion-Exchange Technology Waveguide manufacturing by ion-exchange in Glas The waveguides are formed by ion indiffusion into the bulk material instead of layer deposition with other technologies. The ion size of silver and sodium is well matched. The process is performed below the glass transition temperature of the substrate glass. The process is simple, reproducible and relatively easy to control. Material and process are used since 1986 and well understood. Therefore waveguide properties can be calculated by computer modelling. Na + Ag + air glass 13 µm LFO,

11 Technology Ion-Exchange Production Process Manufacturing of planar waveguide chips 1. Wafer cutting and polishing 2. Photolithography 3. Ion-exchange Substrate glass IAG4 4. Chip cutting and polishing 5. Fiber chip coupling 6. Housing assembly LFO,

12 Technology Ion-Exchange Production Process Glass wafer with metallic mask 3 wafer with 24 splitter chips 1x16 Ti mask produced by high resolution photolithographic mask process line width 1,5 3 µm LFO,

13 Technology Ion-Exchange Production Process Waveguide manufacturing by ion-exchange salt melt mask glass Na + Na + Ag + Na + Step 1: surface waveguides by thermal diffusion Step 2: buried waveguides by field-assisted ion-exchange LFO,

14 Technology Ion-Exchange Production Process Buried waveguides in glass substrates glass surface proprietary glass IAG 4, waveguides made by Ag + / Na + ion exchange Burial depth 15 µm 3 µm 10 µm 1. after thermal diffusion (first step) 2. after field assisted diffusion (second step) LFO,

15 Technology Ion-Exchange Production Process Waveguide Mode Field SM Fiber Mode Field Free of mechanical stress lowest PDL Mode fields are nearly identical! Extremely low fiber-chipcoupling loss LFO,

16 Technology Ion-Exchange Production Process 35 Polarization Independent Insertion Loss Splitters [%] Samples: 1x8 splitters Sample size = 800 ports max. PDL [db] / Splitter Advantage: Typical value for PDL is better than 0.07 db. Benefit: During systems planning possibly disadvantageous effects for analogue systems need not be considered. High speed transmission (>10 Gb/s) no problem! LFO,

17 Technology Ion-Exchange Production Process Integration Density of FBTs vs. Planar Splitters Concatenation of FBT Couplers 1x16-Splitter Tray Design of Monolithic Waveguide Structures 2x2-Coupler Y-Branch Splice Fused (FBT) 2x2-Coupler Element FBT concatenation assembled in a tray 155 Component housing with bare fiber 92 LFO,

18 Technology Ion-Exchange Production Process Planar Waveguide production steps LFO,

19 Technology Ion-Exchange Production Process Integrated optics based on planar waveguide technologies Silica on silicon, ion-exchange in glass, polymers, III/V materials, LiNbO 3 Primitive straight waveguide (prop. loss: 0,07 db/cm) bended waveguide segment/ splines (bending radius >30mm) Y branch ratio: 5:95-50:50 (struct. loss: 0,05 db) directional coupler ratio: 50:50 (struct. loss: 0,15 db) electro or thermooptical modulator Electro or thermooptical switch Example for a waveguide simulation layout on 3 to 4 wafers 2x2 coupler Y branch LFO,

20 Technology Ion-Exchange Production Process Design of fiber arrays fiber chip interface: UV or thermal curing glue with a transition temperature outside the operating temperature range. fiber carrier: glass for optimum thermal expansion matching. Si- or glass-v-groove array: precise fiber alignment assembling: a thermal curing glue with a high transition temperature is used to connect V-groove array and fiber carrier. fiber stress release: bare fiber is fixed between V-groove and fiber carrier. glue glass block fiber bending: fixation of the coated fiber in the array preserves the bare part of the fiber from damage. Si LFO,

21 Technology Ion-Exchange Production Process Si-Arrays, bonded to Glass glue Reference edge LEONI offers a wide range of fiber array products: Maximum channel count 64 Fiber type MM, SM and PM Pitch 127 µm, 250 µm Other pitch on request (up to mm-range) Double layer arrays (2 rows of fibers) 2-dimensional arrays (e.g. 8x8 fibers) SM fiber: Coating Cladding Core Glass 10 µm 250 µm Cavity V-groove Cavity Silizium 125 µm LFO,

22 Technology Ion-Exchange Production Process Lensed fiber arrays Collimator arrays Focusing arrays LEONI offers a wide range of lensed fiber array products: Maximum channel count 64 Fiber type MM, SM and PM Pitch 127 µm, 250 µm Other pitch on request (up to mm-range) Double layer arrays (2 rows of fibers) 2-dimensional arrays (e.g. 8x8 fibers) Various focal lenghts LFO,

23 Technology Ion-Exchange Production Process Housing for 1 x N / 2 x N splitters glass chip fiber array fibers or ribbon fibers 8 slanted angle of endface low back reflection LFO,

24 Technology Ion-Exchange Production Process photo showing the interior of a component fiber feedthrough (e.g. rubber) plastic housing new miniaturized metal housing dimensions (e.g. 1x8): 4 x 4 x 40 mm LFO,

25 PLWL components for standard applications in telecommunication (FTTH) - 1 Standard component splitter How to distribute an optical signal to a number of channels and with high uniformity and lowest losses: Planar waveguides guide, distribute, combine optical signals with smallest form factor. LFO,

26 PLWL components for standard applications in telecommunication (FTTH) - 2 Planar optical splitters (PWS) Standard components 1 x N planar optical splitters (SMF) N = 2, 3, 4, 5, 6, 8, 10, 12, 16, 20, 24, 32, 64 2 x N optical splitters (SMF) N = 2, 4, 8, 16, 20, 24, 32 1 x N PM splitters N = 2, 4, (3, 5, 6, 8) Customized components double, quadruple, multiple monolithic splitter arrays ( e.g. 8 1x2 splitters on a single chip splitter modules / racks / cassettes Housing options components modules cassettes 250 μm, 900 μm, fiber ribbon 900 μm, (1.1, 2, 3 & 3.5 mm FO cable) CS, LGX, 19 & 23 racks etc. LFO,

27 PLWL components for standard applications in telecommunication (FTTH) - 3 PWS series: typical spectral loss curve Insertion Loss (db) Optical characteristics of splitter Nr.: , , ,5 10 9,5 9 8, Wavelength (nm) 1x8-splitter 1x2-splitter Optical characteristics of splitter Nr.: ,5 Loss [db] 1x64-splitter (monotihic) 22 21,8 21,6 21,4 21, ,8 20,6 20,4 20, ,8 19,6 19,4 19, ,8 18,6 18,4 18, Wavelength [nm] Wavelength (nm) Reliability: Excellent long term reliability fully compliant with Telcordia GR 1209 and 1221 LFO, Insertion Loss (db) 5 4,5 4 3,5

28 PLWL components for standard applications in telecommunication (FTTH) - 4 DATA SHEET: 1xN Ultra Broadband Splitter Series optical specification *) 1x2 1x4 1x8 1x10 1x16 1x32 1x64 insertion loss (max.) **) [db] uniformity (max.) [db] return loss [db] > 55 directivity [db] > 55 Optical Features - Very low insertion loss - High uniformity - Ultra low PDL - High bandwidth ( nm) polarization dependent loss [db] < 0.15 wavelength range [nm] **) mechanical and environmental specification fiber type ***) nm and nm SMF 28 (9/125/250 µm) Package Highlights - Small, ruggedized metall housing - Free choice of fiber style - Inhouse connectorization fiber length [m] package dimension [mm] 1 m 40x4x4 to 70x12x7 operating temperature -40 C to + 85 C storage temperature -40 C to + 85 C *) Note: Valid over full operating wavelengths and temperature ranges for all states of polarization **) For extended range nm add 0.3 db to insertion loss for N > 8 ***) Other fiber / cable types and modified packages on request Reliability - Excellent long term reliability - Compliant with Telcordia GR 1209 and 1221 LFO,

29 PLWL components for standard applications in telecommunication (FTTH) - 5 DATA SHEET: 2xN Ultra Broadband Splitter Series optical specification *) 2x2 2x4 2x8 2x16 2x32 insertion loss (max.) **) [db] uniformity (max.) [db] return loss [db] > 55 directivity [db] > 55 polarization dependent loss [db] < 0.15 wavelength range [nm] **) mechanical and environmental specification fiber type ***) fiber length [m] package dimension [mm] nm and nm SMF 28 (9/125/250 µm) *) Note: Valid over full operating wavelengths and temperature ranges for all states of polarization **) For For extended range nm ad 0.3 db to insertion loss for N > 4 ***) Other fiber / cable types and modified packages on request 1 m 60x4x4 to 70x7x4 operating temperature -40 C to + 85 C storage temperature -40 C to + 85 C Optical Features - Very low insertion loss - High uniformity - Ultra low PDL - High bandwidth ( nm) Package Highlights - Small, ruggedized metall housing - Free choice of fiber style - Inhouse connectorization Reliability - Excellent long term reliability - Compliant with Telcordia GR 1209 and 1221 LFO,

30 PLWL components for standard applications in telecommunication (FTTH) - 6 Wavelength Dependent Loss Temperature [ C] Insertion Loss Change [db] Advantage: Benefit: Low WDL: less than ± 0.1 db Time [h] Highly suitable for in field deployment (street side cabinets, free hanging aerial cable / telephone poles) LFO,

31 PLWL components for standard applications in telecommunication (FTTH) - 7 Damp heat (85 C/85%r.h.) status: 9/2004 Climatic chamber test, splitter # , wavelength 1550 nm 1,0 0,5 IL (db) 0,0-0, ,0 Time (h) Climatic chamber test, splitter # , wavelength 1310 nm 1,0 0,5 IL(dB) 0, ,5-1,0 Time (h) 2006: 6000 h passed!! LFO,

32 PLWL components for standard applications in telecommunication (FTTH) - 8 >150,000 splitters sold (IOT, JDSU Photonics IOTech, LFO) >1,000,000,000 operating hours - no failures <10 FIT proven (random failures) - no field returns Telcordia 1209 and 1221 compliant ETSI, EN/CECC compliant, BT 8937 Random Failure Rate ( FIT) FIT 60% 1000 FIT 90% FIT 95% 100 sold devices High Mechanical and Environmental Stability Advantage: Rugged and reliable components proven in extensive tests Benefit: Extension of the lifetime of a system, combined with low costs for maintenance and service. LFO,

33 PLWL components for standard applications in telecommunication (FTTH) - 9 Customized modules and racks Splitter cassettes multiple 1x2 PWSU Splitter cassettes 3-fold 1x4 PWSU - output channels in front panel with SC/APC connectors 8-fold 1x2 PWSU with LC/PC connectors 8-fold 1x2 PWSU with 8 fiber MPO connectors 2-fold 1x2 PWSU with FC/PC and E2000 connectors LFO,

34 PLWL components for standard applications in telecommunication (FTTH) - 10 Optical transmission line with two Amplifiers over 324 km in 450 b.c. Disadvantage: low transmission rate ca. 1 b/s Trajan: roman emperor (98 117) LFO,

35 PLWL components for standard applications in telecommunication (FTTH) - 11 PON architectures Fiber-to-the-home/-building/ -curb applications (FTTH, FTTB, FTTC) Telephony networks (interactive) CATV networks (passive) Dense Wavelength Division Multiplexing (DWDM) As part of complex assemblies Switching Optical Signal Processing worldwide 75% PON / 25% PtP architecture! LFO,

36 PLWL components for standard applications in telecommunication (FTTH) - 12 Passive and active elements in PON and CATV networks CATV: Cable TV OLT: Optical Line Terminal FTTB: Fiber-to-the-building FTTH: Fiber-to-the-home ONU: Optical Network Unit FTTC: Fiber-to-the-curb LFO,

37 3) PLWL components for standard applications in telecommunication (FTTH) Products in the field Article in the journal c t 2009 Report / Optical Network LFO,

38 PLWL components for standard applications in telecommunication (FTTH) - 14 Passive optical network in the subscriber loop typically architecture in European telecommunication networks local exchange subscriber splitter 1x4 or 1x8 splitter 1x8 LFO,

39 Special PLC components - 1 LEONI has a long term experience in planar waveguide design and is able to offer special components with a wide range of waveguide properties, complex functionality and for various optical applications in telecom and non-telecom. LEONI s special components are designed for specific customer requirements: - polarization properties like polarization maintenance - SM-splitters for wavelength ranges below 1260 and above 700 nm - surface waveguides to use evanescent field effects - multimode splitters (SI or GI, up to 400 µm core diameter, and up to NA 0.35) - combination of Y-branches with splitting between 10/90 and 50/50 - combination of splitters and couplers - integration of more than one component on a single chip LFO,

40 Special PLC components - 2 Special PLWL for the wavelength range 1260 to 1650 have the same basic optical properties as shown before for the standard components. They can be produced with the same process parameters. Only design modifications are necessary: Examples for special components: N-fold 1 x 2 (4, 8) ultra broadband splitters (SM) N = 2, 4, 8 Splitting ratio 50/50 N-fold 1 x 2 (ultra) broadband splitters (SMF) N = 2, 3, 4, 5, 6, 7, 8 Splitting ratio between 90/5 and 50/ x4 a 1x4 b Combined splitter component e.g. 2 times 1 x 4, 4 times 1x2 Combination of asymmetric splitter elements e.g. single or multiple 1x3 splitters 10/45/45 Interferometers e.g. Mach-Zehnder interferometer Concentrator: Variation of waveguide pitch PM splitter 1x2 (1x4, 1x8) LFO, Pitch 250 µm Pitch e.g. 25 µm

41 Special PLC components - 3 PLWL series: typical spectral loss curve 8 x 2 output channels for ultra broadband splitters 8-fold 1x2 Insertion Loss (db) 5 4,5 4 3,5 3 2,5 Optical characteristics of splitter Nr.: planar waveguide chip Wavelength (nm) 8 input channels 8-fold 1x2-splitter on a monolithic chip housing size: 40 mm x 4 mm x 4 mm! LFO,

42 Special PLC components - 4 PLWL 4 level splitter cascade with 16 output channels for local fiber distribution (e.g. inhouse) Splitter 1 1x4 + 1(3/4) Splitter 2 1x4 + 1(2/3) Splitter 3 1x4 + 1(1/2) Splitter 4 1x4 I 0 I 1 = 3/4 I 0 I 2 = 2/3 I 1 I 3 = 1/2 I 2 Insertion loss for 16 output channels 14.9 db Uniformity 1.9 db housing size: each 40 mm x 4 mm x 4 mm! LFO,

43 light source optical signal preprocessing optical sensor(s) optical signal processing detecor and electronic preprocessing... control unit micro optics or waveguide optics - beam shaper - special fiber (e.g. PM, MM) - PWG modulator - fiber switch - fiber splitter - fiber coupler - filter - micro lens (array) - GRIN lens -IO chips -etc. optical sensor - Fiber bragg grating - evanescent field sensor chip - fiber loop - doped fiber - micro spectrometer -etc. LFO,

44 Special PLC components Sensors - 5 Michelson Interferometer for high precision distance control Chip mit 3X3-Koppler Gradientenlinse Retroreflektor PD LD PD PD Ausgangssignale um 180 phasenverschoben Spiegel LD = Laserdiode; PD = Photodiode LFO,

45 Special PLC components Sensors - 6 LFO,

46 Special PLC components Sensors - 7 LFO,

47 Special PLC components Sensors - 8 Technische Daten: Laserwellenlänge Strahldurchmesser Messbereich Längeninkremente Auflösung durch Interpolation Verfahrgeschwindigkeit Reflektor Kabellänge 780 nm 0,5 mm 500 mm 780/12 = 65 nm 1 nm 0,75 m/s Kugelretroreflektor Ø 6 mm bis 10 m LFO,

48 Special PLC components Sensors - 9 LFO,

49 Special PLC components - 4 Waveguide optics will improve old technologies and will make them more comfortable for the user! LFO,

50 Fiber Optic Gyro (LITEF GmbH, Freiburg) Light Source Readout-Coupler Integrated Optics Fiber-Coil Light Detector Current Source Pre-Amplifier E 2 PROM A D Dig.Controller LISAGA Driver Output Signal LFO,

51 Special PLC components - 6 Special PLWL (non-telecom applications) for the wavelength ranges below 1260 nm have modified optical properties compared with the standard components. They have to be produced with new set of process parameters: A) modified mask geometry (width of the mask opening) B) modified ion-exchange parameters: a) thermal ion-exchange [Ag + ] concentration temperature diffusion time b) field assisted ion-exchange temperature diffusion time electrical field surface waveguide buried waveguide C) Design modification are necessary as well. LFO,

52 Product flow - 1 Production Customer Relation Design A) Packaging Center for Mass Production of Standard Products (Splitters) Contr. Manuf. In China B) Packaging Center for Special Products and R&D in NHS Logistics Administration LFO Germany Chip Fab in Germany LFO,

53 Product flow - 2 Splitter packaging in Neuhaus-Schierschnitz Packaging technology / clean room PDL IL/RL Fiber chip coupling design & simulation polishing fiber array assembly glueing measurement & charakterisation IL/RL climat WDL REM LFO,

54 Thank You! Questions? LFO,